Heat dissipation material for folding electronic equipment

Abstract

The utility model discloses a heat dissipation material for folding electronic equipment. The heat dissipation material comprises a first heat dissipation material arranged on a first folding part and a second heat dissipation material arranged on a second folding part, the first heat dissipation material is used for heat dissipation of the first folding part; the second heat dissipation material is used for heat dissipation of the second folding part; a heat dissipation bridge is arranged between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is correspondingly arranged in a bending area between the first folding part and the second folding part; the heat dissipation bridge comprises a first protective layer and a second protective layer; a graphite heat dissipation functional layer is arranged between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded through an adhesive layer. The first protective layer and the second protective layer are respectively made of polyimide (PI) films; the adhesive layer is made of an epoxy resin material; according to the utility model, the problems of edge breaking, damage and fracture can be avoided in 400,000 folding experiments, the performance is more stable, and the service life is longer.

Description

Technical Field

[0001] The utility model relates to the technical field related to the improvement of heat dissipation materials for folding electronic devices, and particularly relates to a heat dissipation material for folding electronic devices that can withstand 400,000 folding tests without edge breakage, damage, or fracture. Background Art

[0002] With the development of technology, the industry has higher and higher requirements for the integrated form of products in the fields of 3C (computers, communications, and consumer electronics), automobiles, aerospace, high-speed railways, sports equipment, lighting, drones, medical devices, and electric bicycles, especially in the applications of mobile phones and laptops; high-end products have already released folding solutions, and the thermal management of highly integrated electronic products also faces problems that have to be solved.

[0003] As shown in the attached Figure 1-2 figure, the heat dissipation materials commonly used in folding electronic devices currently include a first heat dissipation material 10 provided on a first folding portion and a second heat dissipation material 30 provided on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; between the first heat dissipation material 10 and the second heat dissipation material 30 is a heat dissipation bridge 20; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, playing a role in temperature equalization and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; between the first protective layer 31 and the second protective layer 33 is provided a graphite heat dissipation functional layer 32; the graphite heat dissipation functional layer 32 is bonded to the first protective layer 31 and the second protective layer 33 with an adhesive layer 34; the first protective layer 31 and the second protective layer 33 are made of PET and PU; the adhesive layer 34 is made of acrylic material; after the heat dissipation material for folding electronic devices with this structure and material is used for a long time, creases are likely to appear in the bending part of the graphite heat dissipation functional layer 32 of the heat dissipation bridge 20, and in severe cases, it will break, affecting its function; the peripheries of the first protective layer 31 and the second protective layer 33 of the heat dissipation bridge 20 will fall off and come into contact, that is, the adhesive layer 34 can no longer bond the first protective layer 31 and the second protective layer 33, resulting in edge breakage; in this way, the performance of the heat dissipation bridge 20 will be reduced or even fail.

[0004] To overcome the above defects, we have developed a heat dissipation material for folding electronic devices that can withstand 400,000 folding tests without edge breakage, damage, or fracture. Summary of the Invention

[0005] To overcome the deficiencies of the prior art, the present utility model discloses a heat dissipation material for a foldable electronic device that can withstand 400,000 folding experiments without edge breakage, damage, or fracture.

[0006] To achieve the above object, the present utility model is realized through the following technical solutions:

[0007] The present utility model discloses a heat dissipation material for a foldable electronic device, including a first heat dissipation material disposed on a first folding portion and a second heat dissipation material disposed on a second folding portion; the first folding portion can be folded relative to the second folding portion; the first heat dissipation material is used for heat dissipation of the first folding portion; the second heat dissipation material is used for heat dissipation of the second folding portion; a heat dissipation bridge is provided between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is correspondingly disposed in the bending area between the first folding portion and the second folding portion for heat diffusion between the first heat dissipation material and the second heat dissipation material, playing a role in temperature equalization and heat dissipation; the heat dissipation bridge includes a first protective layer and a second protective layer; a graphite heat dissipation functional layer is provided between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded by an adhesive layer; the first protective layer and the second protective layer are respectively made of polyimide film PI; the adhesive layer is made of epoxy resin material.

[0008] Preferably, the graphite heat dissipation functional layer is bonded to the first protective layer and the second protective layer respectively by an adhesive layer; the graphite heat dissipation functional layer is completely wrapped by the adhesive layer; the graphite heat dissipation functional layer is not in direct contact with the first protective layer and the second protective layer.

[0009] Preferably, the graphite heat dissipation functional layer is bonded to the first protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the second protective layer, and the graphite heat dissipation functional layer is completely wrapped by the adhesive layer and the second protective layer.

[0010] Preferably, the graphite heat dissipation functional layer is bonded to the second protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the first protective layer, and the graphite heat dissipation functional layer is completely wrapped by the adhesive layer and the first protective layer.

[0011] Preferably, the graphite heat dissipation functional layer is in direct contact with the first protective layer and the second protective layer respectively, and the graphite heat dissipation functional layer is completely wrapped by the adhesive layer, the first protective layer, and the second protective layer.

[0012] Compared with the prior art, the present utility model has at least the following advantages:

[0013] The heat dissipation material for the foldable electronic device of the present utility model can withstand 400,000 folding experiments without edge breakage, damage, or fracture, has more stable performance, and a longer service life. Description of the Drawings

[0014] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for description in the embodiments.

[0015] Figure 1 Schematic diagram of the working principle of the heat dissipation material for a foldable electronic device according to the present utility model;

[0016] Figure 2 Schematic diagram of the structure of the first embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present utility model;

[0017] Figure 3 Schematic diagram of the structure of the second embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present utility model;

[0018] Figure 4 Schematic diagram of the structure of the third embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present utility model;

[0019] Figure 5 Schematic diagram of the structure of the fourth embodiment of the heat dissipation bridge of the heat dissipation material for a foldable electronic device according to the present utility model;

[0020] Among them, 10, the first heat dissipation material; 20, the heat dissipation bridge; 30, the second heat dissipation material; 31, the first protective layer; 32, the graphite heat dissipation functional layer; 33, the second protective layer; 34, the adhesive layer. Detailed implementation manners

[0021] The following will further elaborate on the present utility model in conjunction with the embodiments and the drawings, so that those skilled in the art can implement it with reference to the description in the specification. Embodiment

[0022] See Figure 1-2As shown, Embodiment 1 of the present utility model discloses a heat dissipation material for a foldable electronic device, including a first heat dissipation material 10 disposed on a first folding portion and a second heat dissipation material 30 disposed on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; there is a heat dissipation bridge 20 between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly disposed in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, playing a role in temperature equalization and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is disposed between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 is bonded to the first protective layer 31 and the second protective layer 33 by the adhesive layer 34; the graphite heat dissipation functional layer 32 is completely wrapped by the adhesive layer 34; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of an epoxy resin material; the graphite heat dissipation functional layer 32 is made of a common graphite heat dissipation material and is not in direct contact with the first protective layer 31 and the second protective layer 33; when this embodiment is used, it can be bent upward or downward. Embodiment

[0023] See Figure 1 、 3As shown in the figure, Embodiment 2 of the present utility model discloses a heat dissipation material for a folding electronic device, which includes a first heat dissipation material 10 disposed on a first folding portion and a second heat dissipation material 30 disposed on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; there is a heat dissipation bridge 20 between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly disposed in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, playing a role in temperature equalization and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is disposed between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 and the first protective layer 31 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 is in direct contact with the second protective layer 33, and the graphite heat dissipation functional layer 32 is completely wrapped by the adhesive layer 34 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, the upward bending effect is better. Embodiment

[0024] See Figure 1 、 4As shown in the figure, Embodiment 3 of the present utility model discloses a heat dissipation material for a folding electronic device, which includes a first heat dissipation material 10 provided on a first folding portion and a second heat dissipation material 30 provided on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; there is a heat dissipation bridge 20 between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly arranged in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, playing a role of temperature equalization and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is arranged between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 and the second protective layer 33 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 is in direct contact with the first protective layer 31, and the graphite heat dissipation functional layer 32 is completely wrapped by the adhesive layer 34 and the first protective layer 31; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, the downward bending effect is better. Embodiment

[0025] See Figure 1 、 5As shown in the figure, Embodiment 4 of the present utility model discloses a heat dissipation material for a folding electronic device, which includes a first heat dissipation material 10 disposed on a first folding portion and a second heat dissipation material 30 disposed on a second folding portion; the first folding portion (not shown) can be folded relative to the second folding portion (not shown); the first heat dissipation material 10 is used for heat dissipation of the first folding portion; the second heat dissipation material 30 is used for heat dissipation of the second folding portion; a heat dissipation bridge 20 is provided between the first heat dissipation material 10 and the second heat dissipation material 30; the heat dissipation bridge 20 is correspondingly disposed in the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material 10 and the second heat dissipation material 30, playing a role in temperature equalization and heat dissipation; the heat dissipation bridge 20 includes a first protective layer 31 and a second protective layer 33; a graphite heat dissipation functional layer 32 is provided between the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are bonded by an adhesive layer 34; the graphite heat dissipation functional layer 32 is in direct contact with the first protective layer 31 and the second protective layer 33 respectively, and the graphite heat dissipation functional layer 32 is completely wrapped by the adhesive layer 34, the first protective layer 31 and the second protective layer 33; the first protective layer 31 and the second protective layer 33 are respectively made of polyimide film PI; the adhesive layer 34 is made of epoxy resin material; the graphite heat dissipation functional layer 32 is made of common graphite heat dissipation material; when this embodiment is used, it can be bent upward or downward.

[0026] Only one bending area is mentioned in the above embodiment. When there are two or more bending areas, it can be achieved by simply combining according to the above embodiment, and will not be elaborated here.

[0027] Compared with the prior art, the present utility model has at least the following advantages:

[0028] The heat dissipation material for the folding electronic device described in the present utility model can not have problems such as edge breakage, damage, and fracture in 400,000 folding experiments, with more stable performance and longer service life.

[0029] Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model; therefore, the present utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation material for a foldable electronic device, comprising a first heat dissipation material arranged on a first folding portion and a second heat dissipation material arranged on a second folding portion; the first folding portion can be folded relative to the second folding portion; the first heat dissipation material is used for heat dissipation of the first folding portion; the second heat dissipation material is used for heat dissipation of the second folding portion; a heat dissipation bridge is provided between the first heat dissipation material and the second heat dissipation material; the heat dissipation bridge is provided in correspondence with the bending area between the first folding portion and the second folding portion, and is used for heat diffusion between the first heat dissipation material and the second heat dissipation material, and plays a role in temperature uniformity and heat dissipation; the heat dissipation bridge comprises a first protective layer and a second protective layer; a graphite heat dissipation functional layer is provided between the first protective layer and the second protective layer; the first protective layer and the second protective layer are bonded by an adhesive layer; the characteristics are as follows: The first protective layer and the second protective layer are respectively made of polyimide film PI; the adhesive layer is made of epoxy resin material.

2. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the first protective layer and the second protective layer respectively by adhesive layers; the graphite heat dissipation functional layer is fully wrapped by the adhesive layer; the graphite heat dissipation functional layer is not in direct contact with the first protective layer and the second protective layer.

3. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the first protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the second protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the second protective layer.

4. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is bonded to the second protective layer by an adhesive layer; the graphite heat dissipation functional layer is in direct contact with the first protective layer, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer and the first protective layer.

5. The heat dissipation material for foldable electronic devices according to claim 1, characterized in that: The graphite heat dissipation functional layer is in direct contact with the first protective layer and the second protective layer respectively, and the graphite heat dissipation functional layer is fully wrapped by the adhesive layer, the first protective layer and the second protective layer.

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