Laser crystal cooling device
By designing a laser crystal cooling device including water-cooled plate, crystal base and crystal briquet, the performance degradation caused by the accumulation of laser crystal heat in high-power solid lasers is solved, and the rapid and uniform heat dissipation of laser crystals is achieved, and the spot quality is improved.
Patent Information
- Application Number
- CN202421883466.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-05
AI Technical Summary
In high-power solid-state lasers, laser crystals cause material rigidity reduction, deformation difference and thermal lensing effects due to heat accumulation, affecting spot quality and gain performance. The passive thermal conduction and active thermal management of the prior art are insufficient in high power situations.
A laser crystal cooling device is designed, including a water-cooled plate, a crystal base and a crystal block. By setting up a water inlet channel, a water outlet channel, a first water channel, a second water channel, a third water channel and a fourth water channel, a cooling medium flow path surrounding the laser crystal is formed to achieve rapid and uniform heat dissipation.
Effectively absorb the heat generated by laser crystals when high-power lasers, reduce the negative impact of high temperature on gain amplification, improve the quality of spots, and is suitable for high-power solid-state lasers.
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Figure CN222966497U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of solid-state lasers. Specifically, it relates to a laser crystal cooling device. Background Art
[0002] Inside a solid-state laser, the optical path is free-space light. Among them, the laser crystal serves as a gain medium, forming a resonant cavity in the optical path. Under the continuous pumping of the diode, the free-space light transitions to higher-energy laser after absorbing the energy in the laser crystal.
[0003] However, after the free-space light in the laser crystal absorbs energy and makes a transition, the resulting energy-level loss exists in the laser crystal in the form of heat. Due to the characteristics of the laser crystal material, the rigidity of the material will decrease after being subjected to high temperatures, and the rectangular crystal will have deformation differences caused by temperature gradients in both the axial and radial directions, leading to crystal fracture. At the same time, the thermal lens effect in the radial direction and the negative effects brought about by high temperatures will all affect the spot quality and the gain efficiency of the laser crystal.
[0004] Currently, the commonly used method for dissipating heat from laser crystals is to clamp the laser crystal with a fixture having a high heat transfer coefficient and quickly conduct the heat of the laser crystal into a water-cooling structure (such as patent document CN214849525U). Or use a TEC to actively transfer heat to other structures (such as patent documents CN115864109A, CN201937159U). The above two methods can still cope with solid-state lasers with low power, but after the power is increased, the passive heat conduction power of the crystal fixture is insufficient, and there are also problems with the lifespan and reliability of TEC conduction. Summary of the Utility Model
[0005] In view of this, this application provides a laser crystal cooling device, which is applicable to high-power solid-state lasers, can effectively absorb the heat generated at the laser crystal when the laser power is large, reduce the negative impact of high temperature on gain amplification, and improve the spot quality.
[0006] A laser crystal cooling device includes a water-cooling plate, a crystal base, and a crystal pressing block arranged in sequence along the z direction;
[0007] Along the x direction, on one side of the crystal base facing the crystal pressing block, a first slot is provided, and on one side of the crystal pressing block facing the crystal base, a second slot is provided. The first slot and the second slot form a long accommodating cavity for accommodating the laser crystal;
[0008] An inlet channel and an outlet channel are provided inside the water-cooling plate along the x direction. A first water channel and a second water channel are provided inside the crystal base along the y direction. The first water channel and the second water channel are located at both ends of the accommodation cavity. A third water channel and a fourth water channel are provided inside the crystal pressing block along the x direction. The third water channel and the fourth water channel are located on both sides of the accommodation cavity.
[0009] When the crystal pressing block is installed on the crystal base and the crystal base is installed on the water-cooling plate, the first water channel is communicated with the inlet channel, the third water channel, and the fourth water channel, and the second water channel is communicated with the outlet channel, the third water channel, and the fourth water channel through connection channels. Sealing members are provided between the water-cooling plate and the crystal base and between the crystal base and the crystal pressing block for each of the connection channels.
[0010] Preferably, a layer of indium sheet is coated on the outer periphery of the laser crystal. After the indium sheet is heated, the laser crystal adheres to the crystal base and the crystal pressing block.
[0011] Preferably, two first through holes are provided on each side of the first slot of the crystal base. Along the y direction, first protrusions are provided on the circumferences of the two first through holes on one side of the crystal base, and first grooves are provided on the circumferences of the two first through holes on the other side of the crystal base.
[0012] Two second through holes are provided on each side of the second slot of the crystal pressing block. Second protrusions are provided on the circumferences of the second through holes corresponding to the first grooves, and second grooves are provided on the circumferences of the second through holes corresponding to the first protrusions.
[0013] When the crystal pressing block is installed on the crystal base, the first protrusions are embedded in the second grooves, and the second protrusions are embedded in the first grooves, so that the corresponding connection channels pass through the corresponding first through holes and second through holes to communicate the first water channel with the third water channel and the fourth water channel, and the second water channel with the third water channel and the fourth water channel.
[0014] Preferably, a first gap is provided between the first protrusion and the second groove and between the second protrusion and the first groove. The first gap is filled with indium sheet. After the indium sheet is heated and melted, it fills the first gap and forms the sealing member after cooling.
[0015] Preferably, the diameter of the first through hole corresponding to the first protrusion is larger than the diameter of the second through hole corresponding to the second groove, and the diameter of the second through hole corresponding to the second protrusion is larger than the diameter of the first through hole corresponding to the first groove, so that along the water flow direction, the diameters of the connection channels between the crystal pressing block and the crystal base gradually increase from small to large.
[0016] Preferably, two third through holes are provided along the x direction on one side of the crystal base facing the water cooling plate, fourth through holes corresponding to the third through holes are provided on one side of the water cooling plate facing the crystal base, a third protrusion is provided on the circumference of the third through hole, and a third groove is provided on the circumference of the fourth through hole;
[0017] When the crystal base is installed on the water cooling plate, the third protrusion is embedded in the third groove.
[0018] Preferably, a second gap is provided between the third protrusion and the third groove, and a sealing member is circumferentially provided at the second gap, and the sealing member is an O-ring.
[0019] Preferably, both ends of the first slot have first beveled openings gradually extending outward from the end face of the first slot along the x direction, and both ends of the second slot have second beveled openings gradually extending outward from the end face of the second slot. When the crystal pressing block is installed on the crystal base, the first beveled opening and the second beveled opening form a countersunk hole, and the diameter of the end face of the countersunk hole away from the accommodation cavity is larger than the diameter of the end face of the accommodation cavity.
[0020] Preferably, the water inlet channel and the water outlet channel are communicated through an intermediate channel, and the diameter of the intermediate channel is smaller than the diameter of the water inlet channel, so that a part of the cooling medium in the water inlet channel enters the water outlet channel, and the other part enters the first water channel.
[0021] Preferably, both the crystal base and the crystal pressing block are made of copper, and a layer of gold is plated on the surfaces of the crystal base and the crystal pressing block.
[0022] The beneficial effects of the present application are as follows: The cooling medium in the water inlet channel is transmitted to the third water channel and the fourth water channel on both sides of the top of the laser crystal through the first water channel. Subsequently, the heated cooling medium enters the second water channel along the third water channel and the fourth water channel and is then transmitted to the water outlet channel. The cooling medium in the first water channel, the second water channel, the third water channel, the fourth water channel and the cooling plate quickly dissipates heat from the laser crystal, so as to effectively absorb the heat generated at the laser crystal when the laser power is relatively large, quickly and uniformly dissipate heat from the laser crystal, be applicable to high-power solid-state lasers, reduce the negative impact of high temperature on gain amplification, and improve the spot quality. Description of the Drawings
[0023] To more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.
[0024] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present application. Therefore, they do not have technical substantial significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application.
[0025] Figure 1 is a perspective view of the laser crystal cooling device;
[0026] Figure 2 is the three-view drawing of the crystal base;
[0027] Figure 3 is the three-view drawing of the crystal pressing block;
[0028] Figure 4 is along Figure 1 the cross-sectional view of the laser crystal cooling device in the y direction in
[0029] Figure 5 is along Figure 1 the cross-sectional view of the laser crystal cooling device in the x direction in
[0030] In the figure: 1 - cooling plate; 11 - water inlet channel; 12 - water inlet channel; 13 - intermediate channel; 2 - crystal base; 21 - first water channel; 22 - second water channel; 23 - first through hole; 231 - first protrusion; 232 - first groove; 24 - third through hole; 241 - third protrusion; 25 - first bevel; 26 - first screw; 3 - crystal pressing block; 31 - third water channel; 32 - fourth water channel; 33 - second through hole; 331 - second protrusion; 332 - second groove; 34 - second bevel; 35 - second screw; 4 - laser crystal; 5 - accommodation cavity; 6 - connection channel; 7 - O-ring; 8 - counterbore. Detailed implementation manners
[0031] The embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0032] To make the above objects, features, and advantages of the present application more apparent and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0033] The present application provides a laser crystal cooling device. Referring to Figure 1-5 , it includes a water-cooling plate 1, a crystal base 2, and a crystal pressing block 3 arranged in sequence along the z direction.
[0034] Along the x direction, on one side of the crystal base 2 facing the crystal pressing block 3, a first slot is provided, and on one side of the crystal pressing block 3 facing the crystal base 2, a second slot is provided. The first slot and the second slot form a long accommodating cavity 5 for accommodating the laser crystal 4.
[0035] Inside the water-cooling plate 1, a water inlet channel 11 and a water outlet channel 12 are provided along the x direction. Inside the crystal base 2, a first water channel 21 and a second water channel 22 are provided along the y direction. The first water channel 21 and the second water channel 22 are located at both ends of the accommodating cavity 5. Inside the crystal pressing block 3, a third water channel 31 and a fourth water channel 32 are provided along the x direction. The third water channel 31 and the fourth water channel 32 are located on both sides of the accommodating cavity 5.
[0036] When the crystal pressing block 3 is installed on the crystal base 2, and the crystal base 2 is installed on the water-cooling plate 1, the first water channel 21 is communicated with the water inlet channel 11, the third water channel 31, and the fourth water channel 32, and the second water channel 22 is communicated with the water outlet channel 12, the third water channel 31, and the fourth water channel 32 through connection channels 6. And sealing members are provided between the water-cooling plate 1 and the crystal base 2, and between the crystal base 2 and the crystal pressing block 3 for each of the connection channels 6.
[0037] The water inlet channel 11 and the water outlet channel 12 can both communicate with a liquid supply device (not shown in the figure). The cooling medium provided by the liquid supply device is first transmitted into the water inlet channel 11, then transmitted into the first water channel 21 through the corresponding connection channel 6, and subsequently transmitted into the third water channel 31 and the fourth water channel 32 respectively through the corresponding connection channel 6. The cooling medium in the third water channel 31 and the fourth water channel 32 absorbs the heat on the laser crystal 4 and is then transmitted into the second water channel 22 through the corresponding connection channel 6. Then, the cooling medium in the second water channel 22 is transmitted into the water outlet channel 12 through the corresponding connection channel 6. Finally, after the cooling medium absorbs heat and enters the liquid supply device for re-cooling, the above process is repeated, so that the cooling medium is in a circulating flow state throughout the process. The third water channel 31 and the fourth water channel 32 are located on both sides of the laser crystal 4. When the cooling medium flows in the third water channel 31 and the fourth water channel 32, the upper part of the laser crystal 4 can be cooled quickly. The distance between the lower part of the laser crystal 4 and the water-cooled plate 1, the first water channel 21, and the second water channel 22 is relatively close. The lower part of the laser crystal 4 can be quickly cooled by the cooling medium in the water-cooled plate 1, the first water channel 21, and the second water channel 22. Moreover, the connection channels between the crystal pressing block 3 and the crystal base 2 will pass through both ends of the laser crystal 4 during the process of transmitting the cooling medium, thereby quickly cooling both ends of the laser crystal 4. Through the above structural design, the cooling medium surrounds the laser crystal 4, and can quickly and continuously absorb the heat of the laser crystal 4, so that the laser crystal 4 is quickly cooled.
[0038] The connection channel 6 between the water inlet channel 11 and the first water channel 21, and the connection channel 6 between the water outlet channel 12 and the second water channel 22 will both pass through the cooling plate 1 and the crystal base 2. The connection channels 6 between the first water channel 21 and the third water channel 31, the fourth water channel 32, and the connection channels 6 between the second water channel 22 and the third water channel 31, the fourth water channel 32 will both pass through the crystal base 2 and the crystal pressing block 3. The setting of the seal can prevent the cooling medium in each connection channel 6 from leaking from the connection between the crystal base 2 and the crystal pressing block 3, nor from leaking from the connection between the crystal base 2 and the water-cooled plate 1, so that the water flow circuit in the entire laser crystal cooling device is in a sealed state.
[0039] The cooling medium in this embodiment can be cooling water or other cooling solutions. Preferably, cooling water is used as the cooling medium in this embodiment.
[0040] In order to enable the laser crystal 4 to be quickly cooled, the third water channel 31 and the fourth water channel 32 should be as close to the laser crystal 4 as possible. The lower part of the laser crystal 4 should be as close to the first water channel 21 and the second water channel 22 as possible, and the first water channel 21 and the second water channel 22 should be as close to the water-cooled plate 1 as possible.
[0041] Further, the crystal block 3 of this embodiment may have a plurality of third water channels 31, and each third water channel 31 communicates with the first water channel 21 and the second water channel 22. Correspondingly, the crystal block 3 may also have a plurality of fourth water channels 32, and each fourth water channel 32 communicates with the first water channel 21 and the second water channel 22. In this way, there are a plurality of third water channels 31 and fourth water channels 32 on both sides of the laser crystal 4, which can cool the laser crystal 4 more quickly.
[0042] As Figure 1 shown, the crystal base 2 is mounted on the water-cooling plate 1 by a plurality of first screws 26, and the crystal block 3 is mounted on the crystal base 2 by a plurality of second screws 35.
[0043] In this embodiment, a layer of indium sheet is coated on the outer periphery of the laser crystal 4. After the indium sheet is heated, the laser crystal 4 is tightly adhered to the crystal base 2 and the crystal block 3. In this way, the heat generated when the laser crystal 4 works can be quickly conducted to the crystal block 3 and the crystal base 2, avoiding the decline of its performance and stability caused by heat accumulation.
[0044] In order to conduct the heat of the laser crystal 4 to the crystal block 3 and the crystal base 2, the crystal block 3 and the crystal base 2 of this embodiment are both made of materials with high heat conduction coefficients. Specifically, they are made of copper. The copper material is made by machining and friction stir welding processes, and a layer of gold is plated on its surface. In this way, while quickly conducting away the heat generated by the laser crystal 4, there is no temperature gradient difference in the laser crystal 4, that is, its heat is conducted away evenly.
[0045] Refer to Figures 2-3 , two first through holes 23 are respectively opened on both sides of the first slot of the crystal base 2. Along the y direction, first protrusions 231 are provided on the circumferences of the two first through holes 23 on one side of the crystal base 2, and first grooves 232 are provided on the circumferences of the two first through holes 23 on the other side of the crystal base 2;
[0046] Two second through holes 33 are respectively opened on both sides of the second slot of the crystal block 3. Second protrusions 331 are provided on the circumferences of the second through holes 33 corresponding to the first grooves 232, and second grooves 332 are provided on the circumferences of the second through holes 33 corresponding to the first protrusions 231;
[0047] When the crystal pressing block 3 is installed on the crystal base 2, the first protrusion 231 is embedded in the second groove 332, and the second protrusion 331 is embedded in the first groove 232, so that the corresponding connection channels 6 pass through the corresponding first through holes 23 and second through holes 33 to connect the first water channel 21 with the third water channel 31 and the fourth water channel 32, and the second water channel 22 with the third water channel 31 and the fourth water channel 32.
[0048] The cooperation between the groove and the protrusion can play a guiding role in the process of installing the crystal pressing block 3 on the crystal base 2, so that the laser crystal 4 will not be damaged due to the displacement of the crystal pressing block 3 and the crystal base 2 in other directions.
[0049] Moreover, there is a first gap between the first protrusion 231 and the second groove 332, and between the second protrusion 331 and the first groove 232. An indium sheet is filled in the first gap. After the indium sheet is heated and melted, it fills the first gap, and forms the sealant after cooling.
[0050] The indium sheet melts and fills the entire first gap after heating, and then hardens after cooling, so that the first gap is sealed, so that the cooling medium in the connection channels 6 between the crystal base 2 and the crystal pressing block 3 will not leak from the first gap.
[0051] Furthermore, since the pressure-bearing capacity of the indium sheet as a sealant is poor, in this embodiment, it is designed that the diameter of the first through hole 23 corresponding to the first protrusion 231 is larger than the diameter of the second through hole 33 corresponding to the second groove 332, and the diameter of the second through hole 33 corresponding to the second protrusion 331 is larger than the diameter of the first through hole 23 corresponding to the first groove 232, so that along the water flow direction, the diameters of the connection channels 6 between the crystal pressing block 3 and the crystal base 2 gradually increase from small to large.
[0052] It can be understood that the diameter of the connection channel 6 in the crystal base 2 communicating with the first through hole 23 is equal to the diameter of the corresponding first through hole 23, and the diameter of the connection channel 6 in the crystal pressing block 3 communicating with the second through hole 33 is equal to the diameter of the corresponding second through hole 33. In this way, along the water flow direction, the diameters of the connection channels 6 between the crystal pressing block 3 and the crystal base 2 gradually increase from small to large, which can minimize the pressure on the indium sheet at the first gap, and thus minimize the risk of cooling medium leakage.
[0053] Reference Figure 2 As shown in, two third through holes 24 are provided on the side of the crystal base 2 facing the water cooling plate 1 along the x direction. Corresponding to the third through holes 24, fourth through holes are provided on the side of the water cooling plate 1 facing the crystal base 2. A third protrusion 241 is provided on the circumference of the third through hole 24, and a third groove is provided on the circumference of the fourth through hole;
[0054] When the crystal base 2 is installed on the water-cooling plate 1, the third protrusion 241 is embedded in the third groove to play a guiding role.
[0055] Certainly, it is also possible to arrange grooves circumferentially on the third through-hole 24 and protrusions circumferentially on the fourth through-hole. This embodiment does not make specific limitations in this regard.
[0056] Moreover, there is a second gap between the third protrusion 241 and the third groove, and a seal is arranged circumferentially at the second gap, so that each connection channel 6 between the cooling plate 1 and the crystal base 2 will not leak from the second gap. The seal is an O-ring 7. Specifically, the O-ring 7 is made of fluororubber.
[0057] Along the x direction, both ends of the first slot have first bevels 25 that gradually extend outward from the end face of the first slot, and both ends of the second slot have second bevels 34 that gradually extend outward from the end face of the second slot. When the crystal pressing block 3 is installed on the crystal base 2, the first bevel 25 and the second bevel 34 form a countersunk hole 8. The diameter of the end face of the countersunk hole 8 away from the accommodation cavity 5 is larger than the diameter of the end face of the accommodation cavity 5, so as to avoid accidentally touching other stray light and reflecting it into the end face of the laser crystal 4 during use. Also, the depth of the countersunk hole 8 can be changed during processing to adapt to laser crystals 4 of different lengths.
[0058] Reference Figure 5 , the water inlet channel 11 and the water outlet channel 12 are connected through an intermediate channel 13, and the diameter of the intermediate channel 13 is smaller than the diameter of the water inlet channel 11, so that a part of the cooling medium in the water inlet channel 11 enters the water outlet channel 12, and another part enters the first water channel 21.
[0059] Since the water inlet channel 11 is relatively thick, the water flow is large, and the corresponding water pressure is also very high. By allowing a part of the cooling medium in the water inlet channel 11 to enter the water outlet channel 12 and another part to enter the first water channel 21 through the intermediate channel 13, the pressure on the crystal base 2 and the crystal pressing block 3 can be reduced. While being able to introduce the cooling medium into each water channel, it can avoid the excessive water flow from affecting the stability of the entire cooling device.
[0060] In this specification, each embodiment is described in a progressive, or parallel, or a combination of progressive and parallel ways. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and reference can be made to the description in the method part for related parts.
[0061] It should be noted that in the description of this application, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be construed as a limitation to this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present simultaneously.
[0062] It should also be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that an article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the article or device comprising the above elements.
[0063] The above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to the embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A laser crystal cooling device, characterized in that: It comprises a water cooling plate (1), a crystal base (2) and a crystal pressing block (3) which are sequentially arranged along the z direction; Along the x direction, a first slot is provided on a side of the crystal base (2) facing the crystal compact (3), and a second slot is provided on a side of the crystal compact (3) facing the crystal base (2), wherein the first slot and the second slot form a long strip-shaped accommodation cavity (5) for accommodating the laser crystal (4); The water cooling plate (1) is provided with a water inlet channel (11) and a water outlet channel (12) along the x direction, the crystal base (2) is provided with a first water channel (21) and a second water channel (22) along the y direction, the first water channel (21) and the second water channel (22) are located at two ends of the accommodating cavity (5), and the crystal block (3) is provided with a third water channel (31) and a fourth water channel (32) along the x direction, the third water channel (31) and the fourth water channel (32) are located at two sides of the accommodating cavity (5); When the crystal pressing block (3) is mounted on the crystal base (2), and the crystal base (2) is mounted on the water cooling plate (1), the first water channel (21) and the water inlet channel (11), the third water channel (31), and the fourth water channel (32) as well as the second water channel (22) and the water outlet channel (12), the third water channel (31), and the fourth water channel (32) are all connected via connecting channels (6), and each of the connecting channels (6) is provided with a sealing member between the water cooling plate (1) and the crystal base (2), and between the crystal base (2) and the crystal pressing block (3).
2. A laser crystal cooling device according to claim 1, characterized in that: The outer periphery of the laser crystal (4) is coated with a layer of indium sheet, and after the indium sheet is heated, the laser crystal (4) adheres to the crystal base (2) and the crystal pressing block (3).
3. A laser crystal cooling device according to claim 1, characterized in that: The crystal base (2) is provided with two first through holes (23) on both sides of the first slot, and along the y direction, the two first through holes (23) located on one side of the crystal base (2) are both provided with first protrusions (231) in the circumference, and the two first through holes (23) located on the other side of the crystal base (2) are both provided with first grooves (232) in the circumference; The crystal block (3) has two second through holes (33) on both sides of the second groove, and the second through holes (33) corresponding to the first groove (232) are each provided with a second protrusion (331) in the circumference, and the second through holes (33) corresponding to the first groove (231) are each provided with a second groove (332) in the circumference; When the crystal pressing block (3) is mounted on the crystal base (2), the first protrusion (231) is embedded in the second groove (332), and the second protrusion (331) is embedded in the first groove (232), so that the corresponding connecting channel (6) passes through the corresponding first through hole (23) and the second through hole (33) to connect the first water channel (21) with the third water channel (31) and the fourth water channel (32), and the second water channel (22) with the third water channel (31) and the fourth water channel (32).
4. A laser crystal cooling device according to claim 3, characterized in that: A first gap is provided between the first protrusion (231) and the second groove (332), and between the second protrusion (331) and the first groove (232). The first gap is filled with an indium sheet, which fills the first gap after being heated and melted, and forms the sealing member after being cooled.
5. A laser crystal cooling device according to claim 3, characterized in that: The diameter of the first through hole (23) corresponding to the first protrusion (231) is greater than the diameter of the second through hole (33) corresponding to the second groove (332), and the diameter of the second through hole (33) corresponding to the second protrusion (331) is greater than the diameter of the first through hole (23) corresponding to the first groove (232), so that along the direction of water flow, the diameter of the connecting channel (6) between the crystal pressing block (3) and the crystal base (2) changes from small to large.
6. A laser crystal cooling device according to any one of claims 1 to 5, characterized in that: Two third through holes (24) are provided on one side of the crystal base (2) facing the water cooling plate (1) along the x direction, a fourth through hole is provided on one side of the water cooling plate (1) facing the crystal base (2) corresponding to the third through holes (24), a third protrusion (241) is provided in the circumference of the third through hole (24), and a third groove is provided in the circumference of the fourth through hole; When the crystal base (2) is mounted on the water-cooling plate (1), the third protrusion (241) is embedded in the third groove.
7. A laser crystal cooling device according to claim 6, characterized in that: A second gap is provided between the third protrusion (241) and the third groove, and the sealing member is annularly arranged at the second gap, and the sealing member is an O-type sealing ring (7).
8. A laser crystal cooling device according to any one of claims 1 to 5 and 7, characterized in that: Along the x-direction, both ends of the first slot have a first bevel (25) gradually extending outward from the end face of the first slot, and both ends of the second slot have a second bevel (34) gradually extending outward from the end face of the second slot. When the crystal compact (3) is mounted on the crystal base (2), the first bevel (25) and the second bevel (34) form a countersunk hole (8), and the diameter of the end face of the countersunk hole (8) away from the accommodating cavity (5) is larger than the diameter of the end face of the accommodating cavity (5).
9. A laser crystal cooling device according to any one of claims 1 to 5 and 7, characterized in that: The water inlet channel (11) and the water outlet channel (12) are connected via an intermediate channel (13), and the diameter of the intermediate channel (13) is smaller than the diameter of the water inlet channel (11), so that a portion of the cooling medium in the water inlet channel (11) enters the water outlet channel (12) and another portion enters the first water channel (21).
10. A laser crystal cooling device according to any one of claims 1-5 and 7, characterized in that: The crystal base (2) and the crystal pressing block (3) are both made of red copper, and the surfaces of the crystal base (2) and the crystal pressing block (3) are both plated with a layer of gold.
Citation Information
Patent Citations
Solid laser crystal heat sink method without water-cooling heat dissipation
CN115864109A
Heat dissipation structure for crystal holder of laser
CN201937159U
Water-cooling laser crystal holder
CN214849525U