Long-service-life heat dissipation type light-emitting diode seat

Abstract

The utility model belongs to the technical field of diodes, and particularly relates to a long-service-life heat dissipation type light-emitting diode seat which comprises a bottom plate, a positive electrode support and a negative electrode support are arranged on the two sides of the upper portion of the bottom plate respectively, and packaging glue is packaged on the outer sides of the positive electrode support and the negative electrode support. A positive electrode pin and a negative electrode pin are arranged at the bottom end of the positive electrode support and the bottom end of the negative electrode support respectively, the bottom end of the positive electrode pin and the bottom end of the negative electrode pin penetrate through the first sealing ring and extend to the outside, a hollow splitter plate is installed at the center of the upper surface of the bottom plate, and the hollow splitter plate is located below the interior of the packaging adhesive. And an air inlet pipe is mounted in the center of the lower surface of the hollow splitter plate. According to the utility model, the heat dissipation on the packaging adhesive is effectively improved, the situation that the service life of the LED is shortened as the LED main body is in a high-temperature environment for a long time due to over-high heat on the packaging adhesive is avoided, the service life of the LED is prolonged, and the practicability is strong.

Description

Technical Field

[0001] The utility model belongs to the technical field of diodes, and particularly relates to a long-life heat dissipation type light-emitting diode socket. Background Technique

[0002] A light-emitting diode, abbreviated as LED, is a commonly used light-emitting device that emits light by the recombination of electrons and holes, and can efficiently convert electrical energy into light energy. The energy consumption of a light-emitting diode is one-tenth of that of an incandescent lamp and one-fourth of that of an energy-saving lamp. Because of this energy-saving feature, the application range of LED lamps is very wide.

[0003] After retrieval, the patent publication number CN216250782U discloses a long-life energy-saving light-emitting diode, which includes a positive electrode bracket, a light-emitting diode body, a negative electrode bracket and a bottom plate. One end of the top of the bottom plate is provided with a positive electrode bracket, and the other end of the top of the bottom plate is provided with a negative electrode bracket. The top end of the negative electrode bracket is provided with a fixing seat, and the top end of the fixing seat is provided with a light-emitting diode body. The outer sides of the positive electrode bracket and the negative electrode bracket are encapsulated with encapsulating glue, and the bottom ends of the positive electrode pin and the negative electrode pin both pass through the bottom plate. The bottom plate is evenly provided with glue overflow holes. By installing a bottom plate, a positive electrode pin, a positive electrode bracket, a negative electrode pin, a negative electrode bracket, a light-emitting diode body, and encapsulating glue, and evenly arranging glue overflow holes on the bottom plate, when encapsulating and applying glue, the excess glue can leak out through the glue overflow holes, and the glue is not easy to adhere to the positive electrode pin and the negative electrode pin, and it is not easy to cause a short circuit, thereby prolonging the service life of the light-emitting diode body.

[0004] When the above solution is actually used, the light-emitting diode body will generate a certain amount of heat during operation, and the heat will be transferred to the encapsulating glue. However, the above technical solution cannot effectively dissipate the heat on the encapsulating glue, and it is easy to make the light-emitting diode body stay in a high-temperature environment for a long time, which is likely to reduce the service life of the light-emitting diode body. Therefore, we propose a long-life heat dissipation type light-emitting diode socket to solve the existing problems. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a long-life heat dissipation type light-emitting diode socket to solve the problems put forward in the above background technique.

[0006] To solve the above technical problems, the utility model provides the following technical solutions:

[0007] A long-life heat-dissipating light-emitting diode socket, comprising a bottom plate: on both sides above the bottom plate, a positive electrode bracket and a negative electrode bracket are respectively arranged. The outer sides of the positive electrode bracket and the negative electrode bracket are encapsulated with encapsulating glue. At the bottom ends of the positive electrode bracket and the negative electrode bracket, a positive electrode pin and a negative electrode pin are respectively arranged. The bottom ends of the positive electrode pin and the negative electrode pin both penetrate through the first sealing ring and extend to the outside. At the central position on the upper surface of the bottom plate, a hollow flow-dividing plate is installed, and the hollow flow-dividing plate is located below the encapsulating glue inside. At the central position on the lower surface of the hollow flow-dividing plate, an air inlet pipe is installed. The bottom end of the air inlet pipe penetrates through the second sealing ring and extends to the outside. On the outer wall of the hollow flow-dividing plate, a hollow heat-dissipating plate is installed, and the other end of the hollow heat-dissipating plate penetrates through the encapsulating glue and extends to the outside. On both side surfaces at the other end of the hollow heat-dissipating plate, air outlet holes are opened. At the top end of the negative electrode bracket, a light-emitting diode body is arranged.

[0008] Further, the first sealing ring is installed on the pore wall of the first through hole, and the first through hole is opened on both sides of the surface of the bottom plate.

[0009] Further, the second sealing ring is installed on the pore wall of the second through hole, and the second through hole is opened at the central position on the surface of the bottom plate.

[0010] Further, the inside of the hollow heat-dissipating plate is communicated with the inside of the hollow flow-dividing plate, and the inside of the air inlet pipe is communicated with the inside of the hollow flow-dividing plate.

[0011] Further, the light-emitting diode body is connected with the positive electrode bracket through a wire.

[0012] Further, the hollow flow-dividing plate, the hollow heat-dissipating plate and the air inlet pipe are all made of metal aluminum material.

[0013] With the above technical solutions, the present utility model provides a long-life heat-dissipating light-emitting diode socket, which has at least the following beneficial effects: Through the cooperation of structures such as a hollow flow-dividing plate, a hollow heat-dissipating plate, an air inlet pipe, and air outlet holes, when the present utility model is in natural heat dissipation, the heat generated by the work of the light-emitting diode body is transferred to the encapsulating glue, and the encapsulating glue transfers the heat to the hollow heat-dissipating plate. One end of the hollow heat-dissipating plate is located in the external environment, and the cold air in the external environment will take away the heat on the hollow heat-dissipating plate, increasing the heat dissipation area. Compared with the natural heat dissipation of a single encapsulating glue, the setting of the hollow heat-dissipating plate increases the heat dissipation rate and effect. When the air inlet pipe on the present utility model is connected to an external cold air conveying structure, the external cold air is conveyed into the hollow flow-dividing plate, and the cold air in the hollow flow-dividing plate is conveyed into the interior of the hollow heat-dissipating plate and discharged from the air outlet holes. During the above air flow process, the heat on the encapsulating glue can be effectively dissipated. Thus, the present utility model effectively improves the heat dissipation of the encapsulating glue, avoiding the situation that the high heat on the encapsulating glue causes the light-emitting diode body to be in a high-temperature environment for a long time, resulting in a reduction in the service life of the present utility model, and improving the service life of the present utility model, with strong practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present utility model and form a part of this application:

[0015] Figure 1 Schematic three-dimensional structure diagram of the long-life heat-dissipating light-emitting diode socket provided by the embodiment of this application;

[0016] Figure 2 Schematic structure diagram of the long-life heat-dissipating light-emitting diode socket provided by the embodiment of this application with the encapsulating glue removed;

[0017] Figure 3 Schematic internal structure diagram of the long-life heat-dissipating light-emitting diode socket provided by the embodiment of this application;

[0018] Figure 4 For Figure 3 Enlarged structure diagram at A in

[0019] Figure 5 Schematic structure diagram of the hollow flow-dividing plate of the long-life heat-dissipating light-emitting diode socket provided by the embodiment of this application.

[0020] In the figure: 1, encapsulating glue; 2, hollow heat-dissipating plate; 3, positive electrode pin; 4, negative electrode pin; 5, positive electrode bracket; 6, light-emitting diode body; 7, negative electrode bracket; 8, hollow flow-dividing plate; 9, bottom plate; 10, air inlet pipe; 11, first through hole; 12, first sealing ring; 13, second through hole; 14, second sealing ring; 15, air outlet hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1 to 5 , the long-life heat-dissipating light-emitting diode socket of the present utility model mainly includes a bottom plate 9: on both sides above the bottom plate 9, a positive electrode bracket 5 and a negative electrode bracket 7 are respectively arranged. The outer sides of the positive electrode bracket 5 and the negative electrode bracket 7 are encapsulated with encapsulating glue 1. At the bottom ends of the positive electrode bracket 5 and the negative electrode bracket 7, a positive electrode pin 3 and a negative electrode pin 4 are respectively arranged. The bottom ends of the positive electrode pin 3 and the negative electrode pin 4 both penetrate through the first sealing ring 12 and extend to the outside. At the central position on the upper surface of the bottom plate 9, a hollow flow-dividing plate 8 is installed, and the hollow flow-dividing plate 8 is located below the encapsulating glue 1. At the central position on the lower surface of the hollow flow-dividing plate 8, an air inlet pipe 10 is installed. The bottom end of the air inlet pipe 10 penetrates through the second sealing ring 14 and extends to the outside. A hollow heat-dissipating plate 2 is installed on the outer wall of the hollow flow-dividing plate 8, and the other end of the hollow heat-dissipating plate 2 penetrates through the encapsulating glue 1 and extends to the outside. Air outlet holes 15 are formed on both side surfaces at the other end of the hollow heat-dissipating plate 2. At the top end of the negative electrode bracket 7, a light-emitting diode body 6 is arranged. When the present utility model is in natural heat dissipation, the heat generated by the operation of the light-emitting diode body 6 will be transferred to the encapsulating glue 1, and the encapsulating glue 1 transfers the heat to the hollow heat-dissipating plate 2. One end of the hollow heat-dissipating plate 2 is in the external environment, and the cold air in the external environment will take away the heat on the hollow heat-dissipating plate 2, increasing the heat dissipation area. And compared with the natural heat dissipation of the single encapsulating glue 1, the setting of the hollow heat-dissipating plate 2 increases the heat dissipation rate and effect. When the air inlet pipe 10 on the present utility model is connected to an external cold air conveying structure, the external cold air is conveyed into the hollow flow-dividing plate 8, and the cold air in the hollow flow-dividing plate 8 will be conveyed into the interior of the hollow heat-dissipating plate 2 and discharged from the air outlet holes 15. During the above air flow process, the heat on the encapsulating glue 1 can be effectively dissipated. Therefore, the present utility model effectively improves the heat dissipation of the encapsulating glue 1, avoiding the situation that the heat on the encapsulating glue 1 is too high, causing the light-emitting diode body 6 to be in a high-temperature environment for a long time, resulting in the reduction of the service life of the present utility model, and improving the service life of the present utility model.

[0023] The first sealing ring 12 is installed on the inner wall of the first through hole 11. The first through hole 11 is opened on both sides of the surface of the bottom plate 9. The setting of the first sealing ring 12 can play a sealing role in the connection between the positive electrode pin 3 and the bottom plate 9 and the connection between the negative electrode pin 4 and the bottom plate 9. The second sealing ring 14 is installed on the inner wall of the second through hole 13. The setting of the second sealing ring 14 can play a sealing role in the connection between the air inlet pipe 10 and the bottom plate 9. The second through hole 13 is opened at the center position of the surface of the bottom plate 9. The inside of the hollow heat dissipation plate 2 is communicated with the inside of the hollow flow dividing plate 8. The inside of the air inlet pipe 10 is communicated with the inside of the hollow flow dividing plate 8. The light emitting diode body 6 is connected to the positive electrode bracket 5 through a wire. The hollow flow dividing plate 8, the hollow heat dissipation plate 2 and the air inlet pipe 10 are all made of metal aluminum material.

[0024] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0025] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A long-life heat dissipation type light emitting diode holder, characterized in that: The invention comprises a bottom plate (9), wherein a positive electrode support (5) and a negative electrode support (7) are respectively arranged on both sides above the bottom plate (9), the outer sides of the positive electrode support (5) and the negative electrode support (7) are encapsulated with encapsulation glue (1), the bottom ends of the positive electrode support (5) and the negative electrode support (7) are respectively provided with a positive electrode pin (3) and a negative electrode pin (4), the bottom ends of the positive electrode pin (3) and the negative electrode pin (4) both penetrate through a first sealing ring (12) and extend to the outside, and a hollow diverter plate (8) is installed at the center of the upper surface of the bottom plate (9), and the hollow diverter plate (8) 8) is located below the inside of the packaging glue (1), an air inlet pipe (10) is installed at the center position of the lower surface of the hollow diverter plate (8), the bottom end of the air inlet pipe (10) passes through the second sealing ring (14) and extends to the outside, a hollow heat sink (2) is installed on the outer wall of the hollow diverter plate (8), and the other end of the hollow heat sink (2) passes through the packaging glue (1) and extends to the outside, and air outlet holes (15) are provided on both side surfaces of the other end of the hollow heat sink (2), and a light-emitting diode body (6) is arranged at the top of the negative electrode bracket (7).

2. The long-life heat dissipation type light emitting diode holder according to claim 1, characterized in that: The first sealing ring (12) is mounted on the hole wall of the first through hole (11), and the first through hole (11) is opened on both sides of the surface of the bottom plate (9).

3. The long-life heat dissipation type light emitting diode holder according to claim 1, characterized in that: The second sealing ring (14) is mounted on the hole wall of the second through hole (13), and the second through hole (13) is opened at the center position of the surface of the bottom plate (9).

4. The long-life heat dissipation type light emitting diode holder according to claim 1, characterized in that: The interior of the hollow heat dissipation plate (2) is interconnected with the interior of the hollow diverter plate (8), and the interior of the air inlet pipe (10) is interconnected with the interior of the hollow diverter plate (8).

5. The long-life heat dissipation type light emitting diode holder according to claim 1, characterized in that: The light emitting diode body (6) is connected to the positive electrode support (5) via a wire.

6. The long-life heat dissipation type light emitting diode holder according to claim 1, characterized in that: The hollow diverter plate (8), the hollow heat sink plate (2) and the air inlet pipe (10) are all made of metal aluminum material.

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