Fully-sealed waterproof and dustproof MEMS microphone
By using technical means such as flexible film and rubber sealing ring in MEMS microphone, the efficient dust-proof and waterproofing effect inside the microphone is achieved, solving the problem of insufficient waterproofing and dustproofing in the existing technology, and improving the practicality of the microphone.
Patent Information
- Application Number
- CN202421576988.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-07-05
AI Technical Summary
The existing MEMS microphones have shortcomings in waterproofing and dustproofing, and cannot effectively prevent external dust and moisture from entering the microphone, affecting its usefulness.
A fully sealed waterproof and dust-proof MEMS microphone is designed, using technical means such as flexible film and rubber sealing ring to ensure the sealing of the microphone inside, and protect the flexible film through a dustproof cover to prevent external dust and moisture from entering.
It realizes the efficient dust-proof and waterproofing effect inside the microphone, ensures the stable propagation of sound signals, and improves the overall practicality of the microphone.
Smart Images
Figure CN222967075U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of microphones, in particular to a fully sealed waterproof and dustproof MEMS microphone. Background Art
[0002] As a kind of microphone, the performance of MEMS microphones is very stable at different temperatures and is not affected by temperature, vibration, humidity and time. Due to its strong heat resistance, MEMS microphones can withstand high-temperature reflow soldering at 260°C without any change in performance. Due to the outstanding advantages of MEMS microphones, they are deeply favored by users.
[0003] There are sound holes on the surface of the existing MEMS microphone housing, which are insufficient in waterproof and dustproof performance, and the overall practicality needs to be improved. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a fully sealed waterproof and dustproof MEMS microphone, which can ensure the stable transmission of sound while avoiding external dust and moisture from entering the inside of the microphone, and has high overall practicality.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] A fully sealed waterproof and dustproof MEMS microphone, including a housing, an installation groove is provided on the outer surface of the housing, a support frame is snap-fitted inside the installation groove, a flexible film is wrapped outside the support frame, the flexible film is connected to the support frame by glue, a dustproof cover is snap-fitted at the port of the installation groove, the dustproof cover covers one side of the flexible film, and a plurality of through holes are provided on the outer surface of the dustproof cover.
[0007] By adopting the above technical solutions, it can ensure the effective transmission of sound while avoiding external dust and water vapor from entering the inside of the housing.
[0008] Further, a snap-fit seat is integrally connected to the open end of the housing, and a PCB board is installed inside the snap-fit seat.
[0009] By adopting the above technical solutions, the stability of the PCB board can be effectively improved.
[0010] Further, a rubber sealing ring is installed on the inner end surface of the snap-fit seat, and both side surfaces of the rubber sealing ring are adhesively connected to the inner end surface of the snap-fit seat and the edge position of one side surface of the PCB board by glue respectively.
[0011] By adopting the above technical solutions, the sealing performance of the PCB board installed inside the snap-fit seat can be effectively improved.
[0012] Further, an ASIC chip and a microelectromechanical system are disposed on the outer surface of the PCB board, and the ASIC chip and the microelectromechanical system are electrically connected by a gold wire.
[0013] By adopting the above technical solution, the stable operation of the microphone can be effectively achieved.
[0014] Further, both the ASIC chip and the microelectromechanical system are adhered to the PCB board by die attach glue.
[0015] By adopting the above technical solution, the operating stability of the ASIC chip and the microelectromechanical system can be effectively improved.
[0016] Further, the microelectromechanical system includes a parallel plate capacitor, a diaphragm, and a back electrode.
[0017] By adopting the above technical solution, the vibration of the diaphragm can be used to convert the sound signal into an electrical signal.
[0018] In summary, the beneficial technical effects of the present utility model are as follows:
[0019] The present utility model can use a rubber sealing ring to make the PCB board and the inner side of the buckle seat be hermetically connected, and then use the flexible film covering the inside of the installation groove to make the inside of the housing be in a sealed state. Furthermore, when the external sound drives the flexible film to vibrate, the sound receiving structure in the microelectromechanical system can be effectively driven to vibrate, so that the microphone can sensitively receive the sound signal. At the same time, the flexible film can effectively prevent external moisture from entering the inside of the housing, so that the microphone has an efficient dust and waterproof effect. At the same time, the dustproof cover covering one side of the flexible film can effectively protect the flexible film, and can be flexibly disassembled for cleaning operation during subsequent use, with strong practicability. Description of the Drawings
[0020] Figure 1 It is a first perspective view of the three-dimensional structure of the present utility model;
[0021] Figure 2 It is a second perspective view of the three-dimensional structure of the present utility model.
[0022] In the figure: 1. Housing; 2. Buckle seat; 3. Rubber sealing ring; 4. PCB board; 5. ASIC chip; 6. Microelectromechanical system; 7. Installation groove; 8. Support frame; 9. Flexible film; 10. Dustproof cover. Detailed Embodiment
[0023] The following further details the method of the present utility model with reference to the drawings.
[0024] Refer to the attached Figure 1 and the attached Figure 2, A fully sealed waterproof and dustproof MEMS microphone, including a housing 1. An installation groove 7 is provided on the outer surface of the housing 1. A support frame 8 is snap-fitted inside the installation groove 7. A flexible film 9 is wrapped around the outside of the support frame 8. The flexible film 9 is connected to the support frame 8 by glue. A dustproof cover 10 is snap-fitted at the port of the installation groove 7. The dustproof cover 10 covers one side of the flexible film 9. A plurality of through holes are provided on the outer surface of the dustproof cover 10. The open end of the housing 1 is integrally connected with a snap seat 2. A PCB board 4 is installed inside the snap seat 2. A rubber sealing ring 3 is installed on the inner end face of the snap seat 2. The two side faces of the rubber sealing ring 3 are adhesively connected to the inner end face of the snap seat 2 and the edge position of one side face of the PCB board 4 by glue respectively. Among them, the rubber sealing ring 3 can be used to make the PCB board 4 and the inner side of the snap seat 2 be sealed and connected. Then, the flexible film 9 covering the inside of the installation groove 7 is used to make the inside of the housing 1 in a sealed state. Thus, when the external sound drives the flexible film 9 to vibrate, it can effectively drive the sound receiving structure in the microelectromechanical system 6 to vibrate, so that the microphone can sensitively receive sound signals. At the same time, the flexible film 9 can effectively prevent external moisture and dust from entering the inside of the housing 1, making the microphone have an efficient dustproof and waterproof effect. At the same time, the dustproof cover 10 covering one side of the flexible film 9 can effectively protect the flexible film 9, and can be flexibly disassembled for cleaning operation during subsequent use, with strong practicability. Among them, a solder paste layer can also be applied on the inner end face of the snap seat 2, and then the PCB board 4 and the snap seat 2 are fixed by reflow soldering directly.
[0025] Refer to Figure 1 , An ASIC chip 5 and a microelectromechanical system 6 are provided on the outer surface of the PCB board 4. The ASIC chip 5 and the microelectromechanical system 6 are electrically connected by gold wires. The ASIC chip 5 and the microelectromechanical system 6 are both adhered to the PCB board 4 by die bonding glue. The ASIC chip 5 is electrically connected to the PCB board 4. The microelectromechanical system 6 includes a parallel plate capacitor, a diaphragm, and a backplate. Among them, the diaphragm can be used to sense the vibration of the air, so that the parallel plate capacitor circuit is closed, enabling the microelectromechanical system 6 to convert the sound signal into an electrical signal. Then, the amplified electrical signal is converted into a digital signal by the ASIC chip 5, and finally the digital signal is transmitted.
[0026] Working principle: When in use, first install the MEMS microphone at a designated position. At this time, external sounds can effectively drive the vibration of the taut flexible film 9. Since the PCB board 4 is snapped inside the snap seat 2, and a rubber sealing ring 3 is adhered to the inner end face of the snap seat 2, the rubber sealing ring 3 is adhered to the PCB board 4, and the flexible film 9 is installed at the installation groove 7, the inside of the housing 1 is in a sealed state. When the flexible film 9 vibrates, it can effectively drive the vibration of the air inside the housing 1. At this time, it can effectively drive the vibration of the diaphragm in the microelectromechanical system 6, so that the sound signal can be converted into an electrical signal. The electrical signal is transmitted to the inside of the ASIC chip 5, and the ASIC chip 5 amplifies and converts the electrical signal, and finally produces a digital signal, and then the digital signal is transmitted. During the use of the microphone, the flexible film 9 can be used to prevent external dust and moisture from entering the inside of the housing 1, and at the same time, the dust cover 10 can be used to perform an external protection operation on the flexible film 9.
[0027] The embodiments of this specific implementation manner are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.
Claims
1. A fully sealed waterproof and dustproof MEMS microphone, comprising a housing (1), characterized in that: The outer surface of the shell (1) is provided with a mounting groove (7), the interior of the mounting groove (7) is buckled with a support frame (8), the outside of the support frame (8) is wrapped with a flexible film (9), the flexible film (9) and the support frame (8) are connected by glue, a dust cover (10) is buckled and installed at the end of the mounting groove (7), the dust cover (10) is buckled on one side of the flexible film (9), and a plurality of through holes are provided on the outer surface of the dust cover (10).
2. A fully sealed waterproof and dustproof MEMS microphone according to claim 1, characterized in that: The opening end of the housing (1) is integrally connected with a buckle seat (2), and a PCB board (4) is installed inside the buckle seat (2).
3. A fully sealed waterproof and dustproof MEMS microphone according to claim 2, characterized in that: A rubber sealing ring (3) is installed on the inner end surface of the buckle seat (2), and the two side surfaces of the rubber sealing ring (3) are respectively bonded to the inner end surface of the buckle seat (2) and the edge position of one side surface of the PCB board (4) by glue.
4. The fully sealed waterproof and dustproof MEMS microphone according to claim 2, characterized in that: An ASIC chip (5) and a micro-electromechanical system (6) are arranged on the outer surface of the PCB board (4); the ASIC chip (5) and the micro-electromechanical system (6) are electrically connected via a gold wire.
5. The fully sealed waterproof and dustproof MEMS microphone according to claim 4, characterized in that: The ASIC chip (5) and the micro-electromechanical system (6) are both bonded to the PCB board (4) via a die-bonding adhesive.
6. The fully sealed waterproof and dustproof MEMS microphone according to claim 4, characterized in that: The micro-electromechanical system (6) comprises a parallel plate capacitor, a diaphragm and a back electrode.