Electronic socket conversion device

Abstract

The utility model relates to the technical field of chips, in particular to an electronic socket conversion device. Comprising a conversion plate, the upper side of the conversion plate is connected with a conversion plate upper seat, the upper end of the conversion plate is provided with probe contact metal points, the lower end of the conversion plate is provided with a plurality of lower pins, probe upper hole sites are arranged in the conversion plate upper seat, and the positions of the probe contact metal points are matched with the positions of the probe upper hole sites. Compared with the prior art, the electronic socket has the advantages that the Normal socket is converted into the Pogo pin socket through the conversion device of the electronic socket, so that the electronic socket can be applied to the Normal Hi-fix, and high yield and low tin slag rate are realized. The socket is mainly used for conversion among different types of electronic sockets.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, and particularly to an electronic socket conversion device. Background Art

[0002] When testing a chip, the chip needs to be installed on an electronic socket (Socket), and then the electronic socket is installed on the electronic socket board (Socket board) of a high-precision test transmission device (Hi-fix). Through connection with a chip tester, the chip is tested. Among them, the Socket board and the Hi-fix are of an integrated design, and the Socket is installed on the socket board. Therefore, the type of the Socket board determines the type of the Hi-fix.

[0003] The current types of electronic sockets include a spring contact socket (Normal socket) with contact pins as the test method and a (Pogopin socket) with contact solder balls as the test method. Among them, the Normal socket has disadvantages such as low yield rate and high tin slag rate when testing pin-type chips. The Pogo pin socket will not generate tin slag because the downward pressure direction is consistent when testing pin-type chips, ensuring a high-yield test.

[0004] Due to the special socket board design of the Normal Hi-fix, a Pin Holder is provided on the socket board, and only the corresponding normal socket with lower pins can be used, resulting in the inability to use the pogo pin socket on the Normal Hi-fix. Summary of the Invention

[0005] The utility model aims to overcome the deficiencies of the prior art and provides an electronic socket conversion device.

[0006] To achieve the above object, an electronic socket conversion device is designed, including a conversion board. The upper side of the conversion board is connected to an upper seat of the conversion board. The upper end of the conversion board is provided with probe contact metal points, and the lower end of the conversion board is provided with a plurality of lower pins. Probe upper holes are provided in the upper seat of the conversion board, and the positions of the probe contact metal points are matched with the positions of the probe upper holes.

[0007] The conversion board is a PCB board, and an electrical connection is formed between the probe contact metal points and the lower pins through the PCB board.

[0008] After the lower pins are connected to the conversion board, solder joints are formed on the conversion board.

[0009] The number of the lower pins is the same as the number of the probe contact metal points.

[0010] The lower pins correspond one-to-one with the probe contact metal points.

[0011] A groove is provided in the middle of the upper seat of the conversion board.

[0012] A first screw hole is provided in the middle of the conversion board, and a second screw hole matching with it is provided in the middle of the upper seat of the conversion board.

[0013] A positioning hole is provided on one side of the conversion board, and a positioning post matching with the structure of the positioning hole is provided on the upper seat of the conversion board.

[0014] An installation groove matching with the structure of the conversion board is provided at the lower end of the upper seat of the conversion board.

[0015] Fixed bases are respectively provided on the left and right sides of the upper seat of the conversion board.

[0016] Compared with the prior art, the utility model converts a Normal socket into a Pogo pin socket through the conversion device of the electronic socket, so that it can be applied to Normal Hi-fix, realizing high yield and low solder dross rate. It is mainly used for the conversion and use between different types of electronic sockets. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the utility model.

[0018] Figure 2 It is a schematic structural diagram of the conversion board of the utility model.

[0019] Figure 3 It is a schematic structural diagram of the upper seat of the conversion board of the utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following further describes the utility model with reference to the drawings.

[0021] As Figures 1 to 3 shown, the upper side of the conversion board 1 is connected to the upper seat 2 of the conversion board. The upper end of the conversion board 1 is provided with probe contact metal points 3, and the lower end of the conversion board 1 is provided with a plurality of lower pins 4. The upper seat 2 of the conversion board is provided with upper probe holes 5 inside, and the position of the probe contact metal points 3 matches the position of the upper probe holes 5.

[0022] The conversion board 1 is a PCB board, and an electrical connection is formed between the probe contact metal points 3 and the lower pins 4 through the PCB board. After the lower pins 4 are connected to the conversion board 1, solder joints 10 are formed on the conversion board 1. The number of the lower pins 4 is the same as the number of the probe contact metal points 3. The lower pins 4 correspond one-to-one with the probe contact metal points 3.

[0023] A groove 11 is provided in the middle of the upper seat 2 of the conversion board, which is convenient for fixing screws.

[0024] A first screw hole 6 is provided in the middle of the conversion board 1, and a second screw hole 7 that matches it is provided in the middle of the upper seat 2 of the conversion board. During specific use, a screw passes through the first screw hole 6 and the second screw hole 7 to connect the conversion board 1 and the upper seat 2 of the conversion board.

[0025] A positioning hole 8 is provided on one side of the conversion board 1, and a positioning post 13 that matches the structure of the positioning hole is provided on the upper seat 2 of the conversion board. The cooperation between the positioning hole 8 and the positioning post 13 plays a positioning role.

[0026] An installation groove 12 that matches the structure of the conversion board 1 is provided at the lower end of the upper seat 2 of the conversion board.

[0027] Fixed bases 9 are respectively provided on the left and right sides of the upper seat 2 of the conversion board. During specific use, the upper seat 2 of the conversion board is fixed at the working position through the fixed bases 9.

[0028] In the present utility model, the probe of the Pogo pin socket is inserted into the hole position 5 on the probe, and the lower end of the probe abuts against the probe contact metal point 3, so as to form an electrical connection with the lower pin 4 through the conversion board 1. Then, the upper seat 2 of the conversion board is fixed to the socket board of the Hi-fix to test the chip.

[0029] Through the conversion device of the electronic socket, the present utility model converts the Normal socket into a Pogo pin socket, so that it can be applied to the Normal Hi-fix to achieve a high yield rate and a low solder dross rate. It is mainly used for the conversion and use between different types of electronic sockets.

Claims

1. An electronic socket conversion device, comprising a conversion plate, characterized in that: The upper side of the conversion plate (1) is connected to the conversion plate upper base (2), the upper end of the conversion plate (1) is provided with a probe contact metal point (3), the lower end of the conversion plate (1) is provided with a plurality of lower pins (4), and the conversion plate upper base (2) is provided with a probe upper hole position (5), and the position of the probe contact metal point (3) matches the position of the probe upper hole position (5).

2. An electronic socket conversion device according to claim 1, characterized in that: The conversion board (1) is a PCB board, and an electrical connection is formed between the probe contact metal point (3) and the lower pin (4) via the PCB board.

3. An electronic socket conversion device according to claim 1, characterized in that: After the lower pin (4) is connected to the conversion board (1), a solder joint (10) is formed on the conversion board (1).

4. The electronic socket conversion device according to claim 1, characterized in that: The number of the lower pins (4) is consistent with the number of the probe contact metal points (3).

5. An electronic socket conversion device according to claim 1 or 4, characterized in that: The lower pins (4) correspond one to one with the probe contact metal points (3).

6. The electronic socket conversion device according to claim 1, characterized in that: A groove (11) is provided in the middle of the conversion plate upper seat (2).

7. An electronic socket conversion device according to claim 1 or 6, characterized in that: A first screw hole (6) is provided in the middle of the conversion plate (1), and a second screw hole (7) matching the first screw hole (6) is provided in the middle of the conversion plate upper base (2).

8. The electronic socket conversion device according to claim 1, characterized in that: A positioning hole (8) is provided on one side of the conversion plate (1), and a positioning column (13) that matches the positioning hole (8) is provided on the upper base (2) of the conversion plate.

9. The electronic socket conversion device according to claim 1, characterized in that: The lower end of the conversion plate upper seat (2) is provided with a mounting groove (12) that matches the structure of the conversion plate (1).

10. The electronic socket conversion device according to claim 1, characterized in that: Fixed bases (9) are respectively provided on the left and right sides of the conversion plate upper base (2).

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