Heat dissipation type aluminum substrate

Abstract

The utility model relates to a heat dissipation type aluminum substrate, which belongs to the technical field of aluminum substrates and comprises an aluminum substrate body, a heat dissipation mechanism is arranged on the outer side of the aluminum substrate body, and the heat dissipation mechanism comprises a first vapor chamber movably connected with the top of the aluminum substrate body. The interior of the first vapor chamber is in threaded connection with a fixing bolt which is in threaded connection with the aluminum substrate body, and a plurality of heat conduction plates are fixedly installed at the top of the first vapor chamber. According to the heat dissipation type aluminum substrate, the first vapor chamber and the heat conduction plate can be installed and fixed to the top of the aluminum substrate body through fixing bolts and can also be rapidly disassembled, the movable plate can be driven to move under the action of reset springs, the movable plate and limiting blocks, and the movable plate starts to stably move under limiting of the limiting blocks; and the movable plate moves to drive the limiting rod to reset until the limiting rod and the plug pin are connected in an inserted mode, rapid assembling, fixing or disassembling can be conducted, and overhauling, cleaning and rapid heat dissipation can be conveniently conducted.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, and specifically relates to a heat-dissipating aluminum substrate. Background Technique

[0002] An aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Common single-sided aluminum substrates are usually composed of three layers, namely a circuit layer (copper foil), an insulating layer, and a metal base layer. Due to its good heat dissipation effect, aluminum substrates are widely used in automotive circuit boards. An aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board is composed of three layers, namely a circuit layer (copper foil), an insulating layer, and a metal base layer. It is commonly found in LED lighting products, with two sides. The white side is for soldering LED pins, and the other side shows the natural color of aluminum. Generally, a heat-conducting paste is applied and then it is in contact with the heat-conducting part. There are also ceramic substrates, etc.

[0003] The existing aluminum substrate has a single structure and no heat dissipation structure. During use, a large amount of heat will be generated, and the heat dissipation efficiency of the aluminum substrate is relatively low. As a result, the heat of the aluminum substrate will still gradually rise during long-term operation, which will interfere with the subsequent operation of the components on the aluminum substrate. Moreover, the disassembly and assembly steps of the existing heat dissipation components of the aluminum substrate are relatively cumbersome. When the staff needs to repair or clean the heat dissipation components, it takes a long time to disassemble them, which interferes with the overall cleaning or repair efficiency of the staff and reduces its own service life. Therefore, in view of the above problems, this application proposes another technical solution to solve them. Content of the Utility Model

[0004] In view of the deficiencies of the prior art, the utility model provides a heat-dissipating aluminum substrate, which has the advantages of being convenient for more effective heat dissipation and can be quickly disassembled and assembled for maintenance and cleaning, etc., and solves the problems that the existing aluminum substrate has a single structure, no heat dissipation structure, a large amount of heat will be generated during use, the heat dissipation efficiency of the aluminum substrate is relatively low, resulting in the heat of the aluminum substrate still gradually rising during long-term operation, which will interfere with the subsequent operation of the components on the aluminum substrate, and the disassembly and assembly steps of the existing heat dissipation components of the aluminum substrate are relatively cumbersome, resulting in the staff taking a long time to disassemble them when they need to repair or clean the heat dissipation components, which interferes with the overall cleaning or repair efficiency of the staff and reduces its own service life.

[0005] To achieve the above object, the utility model provides the following technical solution: A heat-dissipating aluminum substrate, including an aluminum substrate body, and a heat dissipation mechanism is arranged on the outer side of the aluminum substrate body;

[0006] The heat dissipation mechanism includes a first heat sink plate movably connected to the top of the aluminum substrate body. A fixing bolt threadedly connected to the aluminum substrate body is threadedly connected inside the first heat sink plate. A plurality of heat conducting plates are fixedly installed on the top of the first heat sink plate. A heat conducting tube fixedly connected to the heat conducting plates is fixedly connected to the top of the first heat sink plate. A second heat sink plate is fixedly installed at the bottom of the aluminum substrate body. An adjusting and disassembling mechanism is arranged inside the aluminum substrate body.

[0007] Furthermore, the adjusting and disassembling mechanism includes two reset springs fixedly installed inside the aluminum substrate body. A movable plate fixedly installed on one side of the reset spring. Limit blocks slidably connected to the aluminum substrate body are fixedly installed at the top and bottom of the movable plate. A limiting rod extending to the outside is fixedly installed on one side of the movable plate. A plug pin engaged with the limiting rod is fixedly installed on the top of the second heat sink plate.

[0008] Furthermore, the number of the heat conducting plates is several, and the heat conducting plates are evenly arranged on the top of the first heat sink plate.

[0009] Furthermore, a fixing groove is formed inside the heat conducting plate. The heat conducting tube is fixedly connected to the heat conducting plate through the fixing groove, and the shape of the heat conducting tube is S-shaped.

[0010] Furthermore, a limiting groove is formed inside the aluminum substrate body. The limit block is slidably connected to the aluminum substrate body through the limiting groove.

[0011] Furthermore, movable grooves are formed on both sides of the aluminum substrate body. The limiting rod is movably connected to the aluminum substrate body through the movable grooves.

[0012] Furthermore, a socket is formed at the bottom of the aluminum substrate body. The plug pin is inserted into the aluminum substrate body through the socket.

[0013] Furthermore, the shape of the limiting rod is U-shaped, the shape of the plug pin is L-shaped, and the limiting rod and the plug pin are engaged with each other.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0015] For this heat dissipating aluminum substrate, through the provided heat dissipation mechanism, the first heat sink plate and the heat conducting plates can be installed and fixed on the top of the aluminum substrate body by using the fixing bolts, and can also be quickly disassembled. With the action of the reset springs, the movable plate and the limit blocks, the movable plate can be driven to move. The movable plate starts to move stably under the limitation of the limit blocks. The movement of the movable plate drives the limiting rod to move in a reset manner until the limiting rod is inserted into the plug pin, then rapid assembly and fixation or disassembly can be carried out, which is convenient for maintenance, cleaning and rapid heat dissipation, and helps to increase the heat dissipation performance of the device. Description of the Drawings

[0016] Figure 1 This is a schematic cross-sectional view of the structure of the present utility model;

[0017] Figure 2 This is a schematic top view of the structure of the present utility model;

[0018] Figure 3 This is a schematic perspective view of a partial structure of the present utility model;

[0019] Figure 4 This is an enlarged schematic view of structure A in the figure of the present utility model.

[0020] In the figure: 1. Aluminum substrate body; 2. Return spring; 3. Movable plate; 4. Limit block; 5. Limit rod; 6. Plug; 101. First heat sink plate; 102. Fixed bolt; 103. Heat conduction plate; 104. Heat conduction tube; 105. Second heat sink plate. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-4 , a heat dissipation type aluminum substrate in this embodiment includes an aluminum substrate body 1, and a heat dissipation mechanism is arranged on the outer side of the aluminum substrate body 1.

[0023] In this embodiment, the heat dissipation mechanism includes a first heat sink plate 101 movably connected to the top of the aluminum substrate body 1. A fixed bolt 102 threadedly connected to the aluminum substrate body 1 is threadedly connected inside the first heat sink plate 101. A plurality of heat conduction plates 103 are fixedly installed on the top of the first heat sink plate 101. The number of the heat conduction plates 103 is several, and the heat conduction plates 103 are evenly arranged on the top of the first heat sink plate 101, which helps to dissipate heat more effectively.

[0024] Among them, a heat conduction tube 104 fixedly connected to the heat conduction plate 103 is fixedly connected to the top of the first heat sink plate 101. A fixing groove is opened inside the heat conduction plate 103, and the heat conduction tube 104 is fixedly connected to the heat conduction plate 103 through the fixing groove. The shape of the heat conduction tube 104 is S-shaped, which helps to fix the heat conduction tube 104 and increase the heat dissipation effect. A second heat sink plate 105 is fixedly installed at the bottom of the aluminum substrate body 1.

[0025] Embodiment 2. An adjustment and disassembly mechanism is provided inside the aluminum substrate body 1. The adjustment and disassembly mechanism includes two reset springs 2 fixedly installed inside the aluminum substrate body 1, a movable plate 3 fixedly installed on one side of the reset spring 2. Limiting blocks 4 fixedly installed at the top and bottom of the movable plate 3 and slidably connected to the aluminum substrate body 1 are provided. A limiting groove is formed inside the aluminum substrate body 1, and the limiting blocks 4 are slidably connected to the aluminum substrate body 1 through the limiting groove, which helps to limit the limiting blocks 4.

[0026] Among them, a limiting rod 5 extending to the outside is fixedly installed on one side of the movable plate 3. Movable grooves are formed on both sides of the aluminum substrate body 1, and the limiting rod 5 is movably connected to the aluminum substrate body 1 through the movable grooves, which helps to perform snap-fitting and fixing of the limiting rod 5. A plug 6 snap-fitted with the limiting rod 5 is fixedly installed on the top of the second heat sink plate 105. A slot is formed at the bottom of the aluminum substrate body 1, and the plug 6 is inserted into the aluminum substrate body 1 through the slot. The shape of the limiting rod 5 is U-shaped, and the shape of the plug 6 is L-shaped. The limiting rod 5 and the plug 6 are snap-fitted with each other, which helps the plug 6 to perform snap-fitting and fixing of the limiting rod 5.

[0027] It should be noted that for this heat-dissipating aluminum substrate, through the provided heat-dissipating mechanism, the first heat sink plate 101 and the heat-conducting plate 103 can be installed and fixed on the top of the aluminum substrate body 1 by using the fixing bolts 102, and can also be quickly disassembled. By using the functions of the reset spring 2, the movable plate 3 and the limiting blocks 4, the movable plate 3 can be driven to move. The movable plate 3 starts to move stably under the limitation of the limiting blocks 4. The movement of the movable plate 3 drives the limiting rod 5 to move back until the limiting rod 5 and the plug 6 are inserted into each other, and then rapid assembly and fixing or disassembly can be carried out, which is convenient for maintenance, cleaning and rapid heat dissipation, and helps to increase the heat dissipation of the device.

[0028] The working principle of the above embodiment is as follows:

[0029] For this heat-dissipating aluminum substrate, when in use, first the first heat sink plate 101 and the heat-conducting plate 103 can be fixed on the top of the aluminum substrate body 1 by using the fixing bolts 102. Then the limiting rod 5 can be pressed, and the reset spring 2 is compressed by the limiting rod 5, thereby driving the limiting rod 5 to move until the limiting rod 5 moves and contracts. Then the second heat sink plate 105 can be inserted into the inside of the aluminum substrate body 1 through the plug 6. Then the limiting rod 5 can be released, and the reset spring 2 starts to automatically reset. The reset of the reset spring 2 drives the movable plate 3 to move. The movable plate 3 starts to move stably under the limitation of the limiting blocks 4. The movement of the movable plate 3 drives the limiting rod 5 to move back until the limiting rod 5 and the plug 6 are inserted into each other, and then rapid assembly and fixing can be carried out;

[0030] Similarly, by using the fixing bolt 102 and the return spring 2, rapid disassembly can be achieved, facilitating maintenance and cleaning. During use, the first heat sink plate 101 and the second heat sink plate 105 distribute the generated heat, and the heat can be conducted and transported through the heat conduction plate 103 and the heat conduction tube 104, facilitating rapid heat dissipation and helping to improve the heat dissipation performance and practicality of the device.

[0031] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0032] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation aluminum substrate, comprising an aluminum substrate body (1), characterized in that: A heat dissipation mechanism is provided on the outer side of the aluminum substrate body (1); The heat dissipation mechanism comprises a first heat spreader (101) movably connected to the top of the aluminum substrate body (1); the first heat spreader (101) is internally threadedly connected to a fixing bolt (102) threadedly connected to the aluminum substrate body (1); a plurality of heat conduction plates (103) are fixedly installed on the top of the first heat spreader (101); a heat conduction pipe (104) fixedly connected to the heat conduction plate (103) is fixedly connected to the top of the first heat spreader (101); a second heat spreader (105) is fixedly installed on the bottom of the aluminum substrate body (1); and an adjustment and disassembly mechanism is provided inside the aluminum substrate body (1).

2. The heat dissipation aluminum substrate according to claim 1, characterized in that: The adjustment and disassembly mechanism comprises two return springs (2) fixedly mounted inside the aluminum substrate body (1), a movable plate (3) fixedly mounted on one side of the return spring (2), a limit block (4) slidably connected to the aluminum substrate body (1) fixedly mounted on the top and bottom of the movable plate (3), a limit rod (5) extending to the outside fixedly mounted on one side of the movable plate (3), and a latch (6) fixedly mounted on the top of the second heat spreader (105) and engaged with the limit rod (5).

3. The heat dissipation aluminum substrate according to claim 1, characterized in that: There are a plurality of heat conducting plates (103), and the heat conducting plates (103) are evenly arranged on the top of the first heat spreader (101).

4. The heat dissipation aluminum substrate according to claim 1, characterized in that: A fixing groove is provided inside the heat conducting plate (103), and the heat conducting pipe (104) is fixedly connected to the heat conducting plate (103) via the fixing groove. The shape of the heat conducting pipe (104) is S-shaped.

5. The heat dissipation aluminum substrate according to claim 2, characterized in that: A limiting groove is provided inside the aluminum substrate body (1), and the limiting block (4) is slidably connected to the aluminum substrate body (1) via the limiting groove.

6. The heat dissipation aluminum substrate according to claim 2, characterized in that: Movable grooves are provided on both sides of the aluminum substrate body (1), and the limiting rod (5) is movably connected to the aluminum substrate body (1) via the movable grooves.

7. The heat dissipation aluminum substrate according to claim 2, characterized in that: A slot is provided at the bottom of the aluminum substrate body (1), and the latch (6) is plugged into the aluminum substrate body (1) through the slot.

8. The heat dissipation aluminum substrate according to claim 2, characterized in that: The limiting rod (5) is in a U-shape, the latch pin (6) is in an L-shape, and the limiting rod (5) and the latch pin (6) are mutually engaged.

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