Substrate slice cleaning device

Abstract

The utility model relates to the technical field of semiconductor substrate material manufacturing, and particularly discloses a substrate slice cleaning device which comprises a container and a plurality of rotating shafts. The container is provided with a cleaning tank for placing a substrate slice; the rotating shafts are rotatably arranged in the cleaning tank, and the multiple rotating shafts are arranged in an arc shape in parallel at intervals; and the plurality of rotating shafts are synchronously and rotationally connected through a synchronous belt. According to the cleaning device provided by the scheme, after the substrate slice is put into the container, the wafer can be driven to rotate through the rotating shaft in the cleaning process, the problem that the substrate slice is blocked by the container in the cleaning process is avoided, and the cleaning effect on the substrate slice is effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor substrate material manufacturing, and particularly relates to a cleaning device for substrate wafers. Background Art

[0002] Indium phosphide substrates are widely used in the fields of radio frequency devices such as manufacturing high-frequency and high-power devices, optical fiber communication, wireless transmission, and radio astronomy. During the production process of indium phosphide substrates, it is necessary to clean the substrate wafers; the existing cleaning method generally places the substrate wafers in a container and then rinses the substrate wafers; blocked by the container, during the cleaning process, there are cleaning dead corners on the substrate wafers, resulting in incomplete cleaning of the substrate wafers. Utility Model Content

[0003] In view of this, the purpose of this application is to provide a cleaning device for substrate wafers to improve the cleaning effect on substrate wafers.

[0004] To achieve the above technical purpose, this application provides a cleaning device for substrate wafers, including: a container and a plurality of rotating shafts;

[0005] A cleaning tank for placing the substrate wafers is provided on the container;

[0006] The rotating shafts are rotatably arranged in the cleaning tank, and the plurality of rotating shafts are arranged in an arc shape in parallel at intervals;

[0007] The plurality of rotating shafts are synchronously rotationally connected by a synchronous belt.

[0008] Further, among the plurality of rotating shafts, any two adjacent rotating shafts are synchronously rotationally connected by a synchronous belt.

[0009] Further, the angle of the arc formed by the plurality of rotating shafts is greater than 8°.

[0010] Further, a plurality of clamping grooves are provided on the cleaning tank at intervals along the axial direction of the rotating shaft;

[0011] The clamping grooves are used for the substrate wafers to be clamped in.

[0012] Further, a plurality of clamping grooves are provided on the rotating shaft at intervals along the axial direction of the rotating shaft;

[0013] The clamping grooves are used for the substrate wafers to be clamped in.

[0014] Further, at least one end of the rotating shaft extends out of the container.

[0015] Further, a handwheel is connected to the end of the rotating shaft extending out of the container.

[0016] Furthermore, both ends of the rotating shaft extend outside the container.

[0017] Synchronous belts are arranged at both ends of the rotating shaft.

[0018] Furthermore, the synchronous belt is a leather belt.

[0019] Furthermore, the container is of a hollow structure.

[0020] As can be seen from the above technical solutions, the present application provides a cleaning device for a wafer substrate, including: a container and a plurality of rotating shafts; a cleaning tank for placing the wafer substrate is arranged on the container; the rotating shafts are rotatably arranged in the cleaning tank, and the plurality of rotating shafts are arranged in an arc-shaped parallel interval; the plurality of rotating shafts are synchronously rotationally connected by a synchronous belt.

[0021] After the wafer substrate is placed in the container in the cleaning device provided by this solution, during the cleaning process, the wafer can be driven to rotate by the rotating shaft, avoiding the problem that the wafer substrate is blocked by the container during the cleaning process, and effectively improving the cleaning effect on the wafer substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic structural diagram of a cleaning device for a wafer substrate provided by an embodiment of the present application;

[0024] Figure 2 It is a schematic structural diagram of a cleaning device for a wafer substrate provided by an embodiment of the present application with a wafer substrate placed therein;

[0025] In the figure: 10, container; 11, cleaning tank; 12, clamping groove; 20, rotating shaft; 21, synchronous belt. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the specification of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection requested by the present application.

[0027] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0028] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0029] Please refer to Figure 1 and Figure 2 , a substrate cleaning device provided in the embodiments of the present application includes: a container 10 and a plurality of rotating shafts 20. A cleaning tank 11 for placing the substrate is provided on the container 10, so that the substrate can be placed in the cleaning tank 11 for cleaning.

[0030] The rotating shafts 20 are all rotatably arranged in the cleaning tank 11, and the plurality of rotating shafts 20 are arranged in an arc shape in parallel at intervals; the plurality of rotating shafts 20 are synchronously rotationally connected through a synchronous belt 21. During the process of cleaning the substrate, the plurality of rotating shafts 20 can rotate synchronously, thereby driving the substrate to rotate, avoiding the problem that there are cleaning dead corners on the substrate and the cleaning effect is not good.

[0031] It should be noted that in this embodiment, the plurality of rotating shafts 20 are arranged in an arc shape to adapt to the circular substrate, which helps the plurality of rotating shafts 20 to contact the substrate, ensuring that the rotating shafts 20 can drive the substrate to rotate when rotating.

[0032] In one embodiment, the angle of the arc formed by the plurality of rotating shafts 20 is greater than 180°. Wherein, the angle of the arc refers to the included angle between the connecting lines of the two ends of the arc and the center of the arc. In this embodiment, the rotating shafts 20 are arranged below the container 10; the angle of the arc formed by the plurality of rotating shafts 20 being greater than 180° enables the bottom and side portions of the substrate placed in the cleaning tank 11 to contact the rotating shafts 20, ensuring that the substrate can be pushed by the rotating shafts 20.

[0033] In one embodiment, multiple substrate wafers can be placed in the cleaning tank 11 simultaneously to clean multiple substrate wafers at the same time, which can improve the cleaning efficiency.

[0034] To provide a place for multiple substrate wafers, as an implementation method, please refer to Figure 1 , a plurality of engaging grooves 12 are provided on the cleaning tank 11 at intervals along the axial direction of the rotating shaft 20. The engaging grooves 12 are used for the substrate wafers to be snapped in, so that the substrate wafers can be placed at intervals in the cleaning tank 11, avoiding the superposition of the substrate wafers and affecting the cleaning effect.

[0035] As another method, the groove body for clamping the substrate wafers can also be provided on the rotating shaft 20. For example, a plurality of clamping grooves are provided on the rotating shaft 20 at intervals along the axial direction of the rotating shaft 20; the clamping grooves are used for the substrate wafers to be snapped in. Through the plurality of spaced clamping grooves, the substrate wafers can also be placed at intervals in the cleaning tank 11.

[0036] In one embodiment, any two adjacent rotating shafts 20 are synchronously rotationally connected by a synchronous belt 21, so as to ensure the synchronous rotation of the plurality of rotating shafts 20 and avoid the increased wear on the edges of the substrate wafers due to different rotational speeds of different rotating shafts 20.

[0037] As an implementation method, at least one end of the rotating shaft 20 extends out of the container 10, which is convenient for the staff to control the rotating shaft 20.

[0038] Furthermore, a handwheel 30 is connected to the end of the rotating shaft 20 extending out of the container 10; the handwheel 30 can be provided with friction lines. The staff can conveniently control the rotation of the rotating shaft 20 through the handwheel 30.

[0039] In another implementation method, both ends of the rotating shaft 20 extend out of the container 10; synchronous belts 21 are provided at both ends of the rotating shaft 20.

[0040] By providing synchronous belts 21 at both ends of the rotating shaft 20, it helps to improve the stability of the transmission effect between the rotating shafts 20, and setting the transmission components outside the container 20 helps to make the structure of the container 20 more compact.

[0041] In application, the synchronous belt 21 can be a belt, which has a certain elasticity and can play a certain buffering role to reduce the impact force when the rotating shaft 20 starts.

[0042] Furthermore, the container 10 is a hollow structure, which can reduce the weight of the container 10 on the one hand and facilitate the flushing of the substrate wafers in the container 10 on the other hand.

[0043] The above are the preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions described in the foregoing examples, or perform equivalent replacements for some of the technical features. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A substrate cleaning device, characterized in that: include: A container (10) and a plurality of rotating shafts (20); The container (10) is provided with a cleaning tank (11) for placing the substrate sheet; The rotating shafts (20) are all rotatably disposed in the cleaning tank (11), and a plurality of the rotating shafts (20) are arranged in parallel and at intervals in an arc shape; The plurality of rotating shafts (20) are connected to each other in synchronous rotation via a synchronous belt (21).

2. The substrate cleaning device according to claim 1, characterized in that: Among the plurality of rotating shafts (20), any two adjacent rotating shafts (20) are connected in synchronous rotation via a synchronous belt (21).

3. The substrate cleaning device according to claim 1, characterized in that: The angle of the arc formed by the arrangement of the plurality of rotating shafts (20) is greater than 180°.

4. The substrate cleaning device according to claim 1, characterized in that: The cleaning tank (11) is provided with a plurality of snap-in grooves (12) arranged at intervals along the axial direction of the rotating shaft (20); The snap-in slot (12) is used for snapping the substrate sheet into.

5. The substrate cleaning device according to claim 1, characterized in that: The rotating shaft (20) is provided with a plurality of slots arranged at intervals along the axial direction of the rotating shaft (20); The card slot is used for the substrate sheet to be carded in.

6. The substrate cleaning device according to claim 1, characterized in that: At least one end of the rotating shaft (20) extends out of the container (10).

7. The substrate cleaning device according to claim 1, characterized in that: The end of the rotating shaft (20) extending outside the container (10) is connected to a hand wheel (30).

8. The substrate cleaning device according to claim 1 or 2, characterized in that: Both ends of the rotating shaft (20) extend out of the container (10); The synchronous belts (21) are provided at both ends of the rotating shaft (20).

9. The substrate cleaning device according to claim 1, characterized in that: The synchronous belt (21) is a belt.

10. The substrate cleaning device according to claim 1, characterized in that: The container (10) is a hollow structure.

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