High-temperature-resistant 96PinDIP device

By designing a split structure of high-temperature resistant 96PinDIP device, the problems of inconvenience in disassembly and low capacity efficiency of conventional 96PinDIP devices are solved, and the convenience of disassembly and assembly and capacity efficiency are achieved, and the impact of PIN foot damage is reduced.

CN222967198UActive Publication Date: 2025-06-10JIANGXI FENGQIANG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421656038.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-15
Publication Date
2025-06-10
Estimated Expiration
2034-07-15

AI Technical Summary

Technical Problem

Due to the integrated structure and PIN wire wrap design, conventional 96PinDIP devices have inconvenient disassembly and assembly, low production capacity efficiency, difficult line packs to be placed, and poor pin puncture of tin wrap wires. Because the device is an integrated structure, it cannot be disassembled and assembled, resulting in the scrapping of the entire finished product when an abnormality occurs.

Method used

A high-temperature 96PinDIP device is designed, adopting a split structure of the upper cover, lower cover and movable box. The lower cover is a frame-type hollow structure and can be detachably connected to the movable box. The 48 PIN pins are divided into two separate 48 PIN pins, which are convenient for disassembly and assembly and maintenance.

Benefits of technology

It realizes the convenience of overall disassembly and assembly, avoids the problem of single damage requiring overall replacement, reduces the possibility of mutual influence between PIN feet, improves production capacity efficiency, and facilitates the replacement and processing of PIN feet.

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Abstract

The utility model discloses a high-temperature-resistant 96PinDIP device, which belongs to the technical field of DIP devices and comprises an upper cover, a lower cover and a heat-resistant layer. The lower cover is of a frame type hollow structure and is detachably connected with the upper cover; the movable box is detachably connected to the inner wall of the lower cover, the movable box and the lower cover are each provided with 48 PINs, the 48 PINs of the movable box and the 48 PINs of the lower cover are arranged in a rectangular array, and the upper cover, the movable box and the lower cover are all made of high-temperature-resistant materials. The high-temperature-resistant 96PinDIP device is convenient to disassemble and assemble, and due to the split type design, the problem that the whole device needs to be replaced when a single device is damaged is solved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of DIP devices, in particular to a high-temperature resistant 96-pin DIP device. Background Art

[0002] The conventional 96-pin DIP device product has an integrated structure, with the upper and lower cover structures assembled simultaneously, and multiple rows of straight PIN feet on both sides. Due to the limitation of the PIN pitch space, the PIN winding inside the product needs to be bent outward, and the size of the outward bend is not easy to control and manage. There are problems such as difficulty in assembly and in placing the wire coil, which affects the production efficiency. At the same time, there are often defects such as the PIN feet piercing the tin-coated wire. Moreover, since the device has an integrated structure and is potted with glue, it cannot be disassembled and assembled. Any of the above abnormalities will result in the scrapping of the entire finished product and cannot be repaired. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a high-temperature resistant 96-pin DIP device to solve the problems raised in the background art.

[0004] To achieve the above purpose, the utility model provides the following technical solution: A high-temperature resistant 96-pin DIP device, comprising:

[0005] An upper cover;

[0006] A lower cover, which is a frame-type hollow structure and is detachably connected to the upper cover;

[0007] A movable box, which is detachably connected to the inner wall of the lower cover, and both the movable box and the lower cover are provided with 48 PIN feet.

[0008] As a preferred implementation, the 48 PIN feet of the movable box and the lower cover are arranged in a rectangular array.

[0009] As a preferred implementation, the upper cover, the movable box and the lower cover are all made of high-temperature resistant materials.

[0010] Compared with the prior art, the technical effects and advantages of the utility model are:

[0011] For this high-temperature resistant 96-pin DIP device, during use, the design of the upper cover, the lower cover and the movable box makes the overall disassembly and assembly convenient, facilitating subsequent disassembly, assembly and maintenance;

[0012] For this high-temperature resistant 96-pin DIP device, thanks to the design of the lower cover and the movable box, the 96 PIN feet are divided into two separate groups of 48 PIN feet. Even if some PIN feet are damaged, only a part needs to be replaced, instead of the operation of replacing all 96 PIN feet as in the prior art. Moreover, during processing, it can also be divided into two parts for processing, and each group of 48 PIN feet is further divided into 4 large arrays, that is, each group of 12 PIN feet forms a group, which is also convenient for sorting;

[0013] For the high-temperature resistant 96 Pin DIP device, the installation method of the PIN pins of the lower cover and the movable box has a larger space compared with the traditional strip-shaped cover installation method.

[0014] The high-temperature resistant 96 Pin DIP device is not only convenient for disassembly and assembly, but also has a split design, which avoids the problem that when a single part is damaged, the whole needs to be replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic structural diagram of the present invention;

[0017] Figure 2 It is a schematic structural diagram of the disassembled state of the present invention;

[0018] Figure 3 It is a bottom view of the present invention.

[0019] Description of the reference numerals in the drawings:

[0020] In the figure:

[0021] 1. Upper cover; 2. Lower cover; 3. Movable box. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] In the following description, a large number of specific details are given to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some well-known technical features are not described.

[0023] Unless otherwise defined, the up, down, left, right, front, back, inner and outer directions involved in this article are based on the up, down, left, right, front, back, inner and outer directions in the drawings shown in the present invention, and are hereby explained together.

[0024] The connection method can adopt existing methods such as bonding, welding, bolt connection, etc., according to actual needs.

[0025] Please refer to Figures 1 to 3 As shown, a high-temperature resistant 96 Pin DIP device, this embodiment includes:

[0026] Upper cover 1;

[0027] Lower cover 2, which is a frame - type hollow structure and is detachably connected to the upper cover 1;

[0028] Movable box 3, which is detachably connected to the inner wall of the lower cover 2. Both the movable box 3 and the lower cover 2 are equipped with 48 PIN feet. When a single PIN foot is damaged, the corresponding movable box 3 or lower cover 2 can be replaced, and there is no need to replace the whole.

[0029] The 48 PIN feet of the movable box 3 and the lower cover 2 are arranged in a rectangular array, and every 48 PIN feet are divided into 4 parts, with each part consisting of 12 PIN feet. Compared with the strip - shaped design, the space is larger, reducing the possibility of mutual influence between PIN feet.

[0030] The upper cover 1, the movable box 3 and the lower cover 2 are all made of high - temperature - resistant materials.

[0031] Working principle

[0032] Before using this high - temperature - resistant 96 - Pin DIP device, the PIN feet are pre - connected, and then the upper cover 1, the lower cover 2 and the movable box 3 are installed. When maintenance is required, the lower cover 2 and the movable box 3 can be disassembled and replaced.

[0033] It should be noted that in this article, relational terms such as "one" and "two" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non - exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to this process, method, article or device. Without further limitation, an element defined by the statement "comprising a......" does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0034] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A high temperature resistant 96PinDIP device, characterized in that: include: Upper cover (1); A lower cover (2), wherein the lower cover (2) is a frame-type hollow structure and is detachably connected to the upper cover (1); The movable box (3) is detachably connected to the inner wall of the lower cover (2), and both the movable box (3) and the lower cover (2) are equipped with 48 PIN pins.

2. A high temperature resistant 96PinDIP device according to claim 1, characterized in that: The 48 PIN pins of the movable box (3) and the lower cover (2) are arranged in a rectangular array.

3. The high temperature resistant 96PinDIP device according to claim 1, characterized in that: The upper cover (1), the movable box (3) and the lower cover (2) are all made of high temperature resistant materials.