Advanced high-performance high-temperature high-humidity intelligent reverse bias test device

Abstract

The utility model belongs to the technical field of reverse bias tests, and particularly relates to an advanced high-performance high-temperature high-humidity intelligent reverse bias test device which comprises a test box, a heating module and a humidifying module are installed on the test box, the heating module comprises a heat supply pipeline and two extension pipes integrally formed on the two sides of the heat supply pipeline, and the humidifying module is installed on the test box. The extension pipe is rotationally connected to the test box, the heat supply pipeline communicates with a first nozzle and a second nozzle which are distributed at equal intervals in the length direction of the heat supply pipeline, and the first nozzle and the second nozzle are each provided with a first valve; the aging test board is fixed at the bottom of the inner side of the test box. According to the utility model, the rotatable heat supply pipeline is arranged in the heating module, the heat supply pipeline is communicated with the nozzle, and the nozzle can realize direct heating of the semiconductor device, so that the internal environment of the test box does not need to be preheated, the speed is high, the heat supply temperature can be adjusted, and the problem of low test speed of the device at the present stage is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of reverse bias tests, and specifically relates to an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device. Background Art

[0002] The high-temperature and high-humidity reverse bias test is an environmental aging test for power semiconductor devices. Generally, it is carried out in a test chamber. When in use, the semiconductor device to be detected is installed on the relevant detection station of the test chamber, and a reverse bias voltage is applied to the semiconductor device. The reverse leakage current value passing through the semiconductor device to be measured is monitored. Then, a forward voltage is applied to the semiconductor device, and the forward current value passing through the semiconductor device is monitored. The relevant performance of the semiconductor is detected through the monitored data.

[0003] Heating and humidifying components are installed on the test chamber, and then the reverse bias test of the semiconductor device is carried out. At present, the heating component of the device is generally installed on the test chamber, and the temperature inside the test chamber is directly increased through an electric heating tube. When the reverse bias test of the semiconductor device needs to be carried out, the temperature and humidity of the entire internal environment of the test chamber need to be increased. Therefore, when the semiconductor device is placed inside the test chamber, there is often a waiting time. At present, the test chamber cannot directly and quickly increase the temperature of the semiconductor device, the heating speed is slow, and it is not energy-saving enough. It cannot quickly carry out the reverse bias test of the semiconductor device, so improvement is needed. Content of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device. By arranging a rotatable heat supply pipe in the heating module, the heat supply pipe is communicated with a nozzle, and the nozzle can directly heat the semiconductor device, so that the internal environment of the test chamber does not need preheating, the speed is fast, and the heat supply temperature can be adjusted, solving the problem of slow test speed of the current device.

[0005] The utility model specifically adopts the following technical solutions to achieve the above purposes:

[0006] An advanced high-performance high-temperature and high-humidity intelligent reverse bias test device, comprising:

[0007] A test chamber, on which a heating module and a humidifying module are installed. The heating module includes a heat supply pipe, and two extension pipes integrally formed on both sides of the heat supply pipe. The extension pipes are rotatably connected to the test chamber, and nozzle one and nozzle two are respectively communicated along the length direction of the heat supply pipe at equal intervals. Valves one are installed on both nozzle one and nozzle two;

[0008] An aging test board, fixed to the inner bottom of the test chamber, and semiconductor devices are arranged at equal intervals on the aging test board;

[0009] An incubator is located on one side of the test chamber, and a gas supply pipe is connected to the air outlet of the incubator. The end of the gas supply pipe far from the incubator is connected to one of the extension pipes.

[0010] Furthermore, the heating module further includes a worm gear fixedly connected to the extension pipe, and a motor installed on the test chamber. A worm is fixedly connected to the output shaft of the motor, and the worm is meshed with the worm gear.

[0011] Furthermore, the gas supply pipe includes a pipe body connected between the incubator and the extension pipe, and a heating cylinder connected to the pipe body. An electric heating wire is installed in the heating cylinder, and a gas supply fan is also installed on the pipe body.

[0012] Furthermore, a controller is installed on one side of the test chamber, and a temperature and humidity detection module is installed in the test chamber. The output end of the temperature and humidity detection module is electrically connected to the input end of the controller, and the output end of the controller is respectively electrically connected to the input end of the first valve, the input end of the electric heating wire, and the input end of the humidification module.

[0013] Furthermore, a circulation pipe is connected between the exhaust port of the test chamber and the intake port of the incubator, and an exhaust fan is installed on the circulation pipe.

[0014] Furthermore, adjustment pipes are connected to both the test chamber and the incubator, and second valves are installed on the adjustment pipes.

[0015] Furthermore, a chamber door is rotatably connected to one side of the test chamber, and a perspective window is provided on the chamber door.

[0016] Compared with the prior art, the present utility model provides an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device, which has the following beneficial effects:

[0017] In the present utility model, a heating module is installed inside the test chamber. The heating module is composed of a heat supply pipe, a first nozzle, a second nozzle, a motor, an extension pipe, etc. The extension pipe is integrally formed at the end of the heat supply pipe, and the extension pipe is rotatably connected to a hole correspondingly opened on the test chamber. When rotating, it can drive the heat supply pipe to rotate, adjust the positions of the first nozzle and the second nozzle. The apertures of the first nozzle and the second nozzle are different, which can adjust the size of the ejected air flow, and then adjust the heating state. When the present utility model is used, hot air can be directly blown to the semiconductor device to be tested, and it is not necessary to preheat the internal environment of the test chamber. When the semiconductor device is loaded, humidification and temperature increase can be directly carried out, saving the preheating time, thereby improving the test efficiency. At the same time, the heating temperature can be flexibly adjusted, and the usability is good.

[0018] In this utility model, by setting up a heat preservation box, the heat preservation box can recycle the hot air in the test box, and the hot air can be cycled and supplied for use by the heating module, which can be more energy-saving, has strong environmental protection, and then saves costs.

[0019] In this utility model, the temperature is automatically adjusted and controlled by a controller, with good intelligent effect and performance, and can improve the test accuracy of the reverse bias test of semiconductor devices. Brief Description of the Drawings

[0020] Figure 1 is a structural schematic diagram of this utility model;

[0021] Figure 2 is a structural schematic diagram of the heating module in this utility model;

[0022] Figure 3 is a structural schematic diagram of the air supply pipeline in this utility model.

[0023] In the figure: 1. Test box; 2. Heating module; 201. Heat supply pipeline; 202. Nozzle 1; 203. Nozzle 2; 204. Valve 1; 205. Motor; 206. Worm gear; 207. Extension pipe; 208. Worm; 3. Box door; 4. Perspective window; 5. Aging test board; 6. Semiconductor device; 7. Humidification module; 8. Heat preservation box; 9. Adjusting pipe; 10. Valve 2; 11. Air supply pipeline; 1101. Pipeline body; 1102. Air supply fan; 1103. Heating cylinder; 1104. Electric heating wire; 12. Circulation pipe; 13. Controller; 14. Exhaust fan. Detailed Embodiment

[0024] Next, the technical solutions in the embodiments of this utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, rather than all the embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of this utility model. Embodiment

[0025] As Figure 1 and Figure 2As shown in the figure, an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device proposed in an embodiment of the present utility model includes: a test chamber 1, on which a heating module 2 and a humidifying module 7 are installed. The heating module 2 includes a heat supply pipeline 201, and two extension pipes 207 integrally formed on both sides of the heat supply pipeline 201. The extension pipes 207 are rotatably connected to the test chamber 1, and the heat supply pipeline 201 is respectively communicated with a first nozzle 202 and a second nozzle 203 distributed at equal intervals along the length direction of the heat supply pipeline 201. Valves 204 are installed on both the first nozzle 202 and the second nozzle 203; an aging test board 5, fixed to the inner bottom of the test chamber 1, and semiconductor devices 6 are arranged on the aging test board 5 at equal intervals; a heat preservation box 8, located on one side of the test chamber 1, and an air supply pipeline 11 is communicated with the air outlet of the heat preservation box 8. One end of the air supply pipeline 11 away from the heat preservation box 8 is communicated with one of the extension pipes 207.

[0026] It should be noted that the heating module 2 and the humidifying module 7 respectively realize the heating and humidifying treatment of the internal environment of the test chamber 1. The heating module 2 is mainly composed of a heat supply pipeline 201, a first nozzle 202, a second nozzle 203, a valve 204 and an extension pipe 207, etc. Among them, the extension pipe 207 is rotatably connected to the corresponding hole opened on the test chamber 1, and one end of the air supply pipeline 11 is communicated at the hole of the test chamber 1, thus realizing the connection between the air supply pipeline 11 and the extension pipe 207 and realizing the air supply of the heat supply pipeline 201. When the extension pipe 207 rotates, it can realize the angle adjustment of the first nozzle 202 and the second nozzle 203, and realize the direct blowing effect on the semiconductor device 6 through the first nozzle 202 or the second nozzle 203, realizing the direct heating of the semiconductor device 6. When heating, it is not necessary to preheat the internal environment of the test chamber 1 first for overall heating. This method can directly heat, thus shortening the time. The apertures of the first nozzle 202 and the second nozzle 203 are different, and different heat flows can be ejected to adjust the heating state. By installing valves 204 on the first nozzle 202 and the second nozzle 203, the flow of hot air is controlled. By arranging the aging test board 5 at the inner bottom of the test chamber 1, it is used for loading the semiconductor device 6, and the heat preservation box 8 is used for the recycling of hot air.

[0027] As Figure 1 and Figure 2 As shown in the figure, in some embodiments, the heating module 2 further includes a worm gear 206 fixedly connected to the extension pipe 207, and a motor 205 installed on the test chamber 1. A worm 208 is fixedly connected to the output shaft of the motor 205, and the worm 208 is meshed with the worm gear 206.

[0028] It should be noted that when it is necessary to adjust the rotation angle of the heating pipeline 201 and then adjust the positions of the first nozzle 202 and the second nozzle 203, the motor 205 is controlled to work. The motor 205 drives the worm 208 to rotate. The worm 208 is meshed and connected with the worm gear 206, and then the extension pipe 207 rotates on the hole of the test chamber 1 to realize the rotation control of the heating pipeline 201.

[0029] As Figure 1 , Figure 2 and Figure 3 shown, in some embodiments, the air supply pipeline 11 includes a pipeline body 1101 connected between the heat preservation box 8 and the extension pipe 207, and a heating cylinder 1103 connected to the pipeline body 1101. An electric heating wire 1104 is installed in the heating cylinder 1103, and an air supply fan 1102 is also installed on the pipeline body 1101.

[0030] It should be noted that the gas in the heat preservation box 8 can enter the test chamber 1 through the pipeline body 1101. When the gas enters the inside of the heating cylinder 1103, the electric heating wire 1104 can be used to dry and heat the gas.

[0031] As Figure 1 , Figure 2 and Figure 3 shown, in some embodiments, a controller 13 is installed on one side of the test chamber 1, and a temperature and humidity detection module is installed inside the test chamber 1. The output end of the temperature and humidity detection module is electrically connected to the input end of the controller 13, and the output end of the controller 13 is respectively electrically connected to the input end of the first valve 204, the input end of the electric heating wire 1104, and the input end of the humidification module 7.

[0032] It should be noted that the model of the controller 13 is S7-400, and the model of the temperature and humidity detection module is DyAura-014-A. It can realize the real-time monitoring of the internal environment of the test chamber 1, and then transmit the data to the controller 13. It can control the electric heating wire 1104 and the first valve 204 according to the data, making the device more intelligent, the temperature adjustment more flexible and accurate, and then making the reverse bias test more precise.

[0033] As Figure 1 shown, in some embodiments, a circulation pipe 12 is connected between the exhaust port of the test chamber 1 and the intake port of the heat preservation box 8, and an exhaust fan 14 is installed on the circulation pipe 12.

[0034] It should be noted that by connecting the circulation pipe 12 between the exhaust port of the test chamber 1 and the intake port of the heat preservation box 8, the recovery of the hot air in the test chamber 1 can be realized and stored in the heat preservation box 8. An exhaust fan 14 is installed on the circulation pipe 12 to realize the diversion of the gas.

[0035] AsFigure 1 As shown, in some embodiments, regulating pipes 9 are connected to both the test chamber 1 and the heat preservation chamber 8, and valves II 10 are installed on the regulating pipes 9.

[0036] It should be noted that the arrangement of the regulating pipes 9 can adjust the air pressure inside the test chamber 1 and the heat preservation chamber 8, regulate the gas environment, and exhaust or intake air according to requirements.

[0037] As Figure 1 shown, in some embodiments, a chamber door 3 is rotatably connected to one side of the test chamber 1, and a perspective window 4 is provided on the chamber door 3. The arrangement of the chamber door 3 can protect the test chamber 1, and the arrangement of the perspective window 4 can facilitate the observation of the internal environment of the test chamber 1.

[0038] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An advanced high-performance high-temperature and high-humidity intelligent reverse bias test device, characterized in that: include: A test box (1), the test box (1) being installed with a heating module (2) and a humidifying module (7), the heating module (2) comprising a heating pipe (201), and two extension pipes (207) integrally formed on both sides of the heating pipe (201), the extension pipes (207) being rotatably connected to the test box (1), and the heating pipe (201) being connected with nozzles 1 (202) and 2 (203) equidistantly distributed along the length direction of the heating pipe (201), and the nozzles 1 (202) and 2 (203) being installed with valves 1 (204); An aging test board (5) is fixed to the inner bottom of the test box (1), and semiconductor devices (6) are arranged on the aging test board (5) at equal intervals; The heat preservation box (8) is located on one side of the test box (1), and an air supply pipe (11) is connected to the air outlet of the heat preservation box (8), and an end of the air supply pipe (11) away from the heat preservation box (8) is connected to one of the extension pipes (207).

2. According to claim 1, an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device is characterized by: The heating module (2) further comprises a worm gear (206) fixedly connected to the extension tube (207), and a motor (205) mounted on the test box (1), wherein a worm (208) is fixedly connected to the output shaft of the motor (205), and the worm (208) is meshingly connected to the worm gear (206).

3. According to claim 1, an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device is characterized by: The air supply pipe (11) comprises a pipe body (1101) connected between the heat preservation box (8) and the extension pipe (207), and a heating tube (1103) connected to the pipe body (1101), an electric heating wire (1104) is installed in the heating tube (1103), and an air supply fan (1102) is also installed on the pipe body (1101).

4. According to claim 3, an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device is characterized in that: A controller (13) is installed on one side of the test box (1), and a temperature and humidity detection module is installed in the test box (1); the output end of the temperature and humidity detection module is electrically connected to the input end of the controller (13), and the output end of the controller (13) is electrically connected to the input end of valve 1 (204), the input end of the electric heating wire (1104), and the input end of the humidification module (7).

5. According to claim 1, an advanced high-performance high-temperature and high-humidity intelligent reverse bias test device is characterized by: A circulation pipe (12) is connected between the exhaust port of the test box (1) and the air inlet port of the heat preservation box (8), and an exhaust fan (14) is installed on the circulation pipe (12).

6. The advanced high-performance high-temperature and high-humidity intelligent reverse bias test device according to claim 1 is characterized by: The test box (1) and the heat preservation box (8) are both connected to a regulating pipe (9), and a second valve (10) is installed on the regulating pipe (9).

7. The advanced high-performance high-temperature and high-humidity intelligent reverse bias test device according to claim 1, characterized in that: A box door (3) is rotatably connected to one side of the test box (1), and a perspective window (4) is provided on the box door (3).

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