Chip appearance detection equipment

Abstract

The utility model relates to the field of chip production detection equipment, and discloses chip appearance detection equipment which comprises a machine table and a chip tray, at least one feeding conveying mechanism, at least one poor screen printing discharging conveying mechanism, at least four BIN discharging conveying mechanisms and at least one empty tray feeding and discharging conveying mechanism are sequentially and horizontally arranged on the machine table side by side. A chip upper surface detecting mechanism, a first chip transferring mechanism and a chip detecting and carrying mechanism are sequentially arranged above the feeding conveying mechanism and the poor screen printing discharging conveying mechanism in a crossing mode, and a tray carrying mechanism is arranged above the feeding conveying mechanism and above the empty tray feeding and discharging conveying mechanism in a crossing mode. A lower surface and solder ball detection mechanism, a chip temporary storage mechanism and a chip thickness detection mechanism are arranged on the sides of the two ends of the chip detection carrying mechanism, and a second chip transfer mechanism is arranged above the chip temporary storage mechanism, the BIN separation discharging conveying mechanism and the empty tray feeding and discharging conveying mechanism in a crossing mode. And the BIN blanking speed is high and the efficiency is high according to the detection result.

Description

Technical Field

[0001] The utility model relates to the field of chip production detection equipment, in particular to a chip appearance detection device. Background Art

[0002] After chip packaging, performance detection and appearance detection are generally carried out. During the appearance detection process, it is necessary to detect the silk printing on the upper surface of the chip, the appearance defects on the lower surface, the poor solder balls on the lower surface, and the thickness of the chip.

[0003] Some existing manufacturers still implement manual visual inspection or employees judge whether there are appearance defects by the chip appearance displayed on the monitor. In this detection method, employees are extremely prone to eye fatigue and there is a risk of missed detection. The stability of the yield after detection is poor, and the detection efficiency of personnel is extremely low. Some manufacturers use equipment to detect the appearance of chips, which can detect the upper surface, lower surface, solder balls and thickness of the chips. However, generally, a single detection line method is used for detection. Some can detect the upper surface in batches, and the detection of other appearance parts still needs to be transferred to other equipment, and the detection efficiency is slow. Content of the Utility Model

[0004] The utility model provides a chip appearance detection device, which solves the problems of poor yield stability, inability to perform multi-line comprehensive detection, and slow detection efficiency during the appearance detection of existing chips.

[0005] The technical solution adopted by the present utility model to solve its technical problems is as follows: A chip appearance detection device includes a machine platform and a chip tray. On the machine platform, there are at least one loading transfer mechanism arranged horizontally and in parallel in sequence for loading chip trays carrying untested chips, at least one silk screen defective unloading transfer mechanism for unloading chip trays carrying chips with defective front silk screen after detection, at least four binning unloading transfer mechanisms for unloading chip trays carrying different classified chips after detection, and at least one empty tray loading and unloading transfer mechanism for unloading empty chip trays without chips after detection. Above the loading transfer mechanism and the silk screen defective unloading transfer mechanism, there are sequentially spanned a chip upper surface detection mechanism, a first chip transfer mechanism, and a chip detection and handling mechanism. On one side of the chip detection and handling mechanism away from the chip upper surface detection mechanism, there is a tray handling mechanism spanning from above the loading transfer mechanism to above the empty tray loading and unloading transfer mechanism. On one end side of the chip detection and handling mechanism away from the binning unloading transfer mechanism, there is a lower surface and solder ball detection mechanism within its moving range. On one end side of the chip detection and handling mechanism close to the binning unloading transfer mechanism, there is a chip temporary storage mechanism corresponding to the lower surface and solder ball detection mechanism within its moving range. Above the binning unloading transfer mechanism and the empty tray loading and unloading transfer mechanism, there is a second chip transfer mechanism. The chip temporary storage mechanism is within the moving range of the second chip transfer mechanism, and on one side of the chip temporary storage mechanism, there is a chip thickness detection mechanism. Chips in the chip trays on multiple loading transfer mechanisms can respectively and simultaneously perform one or more operations among upper surface detection, silk screen defective unloading, lower surface and solder ball detection, chip thickness detection, and chip binning unloading (except that chip thickness detection and chip binning unloading cannot be performed simultaneously), and the chip trays can also operate in parallel with the above steps, enabling batch detection of chips and binning unloading according to the detection results with high speed and efficiency.

[0006] Furthermore: The loading transfer mechanism, the silk screen defective unloading transfer mechanism, the binning unloading transfer mechanism, and the empty tray loading and unloading transfer mechanism all include a horizontal transfer mechanism and a loading and unloading mechanism for storing chip trays and cooperating with the horizontal transfer mechanism to load and unload chip trays. The loading and unloading of chip trays is completed automatically, with less manual labor and high equipment utilization efficiency.

[0007] Furthermore: The chip upper surface detection mechanism includes a first horizontal driving mechanism and a silk screen detection mechanism arranged on the first horizontal driving mechanism and driven by the first horizontal driving mechanism to move horizontally above the loading transfer mechanism and the silk screen defective unloading transfer mechanism. The upper surface detection of each chip in the chip tray is completed automatically.

[0008] Furthermore, the first chip transfer mechanism includes a second horizontal driving mechanism, a first chip positioning mechanism and a first chip picking and placing mechanism which are arranged on the second horizontal driving mechanism and driven by the second horizontal driving mechanism to horizontally move above the loading transfer mechanism and the screen printing defective product unloading transfer mechanism. The first chip picking and placing mechanism includes a third horizontal driving mechanism, a plurality of first vertical driving mechanisms which are arranged on the third horizontal driving mechanism and driven by the third horizontal driving mechanism to relatively move in the horizontal direction, and a plurality of first vacuum suction heads which are respectively arranged on the first vertical driving mechanisms and driven by the first vertical driving mechanisms to move in the vertical direction. When transferring the screen printing defective chips, multiple chips can be picked up and transferred simultaneously at one time according to the actual situation, and the lower surface and solder ball detection of the chips can be automatically completed quickly and efficiently.

[0009] Furthermore, the chip detection and handling mechanism includes a fourth horizontal driving mechanism, a second chip positioning mechanism and a second chip picking and placing mechanism which are arranged on the fourth horizontal driving mechanism and driven by the fourth horizontal driving mechanism to horizontally move above the loading transfer mechanism, the screen printing defective product unloading transfer mechanism, the lower surface and solder ball detection mechanism and the chip temporary storage mechanism. The second chip picking and placing mechanism includes a fifth horizontal driving mechanism, a plurality of second vertical driving mechanisms which are arranged on the fifth horizontal driving mechanism and driven by the fifth horizontal driving mechanism to relatively move in the horizontal direction, and a plurality of second vacuum suction heads which are respectively arranged on the second vertical driving mechanisms and driven by the second vertical driving mechanisms to move in the vertical direction. The chip trays on multiple loading transfer mechanisms can respectively cooperate with the upper surface detection mechanism to perform upper surface detection, cooperate with the first chip transfer mechanism to unload the screen printing defective chips, and cooperate with the chip detection and handling mechanism to perform one or more of the lower surface and solder ball detection of the chips at the same time. When transferring the chips, multiple chips can be picked up and transferred simultaneously at one time according to the actual situation, and the lower surface and solder ball detection of the chips can be automatically completed quickly and efficiently.

[0010] Furthermore, the tray handling mechanism includes a sixth horizontal driving mechanism, a tray positioning mechanism, a third vertical driving mechanism and a tray gripper. The third vertical driving mechanism and the tray positioning mechanism are arranged on the sixth horizontal driving mechanism and driven by the sixth horizontal driving mechanism to horizontally move above the loading transfer mechanism, the screen printing defective product unloading transfer mechanism, the binning and unloading transfer mechanism and the empty tray loading and unloading transfer mechanism. The tray gripper is arranged on the third vertical driving mechanism and driven by the third vertical driving mechanism to move in the vertical direction. The corresponding loading and unloading transfer of the empty chip trays can be automatically completed quickly and efficiently.

[0011] Furthermore, the second chip transfer mechanism includes a seventh horizontal drive mechanism, and a third chip positioning mechanism and a third chip picking and placing mechanism which are arranged on the seventh horizontal drive mechanism and driven by the seventh horizontal drive mechanism to horizontally move above the bin-dividing blanking transmission mechanism, the blank tray loading and unloading transmission mechanism, and the chip temporary storage mechanism. The third chip picking and placing mechanism includes an eighth horizontal drive mechanism, a plurality of fourth vertical drive mechanisms which are arranged on the eighth horizontal drive mechanism and driven by the eighth horizontal drive mechanism to relatively move horizontally, and a plurality of third vacuum suction heads which are respectively arranged on the fourth vertical drive mechanisms and driven by the fourth vertical drive mechanisms to move vertically. The bin-dividing blanking of different classified chips is automatically completed after detection, with high efficiency.

[0012] Furthermore, the lower surface and solder ball detection mechanism includes a two-dimensional detection mechanism and a three-dimensional detection mechanism arranged on the machine table, and the chip thickness detection mechanism is a three-dimensional detection mechanism. The detection of the lower surface, solder balls and thickness of the chip is efficiently and automatically completed, with high efficiency and high precision.

[0013] Furthermore, the chip temporary storage mechanism includes a horizontal temporary storage table arranged on the machine table and a chip horizontal placement carrier which is detachably arranged on the horizontal temporary storage table and has a plurality of chip horizontal placement positions. It is convenient to transfer and detect multiple chips at one time, with fast chip detection and transfer speed, high efficiency and high detection precision. Description of the Drawings

[0014] Figure 1 It is a front view schematic diagram of the first perspective of the present utility model after removing the outer shell;

[0015] Figure 2 It is a front view schematic diagram of the part of the loading and unloading mechanism in the first perspective;

[0016] Figure 3 It is a front view schematic diagram of the second perspective of the present utility model after removing the outer shell;

[0017] Figure 4 It is a front view schematic diagram of the part of the first chip transfer mechanism in the first perspective;

[0018] Figure 5 It is a front view schematic diagram of the parts of the chip detection and handling mechanism, the lower surface and solder ball detection mechanism, and the chip temporary storage mechanism in the first perspective;

[0019] Figure 6 It is a front view schematic diagram of the parts of the chip detection and handling mechanism, the second chip transfer mechanism 700, and the chip temporary storage mechanism in the first perspective.

[0020] The markings in the figure are: machine 100, operation panel 101, pallet transfer window 102, chip pallet 110, horizontal transfer mechanism 201, loading transfer mechanism 210, silk screen defective product unloading transfer mechanism 220, bin sorting unloading transfer mechanism 230, empty tray loading and unloading transfer mechanism 240, loading and unloading mechanism 250, pallet limit frame 251, pallet limit support feet 252, pallet vertical drive mechanism 253, pallet detection mechanism 254, chip upper surface detection mechanism 300, first horizontal drive mechanism 310, silk screen detection mechanism 320, first chip transfer mechanism 400, second horizontal drive mechanism 410, first chip positioning mechanism 420, first chip picking and placing mechanism 430, third horizontal drive mechanism 431, first vertical drive mechanism 432, first vacuum suction head 433, chip detection and handling mechanism 500, fourth horizontal drive mechanism 510, second chip positioning mechanism 520, second chip picking and placing mechanism 530, fifth horizontal drive mechanism 531, second vertical drive mechanism 532, second vacuum suction head 533, pallet handling mechanism 600, sixth horizontal drive mechanism 610, pallet positioning mechanism 620, third vertical drive mechanism 630, pallet gripper 640, second chip transfer mechanism 700, seventh horizontal drive mechanism 710, third chip positioning mechanism 720, third chip picking and placing mechanism 730, eighth horizontal drive mechanism 731, fourth vertical drive mechanism 732, third vacuum suction head 733, lower surface and solder ball detection mechanism 800, two-dimensional detection mechanism 810, three-dimensional detection mechanism 820, chip temporary storage mechanism 900, horizontal temporary storage table 901, chip horizontal placement carrier 902, chip thickness detection mechanism 910. Detailed implementation mode

[0021] The present utility model will be further described below in conjunction with the accompanying drawings and the detailed implementation mode.

[0022] As Figure 1A chip appearance detection device as shown includes a machine platform 100 and a chip tray 110. On the machine platform 100, there are successively arranged horizontally in parallel at least one loading transfer mechanism 210 for loading the chip tray 110 carrying untested chips, at least one silk screen defect unloading transfer mechanism 220 for unloading the chip tray 110 carrying chips with defective front silk screen after detection, at least four binning unloading transfer mechanisms 230 for unloading the chip tray 110 carrying different classified chips after detection respectively, and at least one empty tray loading and unloading transfer mechanism 240 for unloading the empty chip tray 110 without chips after detection. Above the loading transfer mechanism 210 and the silk screen defect unloading transfer mechanism 220, there are successively spanned a chip upper surface detection mechanism 300, a first chip transfer mechanism 400, and a chip detection and handling mechanism 500. On one side of the chip detection and handling mechanism 500 far from the chip upper surface detection mechanism 300, there is a tray handling mechanism 600 spanning from above the loading transfer mechanism 210 to above the empty tray loading and unloading transfer mechanism 240. On the side of one end of the chip detection and handling mechanism 500 far from the binning unloading transfer mechanism 230, there is a lower surface and solder ball detection mechanism 800 within its moving range. On the side of one end of the chip detection and handling mechanism 500 close to the binning unloading transfer mechanism 230, there is a chip temporary storage mechanism 900 corresponding to the lower surface and solder ball detection mechanism 800 within its moving range. Above the binning unloading transfer mechanism 230 and the empty tray loading and unloading transfer mechanism 240, there is a second chip transfer mechanism 700. The chip temporary storage mechanism 900 is within the moving range of the second chip transfer mechanism 700. On one side of the chip temporary storage mechanism 900, there is a chip thickness detection mechanism 910.

[0023] In this specific embodiment, a large number of chip placement positions are arranged vertically and horizontally on the chip tray 110. The loading transfer mechanism 210 has two for loading and transferring the chip tray 110 carrying untested chips, and the binning unloading transfer mechanism 230 has four for unloading and transferring the chip tray 110 containing chips with lower surface defects, solder ball defects, thickness defects, and good products respectively.

[0024] In the specific implementation and operation, first, place the batch of chip trays 110 loaded with chips to be tested on the loading transfer mechanism 210, place multiple empty chip trays 110 on the empty tray loading and unloading transfer mechanism 240. The empty tray loading and unloading transfer mechanism 240 successively loads the empty chip trays 110, and the tray handling mechanism 600 transfers them to the silk screen defect unloading transfer mechanism 220 and the binning unloading transfer mechanism 230 respectively;

[0025] Then, the loading and conveying mechanism 210 transfers the chip tray 110 to the corresponding position of the chip upper surface detection mechanism 300. The loading and conveying mechanism 210 moves the chip tray 110 thereon to cooperate with the chip upper surface detection mechanism 300 to detect the upper surface of each chip in the chip tray 110;

[0026] Then, the loading and conveying mechanism 210 transfers the chip tray 110 after the upper surface of the chip is detected by the chip upper surface detection mechanism 300 to the corresponding position of the first chip transfer mechanism 400. The loading and conveying mechanism 210 moves the chip tray 110 thereon to cooperate with the first chip transfer mechanism 400 to take out the chips with poor silk printing in the chip tray 110. The first chip transfer mechanism 400 transfers the taken-out chips with poor silk printing to the corresponding position of the silk printing defective unloading and conveying mechanism 220. The silk printing defective unloading and conveying mechanism 220 moves the unfilled chip tray 110 thereon to cooperate with the first chip transfer mechanism 400 to transfer and place the taken-out multiple chips with poor silk printing into the empty chip tray 110 on the silk printing defective unloading and conveying mechanism 220;

[0027] Then, the loading and conveying mechanism 210 transfers the chip tray 110 after the chips with poor silk printing are taken away to the corresponding position of the chip detection and handling mechanism 500. The loading and conveying mechanism 210 moves the chip tray 110 thereon to cooperate with the chip detection and handling mechanism 500 to take out multiple chips. The chip detection and handling mechanism 500 transfers the taken-out multiple chips one by one to the corresponding detection positions above the lower surface and solder ball detection mechanism 800. The lower surface and solder ball detection mechanism 800 respectively performs two-dimensional and three-dimensional detections on the lower surface of each chip passing above it and the solder balls on the lower surface. The chip detection and handling mechanism 500 transfers the multiple taken-out and detected chips to the chip temporary storage mechanism 900;

[0028] Then, the chip thickness detection mechanism 910 detects the thickness of the chips on the chip temporary storage mechanism 900;

[0029] Then, the second chip transfer mechanism 700 takes out the chips on the chip temporary storage mechanism 900 after the thickness detection is completed. The bin sorting and unloading conveying mechanism 230 moves the chip tray 110 thereon to cooperate with the second chip transfer mechanism 700 to transfer the taken chips into the corresponding chip tray 110 on the bin sorting and unloading conveying mechanism 230 according to the detection results;

[0030] After all the chips in the chip tray 110 on the loading and conveying mechanism 210 are transferred, the loading and conveying mechanism 210 transfers the empty chip tray 110 above it to the corresponding position of the tray handling mechanism 600. The tray handling mechanism 600 transfers the empty chip tray 110 to the empty tray loading and unloading conveying mechanism 240. The empty tray loading and unloading conveying mechanism 240 unloads and stores the empty chip tray 110. The loading and conveying mechanism 210 continues to load the stored chip tray 110 and perform inspections as described above, and transfers the empty chip tray 110 after inspection to the corresponding position of the tray handling mechanism 600 for unloading and storage by the tray handling mechanism 600;

[0031] When the chip tray 110 on the screen printing defective unloading conveying mechanism 220 is filled with chips with screen printing defects, the screen printing defective unloading conveying mechanism 220 unloads and stores the full chip tray 110. The empty tray loading and unloading conveying mechanism 240 transfers the empty chip tray 110 to the corresponding position of the tray handling mechanism 600. The tray handling mechanism 600 transfers the empty chip tray 110 to the screen printing defective unloading conveying mechanism 220, waiting to continue storing chips with screen printing defects in the future. After the chip tray 110 loaded with chips with screen printing defects is full, it continues to be unloaded and stored, and the empty chip tray 110 is continuously loaded onto the screen printing defective unloading conveying mechanism 220 through the empty tray loading and unloading conveying mechanism 240;

[0032] When the chip tray 110 on the binning unloading conveying mechanism 230 is filled with chips corresponding to the test results, the binning unloading conveying mechanism 230 unloads and stores the full chip tray 110. The empty tray loading and unloading conveying mechanism 240 transfers the empty chip tray 110 to the corresponding position of the tray handling mechanism 600. The tray handling mechanism 600 transfers the empty chip tray 110 to the binning unloading conveying mechanism 230, waiting to continue storing chips corresponding to various test results in the future. After the chip tray 110 loaded with chips corresponding to the test results is full, it continues to be unloaded and stored, and the empty chip tray 110 is continuously loaded onto the binning unloading conveying mechanism 230 through the empty tray loading and unloading conveying mechanism 240;

[0033] Chips in the chip trays 110 on multiple loading and conveying mechanisms 210 can respectively and simultaneously perform one or more operations among upper surface inspection, screen printing defective unloading, lower surface and solder ball inspection, chip thickness inspection, and chip binning unloading (except that chip thickness inspection and chip binning unloading cannot be performed simultaneously), and the chip trays 110 can also run in parallel with the above steps, batch-inspecting chips and binning and unloading according to the inspection results quickly and efficiently.

[0034] On the basis of the above, such as Figure 1 and Figure 2As shown, the loading and conveying mechanism 210, the defective screen printing unloading and conveying mechanism 220, the bin-dividing unloading and conveying mechanism 230, and the empty tray loading and unloading and conveying mechanism 240 all include a horizontal conveying mechanism 201 and a loading and unloading mechanism 250 for storing the chip trays 110 and cooperating with the horizontal conveying mechanism 201 to load and unload the chip trays 110.

[0035] In this specific embodiment, the horizontal conveying mechanism 201 is a linear motor purchased on the market. In specific implementation, the first horizontal driving mechanism 310 can also be a linear driving mechanism such as a driving mechanism composed of a motor and a lead screw assembly; an operation panel 101 is provided above the machine table 100 on the side away from the first chip transfer mechanism 400 of the chip upper surface detection mechanism 300. One end of the horizontal conveying mechanism 201 is located below the operation panel 101, and a tray transfer window 102 corresponding to the vertical direction of the horizontal conveying mechanism 201 is provided on the operation panel 101. The loading and unloading mechanism 250 includes a tray limiting frame 251, tray limiting support feet 252, a tray vertical direction driving mechanism 253, and a tray detection mechanism 254; the tray limiting frame 251 is vertically arranged around the tray transfer window 102 on the operation panel 101 for limiting and storing the chip trays 110, the tray limiting support feet 252 are arranged around the tray transfer window 102 on the operation panel 101 for supporting and limiting the storage of the chip trays 110, the tray vertical direction driving mechanism 253 is arranged on the machine table 100 for cooperating with the tray limiting support feet 252 to load and unload the stored chip trays 110, and the tray detection mechanism 254 is arranged on the tray limiting frame 251 for monitoring the number of chip trays 110 stored in the tray limiting frame 251. The tray detection mechanism 254 is connected with a flashing light for alarming and reminding the operator to perform corresponding operations;

[0036] There are four tray limiting support feet 252, which are respectively arranged in pairs on both sides around the tray transfer window 102. The tray limiting support feet 252 include movable feet and a control box (a cylinder for controlling the movement of the movable feet is arranged in the control box, but it is not limited to being controlled by an automated mechanism, and can also be jointly realized by combining some mechanical structures and automated mechanisms). The movable feet can rotate and move between the horizontal direction and the vertical upper direction. When the movable feet rotate to the horizontal position, they are located in the tray transfer window 102 and can limit the bottom edge of the chip tray 110. When the movable feet rotate upward, they can leave the tray transfer window 102 and hide in the control box without affecting the up and down movement of the chip tray 110;

[0037] The tray vertical direction driving mechanism 253 includes a vertically arranged linear motor located below the machine table 100 and a plurality of vertical driving plates driven by the linear motor to move vertically for pushing against the chip trays 110 to move up and down;

[0038] When the chip tray 110 is unloaded and stored from the horizontal transfer mechanism 201 into the inside of the tray limit frame 251, the tray vertical drive mechanism 253 drives the vertical drive plate to lift the chip tray 110 above the tray limit support feet 252 (during this process, the tray limit support feet 252 cooperate with the lifted chip tray 110 and are controlled by the control box to rotate away from the tray transfer window 102 and hide inside the control box), then the tray limit support feet 252 rotate to the horizontal position, and then the tray vertical drive mechanism 253 drives the vertical drive plate to move downwards. The chip tray 110 moves downwards with the vertical drive plate and is vertically limited and blocked by the tray limit support feet 252, that is, it is unloaded and stored into the tray limit frame 251;

[0039] When the chip tray 110 is loaded from the tray limit frame 251 onto the horizontal transfer mechanism 201, the tray vertical drive mechanism 253 drives the vertical drive plate to lift all the chip trays 110 in the tray limit frame 251 above the tray limit support feet 252 (during this process, the tray limit support feet 252 are in the horizontal state); then, the control box controls the movable feet to rotate upwards away from the tray transfer window 102 and hide inside the control box without affecting the up and down movement of the chip tray 110;

[0040] Then, the tray vertical drive mechanism 253 drives the vertical drive plate to move downwards. The control box controls the tray limit support feet 252 to insert below the penultimate chip tray 110 during the downward movement of all the chip trays 110 in the tray limit frame 251. As the vertical drive plate moves downwards, the penultimate chip tray 110 and the chip trays above it are all limited by the tray limit support feet 252, and the lowermost chip tray 110 moves downwards with the vertical drive plate onto the horizontal transfer mechanism 201 to complete the loading; the tray vertical drive mechanism 253 cooperates with the tray limit support feet 252 to load and unload the chip trays 110 on the horizontal transfer mechanism 201;

[0041] The tray detection mechanism 254 on the loading transfer mechanism 210 is arranged at the lower part corresponding to the tray limit frame 251, and is used to remind and alarm that the detection of the chip trays 110 in the tray limit frame 251 on the loading transfer mechanism 210 is about to be completed, and to remind the operator to transfer the chip trays 110 to the corresponding tray limit frame 251;

[0042] The tray detection mechanisms 254 on the silk screen defective unloading transfer mechanism 220, the bin sorting unloading transfer mechanism 230 and the empty tray loading and unloading transfer mechanism 240 are arranged at the upper part corresponding to the tray limit frame 251, and are used to remind and alarm that the chip trays 110 in the tray limit frame 251 are about to be full, and to remind the operator to remove the chip trays 110 in the corresponding tray limit frame 251.

[0043] Automatically complete the loading and unloading of the chip tray 110, with less manual labor and high equipment utilization efficiency.

[0044] On the basis of the above, as Figures 1 to 3 shown, the chip upper surface detection mechanism 300 includes a first horizontal driving mechanism 310 and a silk screen detection mechanism 320 disposed on the first horizontal driving mechanism 310 and driven by the first horizontal driving mechanism 310 to horizontally move above the loading transmission mechanism 210 and the silk screen defective unloading transmission mechanism 220.

[0045] In this specific embodiment, the first horizontal driving mechanism 310 is a linear motor purchased on the market. In specific implementation, the first horizontal driving mechanism 310 can also be a linear driving mechanism such as a combination of a motor and a lead screw assembly; the silk screen detection mechanism 320 is an industrial camera with a ring light source purchased on the market, which can be used to accurately detect the silk screen on the upper surface of the chip.

[0046] During operation, the direction in which the loading transmission mechanism 210 horizontally transports the chip tray 110 is longitudinal. The loading transmission mechanism 210 longitudinally moves the chip tray 110 to a position corresponding horizontally to the first horizontal driving mechanism 310 and the silk screen detection mechanism 320. The first horizontal driving mechanism 310 drives the silk screen detection mechanism 320 to horizontally move above the chip tray 110 to detect the silk screen on the upper surface of each chip corresponding horizontally in the chip tray 110; after all the chips in a horizontal row in the chip tray 110 are detected, the loading transmission mechanism 210 moves the chips in the next horizontal row in the chip tray 110 to a position corresponding horizontally to the first horizontal driving mechanism 310 and the silk screen detection mechanism 320. The first horizontal driving mechanism 310 drives the silk screen detection mechanism 320 to horizontally move above the chip tray 110 to detect the silk screen on the upper surface of each chip corresponding horizontally in the chip tray 110. In this way, the upper surface detection of each horizontal row of chips in the chip tray 110 is automatically completed. Automatically complete the upper surface detection of each chip in the chip tray 110.

[0047] On the basis of the above, as Figure 1 、 Figure 3 and Figure 4As shown, the first chip transfer mechanism 400 includes a second horizontal drive mechanism 410, and a first chip positioning mechanism 420 and a first chip picking and placing mechanism 430 which are arranged on the second horizontal drive mechanism 410 and driven by the second horizontal drive mechanism 410 to horizontally move above the loading transfer mechanism 210 and the screen printing defective product unloading transfer mechanism 220. The first chip picking and placing mechanism 430 includes a third horizontal drive mechanism 431, a plurality of first vertical drive mechanisms 432 which are arranged on the third horizontal drive mechanism 431 and driven by the third horizontal drive mechanism 431 to relatively move in the horizontal direction, and a plurality of first vacuum suction heads 433 which are respectively arranged on the first vertical drive mechanisms 432 and driven by the first vertical drive mechanisms 432 to move in the vertical direction.

[0048] In this specific embodiment, the second horizontal drive mechanism 410 is a linear motor purchased on the market. In specific implementation, the second horizontal drive mechanism 410 can also be a linear drive mechanism such as a drive mechanism composed of a motor and a lead screw assembly. The first chip positioning mechanism 420 is an industrial camera with a ring light source purchased on the market, which can be used for precise positioning of the chips in the chip tray 110. The third horizontal drive mechanism 431 is a linear motor that can drive two movers to perform different operations simultaneously and is equipped with a matching parallel guide rail. Two first vertical drive mechanisms 432 are fixed on the movers and driven by the linear motor to move horizontally. The first vertical drive mechanism 432 is a high-precision micro linear motor. In specific implementation, the first vertical drive mechanism 432 can also be a linear drive mechanism such as a high-precision cylinder with a controllable stroke.

[0049] During operation, the direction in which the loading transfer mechanism 210 horizontally transports the chip tray 110 is the longitudinal direction.

[0050] The screen printing defective product unloading transfer mechanism 220 transports the chip tray 110 longitudinally to a position where the chip placement position above the chip tray 110 is horizontally corresponding to the first vacuum suction head 433. The loading transfer mechanism 210 moves the screen printing defective chips in the chip tray 110 to a position horizontally corresponding to the first vacuum suction head 433 below the first chip transfer mechanism 400. The second horizontal drive mechanism 410 drives the first chip positioning mechanism 420 and the first chip picking and placing mechanism 430 to move above the chip tray 110 on the loading transfer mechanism 210.

[0051] When there are two (or an even number) of silk-screen printing defects in a horizontal row of chips on the chip tray 110, with the assistance of the first chip positioning mechanism 420, the third horizontal driving mechanism 431 drives two movers to drive two first vertical driving mechanisms 432 to horizontally move above the chips with silk-screen printing defects respectively. The two first vertical driving mechanisms 432 simultaneously drive two first vacuum suction heads 433 to move downward to pick up the corresponding chips with silk-screen printing defects and then move upward to reset. When there is only one (or after transferring an even number of defective chips in multiple ones, there is still one left) silk-screen printing defect in a horizontal row of chips on the chip tray 110, with the assistance of the first chip positioning mechanism 420, the third horizontal driving mechanism 431 drives two movers to drive one of the first vertical driving mechanisms 432 to horizontally move above the chip with silk-screen printing defect, and drive the other first vertical driving mechanism 432 to horizontally move to the longitudinal corresponding position of the chip with silk-screen printing defect in the next horizontal row. One first vertical driving mechanism 432 drives the corresponding first vacuum suction head 433 to move downward to pick up the corresponding chip with silk-screen printing defect and then move upward to reset. The feeding transmission mechanism 210 longitudinally moves the chip with silk-screen printing defect in the next horizontal row in the chip tray 110 to below the other first vacuum suction head 433, and the other first vertical driving mechanism 432 drives the corresponding first vacuum suction head 433 to move downward to pick up the corresponding chip with silk-screen printing defect and then move upward to reset;

[0052] When both of the two first vacuum suction heads 433 pick up chips with silk-screen printing defects, the second horizontal driving mechanism 410 drives the first chip picking and placing mechanism 430 to transfer above the silk-screen printing defective material discharging transmission mechanism 220. The third horizontal driving mechanism 431 drives two movers to drive two first vertical driving mechanisms 432 to move above the empty positions in the chip tray 110 respectively. The two first vertical driving mechanisms 432 drive the two first vacuum suction heads 433 to move downward to place the chips into the empty positions in the chip tray 110 and then move upward to reset. When there is only one empty position in a horizontal row of the chip tray 110 on the silk-screen printing defective material discharging transmission mechanism 220, the third horizontal driving mechanism 431 drives two movers to drive two first vertical driving mechanisms 432 to correspond to the empty positions in different horizontal rows in the chip tray 110 respectively. After placing one chip, the silk-screen printing defective material discharging transmission mechanism 220 drives the chip tray 110 to longitudinally move so that the empty position on the chip tray 110 corresponds to the first vertical driving mechanism 432 to cooperate with placing the chip.

[0053] After all the chips with silk-screen printing defects in the chip tray 110 on the feeding transmission mechanism 210 are transferred to the chip tray 110 on the silk-screen printing defective material discharging transmission mechanism 220, the feeding transmission mechanism 210 drives the chip tray 110 to transfer the remaining chips to the next process;

[0054] After the chip tray 110 on the silk screen printing defective blanking and conveying mechanism 220 is filled with silk screen printing defective chips, the silk screen printing defective blanking and conveying mechanism 220 discharges and stores the full chip tray 110, and the empty chip tray 110 is loaded by the empty tray loading and unloading conveying mechanism 240. Then, the tray handling mechanism 600 transfers the empty chip tray 110 from the empty tray loading and unloading conveying mechanism 240 to the silk screen printing defective blanking and conveying mechanism 220 to continue receiving and placing silk screen printing defective chips for storage.

[0055] When transferring silk screen printing defective chips, multiple chips can be picked up and transferred simultaneously according to the actual situation, and the lower surface and solder ball detection of the chips can be automatically completed quickly and efficiently.

[0056] On the above basis, as Figure 1 、 Figure 3 、 Figure 5 and Figure 6 shown, the chip detection and handling mechanism 500 includes a fourth horizontal driving mechanism 510 and a second chip positioning mechanism 520 and a second chip picking and placing mechanism 530 which are arranged on the fourth horizontal driving mechanism 510 and are driven by the fourth horizontal driving mechanism 510 to move horizontally above the loading conveying mechanism 210, the silk screen printing defective blanking and conveying mechanism 220, the lower surface and solder ball detection mechanism 800, and the chip temporary storage mechanism 900. The second chip picking and placing mechanism 530 includes a fifth horizontal driving mechanism 531, a plurality of second vertical driving mechanisms 532 which are arranged on the fifth horizontal driving mechanism 531 and are driven by the fifth horizontal driving mechanism 531 to move relatively horizontally, and a plurality of second vacuum suction heads 533 which are respectively arranged on the second vertical driving mechanisms 532 and are driven by the second vertical driving mechanisms 532 to move vertically.

[0057] In this specific embodiment, the fourth horizontal driving mechanism 510 is a linear motor purchased on the market. In specific implementation, the fourth horizontal driving mechanism 510 can also be a linear driving mechanism such as a combination of a motor and a lead screw assembly; the second chip positioning mechanism 520 is an industrial camera with a ring light source purchased on the market, which can be used for precise positioning of the chips in the chip tray 110; the fifth horizontal driving mechanism 531 is a linear motor that can drive eight movers to perform different operations simultaneously and is equipped with a matching parallel guide rail. In specific implementation, it can also be composed of two linear motors that can respectively drive four movers to perform different operations simultaneously and are equipped with matching parallel guide rails to reduce costs. The second vertical driving mechanism 532 has eight fixed on the movers and is driven by a linear motor to move horizontally; the second vertical driving mechanism 532 is a high-precision micro linear motor. In specific implementation, the second vertical driving mechanism 532 can also be a linear driving mechanism such as a high-precision and stroke-controllable air cylinder.

[0058] During operation, the direction in which the loading and conveying mechanism 210 horizontally conveys the chip tray 110 is longitudinal.

[0059] When the chip detection and handling mechanism 500 transfers the chips on the loading and conveying mechanism 210 and conducts inspections, after the chips with poor screen printing on the loading and conveying mechanism 210 are taken away, the chip tray 110 longitudinally moves to the position where the chips on the chip tray 110 are horizontally corresponding to the second vacuum suction heads 533; the fourth horizontal driving mechanism 510 drives the second chip positioning mechanism 520 and the second chip picking and placing mechanism 530 to transfer above the chip tray 110 on the loading and conveying mechanism 210; under the auxiliary positioning of the second chip positioning mechanism 520, the fifth horizontal driving mechanism 531 drives the eight second vertical driving mechanisms 532 to be longitudinally corresponding to the chips to be inspected in the chip tray 110 respectively. The loading and conveying mechanism 210 drives the chip tray 110 thereon to longitudinally move, so that the chips to be inspected in the chip tray 110 are sequentially corresponding to the second vacuum suction heads 533 in the vertical direction. The eight second vertical driving mechanisms 532 respectively drive the second vacuum suction heads 533 to move downward to pick up the corresponding chips to be inspected in the chip tray 110 and then move upward to reset (when there are multiple chips to be inspected in a horizontal row on the chip tray 110, the multiple second vertical driving mechanisms 532 can simultaneously drive the multiple second vacuum suction heads 533 to move downward to pick up the corresponding chips to be inspected in the chip tray 110 and then move upward to reset, which can save time; for example, if there are eight chips to be inspected in a horizontal row, that is, the eight second vertical driving mechanisms 532 can drive the eight second vacuum suction heads 533 to move downward simultaneously to pick up the corresponding chips to be inspected in the chip tray 110 and then move upward to reset).

[0060] After the eight second vacuum suction heads 533 are all adsorbed with the chips to be inspected, the fifth horizontal driving mechanism 531 drives the second chip picking and placing mechanism 530 to horizontally move transversely, so that the lower surfaces of the eight chips to be inspected picked up by the second chip picking and placing mechanism 530 sequentially pass above the lower surface and solder ball inspection mechanism 800, completing the two-dimensional and three-dimensional inspections of the lower surface of the chip and the solder balls on the lower surface.

[0061] When the inspection of the chips to be inspected adsorbed on the eight second vacuum suction heads 533 is completed by the lower surface and solder ball inspection mechanism 800, the fifth horizontal driving mechanism 531 drives the second chip picking and placing mechanism 530 to horizontally move transversely above the chip temporary storage mechanism 900. The eight second vertical driving mechanisms 532 simultaneously drive the eight second vacuum suction heads 533 to place the inspected chips on the chip temporary storage mechanism 900 and then move upward to reset. The chips on the chip temporary storage mechanism 900 await subsequent transfer by the second chip transfer mechanism 700 to the corresponding binning and unloading conveying mechanism 230.

[0062] After all the chips in the chip tray 110 on the loading transfer mechanism 210 are detected and transferred, the loading transfer mechanism 210 transfers the empty chip tray 110 to the corresponding position of the tray handling mechanism 600. The tray handling mechanism 600 transfers the empty chip tray 110 to the empty tray loading and unloading transfer mechanism 240. The empty tray loading and unloading transfer mechanism 240 unloads the empty chip tray 110 for storage, and then the loading transfer mechanism 210 loads the chip tray 110 full of chips to be detected and sequentially passes through the chip upper surface detection mechanism 300, the first chip transfer mechanism 400, and the chip detection and handling mechanism 500 for corresponding detection and transfer.

[0063] The chip trays 110 on multiple loading transfer mechanisms 210 can simultaneously cooperate with the chip upper surface detection mechanism 300 for upper surface detection, cooperate with the first chip transfer mechanism 400 for discharging defective screen-printed chips, and cooperate with the chip detection and handling mechanism 500 for one or more of the lower surface and solder ball detection of the chips. Moreover, when transferring chips, multiple chips can be picked up and transferred simultaneously at one time according to the actual situation, and the lower surface and solder ball detection of the chips are completed automatically with high speed and efficiency.

[0064] On the above basis, as Figure 1 and Figure 3 shown, the tray handling mechanism 600 includes a sixth horizontal driving mechanism 610, a tray positioning mechanism 620, a third vertical driving mechanism 630, and a tray gripper 640. The third vertical driving mechanism 630 and the tray positioning mechanism 620 are arranged on the sixth horizontal driving mechanism 610 and are driven by the sixth horizontal driving mechanism 610 to move horizontally above the loading transfer mechanism 210, the defective screen-printed chip discharging transfer mechanism 220, the bin-dividing discharging transfer mechanism 230, and the empty tray loading and unloading transfer mechanism 240. The tray gripper 640 is arranged on the third vertical driving mechanism 630 and is driven by the third vertical driving mechanism 630 to move vertically.

[0065] In this specific embodiment, the sixth horizontal driving mechanism 610 is a linear motor purchased on the market. In specific implementation, the sixth horizontal driving mechanism 610 can also be a linear driving mechanism such as a combination of a motor and a lead screw assembly; the third vertical driving mechanism 630 is a linear motor. In specific implementation, the third vertical driving mechanism 630 can also be a linear driving mechanism such as a cylinder with controllable stroke; the tray positioning mechanism 620 is an industrial camera with a ring light source purchased on the market, which can be used for precise positioning of the grasping position of the chip tray 110; the tray gripper 640 is a combined mechanism of a frame and four cylinder jaws, which can be used to grasp the outer edge of the chip tray 110 correspondingly. In specific implementation, the tray gripper 640 can also be an integrated jaw cylinder equipped with a matching outer edge of the chip tray 110.

[0066] During operation, the direction in which the loading and transporting mechanism 210 horizontally transports the chip tray 110 is longitudinal.

[0067] After all the chips in the chip tray 110 on the loading and transporting mechanism 210 are transferred and detected, the loading and transporting mechanism 210 longitudinally transfers the empty chip tray 110 to the horizontal corresponding position on the tray handling mechanism 600; with the assistance of the tray positioning mechanism 620, the sixth horizontal driving mechanism 610 drives the tray positioning mechanism 620 and the tray gripper 640 to move above the empty chip tray 110 on the loading and transporting mechanism 210; the third vertical driving mechanism 630 drives the tray gripper 640 to move down to pick up the empty chip tray 110 and then move up to reset; then, with the assistance of the tray positioning mechanism 620, the sixth horizontal driving mechanism 610 drives the tray positioning mechanism 620 and the tray gripper 640 to move above the empty tray loading and unloading transporting mechanism 240 (meanwhile, the empty tray loading and unloading transporting mechanism 240 has transferred the transfer plate horizontally carrying the chip tray 110 to the corresponding position), the third vertical driving mechanism 630 drives the tray gripper 640 to move down to place the empty chip tray 110 on the empty tray loading and unloading transporting mechanism 240 and then move up to reset; the empty tray loading and unloading transporting mechanism 240 transfers and stores the empty chip tray 110, and subsequently, the loading and transporting mechanism 210 continues to load the chip tray 110 carrying chips for corresponding transfer and detection.

[0068] When the chips in the chip tray 110 on the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 are all filled, the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 discharges and stores the full chip tray 110; the empty tray loading and unloading transfer mechanism 240 transfers the empty chip tray 110 to the corresponding horizontal position on the tray handling mechanism 600; then, with the assistance of the tray positioning mechanism 620, the sixth horizontal driving mechanism 610 drives the tray positioning mechanism 620 and the tray gripper 640 to move above the empty chip tray 110 on the empty tray loading and unloading transfer mechanism 240. The third vertical driving mechanism 630 drives the tray gripper 640 to move down to pick up the empty chip tray 110 and then move up to reset; then, with the assistance of the tray positioning mechanism 620, the sixth horizontal driving mechanism 610 drives the tray positioning mechanism 620 and the tray gripper 640 to move above the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 (meanwhile, the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 has transferred the transfer plate carrying the chip tray 110 horizontally thereon to the corresponding position); the third vertical driving mechanism 630 drives the tray gripper 640 to move down to place the empty chip tray 110 on the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 and then move up to reset; subsequently, the silk-screening defective blanking transfer mechanism 220 or the bin-dividing blanking transfer mechanism 230 transfers the empty chip tray 110 to the corresponding position to continue loading the corresponding chips after detection.

[0069] Automatically complete the corresponding loading and unloading transfer of the empty chip tray 110, with high speed and efficiency.

[0070] On the basis of the above, as Figure 1 、 Figure 3 and Figure 6 shown, the second chip transfer mechanism 700 includes a seventh horizontal driving mechanism 710 and a third chip positioning mechanism 720 and a third chip picking and placing mechanism 730 which are arranged on the seventh horizontal driving mechanism 710 and driven by the seventh horizontal driving mechanism 710 to move horizontally above the bin-dividing blanking transfer mechanism 230, the empty tray loading and unloading transfer mechanism 240 and the chip temporary storage mechanism 900. The third chip picking and placing mechanism 730 includes an eighth horizontal driving mechanism 731, a plurality of fourth vertical driving mechanisms 732 which are arranged on the eighth horizontal driving mechanism 731 and driven by the eighth horizontal driving mechanism 731 to move relatively in the horizontal direction, and a plurality of third vacuum suction heads 733 which are respectively arranged on the fourth vertical driving mechanisms 732 and driven by the fourth vertical driving mechanisms 732 to move in the vertical direction.

[0071] In this specific embodiment, the seventh horizontal driving mechanism 710 is a linear motor purchased on the market. In specific implementation, the seventh horizontal driving mechanism 710 can also be a linear driving mechanism such as a driving mechanism composed of a motor and a lead screw assembly. The third chip positioning mechanism 720 is an industrial camera with a ring light source purchased on the market, which can be used to accurately position the chips on the chip temporary storage mechanism 900 and the chip placement positions in the chip tray 110. The eighth horizontal driving mechanism 731 is a linear motor that can drive eight movers to perform different operations simultaneously and is equipped with a matching parallel guiding slide rail. In specific implementation, it can also be composed of two linear motors that can respectively drive four movers to perform different operations simultaneously and are equipped with matching parallel guiding slide rails to reduce costs. The fourth vertical driving mechanism 732 has eight and is driven by the eighth horizontal driving mechanism 731 to move horizontally on eight movers. The fourth vertical driving mechanism 732 is a high-precision micro linear motor. In specific implementation, the fourth vertical driving mechanism 732 can also be a linear driving mechanism such as a high-precision and stroke-controllable air cylinder. The chip temporary storage mechanism 900 is provided with twelve chip temporary storage positions, eight of which are used in the test corresponding to the number of the third vacuum suction heads 733. The chip temporary storage positions can also be determined to be more or less than twelve according to the actual situation.

[0072] During operation, the direction in which the loading and transporting mechanism 210 horizontally transports the chip tray 110 is the longitudinal direction.

[0073] After the detection of the preset number of chips temporarily stored on the chip temporary storage mechanism 900 is completed, the seventh horizontal driving mechanism 710 drives the third chip positioning mechanism 720 and the third chip picking and placing mechanism 730 to transfer to the corresponding position above the chip temporary storage mechanism 900; with the assistance of the third chip positioning mechanism 720, the eighth horizontal driving mechanism 731 drives eight fourth vertical driving mechanisms 732 to transfer to the positions above the eight chips on the chip temporary storage mechanism 900 respectively. The eight fourth vertical driving mechanisms 732 drive the eight second vacuum suction heads 533 to move down to pick up the detected chips on the chip temporary storage mechanism 900 and then move up and reset (simultaneously, according to the information of the detected chips temporarily stored on the chip temporary storage mechanism 900, the corresponding bin sorting and blanking transmission mechanism 230 longitudinally transfers the chip tray 110 on it to the position where the empty space on the chip tray 110 corresponds horizontally to the third vacuum suction head 733); the seventh horizontal driving mechanism 710 drives the third chip positioning mechanism 720 and the third chip picking and placing mechanism 730 to transfer successively to the positions above the eight bin sorting and blanking transmission mechanisms 230 where the detected chips are placed correspondingly. The fourth vertical driving mechanisms 732 drive the eight second vacuum suction heads 533 to move down successively to place the chips into the cavities in the chip tray 110 on the corresponding bin sorting and blanking transmission mechanism 230 and then move up and reset (during this process, when the detected chips need to be placed into different horizontal rows of cavities in the chip tray 110 on the bin sorting and blanking transmission mechanism 230, the bin sorting and blanking transmission mechanism 230 cooperates with the longitudinal movement of the chip tray 110 to complete the placement of the detected chips).

[0074] When the chip tray 110 on the bin sorting and blanking transmission mechanism 230 is fully loaded with chips, the bin sorting and blanking transmission mechanism 230 discharges and stores the fully loaded chip tray 110; the empty tray loading and unloading transmission mechanism 240 loads an empty chip tray 110 and transfers it to the position corresponding to the tray handling mechanism 600. The tray handling mechanism 600 transfers the empty chip tray 110 to the corresponding bin sorting and blanking transmission mechanism 230. Subsequently, the bin sorting and blanking transmission mechanism 230 transfers the empty chip tray 110 to the corresponding position to continue loading the corresponding detected chips.

[0075] Automatically complete the bin sorting and blanking of different classified chips after detection, with high efficiency.

[0076] On the basis of the above, such as Figure 1 、 Figure 3 and Figure 5As shown, the lower surface and solder ball detection mechanism 800 includes a two-dimensional detection mechanism 810 and a three-dimensional detection mechanism 820 disposed on the machine table 100, and the chip thickness detection mechanism 910 is a three-dimensional detection mechanism. In a specific implementation, the two-dimensional detection mechanism 810 is a 2D industrial camera with a ring light source purchased on the market, which can be used for high-precision detection of the defects on the lower surface of the chip. The three-dimensional detection mechanism 820 and the chip thickness detection mechanism 910 are both 3D industrial cameras purchased on the market, which are respectively used to detect the defects of the solder balls on the lower surface of the chip and the thickness of the chip on the stationary chip temporary storage mechanism 900. It efficiently and automatically completes the detection of the lower surface, solder balls and thickness of the chip, with high efficiency and high precision.

[0077] On the basis of the above, as Figure 1 , Figure 5 and Figure 6 shown, the chip temporary storage mechanism 900 includes a horizontal temporary storage table 901 disposed on the machine table 100 and a chip horizontal placement carrier 902 detachably disposed on the horizontal temporary storage table 901 and having a plurality of chip horizontal placement positions. In this specific embodiment, there are twelve chip horizontal placement positions on the chip horizontal placement carrier 902, and eight of them are used in the test. There are eight chip transfer mechanisms on both the chip detection and handling mechanism 500 and the second chip transfer mechanism 700. The number of chip horizontal placement positions can also be determined according to the actual situation to be more or less than twelve, or the chip horizontal placement carrier 902 with different numbers of chip horizontal placement positions can be replaced according to actual needs, which is convenient for transferring and detecting multiple chips at one time. The chip detection and transfer speed is fast and the efficiency is high. The specially set high-level chip horizontal placement carrier 902 enables high-precision thickness detection.

[0078] In the specific embodiments described above, the purpose, technical solutions and beneficial effects of the present invention have been further described in detail. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip appearance inspection device, comprising a machine platform (100) and a chip tray (110), characterized in that: The machine platform (100) is horizontally and sequentially arranged in parallel with at least one loading conveying mechanism (210) for loading a chip tray (110) for carrying untested chips, at least one silk-screen defect unloading conveying mechanism (220) for unloading a chip tray (110) for carrying chips with poor front silk-screen printing after testing, at least four BIN-based unloading conveying mechanisms (230) for unloading chip trays (110) of different classifications of chips after testing, and at least one empty tray unloading conveying mechanism (240) for unloading an empty chip tray (110) without chips after testing. A chip upper surface testing mechanism (300), a first chip transfer mechanism (400) and a chip testing transport mechanism (500) are sequentially arranged above the loading conveying mechanism (210) and the silk-screen defect unloading conveying mechanism (220). The chip testing transport mechanism (500) is provided on a side away from the chip upper surface testing mechanism (300). A tray transport mechanism (600) is arranged from above the loading conveying mechanism (210) to above the empty tray loading and unloading conveying mechanism (240); a lower surface and a solder ball detection mechanism (800) are arranged on the side of one end of the chip detection transport mechanism (500) away from the BIN unloading conveying mechanism (230) within its moving range; a chip temporary storage mechanism (900) corresponding to the lower surface and the solder ball detection mechanism (800) is arranged on the side of one end of the chip detection transport mechanism (500) close to the BIN unloading conveying mechanism (230) within its moving range; a second chip transfer mechanism (700) is arranged above the BIN unloading conveying mechanism (230) and the empty tray loading and unloading conveying mechanism (240); the chip temporary storage mechanism (900) is located within the moving range of the second chip transfer mechanism (700); and a chip thickness detection mechanism (910) is arranged on one side of the chip temporary storage mechanism (900).

2. A chip appearance inspection device according to claim 1, characterized in that: The loading and conveying mechanism (210), the screen-printing defect unloading and conveying mechanism (220), the BIN unloading and conveying mechanism (230), and the empty tray loading and unloading and conveying mechanism (240) all include a horizontal conveying mechanism (201) and an unloading and unloading mechanism (250) for storing the chip tray (110) and cooperating with the horizontal conveying mechanism (201) to load and unload the chip tray (110).

3. The chip appearance inspection device according to claim 1, characterized in that: The chip upper surface detection mechanism (300) comprises a first horizontal driving mechanism (310) and a silk screen detection mechanism (320) arranged on the first horizontal driving mechanism (310) and driven by the first horizontal driving mechanism (310) to move horizontally above a loading transmission mechanism (210) and a silk screen bad unloading transmission mechanism (220).

4. The chip appearance inspection device according to claim 1, characterized in that: The first chip transfer mechanism (400) comprises a second horizontal drive mechanism (410), a first chip positioning mechanism (420) and a first chip placement mechanism (430) arranged on the second horizontal drive mechanism (410) and driven by the second horizontal drive mechanism (410) to move horizontally above a loading transmission mechanism (210) and a screen printing defect unloading transmission mechanism (220), and the first chip placement mechanism (430) comprises a third horizontal drive mechanism (431), a plurality of first vertical drive mechanisms (432) arranged on the third horizontal drive mechanism (431) and driven by the third horizontal drive mechanism (431) to move relatively in a horizontal direction, and a plurality of first vacuum suction heads (433) respectively arranged on the first vertical drive mechanism (432) and driven by the first vertical drive mechanism (432) to move in a vertical direction.

5. The chip appearance inspection device according to claim 1, characterized in that: The chip detection and transport mechanism (500) comprises a fourth horizontal driving mechanism (510), a second chip positioning mechanism (520) and a second chip placement mechanism (530) arranged on the fourth horizontal driving mechanism (510) and driven by the fourth horizontal driving mechanism (510) to move horizontally above the loading and conveying mechanism (210), the screen printing defect unloading and conveying mechanism (220), the lower surface and solder ball detection mechanism (800) and the chip temporary storage mechanism (900), the second chip placement mechanism (530) comprises a fifth horizontal driving mechanism (531), a plurality of second vertical driving mechanisms (532) arranged on the fifth horizontal driving mechanism (531) and driven by the fifth horizontal driving mechanism (531) to move relatively in the horizontal direction, and a plurality of second vacuum suction heads (533) respectively arranged on the second vertical driving mechanisms (532) and driven by the second vertical driving mechanisms (532) to move in the vertical direction.

6. The chip appearance inspection device according to claim 1, characterized in that: The pallet transport mechanism (600) comprises a sixth horizontal drive mechanism (610), a pallet positioning mechanism (620), a third vertical drive mechanism (630) and a pallet clamp (640); the third vertical drive mechanism (630) and the pallet positioning mechanism (620) are arranged on the sixth horizontal drive mechanism (610) and driven by the sixth horizontal drive mechanism (610) to move horizontally above the loading and conveying mechanism (210), the screen printing defect unloading and conveying mechanism (220), the BIN unloading and conveying mechanism (230) and the empty tray loading and unloading and conveying mechanism (240); the pallet clamp (640) is arranged on the third vertical drive mechanism (630) and driven by the third vertical drive mechanism (630) to move in the vertical direction.

7. The chip appearance inspection device according to claim 1, characterized in that: The second chip transfer mechanism (700) comprises a seventh horizontal drive mechanism (710) and a third chip positioning mechanism (720) and a third chip placement mechanism (730) arranged on the seventh horizontal drive mechanism (710) and driven by the seventh horizontal drive mechanism (710) to move horizontally above the BIN unloading and conveying mechanism (230), the empty tray unloading and conveying mechanism (240) and the chip temporary storage mechanism (900); the third chip placement mechanism (730) comprises an eighth horizontal drive mechanism (731), a plurality of fourth vertical drive mechanisms (732) arranged on the eighth horizontal drive mechanism (731) and driven by the eighth horizontal drive mechanism (731) to move relatively in the horizontal direction, and a plurality of third vacuum suction heads (733) respectively arranged on the fourth vertical drive mechanisms (732) and driven by the fourth vertical drive mechanisms (732) to move in the vertical direction.

8. The chip appearance inspection device according to claim 1, characterized in that: The lower surface and solder ball detection mechanism (800) comprises a two-dimensional detection mechanism (810) and a three-dimensional detection mechanism (820) arranged on the machine platform (100), and the chip thickness detection mechanism (910) is a three-dimensional detection mechanism.

9. The chip appearance inspection device according to claim 1, characterized in that: The chip temporary storage mechanism (900) comprises a horizontal temporary storage table (901) arranged on the machine table (100) and a chip horizontal placement carrier (902) detachably arranged on the horizontal temporary storage table (901) and having a plurality of chip horizontal placement holes.

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