Coil component and filter circuit including same

Abstract

The present disclosure is a coil component (100), in which the coil component (100) comprises: an insulator (3) having a pair of main surfaces facing each other; two or more first conductors (10a-10c) that form a first coil; and three or more second conductors (20a-20c) that form a second coil, the first conductors and the second conductors being stacked parallel to the pair of main surfaces of the insulator, the first coil (L1) and the second coil (L2) being disposed such that the winding axes face the normal direction with respect to the pair of main surfaces, and the openings of the first coil (L1) and the second coil (L2) at least partially overlap. The insulator (3) includes a first laminated portion (11) including a portion in which the two or more second conductors (20a, 20b) and the first conductor (10a) are laminated adjacent to each other in the lamination direction, and a second laminated portion (21) including a portion in which the first conductor (10c) and the second conductor (20c) are laminated adjacent to each other in the lamination direction. The interval (d1) between a conductor (20b) disposed on a layer of the first conductor (10) and the second conductor (20) included in the first laminated section (11) on the side of the second laminated section (21) and a conductor (10b) disposed on a layer of the first conductor (10) and the second conductor (20) included in the second laminated section (21) on the side of the first laminated section (11) is larger than the interval (d2) between adjacent conductors in the first laminated section (11) and the interval (d2) between adjacent conductors in the second laminated section (21).

Description

Technical Field

[0001] The present disclosure relates to a coil component and a filter circuit including the coil component. Background Art

[0002] In an electronic device, a filter circuit including a coil component is used for noise countermeasures. Generally, since a capacitor as a capacitive element is used in the filter circuit, the noise suppression effect is reduced due to the equivalent series inductance (ESL) which is the parasitic inductance of the capacitor. There is known a coil component having a function of canceling the equivalent series inductance ESL of such a capacitor.

[0003] Japanese Unexamined Patent Application Publication No. 2020-31118 (Patent Document 1) discloses a common-mode noise filter including a first coil formed of a first spiral conductor and a second spiral conductor and a second coil formed of a third spiral conductor and a fourth spiral conductor.

[0004] In the common-mode noise filter described in Patent Document 1, a second coil is sandwiched between the first spiral conductor and the second spiral conductor constituting the first coil, and the interval between the third spiral conductor and the fourth spiral conductor constituting the second coil is smaller than the intervals between the first spiral conductor and the third spiral conductor and between the second spiral conductor and the fourth spiral conductor.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2020-31118 Summary of the Utility Model

[0008] Problems to be Solved by the Utility Model

[0009] In the common-mode noise filter described in Patent Document 1, a relatively large interval is provided between the first spiral conductor constituting the first coil and the third spiral conductor constituting the second coil and between the second spiral conductor constituting the first coil and the fourth spiral conductor constituting the second coil.

[0010] Therefore, according to the common-mode noise filter described in Patent Document 1, although the parasitic capacitance can be reduced, the magnetic coupling force between the first coil and the second coil may be weakened.

[0011] An object of the present disclosure is to provide a coil component and a filter circuit including the coil component that can increase the magnetic coupling force between the first coil and the second coil while reducing the parasitic capacitance.

[0012] Solutions to Solve the Problems

[0013] A coil component according to one aspect of the present disclosure includes: an insulator having a pair of main surfaces facing each other; two or more first conductors forming a first coil; and three or more second conductors forming a second coil. The first conductors and the second conductors are laminated in parallel with the pair of main surfaces of the insulator. The first coil and the second coil are arranged such that the winding axes face the normal direction with respect to the pair of main surfaces. At least a part of the openings of the first coil and the second coil overlap with each other. The insulator includes a first laminated portion and a second laminated portion. The first laminated portion includes a portion formed by laminating two or more second conductors and first conductors adjacent to each other in the lamination direction. The second laminated portion includes a portion formed by laminating first conductors and second conductors adjacent to each other in the lamination direction. The interval between the conductors in the layer closer to the second laminated portion among the first conductors and the second conductors included in the first laminated portion and the conductors in the layer closer to the first laminated portion among the first conductors and the second conductors included in the second laminated portion is larger than the intervals between adjacent conductors within the first laminated portion and the intervals between adjacent conductors within the second laminated portion.

[0014] Alternatively, the second laminated portion may include a portion formed by laminating three conductors including the first conductor and the second conductor adjacent to each other in the lamination direction.

[0015] Alternatively, when the insulator is viewed from the normal direction, the first coil and the second coil may each have a single-loop coil shape.

[0016] Alternatively, when the insulator is viewed from the normal direction, the two or more first conductors may each have the single-loop coil shape of the first coil, and when the insulator is viewed from the normal direction, the three or more second conductors may each have the single-loop coil shape of the second coil.

[0017] Alternatively, the lamination order of the first conductors and the second conductors in the first laminated portion may be the same as the lamination order of the first conductors and the second conductors in the second laminated portion.

[0018] Alternatively, the coil component may further include a plurality of electrodes provided on the insulator. The insulator has a plurality of side surfaces connecting the pair of main surfaces, and the plurality of side surfaces include a first side surface, a second side surface, and a third side surface. The plurality of electrodes include a first electrode provided on the first side surface, a second electrode provided on the second side surface, and a third electrode provided on the third side surface. The first coil includes the first conductor formed by the first wiring pattern and the first conductor formed by the second wiring pattern. The second coil includes the second conductor formed by the third wiring pattern and the second conductor formed by the fourth wiring pattern. The first conductor formed by the first wiring pattern is connected to the first electrode and the third electrode. The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by a first via conductor. The second conductor formed by the third wiring pattern is connected to the second electrode and the third electrode. The second conductor formed by the fourth wiring pattern is connected to the second conductor formed by the third wiring pattern by a second via conductor.

[0019] A filter circuit according to one embodiment of the present disclosure includes: the above-described coil component; and a capacitor connected to the coil component.

[0020] Effects of the utility model

[0021] According to one embodiment of the present disclosure, it is possible to provide a coil component capable of increasing the magnetic coupling force between the first coil and the second coil while reducing parasitic capacitance, and a filter circuit including the coil component. Description of the drawings

[0022] Figure 1 is a perspective three-dimensional view of the coil component of the present embodiment.

[0023] Figure 2 is a perspective top view of the coil component of the present embodiment.

[0024] Figure 3 is a three-dimensional view for explaining the wiring pattern of the coil component of the present embodiment.

[0025] Figure 4 is a top view of the coil included in the coil component of the present embodiment.

[0026] Figure 5 is a perspective side view of the coil component of the present embodiment.

[0027] Figure 6 is a conceptual diagram for explaining the stacking order of the conductors in the laminate.

[0028] Figure 7 is a circuit diagram of a filter circuit including the coil component of the present embodiment.

[0029] Figure 8 It is a conceptual diagram showing Modification Example 1 of the stacking order of conductors in the laminate.

[0030] Figure 9 It is a conceptual diagram showing Modification Example 2 of the stacking order of conductors in the laminate.

[0031] Figure 10 It is a conceptual diagram showing Modification Example 3 of the stacking order of conductors in the laminate.

[0032] Figure 11 It is a conceptual diagram showing Modification Example 4 of the stacking order of conductors in the laminate. Detailed Implementation Manner

[0033] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals, and their description will not be repeated.

[0034] Figure 1 It is a perspective three-dimensional view of the coil component 100 of the present embodiment. Figure 2 It is a perspective top view of the coil component 100 of the present embodiment. Figure 3 It is a three-dimensional view for explaining the wiring pattern of the coil component 100 of the present embodiment. Figure 4 It is a top view of the coils L1 and L2 included in the coil component 100 of the present embodiment.

[0035] In Figures 1 to 4 , the long side direction of the coil component 100 is set as the X direction, the short side direction is set as the Y direction, and the height direction is set as the Z direction.

[0036] The coil component 100 includes coils L1 and L2. The coil component 100 is composed of a laminate (insulator) 3 of ceramic layers. On the laminate 3, a substrate (ceramic green sheet) forming the wiring patterns of the coils L1 (first coil) and L2 (second coil) is laminated. The lamination direction of the ceramic layers is the Z direction, and the direction of the arrow indicates the upper layer direction.

[0037] The laminate 3 has a pair of main surfaces facing each other and a plurality of side surfaces connecting between the pair of main surfaces. Hereinafter, the upper surface of the laminate 3 in the pair of main surfaces facing each other may be referred to as the "first main surface", the bottom surface may be referred to as the "second main surface", and the pair of main surfaces facing each other may be simply referred to as "main surfaces".

[0038] On one side (the first side) of the two sides on the long side of the laminate 3, an electrode 4a (the first electrode) is provided, and on the other side (the second side), an electrode 4b (the second electrode) is provided. On one side (the third side) of the two sides on the short side, an electrode 4c (the third electrode) is provided, and on the other side (the fourth side), an electrode 4d (the fourth electrode) is provided. As Figure 1 and Figure 2 shown, the electrodes 4a to 4d are provided so as to extend along the first main surface and the second main surface from the side surface of the laminate 3.

[0039] As Figures 1 to 3 shown, the coil L1 and the coil L2 are arranged such that the winding axes face the normal direction with respect to the main surface of the laminate 3, and the openings of the coil L1 and the coil L2 overlap each other magnetically coupled. The coil L1 is composed of conductors 10a to 10c laminated in the Z-axis direction in the laminate 3. The coil L2 is composed of conductors 20a to 20c laminated in the Z-axis direction in the laminate 3. In this way, the coil L1 and the coil L2 are composed of a plurality of conductors 10a to 10c, 20a to 20c laminated parallel to the main surface of the laminate 3.

[0040] Hereinafter, the conductors 10a, 10b, 10c constituting the coil L1 are sometimes referred to as conductors 10, and the conductors 20a, 20b, 20c constituting the coil L2 are sometimes referred to as conductors 20. In addition, the conductors 10, 20 are sometimes collectively referred to as conductors (10, 20).

[0041] As Figure 1 shown, between the conductor 10a and the conductor 10b constituting the coil L1, the conductors 20a, 20b among the conductors 20a to 20c constituting the coil L2 are laminated. The conductor 20c constituting the coil L2 is laminated at a position adjacent to the conductor 10c.

[0042] Refer to Figure 3 to describe the wiring patterns of the coils L1, L2. The coils L1, L2 are formed by the conductors 10, 20 formed on six-layer ceramic green sheets in the laminate 3. In Figure 3 the wiring patterns of the conductors 10, 20 included in each of the six layers are shown. Each wiring pattern is formed, for example, by printing a conductive paste (Ni paste) using a screen printing method on a ceramic green sheet as a substrate.

[0043] The laminate 3 is formed by laminating a plurality of such ceramic green sheets as substrates. All the layers constituting the laminate 3 are made of the same material. In this way, since all the layers of the laminate 3 are made of the same material, it is possible to prevent the possibility that after the lamination process of the laminate 3, peeling and cracks occur in the laminate 3 due to differences in the coefficient of thermal expansion during the batch firing process.

[0044] The coil L1 is composed of a conductor 10a disposed on the first layer, a conductor 10b disposed on the fourth layer, and a conductor 10c disposed on the fifth layer. The coil L2 is composed of a conductor 20a disposed on the second layer, a conductor 20b disposed on the third layer, and a conductor 20c disposed on the sixth layer.

[0045] The connection portion 63a of the conductor 10b and the connection portion 63b of the conductor 10c are connected by a via conductor 53. The connection portion 64a of the conductor 10b and the connection portion 64b of the conductor 10c are connected by a via conductor 54.

[0046] The connection portion 61a of the conductor 20a and the connection portion 61b of the conductor 20b are connected by a via conductor 51. The connection portion 62a of the conductor 20a and the connection portion 62b of the conductor 20b are connected by a via conductor 52.

[0047] Between the conductor 10a and the conductor 10b that form part of the coil L1, the conductors 20a and 20b that form part of the coil L2 are interposed. Moreover, between the conductor 20b and the conductor 20c that form part of the coil L2, the conductors 10b and 10c that form part of the coil L1 are interposed. Thus, in the laminate 3, between the plurality of conductors 10 that form part of the coil L1, the conductor 20 that forms part of the coil L2 is interposed, and between the plurality of conductors 20 that form part of the coil L2, the conductor 10 that forms part of the coil L1 is interposed.

[0048] The wiring patterns of the conductor 10a and the conductor 10b are common. The wiring patterns of the conductor 20b and the conductor 20c are common. The wiring pattern of the conductor 20b and the conductor 20c is a pattern obtained by flipping the wiring pattern of the conductor 10a and the conductor 10b. The wiring pattern of the conductor 20a is a pattern obtained by flipping the wiring pattern of the conductor 10c.

[0049] The conductors 10a to 10c and the conductors 20a to 20c are laminated on the laminate 3 in such a way that Figure 3 the imaginary lines V1, V1 shown pass through the centers of the openings of the coils L1 and L2. Accordingly, the coils L1 and L2 are arranged such that the openings face the normal direction with respect to the main surface of the laminate 3. In addition, as Figure 2 shown, when the laminate 3 is observed from the normal direction with respect to the main surface, the opening patterns of the coil L1 and the coil L2 are common.

[0050] As Figure 4 shown, when the laminate 3 is observed from the normal direction with respect to the main surface, the coils L1 and L2 each have a single-loop coil shape. Moreover, as Figure 3As shown, when observing the laminate 3 in the normal direction with respect to the main surface, the conductors 10a to 10c each have a single-loop coil shape of the coil L1, and the conductors 20a to 20c each have a single-loop coil shape of the coil L2.

[0051] As Figure 1 shown, the end portion 91a of the conductor 10a and the end portion 91b of the conductor 10b are connected to the electrode 4a. The end portion 93a of the conductor 10a and the end portion 93c of the conductor 10b are connected to the electrode 4c. The end portion 92a of the conductor 20b and the end portion 92b of the conductor 20c are connected to the electrode 4b. The end portion 93b of the conductor 20b and the end portion 93d of the conductor 20c are connected to the electrode 4c.

[0052] The coil L1 includes the conductor 10b formed of the first wiring pattern and the conductor 10c formed of the second wiring pattern. The coil L2 includes the conductor 20b formed of the third wiring pattern and the conductor 20a formed of the fourth wiring pattern. The conductor 10b formed of the first wiring pattern is connected to the electrode 4a at the end portion 91b and is connected to the electrode 4c at the end portion 93b. The conductor 10c formed of the second wiring pattern is connected to the conductor 10b formed of the first wiring pattern by via conductors 53 and 54. The conductor 20b formed of the third wiring pattern is connected to the electrode 4b at the end portion 92a and is connected to the electrode 4c at the end portion 93b. The conductor 20a formed of the fourth wiring pattern is connected to the conductor 20b formed of the third wiring pattern by via conductors 51 and 52.

[0053] The end portion 91a of the conductor 10a and the end portion 91b of the conductor 10b form the first end portion of the coil L1. The end portion 93a of the conductor 10a and the end portion 93c of the conductor 10b form the second end portion of the coil L1. The end portion 92a of the conductor 20b and the end portion 92b of the conductor 20c form the first end portion of the coil L2. The end portion 93b of the conductor 20b and the end portion 93d of the conductor 20c form the second end portion of the coil L2.

[0054] In the present embodiment, the connection point of the coil L1 and the coil L2 exists at the electrode 4c. In other words, in the present embodiment, the distance from the connection point of the coil L1 and the coil L2 to the electrode 4c is zero. Hereinafter, the connection point of the coil L1 and the coil L2 will also be referred to as the "intermediate connection point".

[0055] As Figure 1 and Figure 2 shown, when observing the laminate 3 in the normal direction with respect to the main surface, the end portions 93a and 93c of the coil L1 and the end portions 93b and 93d of the coil L2 are arranged at overlapping positions.

[0056] The electrode 4c includes the intermediate connection point of the coil L1 and the coil L2. As Figure 4As shown, when a voltage is applied to the counter electrode 4a, the current flowing in from the electrode 4a (input) flows from the ends 91a and 91b of the coil L1 to the ends 93a and 93c and reaches the electrode 4c, and then flows into the ends 93b and 93d of the coil L1 via the electrode 4c. The current flowing into the ends 93b and 93d of the coil L2 flows to the ends 92a and 92b of the coil L2 and reaches the electrode 4b (output). In this case, the electrode 4a functions as an input terminal, the electrode 4b functions as an output terminal, and the electrode 4c functions as an intermediate connection terminal.

[0057] As Figure 3 shown, in the present embodiment, the two ends of the conductors 10b and 10c are connected by the path conductors 53 and 54 near the two ends, and the two ends of the conductors 20a and 20b are connected by the path conductors 51 and 52 near the two ends. Thus, a parallel circuit of the conductors 10b and 10c and a parallel circuit of the conductors 20a and 20b are formed.

[0058] In the coil component 100, in the conductors 10a to 10c and the conductors 20a to 20c laminated in multiple layers, the current flows in the parallel circuit. Therefore, the coil component 100 can handle a large current.

[0059] In the present embodiment, by connecting the conductors 10b and 10c by the path conductors 53 and 54, the conductors 10c and the electrodes 4a and 4c are electrically connected via the path conductors 53 and 54 and the conductor 10b (see Figure 1 and Figure 3 ). Thus, in order to electrically connect the conductor 10c and the electrodes 4a and 4c, it is not necessary to lead out the two ends of the conductor 10c like the conductor 10b and connect them to the electrodes 4a and 4c.

[0060] Similarly, in the present embodiment, by connecting the conductors 20a and 20b by the path conductors 51 and 52, the conductors 20a and the electrodes 4b and 4c are electrically connected via the path conductors 51 and 52 and the conductor 20b (see Figure 1 and Figure 3 ). Thus, in order to electrically connect the conductor 20a and the electrodes 4b and 4c, it is not necessary to lead out the two ends of the conductor 20a like the conductor 20b and connect them to the electrodes 4a and 4c.

[0061] Both ends of the conductor 10c can also be led out and connected to the electrodes 4a and 4c. Similarly, both ends of the conductor 20a can also be led out and connected to the electrodes 4a and 4c. In this case, the path conductors 51 to 54 are no longer required. In this case, the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c increases. If the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c increases in this way, when the conductors (10, 20) are stacked on the laminate 3 and compacted, the ends may approach each other and it is likely to cause peeling in the laminate 3.

[0062] Therefore, in the present embodiment, the conductor 10b and the conductor 10c are connected by the path conductors 53 and 54, and in addition, the conductor 20a and the conductor 20b are connected by the path conductors 51 and 52. Thereby, the number of ends of the conductors (10, 20) that need to be provided for the electrodes 4a to 4c can be reduced. As a result, peeling in the laminate 3 can be prevented in the manufacturing process of the laminate 3. Of course, as long as peeling is not likely to occur during manufacturing, both ends of the conductor 10c can be connected to the electrodes 4a and 4c, and both ends of the conductor 20a can be connected to the electrodes 4a and 4c.

[0063] Figure 5 is a perspective side view of the coil component 100 of the present embodiment. Figure 6 is a conceptual diagram for explaining the stacking order of the conductors 10 and 20 in the laminate 3.

[0064] Figure 6 is from the perspective of conceptually explaining the stacking order of the conductors 10 and 20 in the laminate 3 Figure 5 The side view shown is simplified. Therefore, in Figure 5 the illustration of the connection portions of the conductors 10 and 20 with the electrodes 4c and 4d and the path conductors 51 to 54 is omitted.

[0065] In the laminate 3, there are a stacked portion 11 and a stacked portion 21 formed by combinations of the conductors 10 and 20. The stacked portion 11 includes the conductor 10a that constitutes a part of the coil L1 and the conductors 20a and 20b that constitute a part of the coil L2. The stacked portion 21 includes the conductors 10b and 10c that constitute a part of the coil L1 and the conductor 20c that constitutes a part of the coil L2. In this way, the laminate 3 includes a stacked portion 11 (first stacked portion) and a stacked portion 21 (second stacked portion) formed by stacking two or more conductors (10, 20).

[0066] As Figure 5 shown, in the stacked portion 11, the conductors 20a and 20b are connected by the path conductors 51 and 52. In the stacked portion 21, the conductors 10b and 10c are connected by the path conductors 53 and 54.

[0067] AsFigure 5 and Figure 6 As shown in Figure 6 , both the stacked portion 11 and the stacked portion 21 include conductors (10, 20) stacked in three layers. In the stacked portion 11 and the stacked portion 21 respectively, the conductors 10, 20 are arranged in such a way that they include the conductor 10 forming a part of the coil L1 and the conductor 20 forming a part of the coil L2. Thus, in both the stacked portion 11 and the stacked portion 21, the coupling force of the mutual inductance between the coil L1 and the coil L2 can be enhanced.

[0068] Particularly in the present embodiment, the conductor 10a forming a part of the coil L1 is arranged on the uppermost layer of the stacked portion 11, and the conductor 20c forming a part of the coil L2 is arranged on the lowermost layer of the stacked portion 21.

[0069] The stacked portion 11 includes a portion formed by stacking two or more conductors 20 (20a, 20b) and the conductor 10 (10a) adjacent to each other in the stacking direction, and the stacked portion 21 includes a portion formed by stacking the conductor 10 (10c) and the conductor 20 (20c) adjacent to each other in the stacking direction. The stacked portion 21 includes a portion formed by stacking three conductors (10b, 10c, 20c) including the conductor 10 and the conductor 20 adjacent to each other in the stacking direction.

[0070] The distance d1 between the conductor 20b arranged in the layer closer to the stacked portion 21 among the conductors 10 and 20 included in the stacked portion 11 and the conductor 10b arranged in the layer closer to the stacked portion 11 among the conductors 10 and 20 included in the stacked portion 21 is larger than the distance d2 between adjacent conductors (10, 20) within the stacked portion 11 and the distance d2 between adjacent conductors (10, 20) within the stacked portion 21.

[0071] In the present embodiment, the distance between the stacked portion 11 and the stacked portion 21 is enlarged so that d1 is larger than d2. More specifically, while minimizing the distance (d2) between the conductors (10, 20), the distance (d1) between the stacked portion 11 and the stacked portion 21 is maximized in consideration of the magnetic coupling force.

[0072] Thereby, a coil component 100 can be provided that can reduce the parasitic capacitance that may be generated between the stacked portion 11 and the stacked portion 21 while increasing the magnetic coupling force between the coil L1 and the coil L2.

[0073] In addition, a stacked body 3 is illustrated in this example in which the distance between adjacent conductors (10, 20) within the stacked portion 11 and the distance between adjacent conductors (10, 20) within the stacked portion 21 are both adjusted to d2.

[0074] However, as long as the intervals between adjacent conductors (10, 20) in the stacked portion 11 and the intervals between adjacent conductors (10, 20) in the stacked portion 21 are shorter than d1, the intervals between adjacent conductors (10, 20) in the stacked portion 11 and the intervals between adjacent conductors (10, 20) in the stacked portion 21 may also be different.

[0075] The intervals between adjacent conductors (10, 20) in the layer portion 11 may also be different. For example, the interval between the conductor 10a and the conductor 20a and the interval between the conductor 20a and the conductor 20b may be different. Similarly, the interval between the conductor 10b and the conductor 10c and the interval between the conductor 10c and the conductor 20c may be different.

[0076] By designing the intervals of the conductors 10 and 20 in various ways like this, the magnetic coupling force between the coils L1 and 2 can be finely adjusted. For example, if the interval between the two conductors 10b and 10c is shortened, the magnetic coupling force between the conductors 10b and 10c increases. As a result, the self-inductance of the coil L1 can be enhanced.

[0077] Here, for example, compared with the case where one layer of each of the coil L1 and the coil L2 is made into a group, three groups are made, and the intervals at two places are enlarged, by laminating two local layers of the coil L1 and the coil L2 as two groups as in this embodiment, the parasitic capacitance generated to obtain the same inductance component can be reduced.

[0078] Here, refer to Figure 7 the filter circuit 1 as an example of a circuit applying the coil component 100 of this embodiment. Figure 7 is a circuit diagram of the filter circuit 1 including the coil component 100 of this embodiment.

[0079] The filter circuit 1 is, for example, an EMI removal filter and is a third-order T-type LC filter circuit. The coil component 100 is used in this filter circuit 1. In addition, although the third-order T-type LC filter circuit is used as the structure of the filter circuit 1 in the following embodiments for description, the coil component 100 with the same structure can also be applied to a fifth-order T-type LC filter circuit, a higher-order T-type LC filter circuit.

[0080] As Figure 7 shown, the filter circuit 1 applying the coil component 100 includes a capacitor C1. The coil component 100 includes a capacitor C, which is connected in parallel with the coils L1 and L2 and is formed by the parasitic capacitance generated in the coils L1 and L2. If a capacitor C exists in parallel with such coils L1 and L2, the high-frequency band noise that is originally intended to be removed by the capacitor C1 described later will pass through the capacitor C, so the noise removal becomes insufficient. Therefore, it is desirable to suppress such a capacitor C as much as possible.

[0081] The capacitor C1 is connected to the coil component 100. One end of the capacitor C1 is connected to the electrode 4c that forms the intermediate connection point of the coil L1 and the coil L2, and the other end of the capacitor C1 is connected to the GND wiring. The capacitor C1 is constituted by, for example, a multilayer ceramic capacitor having BaTiO 3 (barium titanate) as a main component. As the capacitor C1, a multilayer ceramic capacitor having other materials as a main component may also be used. For example, other types of capacitors such as aluminum electrolytic capacitors may also be used as the capacitor C1.

[0082] The capacitor C1 has an inductor L3 as a parasitic inductance (equivalent series inductance (ESL)). As Figure 7 shown, the capacitor C1 is represented by a circuit structure in which the inductor L3 is connected in series with the capacitor C1a. In addition, the capacitor C1 may also be configured to be equivalent to a circuit structure in which a parasitic resistance (equivalent series resistance (ESR)) is connected in series with the inductor L3 and the capacitor C1a.

[0083] The coil L1 and the coil L2 are magnetically coupled and generate a negative inductance component (-M) in series with the capacitor C1. In Figure 7 , the negative inductance component is represented as an inductor of -M. The parasitic inductance (inductor L3) of the capacitor C1 can be canceled out by using this negative inductance component. Thereby, the parasitic inductance component of the capacitor C1 can be apparently reduced. The filter circuit 1 constituted by the capacitor C1, the coil L1, and the coil L2 uses the negative inductance component generated by the mutual inductance of the coil L1 and the coil L2 to cancel the parasitic inductance of the capacitor C1, thereby enabling improvement of the noise attenuation effect in the high frequency band.

[0084] In the present embodiment, the intermediate connection point of the coil L1 and the coil L2 exists at the electrode 4c. In other words, in the present embodiment, no wiring pattern is provided from the intermediate connection point of the coil L1 and the coil L2 to the electrode 4c in either the coil L1 or the coil L2. Therefore, compared with the conventional structure in which a wiring pattern is provided from the intermediate connection point of the coil L1 and the coil L2 to the electrode 4c, the length of the wiring pattern does not change due to manufacturing deviation, and thus deviation in the magnitude of the parasitic inductance component can be prevented. Since no redundant wiring pattern that causes deviation in the magnitude of the parasitic inductance component is provided in the coil component 100 of the present embodiment, there is no parasitic inductance component dependent on the wiring pattern.

[0085] Therefore, in the manufacture of the coil component 100, labor for improving the accuracy to the limit and the cost required therefor in order to suppress such deviation can be suppressed. Therefore, according to the present embodiment, a coil component capable of preventing deviation in the magnitude of the parasitic inductor component and a filter circuit including the coil component can be provided.

[0086] Moreover, when the coil component 100 is used as a component for removing noise from a power line and current flows from the electrode 4a to the electrode 4b, the current flowing inside the laminate 3 passes through the electrode 4c outside the laminate 3. At this time, compared with the conventional pattern in which the current continuously flows inside the laminate 3, the electrode 4c functions as a heat dissipation function, and the heat generated by the current is dissipated at the electrode 4c. Therefore, according to the coil component 100, the heat dissipation effect can be improved.

[0087] Moreover, in the coil component 100 of the present embodiment, there is an effect that can simplify the steps of checking the conduction of the electrodes 4a to 4c and the coils L1 and L2. In the case of a conventional coil component provided with a wiring pattern from the intermediate connection point between the coils L1 and L2 to the electrode 4c, it is impossible to confirm that there is no problem with the conduction between the intermediate connection point of the coils L1 and L2 and the electrode 4c only by testing the conduction between the electrodes 4a and 4b. Since other wirings enter between the intermediate connection point of the coils L1 and L2 and the electrode 4c, it is necessary to check the disconnection state of the other wirings and the connection state between the other wirings and the electrode 4c. Therefore, in the conventional configuration, in order to confirm that the other wirings and the electrode 4c are not problematic, in addition to the check between the electrodes 4a and 4b, it is also necessary to perform a conduction check between the electrode 4a or 4b and the electrode 4c.

[0088] In contrast, in the coil component 100 of the present embodiment, the electrode 4c corresponding to the intermediate connection terminal functions as a conduction line for connecting the coils L1 and L2. Therefore, in the coil component 100, by performing a conduction check between the electrodes 4a and 4b, the conduction check of the electrodes 4a to 4c and the coils L1 and L2 can be completed.

[0089] Moreover, when the coil component 100 of the present embodiment is used for purposes such as removing noise from a power line, the electrodes 4a and 4b function as mounting terminals connected in series with the power line. That is, the electrodes 4a and 4b are constituted by mounting terminals. In the coil component 100, since the electrodes 4a and 4b are provided on the long side of the laminate 3, the size of the mounting terminals can be increased compared with the case where the electrodes 4a and 4b are provided on the short side of the laminate 3. As a result, when current flows in the power line, the heat generated by the mounting portion can be sufficiently dissipated using the electrode width.

[0090] In addition, in the coil component 100 of the present embodiment, by arranging the ends 91a and 91b of the coil L1 on the electrode 4a having a wider width on the long side of the laminate 3, and arranging the ends 92a and 92b of the coil L2 on the electrode 4b having a wider width on the long side of the laminate 3, there is also an effect that a coil with a large opening can be formed using the distance from one end to the other end of the long side.

[0091] In addition, the coil component 100 of the present embodiment is not limited to this. For example, it may be a square without long sides and short sides, and the coil may be circular or elliptical instead of being substantially rectangular parallelepiped. By making it circular, there will be no part with a locally high current density in the conductor forming the coil. Therefore, even in applications where a large current flows, it is not likely to malfunction due to heat generation.

[0092] <Modification Example 1>

[0093] Next, Modification Example 1 applicable to the present embodiment will be described. Figure 8 It is a conceptual diagram of Modification Example 1 showing the lamination order of the conductors 10 and 20 in the laminate 301.

[0094] The laminate 301 of Modification Example 1 is an example in which one conductor 10 is added to the uppermost layer of the lamination portion 11 of the laminate 3 and one conductor 10 is deleted from the lamination portion 21 of the laminate 3. In the laminate 301 of Modification Example 1, the lamination portion 11 is composed of four conductors 10 and 20, and the lamination portion 21 is composed of two conductors 10 and 20.

[0095] In the laminate 301, similar to the laminate 3, the conductors 10 and 20 are arranged such that the lamination portion 11 and the lamination portion 21 respectively contain the local conductor 10 constituting the coil L1 and the local conductor 20 constituting the coil L2. In the laminate 301, similar to the laminate 3, the conductor 10a constituting a part of the coil L1 is arranged at the uppermost layer of the lamination portion 11, and the conductor 20c constituting a part of the coil L2 is arranged at the lowermost layer of the lamination portion 21.

[0096] In the laminate 301 of Modification Example 1, similar to the laminate 3, the interval between the lamination portion 11 and the lamination portion 21 is widened so that d1 is larger than d2. Thus, in Modification Example 1, it is also possible to reduce the parasitic capacitance that may be generated between the lamination portion 11 and the lamination portion 21 while increasing the magnetic coupling force between the coil L1 and the coil L2.

[0097] In the laminate 301 of Modification Example 1, different from the laminate 3, the number of layers of the lamination portion 11 and the number of layers of the lamination portion 21 are different. By making the number of layers of the lamination portion 11 and the number of layers of the lamination portion 21 different in this way, it is possible to finely adjust the self-inductance values of the coils L1 and L2 respectively. As a result, it is also possible to finely adjust the mutual inductance of the coils L1 and L2.

[0098] <Modification Example 2>

[0099] Next, Modification Example 2 applicable to the present embodiment will be described. Figure 9 It is a conceptual diagram of Modification Example 2 showing the lamination order of the conductors 10 and 20 in the laminate 302.

[0100] The laminate 302 of Modification 2 is an example in which one conductor 10 is deleted from the stacked portion 21 of the laminate 3. The structure of the stacked portion 11 of the laminate 302 is the same as the structure of the stacked portion 11 of the laminate 3. In the laminate 302 of Modification 2, the stacked portion 11 is composed of three conductors 10 and 20, and the stacked portion 21 is composed of two conductors 10 and 20.

[0101] In the laminate 302, similar to the laminate 3, the conductors 10 and 20 are arranged such that the stacked portion 11 and the stacked portion 21 respectively include the local conductor 10 that constitutes the coil L1 and the local conductor 20 that constitutes the coil L2. In the laminate 302, similar to the laminate 3, the conductor 10a that constitutes a part of the coil L1 is arranged on the uppermost layer of the stacked portion 11, and the conductor 20c that constitutes a part of the coil L2 is arranged on the lowermost layer of the stacked portion 21.

[0102] In the laminate 302 of Modification 2, similar to the laminate 3, the interval between the stacked portion 11 and the stacked portion 21 is enlarged such that d1 is larger than d2. Thus, in Modification 2, it is also possible to reduce the parasitic capacitance that may be generated between the stacked portion 11 and the stacked portion 21 while increasing the magnetic coupling force between the coil L1 and the coil L2.

[0103] In the laminate 302 of Modification 2, similar to the laminate 301 of Modification 1, the number of layers of the stacked portion 11 and the number of layers of the stacked portion 21 are different. By making the number of layers of the stacked portion 11 and the number of layers of the stacked portion 21 different in this way, it is possible to finely adjust the self-inductance values of the coils L1 and L2 respectively. As a result, it is also possible to finely adjust the mutual inductance of the coils L1 and L2.

[0104] <Modification 3>

[0105] Next, Modification 3 that can be applied to the present embodiment will be described. Figure 10 It is a conceptual diagram of Modification 3 showing the stacking order of the conductors 10 and 20 in the laminate 303.

[0106] The laminate 303 of Modification 3 includes a stacked portion 11, a stacked portion 21, and a stacked portion 31 that include combinations of the conductors 10 and 20. The intervals between the stacked portion 11 and the stacked portion 21 and between the stacked portion 21 and the stacked portion 31 are both d1.

[0107] The intervals between adjacent conductors (10, 20) within the stacked portion 11, within the stacked portion 21, and within the stacked portion 31 of Modification 3 are all d2. In Modification 3, the relationship d1 > d2 also holds.

[0108] The stacked structure of the stacked body 303 of Modification 3 is equivalent to a structure in which a stacked portion is added between the stacked portion 11 and the stacked portion 21 in the stacked body 3 described in this embodiment. Figure 6 between the stacked portion 11 and the stacked portion 21 in the stacked body 3.

[0109] In the stacked body 303 of Modification 3, in the stacked portion 11, two conductors 20 (20a, 20b) are stacked adjacent to the conductor 10 (10a), and in the stacked portion 21, there is a portion where the conductor 10 (10c) and the conductor 20 (20c) are stacked adjacent to each other. The interval d1 between the stacked portion 11 and the stacked portion 21 is larger than the interval d2 between the adjacent conductors (10, 20) in the stacked portion 11 and the interval d2 between the adjacent conductors (10, 20) in the stacked portion 21.

[0110] In the stacked body 303 of Modification 3, in the stacked portion 21, two conductors 20 (20c, 20d) are stacked adjacent to the conductor 10 (10c), and in the stacked portion 31, there is a portion where the conductor 10 (10e) and the conductor 20 (20e) are stacked adjacent to each other. The interval d1 between the stacked portion 21 and the stacked portion 31 is larger than the interval d2 between the adjacent conductors (10, 20) in the stacked portion 11 and the interval d2 between the adjacent conductors (10, 20) in the stacked portion 21.

[0111] The stacked portion such as the stacked portion 21 of Modification 3 may be composed of four or more stacked conductors (10, 20). In addition, as long as the interval between the adjacent conductors (10, 20) in the stacked portion 11, the interval between the adjacent conductors (10, 20) in the stacked portion 21, and the interval between the adjacent conductors (10, 20) in the stacked portion 31 are shorter than d1, any interval can be designed. In addition, the interval between the adjacent conductors of the stacked portion 11 and the stacked portion 21 and the interval between the adjacent conductors of the stacked portion 21 and the stacked portion 31 may not be the same d1, as long as it is a distance longer than the distance between the conductors in each stacked portion.

[0112] In the stacked body 303 of Modification 3, similar to the stacked body 3, the interval between the stacked portion 11 and the stacked portion 21 and the interval between the stacked portion 21 and the stacked portion 31 are also enlarged so that d1 is larger than d2. Thereby, while reducing the parasitic capacitance that may be generated between the stacked portion 11 and the stacked portion 21 and the parasitic capacitance that may be generated between the stacked portion 21 and the stacked portion 31, the magnetic coupling force between the coil L1 and the coil L2 can be improved.

[0113] <Modification 4>

[0114] Next, Modification 4 that can be applied to this embodiment will be described. Figure 11 is a conceptual diagram showing Modification 4 regarding the stacking order of the conductors 10 and 20 in the stacked body 304.

[0115] The laminate 304 of Modification Example 4 is an example in which a conductor 10 is added to the uppermost layer of the stacked portion 11 of the laminate 3 and a conductor 20 is added to the lowermost layer of the stacked portion 21 of the laminate 3. In the laminate 304 of Modification Example 4, both the stacked portion 11 and the stacked portion 21 are composed of four conductors 10 and 20. In the laminate 304, the conductors 10a, 10b and the conductors 20a, 20b are stacked in the stacked portion 11, and the conductors 10c, 10d and the conductors 20c, 20d are stacked in the stacked portion 21.

[0116] In the laminate 304 of Modification Example 4, the stacking patterns of the conductors 10 and 20 in the stacked portion 11 and the stacking patterns of the conductors 10 and 20 in the stacked portion 21 are the same. That is, in the laminate 304 of Modification Example 4, in both the stacked portion 11 and the stacked portion 21, the conductor 10 is stacked in the upper two layers and the conductor 20 is stacked in the lower two layers.

[0117] In this way, in Modification Example 4, the stacking order of the conductor 10 and the conductor 20 in the stacked portion 11 is the same as the stacking order of the conductor 10 and the conductor 20 in the stacked portion 21. By making the stacking order of the conductor 10 and the conductor 20 in the plurality of stacked portions 11 and 21 the same, the incidence of manufacturing defects can be reduced.

[0118] Modification Examples 1 to 4 have been described above in sequence. As the stacked portions 11 and 21 of Modification Examples 1 to 4, the case where the maximum number of consecutive layers of the conductor 10 or the conductor 20 is 2 has been described. However, the conductor 10 or the conductor 20 may be stacked in such a way that the maximum number of consecutive layers of the conductor 10 or the conductor 20 is 3 or more. For example, in Figure 8 the Modification Example 1 shown, a conductor 20 may be additionally arranged below the lowermost conductor 20 (20b) in the stacked portion 11. In Figure 10 the Modification Example 3 shown, a conductor 20 may be additionally arranged below the lowermost conductor 20 in each of the stacked portions 11, 21, and 31.

[0119] In the present disclosure, an example in which the lowermost conductor (10, 20) of the stacked portion 11 is different from the uppermost conductor (10, 20) of the stacked portion 21 has been described. For example, in Figure 6 the lowermost layer of the stacked portion 11 shown, the conductor 20 is arranged, and in Figure 6 the uppermost layer of the stacked portion 21 shown, the conductor 10 is arranged. However, the conductor 10 (or the conductor 20) may be arranged at either the lowermost layer of the stacked portion 11 or the uppermost layer of the stacked portion 21.

[0120] In the present disclosure, examples are described in which the coil L1 and the coil L2 each form a single loop, the conductors 10a to 10c each form a single loop of the coil L1, and the conductors 20a to 20c each form a single loop of the coil L2. However, at least one of the coil L1 and the coil L2 may be formed of a spiral loop pattern. Further, a single loop of the coil L1 may be formed by connecting the conductors 10a to 10c in series, and a single loop of the coil L2 may be formed by connecting the conductors 20a to 20c in series.

[0121] [Solution]

[0122] The solutions of the present disclosure are listed below.

[0123] (Item 1) The coil component according to Item 1 includes: an insulator having a pair of main surfaces facing each other; two or more first conductors forming a first coil; and three or more second conductors forming a second coil. The first conductors and the second conductors are laminated in parallel with the pair of main surfaces of the insulator. The first coil and the second coil formed by three or more of the second conductors among the plurality of conductors are included. The first coil and the second coil are arranged such that the winding axis faces the normal direction with respect to the pair of main surfaces. At least a part of the openings of the first coil and the second coil overlap with each other. The insulator includes a first laminated portion and a second laminated portion. The first laminated portion includes a portion formed by laminating two or more second conductors and the first conductors adjacent to each other in the lamination direction. The second laminated portion includes a portion formed by laminating the first conductors and the second conductors adjacent to each other in the lamination direction. The distance between the conductors disposed on the layer closer to the second laminated portion among the first conductors and the second conductors included in the first laminated portion and the conductors disposed on the layer closer to the first laminated portion among the first conductors and the second conductors included in the second laminated portion is larger than the distance between adjacent conductors in the first laminated portion and the distance between adjacent conductors in the second laminated portion.

[0124] (Item 2) The coil component according to Item 1, wherein the second laminated portion includes a portion formed by laminating three conductors including the first conductor and the second conductor adjacent to each other in the lamination direction.

[0125] (Item 3) The coil component according to Item 1 or Item 2, wherein when the insulator is viewed from the normal direction, the first coil and the second coil each have a single-loop coil shape.

[0126] (Item 4) The coil component according to Item 3, wherein when the insulator is viewed from the normal direction, two or more of the first conductors each have a single-loop coil shape of the first coil, and when the insulator is viewed from the normal direction, three or more of the second conductors each have a single-loop coil shape of the second coil.

[0127] (Item 5) The coil component according to any one of Items 1 to 4, wherein the lamination order of the first conductor and the second conductor in the first lamination part is the same as the lamination order of the first conductor and the second conductor in the second lamination part.

[0128] (Item 6) The coil component according to any one of Items 1 to 5, wherein the coil component further includes a plurality of electrodes provided on the insulator, the insulator has a plurality of side surfaces connecting between a pair of main surfaces, the plurality of side surfaces include a first side surface, a second side surface, and a third side surface, the plurality of electrodes include a first electrode provided on the first side surface, a second electrode provided on the second side surface, and a third electrode provided on the third side surface, the first coil includes a first conductor formed of a first wiring pattern and a first conductor formed of a second wiring pattern, the second coil includes a second conductor formed of a third wiring pattern and a second conductor formed of a fourth wiring pattern, the first conductor formed of the first wiring pattern is connected to the first electrode and the third electrode, the first conductor formed of the second wiring pattern is connected to the first conductor formed of the first wiring pattern by a first via conductor, the second conductor formed of the third wiring pattern is connected to the second electrode and the third electrode, and the second conductor formed of the fourth wiring pattern is connected to the second conductor formed of the third wiring pattern by a second via conductor.

[0129] (Item 7) The filter circuit of Item 7 includes: the coil component according to any one of Items 1 to 6; and a capacitor connected to the coil component.

[0130] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The scope of the present disclosure is represented by the claims, rather than by the above description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0131] Description of Reference Numerals

[0132] 1, filter circuit; 3, 301 to 304, insulator; 4a, 4b, 4c, 4d, electrode; 10a to 10e, 20a to 20d, conductor; 11, first lamination part; 21, second lamination part; 31, second lamination part; 51 to 54, via conductor; 61a, 61b, 62a, 62b, 63a, 63b, 64a, 64b, connection part; 91a, 91b, 92a, 92b, 93a, 93b, end part; 100, coil component; C1, capacitor; L1, L2, coil.

Claims

1. A coil component, characterized in that, the coil component includes: an insulator having a pair of main surfaces facing each other; two or more first conductors forming a first coil; and three or more second conductors forming a second coil, the first conductors and the second conductors are stacked in parallel with the pair of main surfaces of the insulator, the first coil and the second coil are arranged such that the winding axis faces the normal direction with respect to the pair of main surfaces, and at least a part of the openings of the first coil and the second coil overlap each other, the insulator includes a first stacked portion and a second stacked portion, the first stacked portion includes a part formed by stacking two or more of the second conductors and the first conductors adjacent to each other in the stacking direction, the second stacked portion includes a part formed by stacking the first conductors and the second conductors adjacent to each other in the stacking direction, the distance between the conductor in the layer closer to the second stacked portion among the first conductors and the second conductors included in the first stacked portion and the conductor in the layer closer to the first stacked portion among the first conductors and the second conductors included in the second stacked portion is larger than the distance between adjacent conductors in the first stacked portion and the distance between adjacent conductors in the second stacked portion.

2. The coil component according to claim 1, characterized in that, the second stacked portion includes a part formed by stacking three conductors including the first conductor and the second conductor adjacent to each other in the stacking direction.

3. The coil component according to claim 1 or 2, characterized in that, when observing the insulator from the normal direction, the first coil and the second coil each have a single-loop coil shape.

4. The coil component according to claim 3, characterized in that, when observing the insulator from the normal direction, the two or more first conductors each have the single-loop coil shape of the first coil, when observing the insulator from the normal direction, the three or more second conductors each have the single-loop coil shape of the second coil.

5. The coil component according to claim 1 or 2, characterized in that, the stacking order of the first conductors and the second conductors in the first stacked portion is the same as the stacking order of the first conductors and the second conductors in the second stacked portion.

6. The coil component according to claim 1 or 2, characterized in that, the coil component further includes a plurality of electrodes provided on the insulator, the insulator has a plurality of side surfaces connecting the pair of main surfaces, the plurality of side surfaces include a first side surface, a second side surface, and a third side surface, the plurality of electrodes include a first electrode provided on the first side surface, a second electrode provided on the second side surface, and a third electrode provided on the third side surface, the first coil includes the first conductors formed by a first wiring pattern and the first conductors formed by a second wiring pattern, the second coil includes the second conductors formed by a third wiring pattern and the second conductors formed by a fourth wiring pattern, The first conductor formed by the first wiring pattern is connected to the first electrode and the third electrode. The first conductor formed by the second wiring pattern is connected to the first conductor formed by the first wiring pattern by a first via conductor. The second conductor formed by the third wiring pattern is connected to the second electrode and the third electrode. The second conductor formed by the fourth wiring pattern is connected to the second conductor formed by the third wiring pattern by a second via conductor.

7. A filter circuit characterized in that the filter circuit includes: the coil component according to any one of claims 1 to 6; and a capacitor connected to the coil component.

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