Organic conductive film covering device of FPC circuit board

Abstract

The utility model discloses an organic conducting film covering device of an FPC circuit board, which belongs to the technical field of film covering of the FPC circuit board, and comprises a first conveying frame and a second conveying frame, the outer walls of the two opposite ends of the first conveying frame and the second conveying frame are fixedly connected with a supporting seat, the top of the supporting seat is provided with a winding device, and the winding device is connected with the first conveying frame and the second conveying frame. A conductive film is wound on the surface of the winding device, a circuit board body used in cooperation with the conductive film is placed on the first conveying frame, the conveying effect can be provided for the circuit board body through cooperation of the first conveying frame and the second conveying frame, and therefore the winding device drives the conductive film to be conveyed; according to the organic conducting film covering device for the FPC, the conveying mechanism is additionally arranged, so that a conducting film can cover the conveyed circuit board main body, the cutting mechanism is additionally arranged, the conducting film connected to the circuit board main body can be cut, continuous film covering processing of the circuit board main body can be achieved, and therefore the working efficiency of the organic conducting film covering device for the FPC is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of film covering of FPC circuit boards, and particularly relates to an organic conductive film covering device for FPC circuit boards. Background Art

[0002] The organic conductive film of a circuit board is an important electronic material with broad application prospects. The organic conductive film can be covered on the circuit board through a specific process to improve the conductive performance and stability of the circuit board. This conductive film is usually composed of organic materials and conductive particles and has good flexibility and processability. In practical applications, the organic conductive film can be used to manufacture the conductive film device on a multi-layer circuit board or to attach the conductive film to the circuit board. Through the organic conductive film covering device dedicated to FPC circuit boards, the film covering operation can be performed on the circuit board.

[0003] An organic conductive film covering device for an FPC circuit board proposed according to the publication number: CN107493654A includes a device body. The device body is of a rectangular cavity structure. Two groups of cylinders are installed on the inner wall of the top of the device body. The piston rods of the two groups of cylinders are connected to a first mounting plate. The lower surface of the first mounting plate is evenly provided with first springs at equal distances along the length direction. One end of the first spring away from the first mounting plate is connected to a second mounting plate. A film covering device is fixed on the lower surface of the second mounting plate. A first rotating shaft is movably installed in the middle of the inner wall of the bottom plate of the device body, and a first gear is installed on the top of the first rotating shaft. In the present invention, the circuit board can be fixed during film covering, making the film covering more accurate and reducing the defective rate; at the same time, the other side can be quickly film covered, which is convenient and fast, reduces the operation time, and improves the production efficiency. The structure of this device is simple and the design is novel, which is worthy of popularization.

[0004] According to the above introduction, the organic conductive film covering device for FPC circuit boards realizes fixed film covering of the circuit board during use. However, during the film covering process, the efficiency of film covering the FPC circuit board is affected. The FPC circuit board can only be processed and film covered singly during the film covering process and cannot be continuously film covered, resulting in a reduction in the efficiency of the covering device used for the FPC circuit board. In order to solve the above-mentioned problems, an improved organic conductive film covering device for FPC circuit boards is proposed. Content of the Utility Model

[0005] The purpose of the present utility model is to provide an organic conductive film covering device for an FPC circuit board. Through the cooperation of the first conveyor rack and the second conveyor rack, the conveying effect can be provided for the circuit board main body, so that the conductive film is driven to be conveyed by the winding device, and then the conductive film can be covered on the conveyed circuit board main body. Moreover, a cutting mechanism is added, which can cut the conductive film connected to the circuit board main body, realizing the continuous film covering process of the circuit board main body, thereby enhancing the working efficiency of the organic conductive film covering device for the FPC circuit board, so as to solve the problems raised in the above background technology.

[0006] To achieve the above purpose, the present utility model provides the following technical solutions: An organic conductive film covering device for an FPC circuit board includes a first conveyor rack and a second conveyor rack. At the opposite ends of the outer walls of the first conveyor rack and the second conveyor rack, there are fixedly connected support seats. On the top of the support seats, there is a winding device, and a conductive film is wound around the surface of the winding device. A circuit board main body that cooperates with the conductive film is placed on the first conveyor rack. A cutting mechanism is arranged on the inner side wall of the support seat. On the top of the second conveyor rack, there is fixedly connected a support frame, and a pressing component is arranged on the support frame.

[0007] Preferably, on the opposite sides of the support seats, there are fixedly connected guide rods. The guide rods are arranged on the side close to the first conveyor rack. At both ends of the guide rods, there are adjusting components, and a pressing roller is fixedly connected to the lower ends of the adjusting components. The conductive film is attached to the surfaces of the guide rods and the pressing roller.

[0008] Preferably, the cutting mechanism includes an electric slide rail and an electric slider. The electric slide rail is installed on the support seat and is located below the winding device. The electric slider is slidably connected to the electric slide rail. At the lower end of the electric slider, there is a cutting knife for dividing the conductive film.

[0009] Preferably, the pressing component includes an electric push rod. The electric push rod is fixed on the top of the support frame. The piston rod of the electric push rod is fixedly connected with a pressing plate, and a rubber pad is fixedly connected to the lower surface of the pressing plate.

[0010] Preferably, at both ends of the upper surface of the pressing plate, there are fixedly connected positioning rods. The tops of the positioning rods pass through the support frame through sliding sleeves and are fixedly connected with limiting blocks.

[0011] Preferably, the adjusting component includes a connecting rod. The connecting rod is fixed at both ends of the pressing roller. One end of the connecting rod passes through the guide rod through a movable sleeve and extends upward.

[0012] Preferably, a spring is sleeved on the surface of the connecting rod. The top of the spring is fixed on the guide rod, and the bottom of the spring is fixed on the surface of the pressing roller.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. The present utility model provides an organic conductive film covering device for an FPC circuit board. Through the cooperation of the first conveyor rack and the second conveyor rack, the device can provide a conveying effect for the circuit board body, and then drive the conductive film to be conveyed by the winding device, so that the conductive film can be covered on the conveyed circuit board body. In addition, a cutting mechanism is added, which can cut the conductive film connected to the circuit board body, realizing continuous film covering processing of the circuit board body, thereby enhancing the working efficiency of the organic conductive film covering device for the FPC circuit board.

[0015] 2. The present utility model provides an organic conductive film covering device for an FPC circuit board. By providing driving force through the electric push rod in the pressing assembly, the pressing plate is driven to perform lifting adjustment on the support frame. During the lifting adjustment of the pressing plate, through the cooperation of the positioning rod and the sliding sleeve, the stability of the lifting adjustment of the pressing plate can be provided, so that the pressing plate drives the rubber pad to apply pressure to the circuit board body covered with the conductive film again, making the conductive film closely adhere to the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the front view schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is the rear view schematic diagram of the overall structure of the present utility model;

[0018] Figure 3 is the partial side view schematic diagram of the support seat structure of the present utility model;

[0019] Figure 4 is the schematic diagram of the support seat, cutting mechanism and adjustment assembly structure of the present utility model.

[0020] Reference numerals in the figures: 1, first conveyor rack; 2, second conveyor rack; 3, support seat; 4, winding device; 5, conductive film; 6, circuit board body; 7, cutting mechanism; 71, electric slide rail; 72, electric slider; 73, cutting knife; 8, support frame; 9, pressing assembly; 91, electric push rod; 92, pressing plate; 93, rubber pad; 10, guide rod; 11, adjustment assembly; 111, connecting rod; 112, movable sleeve; 113, spring; 12, pressure roller; 13, positioning rod; 14, limit block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] The present invention provides an organic conductive film covering device for an FPC circuit board as shown in Figures 1 to 4 , which includes a first conveyor rack 1 and a second conveyor rack 2. Support seats 3 are fixedly connected to the outer walls of the opposite ends of the first conveyor rack 1 and the second conveyor rack 2. A winding device 4 is arranged on the top of the support seat 3, and a conductive film 5 is wound on the surface of the winding device 4. A circuit board main body 6 that cooperates with the conductive film 5 is placed on the first conveyor rack 1. A cutting mechanism 7 is arranged on the inner side wall of the support seat 3. A support frame 8 is fixedly connected to the top of the second conveyor rack 2, and a pressing assembly 9 is arranged on the support frame 8. Through the cooperation of the first conveyor rack 1 and the second conveyor rack 2 provided, a conveying effect can be provided for the circuit board main body 6, so that the winding device 4 drives the conductive film 5 to be conveyed, and thus the conductive film 5 can be covered on the conveyed circuit board main body 6. Moreover, the cutting mechanism 7 is added, which can cut the conductive film 5 connected between the circuit board main bodies 6, realizing continuous film covering processing of the circuit board main body 6, thereby enhancing the working efficiency of the organic conductive film covering device for the FPC circuit board.

[0023] Guide rods 10 are fixedly connected to the opposite sides of the support seat 3. The guide rods 10 are arranged on the side close to the first conveyor rack 1. Adjusting components 11 are arranged at both ends of the guide rods 10. A pressing roller 12 is fixedly connected to the lower end of the adjusting component 11. The conductive film 5 is attached to the surfaces of the guide rods 10 and the pressing roller 12. By arranging the guide rods 10, a guiding effect can be provided for the conductive film 5. Subsequently, through the connection between the adjusting component 11 and the pressing roller 12, the pressing roller 12 is used to cover and press between the conductive film 5 and the circuit board main body 6.

[0024] The cutting mechanism 7 includes an electric slide rail 71 and an electric slider 72. The electric slide rail 71 is installed on the support seat 3 and is located below the winding device 4. The electric slider 72 is slidably connected to the electric slide rail 71. A cutting knife 73 for dividing the conductive film 5 is arranged at the lower end of the electric slider 72. By providing a power source through the electric slide rail 71 and the electric slider 72, the cutting knife 73 can be driven to move quickly, so that the conductive film 5 connected between two adjacent circuit board main bodies 6 can be cut and separated.

[0025] The pressing assembly 9 includes an electric push rod 91. The electric push rod 91 is fixed to the top of the support frame 8. The piston rod of the electric push rod 91 is fixedly connected to a pressing plate 92. A rubber pad 93 is fixedly connected to the lower surface of the pressing plate 92. Positioning rods 13 are fixedly connected to both ends of the upper surface of the pressing plate 92. The top of the positioning rod 13 passes through the support frame 8 through a sliding sleeve and is fixedly connected to a limiting block 14. By providing driving force through the electric push rod 91 in the pressing assembly 9, the pressing plate 92 is driven to perform lifting adjustment on the support frame 8. And during the lifting adjustment of the pressing plate 92, through the cooperation of the provided positioning rod 13 and the sliding sleeve, stability can be provided for the lifting adjustment of the pressing plate 92, so that the pressing plate 92 drives the rubber pad 93 to apply pressure to the circuit board body 6 covered with the conductive film 5 again, making the conductive film 5 and the circuit board body 6 fit tightly together.

[0026] The adjusting assembly 11 includes a connecting rod 111. The connecting rod 111 is fixed to both ends of the pressing roller 12. One end of the connecting rod 111 passes through the guide rod 10 through a movable sleeve 112 and extends upward. A spring 113 is sleeved on the surface of the connecting rod 111. The top of the spring 113 is fixed to the guide rod 10, and the bottom of the spring 113 is fixed to the surface of the pressing roller 12. Through the cooperation of the provided connecting rod 111 and the movable sleeve 112, the position of the pressing roller 12 can be limited to prevent the pressing roller 12 from moving horizontally. Subsequently, through the provided spring 113, an elastic force can be provided between the pressing roller 12 and the guide rod 10. Therefore, the pressing roller 12 can be driven to perform vertical adjustment following the thickness of the circuit board body 6, so that the conductive film 5 can be covered on the circuit board body 6.

[0027] During specific use, first, through the cooperation of the provided first conveyor 1 and the second conveyor 2, the circuit board body 6 can be conveyed, so that the conductive film 5 is driven to be conveyed by the winding device 4. Then, for the conveyed conductive film 5, the guide rod 10 can provide a guiding effect on the conductive film 5. Subsequently, through the connection between the adjusting assembly 11 and the pressing roller 12, the conductive film 5 and the circuit board body 6 are covered and pressed by the pressing roller 12. Then, for the excess conductive film 5 between the covered circuit board bodies 6, a power source is provided by the electric slide rail 71 and the electric slider 72, so that the cutting knife 73 is driven to move quickly. Therefore, the conductive film 5 connecting adjacent two circuit board bodies 6 can be cut and separated. Finally, again, driving force is provided through the electric push rod 91 in the pressing assembly 9, the pressing plate 92 is driven to perform lifting adjustment on the support frame 8. And during the lifting adjustment of the pressing plate 92, through the cooperation of the provided positioning rod 13 and the sliding sleeve, stability can be provided for the lifting adjustment of the pressing plate 92, so that the pressing plate 92 drives the rubber pad 93 to apply pressure to the circuit board body 6 covered with the conductive film 5 again, making the conductive film 5 and the circuit board body 6 fit tightly together.

[0028] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An organic conductive film covering device for an FPC circuit board, comprising a first conveying frame (1) and a second conveying frame (2), characterized in that: The outer walls of the two opposing ends of the first conveying frame (1) and the second conveying frame (2) are fixedly connected with a support seat (3); a winding device (4) is arranged on the top of the support seat (3); a conductive film (5) is wound around the surface of the winding device (4); a circuit board body (6) used in conjunction with the conductive film (5) is placed on the first conveying frame (1); a cutting mechanism (7) is arranged on the inner side wall of the support seat (3); a support frame (8) is fixedly connected to the top of the second conveying frame (2); a pressing assembly (9) is arranged on the support frame (8).

2. The organic conductive film covering device for an FPC circuit board according to claim 1, characterized in that: A guide rod (10) is fixedly connected to the opposite side of the support seat (3), and the guide rod (10) is arranged on a side close to the first conveying frame (1). Adjustment components (11) are arranged at both ends of the guide rod (10), and a pressure roller (12) is fixedly connected to the lower end of the adjustment component (11), and the conductive film (5) is attached to the surface of the guide rod (10) and the pressure roller (12).

3. The organic conductive film covering device for an FPC circuit board according to claim 2, characterized in that: The cutting mechanism (7) comprises an electric slide rail (71) and an electric slider (72); the electric slide rail (71) is mounted on the support seat (3) and is located below the winding device (4); the electric slider (72) is slidably connected to the electric slide rail (71); and a cutting knife (73) for dividing the conductive film (5) is provided at the lower end of the electric slider (72).

4. The organic conductive film covering device for an FPC circuit board according to claim 1, characterized in that: The pressing assembly (9) comprises an electric push rod (91), the electric push rod (91) is fixed on the top of the support frame (8), the piston rod of the electric push rod (91) is fixedly connected to a pressing plate (92), and the lower surface of the pressing plate (92) is fixedly connected to a rubber pad (93).

5. The organic conductive film covering device for an FPC circuit board according to claim 4, characterized in that: Positioning rods (13) are fixedly connected to both ends of the upper surface of the pressure plate (92); the top of the positioning rod (13) passes through the support frame (8) via a sliding sleeve and is fixedly connected to a limiting block (14).

6. The organic conductive film covering device for an FPC circuit board according to claim 2, characterized in that: The adjustment assembly (11) comprises a connecting rod (111), wherein the connecting rod (111) is fixed to both ends of the pressure roller (12), and one end of the connecting rod (111) passes through the guide rod (10) through a movable sleeve (112) and extends upward.

7. The organic conductive film covering device for an FPC circuit board according to claim 6, characterized in that: A spring (113) is sleeved on the surface of the connecting rod (111), the top of the spring (113) is fixed on the guide rod (10), and the bottom of the spring (113) is fixed on the surface of the pressure roller (12).

Images