Printed circuit board solder mask coating device

Abstract

The utility model discloses a printed circuit board solder resist coating device, and relates to the technical field of circuit board solder resist coating. The utility model relates to a solder resist coating device, in particular to a solder resist coating device, which solves the problems that the existing solder resist coating device lacks an effective limiting structure in the process of conveying a circuit substrate in a streamlined manner, the circuit substrate is insufficient in stability in the conveying and coating processes, and the overall working stability needs to be improved. Conveying rollers are arranged at the two ends of the belt conveyor, the outer surfaces of the conveying rollers are sleeved with a plurality of conveying belts at the same intervals, an air suction base is arranged on the inner side of the belt conveyor, a plurality of air suction holes are formed in the upper surface of the air suction base, and the air suction holes correspond to gaps between every two adjacent conveying belts in position. And the side surface of the air suction seat is fixedly connected with an air suction pipe. The effects that the circuit substrate can be limited, and it is ensured that the circuit substrate has high stability during conveying and coating are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of solder resist coating for circuit boards, and specifically relates to a solder resist coating device for printed circuit boards. Background Technique

[0002] When a circuit board is produced and manufactured, a solder resist layer needs to be coated on the surface of the substrate. At this time, a solder resist coating device is required. This device is one of the circuit board production and manufacturing devices and is also one of the basic devices for batch production and processing.

[0003] In the process of the existing solder resist coating device transporting the circuit board substrate in a flowing water manner, there is a lack of an effective limiting structure, and the circuit board substrate lacks stability during the transportation and coating processes, and the overall working stability needs to be improved. Content of the Utility Model

[0004] The purpose of the utility model is to provide a solder resist coating device for printed circuit boards to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A solder resist coating device for printed circuit boards, including a belt conveyor. Both ends of the belt conveyor are provided with conveying rollers, and the outer surfaces of the conveying rollers are sleeved with multiple conveying belts with consistent spacing. An air suction seat is arranged inside the belt conveyor. Multiple air suction holes are arranged on the upper surface of the air suction seat, and the air suction holes correspond to the gap positions between adjacent two conveying belts. A suction pipe is fixedly connected to the side surface of the air suction seat, and a vacuum pump is fixedly installed in the pipeline of the suction pipe.

[0006] Preferably, an installation seat is fixedly connected to each of the symmetric side surfaces of the belt conveyor. An installation hole is arranged on the outer surface of the installation seat, and a hydraulic rod is fixedly installed inside the installation hole. The telescopic end of the hydraulic rod is fixedly connected to a storage tank, and a coating rubber roller is rotatably connected to the lower port of the storage tank.

[0007] Preferably, a drying seat is fixedly installed on the upper surface of the belt conveyor, and multiple resistance heating tubes are fixedly installed on the inner top wall of the drying seat.

[0008] Preferably, a linear module is fixedly installed on the side surface of the drying seat, a cylinder is fixedly installed on the moving end of the linear module, and a suction cup is fixedly installed on the telescopic end of the cylinder.

[0009] Preferably, the cylinders are vertically distributed, and the linear modules are horizontally distributed.

[0010] Preferably, a limiting slide bar is arranged on the outer surface of the storage tank, a limiting slide hole is arranged on the outer surface of the installation seat, and the limiting slide bar penetrates through the inside of the limiting slide hole.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] 1. When the present utility model conveys the circuit board to be coated by the conveyor belt, the vacuum pump can be started. At this time, the operation of the vacuum pump generates suction in the suction pipe, which can further extract the air inside the suction seat, so that the external air can pass through the suction holes on the upper surface of the suction seat and enter the inside of the suction seat. At this time, the flowing air can generate a downward acting force on the circuit board conveyed on the conveyor belt, enabling the circuit board to move stably with the operation of the conveyor belt, avoiding the position deviation of the circuit board during the conveying process, and ensuring the stable position of the circuit board during coating, effectively improving the working stability of the device;

[0013] 2. Through the setting of the drying seat, the present utility model can make the semi-finished product pass through the inside of the drying seat after coating. At this time, the resistance heating tube is started, and the resistance heating tube can effectively increase the temperature inside the drying seat, thereby accelerating the drying speed of the coating on the surface of the circuit board, enabling the device to have a drying structure and function, and effectively improving the functionality and practicality of the device;

[0014] 3. After drying, the present utility model can use the detection equipment to detect the coated surface of the circuit board. When the coating is unqualified, the extension cylinder is extended, and the cylinder drives the suction cup to descend. The suction cup can adsorb the circuit board, and then the cylinder is contracted, and at the same time, the linear module is driven to operate. At this time, the linear module drives the cylinder and the circuit board to move horizontally. When moving to the specified position, the suction cup is desorbed, which can effectively discharge the unqualified products, and the overall functionality and practicality are further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the first perspective view of the three-dimensional structure of the present utility model;

[0016] Figure 2 is the second perspective view of the three-dimensional structure of the present utility model;

[0017] Figure 3 is the internal structure diagram of the drying seat of the present utility model.

[0018] In the figure: 1. Belt conveyor; 2. Conveyor belt; 3. Suction seat; 4. Mounting seat; 5. Hydraulic rod; 6. Storage tank; 7. Coating rubber roller; 8. Vacuum pump; 9. Drying seat; 10. Linear module; 11. Cylinder; 12. Suction cup; 13. Resistance heating tube; 14. Suction pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0020] Please refer to Figures 1-3 , an embodiment provided by the present invention: a solder resist coating device for a printed circuit board, including a belt conveyor 1. Conveyor rollers are provided at both ends of the belt conveyor 1, and a plurality of conveyor belts 2 with uniform spacing are sleeved on the outer surfaces of the conveyor rollers. An air suction seat 3 is arranged inside the belt conveyor 1. A plurality of air suction holes are arranged on the upper surface of the air suction seat 3, and the air suction holes correspond to the gaps between two adjacent conveyor belts 2. A suction pipe 14 is fixedly connected to the side surface of the air suction seat 3, and a vacuum pump 8 is fixedly installed in the pipeline of the suction pipe 14. When the conveyor belt 2 conveys the circuit board to be coated, the vacuum pump 8 can be started. At this time, the operation of the vacuum pump 8 generates suction in the suction pipe 14, and then the air inside the air suction seat 3 can be extracted, so that the external air passes through the air suction holes on the upper surface of the air suction seat 3 and enters the inside of the air suction seat 3. At this time, the flowing air can generate a downward acting force on the circuit board conveyed on the conveyor belt 2, so that the circuit board can stably move with the operation of the conveyor belt 2, avoiding the position deviation of the circuit board during the conveying process, and at the same time ensuring the stable position of the circuit board during coating, effectively improving the stability of the operation of the device.

[0021] Furthermore, a mounting seat 4 is fixedly connected to the symmetric side surfaces of the belt conveyor 1 respectively. Mounting holes are arranged on the outer surface of the mounting seat 4, and a hydraulic rod 5 is fixedly installed inside the mounting holes. The telescopic end of the hydraulic rod 5 is fixedly connected to a storage tank 6. A coating rubber roller 7 is rotatably connected to the lower port of the storage tank 6. A limiting slide bar is arranged on the outer surface of the storage tank 6, and a limiting slide hole is arranged on the outer surface of the mounting seat 4. The limiting slide bar penetrates through the inside of the limiting slide hole. During coating, the length of the hydraulic rod 5 can be adjusted, and then the height of the storage tank 6 can be effectively adjusted, so that the coating rubber roller 7 at one end of the storage tank 6 can effectively fit on the coating surface of the circuit board substrate. With the operation of the conveyor belt 2, the moving circuit board substrate drives the coating rubber roller 7 to rotate, and then the solder resist in the storage tank 6 can be effectively coated on the coating surface of the circuit board substrate. The whole coating operation is flexible and convenient.

[0022] Furthermore, a drying seat 9 is fixedly installed on the upper surface of the belt conveyor 1, and a plurality of resistance heating tubes 13 are fixedly installed on the inner top wall of the drying seat 9. Through the setting of the drying seat 9, after coating, the semi-finished product can pass through the inside of the drying seat 9. At this time, the resistance heating tubes 13 are started, and the resistance heating tubes 13 can effectively increase the temperature inside the drying seat 9, thereby accelerating the drying speed of the surface coating of the circuit board, enabling the device to have a drying structure and function, and effectively improving the functionality and practicality of the device.

[0023] Furthermore, a linear module 10 is fixedly installed on the side surface of the drying seat 9. A cylinder 11 is fixedly installed on the moving end of the linear module 10, and a suction cup 12 is fixedly installed on the telescopic end of the cylinder 11. The cylinder 11 is vertically distributed, and the linear module 10 is horizontally distributed. After drying, a detection device can be used to detect the coated surface of the circuit board. When the coating is unqualified, the cylinder 11 is extended, and the cylinder 11 drives the suction cup 12 to descend. The suction cup 12 can adsorb the circuit board, and then the cylinder 11 is contracted, and at the same time, the linear module 10 is driven to operate. At this time, the linear module 10 drives the cylinder 11 and the circuit board to move horizontally. When moving to the designated position, the suction cup 12 is detached, and the defective products can be effectively discharged, further improving the overall functionality and practicality.

[0024] Working principle: When in use, first install the device at a specified position, then place the circuit board substrate to be coated on the conveyor belt 2, and then start the belt conveyor 1 to make the conveyor belt 2 run. At this time, the circuit substrate can be conveyed. When the conveyor belt 2 conveys the circuit substrate to be coated, start the vacuum pump 8. The operation of the vacuum pump 8 at this time generates suction in the suction pipe 14, thereby being able to extract the air inside the suction seat 3, so that the external air passes through the suction holes on the upper surface of the suction seat 3 and enters the inside of the suction seat 3. At this time, the flowing air can generate a downward acting force on the circuit substrate conveyed on the conveyor belt 2, enabling the circuit substrate to move stably with the operation of the conveyor belt 2 and avoiding the position deviation of the circuit substrate during the conveying process. When the circuit substrate moves to a specified position, adjust the length of the hydraulic rod 5, and then effectively adjust the height of the storage tank 6, so that the coating rubber roller 7 at one end of the storage tank 6 can effectively fit on the coating surface of the circuit substrate. With the operation of the conveyor belt 2, the moving circuit substrate drives the coating rubber roller 7 to rotate, and then effectively coats the solder resist in the storage tank 6 on the coating surface of the circuit substrate. After coating, the semi-finished product enters the inside of the drying seat 9 with the conveyance of the conveyor belt 2 and passes through the inside of the drying seat 9. At this time, start the resistance heating tube 13, and the resistance heating tube 13 can effectively dry the solder resist layer on the substrate surface. After drying, use the detection equipment to detect the coating surface of the circuit board. When the coating is unqualified, extend the air cylinder 11, and the air cylinder 11 drives the suction cup 12 to lower its position. The suction cup 12 can adsorb the circuit board, and then contract the air cylinder 11, and at the same time drive the linear module 10 to operate. At this time, the linear module 10 drives the air cylinder 11 and the circuit board to move horizontally. When moving to a specified position, the suction cup 12 is desorbed, and the unqualified products can be effectively unloaded.

[0025] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0026] The standard parts used in this application document can all be purchased from the market. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art for connection, and the machines, parts and equipment all adopt conventional models in the prior art. Coupled with the circuit connection adopting the conventional connection method in the prior art, no specific description will be made here.

[0027] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A printed circuit board solder mask coating device, comprising a belt conveyor (1), characterized in that: Conveying rollers are arranged at both ends of the belt conveyor (1), and a plurality of conveying belts (2) with uniform spacing are sleeved on the outer surface of the conveying rollers. An air suction seat (3) is arranged on the inner side of the belt conveyor (1). A plurality of air suction holes are arranged on the upper surface of the air suction seat (3), and the air suction holes correspond to the gap positions between two adjacent conveying belts (2). An air suction pipe (14) is fixedly connected to the side surface of the air suction seat (3), and a vacuum pump (8) is fixedly installed in the pipeline of the air suction pipe (14).

2. A printed circuit board solder mask coating device according to claim 1, characterized in that: A mounting seat (4) is fixedly connected to each of the symmetrical side surfaces of the belt conveyor (1); a mounting hole is provided on the outer surface of the mounting seat (4); and a hydraulic rod (5) is fixedly installed inside the mounting hole. The telescopic end of the hydraulic rod (5) is fixedly connected to a material storage tank (6); and a coating rubber roller (7) is rotatably connected to the lower end of the material storage tank (6).

3. A printed circuit board solder mask coating device according to claim 1, characterized in that: A drying seat (9) is fixedly mounted on the upper surface of the belt conveyor (1), and a plurality of resistance heating tubes (13) are fixedly mounted on the inner top wall of the drying seat (9).

4. A printed circuit board solder resist coating device according to claim 3, characterized in that: A linear module (10) is fixedly mounted on the side surface of the drying seat (9), a cylinder (11) is fixedly mounted on the movable end of the linear module (10), and a suction cup (12) is fixedly mounted on the telescopic end of the cylinder (11).

5. A printed circuit board solder resist coating device according to claim 4, characterized in that: The cylinders (11) are distributed vertically, and the linear modules (10) are distributed horizontally.

6. A printed circuit board solder resist coating device according to claim 2, characterized in that: A limiting sliding rod is provided on the outer surface of the material storage tank (6), a limiting sliding hole is provided on the outer surface of the mounting seat (4), and the limiting sliding rod passes through the interior of the limiting sliding hole.

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