Backboard assembly and display module

By setting up a protective structure in the bent section of the back plate of the display module, the problem of cracking and wear of the flexible circuit board is solved, and the effect of reducing the defect rate and improving the performance of the display module is achieved.

CN222979896UActive Publication Date: 2025-06-13CHONGQING BOE OPTOELECTRONICS +1
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Patent Information

Application Number
CN202422254660.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-13
Publication Date
2025-06-13
Estimated Expiration
2034-09-13

AI Technical Summary

Technical Problem

The back plate material characteristics of the existing display modules lead to cracking of the bent position, wear of the flexible circuit board, causing copper leakage and short circuit problems, affecting the performance and reliability of the display module.

Method used

A protective structure is provided in the bent section of the back plate or a protective structure is defined by the bent section itself, physically isolating the outer surface of the bent section from the flexible circuit board to avoid scratches and copper leakage.

Benefits of technology

By isolating the cracked zone and flexible circuit board of the bent section, the defect rate is reduced and the performance and reliability of the display module are improved.

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Abstract

The embodiment of the utility model provides a backboard assembly and a display module, the backboard assembly comprises a body, a side plate, a bending section and a protection structure, the bending section is connected between the body and the side plate, the extension direction of the side plate is perpendicular to the plane where the body is located, and the protection structure is at least partially arranged on the bending section or formed on the bending section. The display module is used for preventing the outer side surface of the bending section from interfering with a flexible circuit board of the display module and protecting the flexible circuit board from being abraded by cracks of the bending section, so that the reject ratio is reduced, and the performance of the display module is improved.
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Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to a backplane assembly and a display module. Background Art

[0002] With the gradual development of technology, consumer products such as electronic products are iteratively upgraded, and the display industry is also changing with each passing day. Taking the display screen of a NB (Notebook Computer) as an example, in the consumer market field, there has been a continuous pursuit of developing ultra-thin, ultra-narrow bezel and lightweight modules. However, the thin and light as well as narrow bezel design will inevitably sacrifice some performance of the module.

[0003] Considering various aspects such as cost, weight, and heat dissipation performance, the existing display modules use a backplane made of a specific material as a support. However, due to the limitations of the characteristics of the backplane material itself, the performance of the display module is adversely affected. Utility Model Content

[0004] Embodiments of this application provide a backplane assembly and a display module to solve or alleviate one or more technical problems in the prior art.

[0005] As an aspect of the embodiments of this application, embodiments of this application provide a backplane assembly. The backplane assembly is applied to a display module and includes:

[0006] A backplane, including a body, side plates, and a bending section. The bending section is connected between the body and the side plates, and the extending direction of the side plates is perpendicular to the plane where the body is located;

[0007] A protection structure, at least partially disposed on or formed on the bending section, for preventing the outer surface of the bending section from interfering with the flexible circuit board of the display module.

[0008] In one implementation, the protection structure is disposed on the outer surface of the bending section, and the outer surface of the protection structure is used to abut against the flexible circuit board so as to isolate the outer surface of the bending section from the flexible circuit board.

[0009] In one implementation, the protection structure is strip-shaped and made of a flexible material.

[0010] In one implementation, the backplane assembly further includes: a rubber frame, which surrounds the outer peripheral side of the backplane. The rubber frame defines an avoidance area for avoiding the flexible circuit board and a rubber strip disposed on the outer surface of the bending section, and the rubber strip forms the protection structure.

[0011] In one implementation, the cross-sectional shape of the outer surface of the protection structure is arc-shaped.

[0012] In one implementation, the material of the protection structure is a rigid material, and at least part of the protection structure covers the outer surface of the bending section.

[0013] In one embodiment, the protection structure includes a first extension section and a second extension section. The first extension section extends to the outer surface of the main body, and the second extension section extends to the outer surface of the side plate. Wherein, the first extension section is adhesively connected to the outer surface of the main body through an adhesive member.

[0014] In one embodiment, a hollow area is formed at the position of the bending section corresponding to the flexible circuit board. The hollow area penetrates through the bending section, and the hollow area forms the protection structure.

[0015] In one embodiment, the protection structure further includes a protective glue layer attached to the outside of the hollow area. The surface of the protective glue layer facing the hollow area forms a reflective surface.

[0016] As another aspect of the embodiments of the present application, the embodiments of the present application provide a display module, including: the backplane assembly of any one of the above embodiments; a display panel disposed on the backplane assembly, including an array substrate having a bonding area; a driving chip for generating a driving signal for driving the array substrate; a flexible circuit board connected between the bonding area and the driving chip for outputting the driving signal generated by the driving chip to the array substrate.

[0017] According to the backplane assembly and the display module of the embodiments of the present application, by providing a protection structure on the bending section of the backplane or directly defining the protection structure by the bending section itself, the outer surface of the bending section is physically isolated from the flexible circuit board, avoiding the cracking area on the outer surface of the bending section from scratching the green oil layer of the flexible circuit board and causing copper leakage, thereby reducing the defective rate and improving the performance of the display module.

[0018] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the drawings, unless otherwise specified, the same reference numerals throughout the several views denote the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0020] Figure 1A A schematic structural diagram of a backplane assembly according to an embodiment of the present application is shown;

[0021] Figure 1B Shown Figure 1A An enlarged view of area m therein;

[0022] Figure 2A Shows a rear view of a display module according to Embodiment 1 of the present application;

[0023] Figure 2B Shows Figure 2A Schematic cross-sectional view of A-A;

[0024] Figure 2C Shows Figure 2B Enlarged view of area A;

[0025] Figure 3A Schematic cross-sectional view of a display module according to Embodiment 2 of the present application;

[0026] Figure 3B Shows Figure 3A Enlarged view of area B;

[0027] Figure 4A Shows a rear view of a display module according to Embodiment 3 of the present application;

[0028] Figure 4B Shows Figure 4A Schematic cross-sectional view of A-A;

[0029] Figure 4C Shows a partial enlarged view of a display module according to Embodiment 3 of the present application;

[0030] Figure 4D Shows a partial schematic view of a backplane according to Embodiment 3 of the present application.

[0031] Explanation of reference numerals:

[0032] 100 - Display module, 101 - Polarizer, 102 - Color film layer, 103 - Array substrate, 104 - Film layer assembly, 105 - Adhesive tape, 106 - Printed circuit board, 107 - Light guide plate, 108 - Reflector, 109 - Light bar, 110 - Backplane, 111 - Body, 112 - Bent section, 112a - Hollow area, 113 - Side plate, 114 - Folded-back section, 120 - Flexible circuit board, 121 - Rear plate section, 122 - Lower plate section, 123 - Front plate section, 130 - Protection structure, 131 - Glue frame, 131a - Avoidance area, 132 - Rubber strip, 133 - First extension section, 134 - Second extension section, 140 - Protection glue layer, 150 - Adhesive member, 160 - Light-shielding tape. Detailed Description of the Invention

[0033] In the following, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are regarded as exemplary rather than restrictive in nature.

[0034] During the display module testing process, the inventors of the present application found problems of assembled flash screen and opening / closing test flash screen. After analysis, it was found that the bending position of the backplane 110 cracked, and the crack of the backplane 110 abraded the green oil layer of the FPC (Flexible Printed Circuit), forming a copper leakage area. The direct contact between the copper leakage area and the backplane 110 caused the short circuit of the display module, resulting in related defects such as flash screen.

[0035] The material of the backplane 110 belongs to high-strength aluminum alloy, which has the characteristics of high strength and low elongation. The bending position belongs to the area with large material stretching, and the degree of cracking increases with the increase of material thickness and stretching length. This problem belongs to the material characteristics and cannot be completely avoided. Considering the cost, weight and heat dissipation performance of the display module, the backplane 110 made of aluminum alloy is superior to the backplane 110 made of stainless steel. For the above reasons, without changing the material of the backplane 110, the embodiments of the present application provide a backplane assembly and a display module 100 that can at least solve the above technical problems.

[0036] Figure 1A The structure diagram of the backplane assembly according to the embodiment of the present application is shown. Figure 1B Shown Figure 1A The enlarged view of the m area in Figure 2A The rear view of the display module 100 according to the first embodiment of the present application is shown. Figure 2B Shown Figure 2A The schematic cross-sectional view of A-A in

[0037] Figure 1A And 1B Only the backplane assembly, the flexible circuit board 120 and the printed circuit board 106 of the display module 100 are shown in Figure 1B The flexible circuit board 120 and the printed circuit board 106 (PCB, Printed Circuit Board) are in an unbended state, and the flexible circuit board 120 and the printed circuit board 106 are bent in the direction of the arrow shown in Figure 2B To form the bent state shown in Figure 2B For Figure 2A The A-A cross-section of is rotated counterclockwise by 90°.

[0038] If the position in the usage state of the display module 100 is used as a reference, the X direction shown in the drawings is to the left, the Y direction is downward, and the Z direction is forward.

[0039] As shown in Figures 1A to 2AAs shown, the backplane assembly of the embodiment of the present application is applied to the display module 100 to provide support for the display module 100. The display module 100 generally includes a backplane assembly, a display panel disposed on the backplane assembly, a driving chip for generating driving signals for the driving array substrate 103, and a flexible circuit board 120. Among them, the backplane assembly is the backplane assembly of any of the following embodiments.

[0040] Among them, the display panel includes an array substrate 103, which is also called a TFT (Thin-Film Transistor). The array substrate 103 has a bonding area. The driving chip is disposed on the printed circuit board 106. The flexible circuit board 120 is connected between the bonding area and the driving chip on the printed circuit board 106, and is used to output the driving signals generated by the driving chip to the array substrate 103.

[0041] The display module 100 may further include a light bar 109, a reflective sheet 108, a light guide plate 107, a light collecting prism included in the film layer assembly 104, a diffusion sheet, etc., as well as a liquid crystal layer, a color film layer 102, a polarizer 101, a light-shielding tape 160, and an adhesive tape 105. Among them, the backplane assembly forms a receiving area for receiving the light bar 109 at the bottom. The light-shielding tape 160 is generally located on the front side of the folded section 114 of the backplane 110, and is used to prevent light from irradiating the non-display area of the display module 100 and the carrier array substrate 103. The light guide plate 107 and the reflective sheet 108 are generally located above the light bar 109; the adhesive tape 105 generally wraps the bottom of the display module 100, and is used for sealing and light shielding, and at the same time fixes the printed circuit board 106 to the backplane assembly.

[0042] The light emitted by the light bar 109 is reflected by the reflective sheet 108 and the light guide plate 107 converts the line light source into a surface light source, enters the film layer assembly 104, is enhanced and homogenized by the film layer assembly 104, and then the polarizer 101 filters out light with a specific polarization direction and reaches the liquid crystal layer. The array substrate 103 controls the arrangement state of the liquid crystal molecules in the liquid crystal layer based on the driving signal, thereby modulating the polarization direction of the light. The light modulated by the liquid crystal layer is filtered into red, green, and blue light by the color film layer 102, and then processed by the polarizer 101 to form the final image.

[0043] Figure 2C Shown Figure 2B The enlarged view of area A, as Figures 2A to 2CAs shown in the figure, the backplane assembly of the embodiment of the present application includes a backplane 110 and a protection structure 130. The backplane 110 generally includes a body 111, side plates 113 and a bending section 112. The bending section 112 is connected between the body 111 and the side plates 113, and the extending direction of the side plates 113 is perpendicular to the plane where the body 111 is located; the protection structure 130 is at least partially disposed on the bending section 112 or formed on the bending section 112, and is used to prevent the outer surface of the bending section 112 from interfering with the flexible circuit board 120 of the display module 100, thereby protecting the flexible circuit board 120 from being scratched by cracks generated when the bending section 112 is bent, thereby reducing the defective rate and improving the performance of the display module 100.

[0044] In the embodiment of the present application, the bending section 112 can be understood as the connection part between the body 111 and the side plates 113. The bending section 112 includes two parts that form an angle with each other, and the two parts are respectively connected to the body 111 and the side plates 113.

[0045] In the embodiment of the present application, the outer surface of the bending section 112 refers to the side surface of the bending section 112 away from the center of the backplane 110 in the Y direction. The plane where the body 111 is located is the plane defined by X and Y, and the extending direction of the side plates 113 extends in the Z direction. If the position of the display module 100 in the use state is used as a reference, the outer surface of the bending section 112 refers to the lower surface of the bending section 112, the plane where the body 111 is located is the vertical plane defined by the left-right direction and the up-down direction, and the extending direction of the side plates 113 is the front-back direction.

[0046] The backplane 110 further includes a folding section 114 located on the front side of the body 111. An area for accommodating the light bar 109 is defined between the body 111, the bending section 112, the side plates 113 and the folding section 114. After being bent, the flexible circuit board 120 defines a rear plate section 121 located on the rear side of the body 111 of the backplane 110, a lower plate section 122 located below the bending section 112 and the side plates 113 of the backplane 110, and a front plate section 123 located in front of the array substrate 103, so as to connect the array substrate 103 of the display module 100 with the printed circuit board 106.

[0047] In an embodiment of the present application, the protection structure 130 is disposed on the outer surface of the bending section 112, and the outer surface of the protection structure 130 is used to abut against the flexible circuit board 120, so that the outer surface of the bending section 112 is isolated from the flexible circuit board 120. In this embodiment, the protection structure 130 is concentrated on the outer surface of the bending section 112 where cracks are likely to occur, and the size is smaller, which is beneficial to reducing the local size of the display module 100.

[0048] The protection structure 130 is strip-shaped and made of a flexible material, so as to physically isolate the cracking area of the bending section 112 from the flexible circuit board 120, and at the same time reduce the friction between the protection structure 130 and the flexible circuit board 120. Among them, the flexible material can be silicone, polyurethane, etc.

[0049] As Figure 1B shown, the backplane assembly may further include a rubber frame 131. The rubber frame 131 surrounds the outer peripheral side of the backplane 110. The rubber frame 131 is provided with an avoidance area 131a for avoiding the flexible circuit board 120 and a rubber strip 132 disposed on the outer surface of the bending section 112. The rubber strip 132 forms the protection structure 130. The avoidance area 131a of the rubber frame 131 can further reduce the local size of the display module 100. And the rubber frame 131 uses the integrally formed rubber strip 132 as the protection structure 130. While satisfying the avoidance of the flexible circuit board 120 by the rubber frame 131, it can also prevent the flexible circuit board 120 from directly contacting the cracking area of the bending section 112 of the backplane 110. In addition, the integral molding of the rubber frame 131 and the rubber strip 132 does not require additional processing technology and basically does not increase the cost.

[0050] In the first embodiment of the present application, the cross-sectional shape of the outer surface of the protection structure 130 is arc-shaped, reducing the friction area between the protection structure 130 and the flexible circuit board 120. As Figure 2B and 2C shown, the cross-section therein is a plane intercepted by a plane defined by the Y direction and the Z direction.

[0051] Figure 3A Shows a schematic cross-sectional view of the display module 100 according to the second embodiment of the present application. Figure 3B Shows Figure 3A an enlarged view of area B.

[0052] In the second embodiment of the present application, as Figure 3A , 3B shown, the material of the protection structure 130 is a rigid material. At least part of the protection structure 130 covers the outer surface of the bending section 112, so that the flexible circuit board 120 contacts the protection structure 130 instead of the cracking area of the bending section 112 of the backplane 110. While preventing the flexible circuit board 120 from being scratched by the cracking area of the bending section 112, the local strength of the display module 100 is improved.

[0053] The rigid material can be metal, for example, iron, aluminum, etc.

[0054] In one of the embodiments, the protection structure 130 includes a first extension segment 133 and a second extension segment 134. The first extension segment 133 extends to the outer surface of the main body 111, and the second extension segment 134 extends to the outer surface of the side plate 113. Among them, the first extension segment 133 is adhesively connected to the outer surface of the main body 111 through an adhesive 150. By providing two extension segments, the local strength of the display module 100 is further improved. At the same time, the first extension segment 133 fixes the entire protection structure 130 to the backplane 110 through the adhesive 150, eliminating the fixing member for fixing the second extension segment 134 and reducing the local size of the display module 100.

[0055] In Figure 3B the illustrated example, the first extension segment 133 extends along the Y direction from the outer surface of the main body 111. The second extension segment 134 is bent from the end of the first extension segment 133 in the Y direction to the outer surface of the side plate 113 outside the bending segment 112 and extends in the Z direction, forming a substantially L-shaped cross-section structure, which simplifies the structure and reduces the local size of the display module 100.

[0056] Figure 4A The rear view of the display module 100 according to the third embodiment of the present application is shown, Figure 4B shown Figure 4A schematic cross-sectional view of A-A of Figure 4C The partial enlarged view of the display module 100 according to the third embodiment of the present application is shown, Figure 4D The partial schematic view of the backplane 110 according to the third embodiment of the present application is shown, Figure 4D is a partial view of the backplane 110 viewed from the reverse direction of Y.

[0057] In the third embodiment of the present application, as Figures 4A to 4D shown, a hollow area 112a is provided at the position of the bending segment 112 corresponding to the flexible circuit board 120. The hollow area 112a penetrates through the bending segment 112. The hollow area 112a forms the protection structure 130. During the processing stage of the backplane 110, before the bending process, through the blanking process, the bending cracking area of the backplane 110 corresponding to the flexible circuit board 120 is cut off to form the hollow area 112a, and then bending is performed, and there will be no problem of cracks generated by subsequent bending; moreover, the process is simple and the cost is basically not increased.

[0058] The Z-direction dimension of the hollow area 112a is small, and the light passing through the hollow area 112a can be directly blocked by the front light-shielding tape 160 and the peripheral adhesive tape 105 to prevent light leakage.

[0059] The protection structure 130 may further include a protective glue layer 140 attached to the outside of the hollow area 112a. The surface of the protective glue layer 140 facing the hollow area 112a forms a reflective surface. For example, the reflective surface is white to avoid light loss.

[0060] In Figure 4D the illustrated example, the protective glue extends along the Y direction from the outer surface of the main body 111 in sequence, bends to the outer surface of the side plate 113 outside the hollow area 112a, and then extends in the Z direction, forming a substantially L-shaped cross-section structure to completely cover the hollow area 112a, while simplifying the structure and reducing the local size of the display module 100.

[0061] In the backplane assembly and the display module 100 of the embodiment of the present application, by providing the protection structure 130 at the bending section 112 of the backplane 110 or directly defining the protection structure 130 by the bending section 112 itself, the outer surface of the bending section 112 is physically isolated from the flexible circuit board 120, avoiding the green oil layer of the flexible circuit board 120 being scratched by the cracking area on the outer surface of the bending section 112, thereby reducing the defective rate and improving the performance of the display module 100.

[0062] In the description of this specification, it should be understood that the orientation or positional relationship indicated by terms such as "length", "upper", "lower", "front", "rear", "left", "right", "vertical", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0063] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0064] In the present application, unless otherwise clearly specified and limited, terms such as "connected" and "coupled" may be electrical connections or communications; they may be directly connected or indirectly connected through an intermediate medium, and may be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0065] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include contact between the first and second features not directly but through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and diagonally above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly below and diagonally below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0066] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure of this application, components and arrangements of specific examples are described above. Of course, they are merely examples and are not intended to limit this application. In addition, this application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity and does not in itself indicate the relationship between the various embodiments and / or arrangements discussed.

[0067] As described above, only the specific embodiments of this application are provided, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of various changes or substitutions, and these should all be covered within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. A backplane assembly, characterized in that: The back panel assembly is applied to a display module, and the back panel assembly includes: A back plate, comprising a body, a side plate and a bending section, wherein the bending section is connected between the body and the side plate, and an extending direction of the side plate is perpendicular to the plane where the body is located; The protection structure is at least partially disposed on or formed on the bending section, and is used to prevent the outer surface of the bending section from interfering with the flexible circuit board of the display module.

2. The back plate assembly according to claim 1, characterized in that: The protection structure is arranged on the outer surface of the bending section, and the outer surface of the protection structure is used to abut against the flexible circuit board, so that the outer surface of the bending section is isolated from the flexible circuit board.

3. The back plate assembly according to claim 2, characterized in that: The protection structure is in strip shape and is made of flexible material.

4. The back plate assembly according to claim 3, characterized in that: The back panel assembly also includes: a rubber frame, which is arranged around the outer peripheral side of the back panel, and the rubber frame defines an escape area for evading the flexible circuit board and a rubber strip arranged on the outer surface of the bending section, and the rubber strip forms the protective structure.

5. The back plate assembly according to claim 3, characterized in that: The cross-sectional shape of the outer surface of the protection structure is an arc shape.

6. The back plate assembly according to claim 1, characterized in that: The material of the protection structure is a rigid material, and at least a portion of the protection structure is covered on the outer surface of the bending section.

7. The back plate assembly according to claim 6, characterized in that: The protective structure includes a first extension section and a second extension section, the first extension section extends to the outer surface of the main body, and the second extension section extends to the outer surface of the side panel; wherein the first extension section is bonded to the outer surface of the main body by an adhesive.

8. The back plate assembly according to claim 1, characterized in that: A hollow area is provided at a position of the bending section corresponding to the flexible circuit board, the hollow area runs through the bending section, and the hollow area forms the protective structure.

9. The back plate assembly according to claim 8, characterized in that: The protection structure further comprises a protection adhesive layer attached to the outer side of the hollow area, and the surface of the protection adhesive layer facing the hollow area forms a reflective surface.

10. A display module, characterized in that: include: The back panel assembly according to any one of claims 1 to 9; A display panel, disposed on the back panel assembly, comprising an array substrate, wherein the array substrate has a binding area; A driving chip, used for generating a driving signal for driving the array substrate; The flexible circuit board is connected between the binding area and the driving chip, and is used for outputting the driving signal generated by the driving chip to the array substrate.