Composite PCB (printed circuit board)
By setting a heat dissipation film layer, a diffusion heat dissipation groove and a clamping block structure on the composite PCB circuit board, the problems of insufficient heat dissipation and clamping loss in the prior art are solved, and better heat dissipation effect and board stability are achieved.
Patent Information
- Application Number
- CN202421708786.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The overall heat dissipation of existing composite PCB circuit boards is low, which affects the normal use of welding electronic components. At the same time, long-term clamping will cause plate clamping.
A composite PCB circuit board is designed, using a heat dissipation film layer, a diffusion heat dissipation groove, a heat dissipation convex strip and a carbon-based coating to improve heat dissipation, and a clamping groove and anti-clip block are opened on the side walls to avoid clamping damage.
It effectively improves the overall heat dissipation of the circuit board, prevents problems caused by heat accumulation of welding electronic components, and avoids clamping damage to the board through the anti-clip block structure.
Smart Images
Figure CN222981727U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB circuit boards, in particular to a composite PCB circuit board. Background Art
[0002] A composite PCB circuit board, also known as a printed circuit board or a printed wiring board, is a core component in electronic devices. The composite PCB circuit board provides a platform for electronic components in electronic devices to be connected through pre-designed paths.
[0003] Composite PCB circuit boards are widely used in various electronic products, such as computers, mobile phones, household appliances, automotive electronics and other fields.
[0004] Currently, for existing composite PCB circuit boards, corresponding electronic components will be welded later. These electronic components will generate more heat when powered on. However, the overall heat dissipation of the main body of the board is relatively low, which will affect the normal use of the welded electronic components.
[0005] In addition, for existing composite PCB circuit boards, before welding electronic components, they need to be clamped by a fixture, and long-term clamping will cause damage to the board.
[0006] The above problems are widespread and urgently need to be improved. Content of the Utility Model
[0007] The purpose of the utility model is to solve the above-mentioned disadvantages existing in the prior art, and to propose a composite PCB circuit board.
[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0009] Design a composite PCB circuit board, including a circuit board body. Installation holes are provided on the circuit board body. A heat dissipation film layer is provided on the circuit board body. Heat dissipation grooves and clamping grooves are provided on the side wall of the circuit board body. Heat dissipation ridges are provided in the heat dissipation grooves. Heat dissipation coatings are provided on the heat dissipation grooves and the heat dissipation ridges. Anti-clamping blocks are clamped in the clamping grooves. Clamping grooves and pressure-resistant and wear-resistant layers are provided on the anti-clamping blocks. An adhesive coating is provided on the circuit board body. Adhesive card slots are provided on the anti-clamping blocks. Frosted layers are provided on the adhesive card slots.
[0010] Furthermore, the heat dissipation film layer is uniformly arranged along the lower end surface of the circuit board body. The heat dissipation film layer is a fluoroplastics film with a thickness of 60 to 70 microns.
[0011] Further, the heat dissipation grooves are uniformly formed along the side wall surface of the circuit board body. The top view cross-section of the heat dissipation grooves is a structure that diffuses outward. The overall shape of the heat dissipation ridges is a long strip structure, and both the upper and lower ends of the heat dissipation ridges are not higher than the heat dissipation grooves. The heat dissipation ridges are made of aluminum alloy.
[0012] Further, the heat dissipation coating is uniformly provided on the surfaces of the heat dissipation grooves and the heat dissipation ridges. The heat dissipation coating is a carbon-based coating with a thickness of 40 to 50 microns.
[0013] Further, the pressure-resistant and wear-resistant layer is uniformly provided on the inner groove wall surface of the clamping groove and the upper and lower end surfaces of the anti-clamping block. The pressure-resistant and wear-resistant layer is made of PTFE (polytetrafluoroethylene) coating material.
[0014] Further, the top view cross-section of the anti-clamping block is a U-shaped structure, and the anti-clamping block is made of plastic steel.
[0015] Further, the anti-clamping block is clamped with the clamping groove through the bonding card slot. The bonding coating is provided on the upper and lower end surfaces of the circuit board body. The circuit board body is in pressing contact with the frosted layer on the anti-clamping block through the bonding coating.
[0016] A composite PCB circuit board proposed by the present utility model has the following beneficial effects:
[0017] 1. By providing a heat dissipation film layer on the circuit board body, opening diffusion-type heat dissipation grooves on the side wall of the circuit board body, then arranging heat dissipation ridge structures in the heat dissipation grooves, and then providing heat dissipation coating structures on the surfaces of the heat dissipation grooves and the heat dissipation ridges, when the circuit board body is powered on and working, the heat generated by the operation of the electronic components soldered on the circuit board body can be effectively and comprehensively thermally conducted and dissipated, improving the overall heat dissipation performance of the circuit board body and ensuring the normal use of the electronic components soldered on the circuit board body.
[0018] 2. By opening clamping grooves on the side wall surface of the circuit board body, adhesively fixing and arranging anti-clamping block structures on the clamping grooves, then providing clamping grooves on the anti-clamping blocks, and finally providing pressure-resistant and wear-resistant layers on the surfaces of the anti-clamping blocks and the clamping grooves, before soldering electronic components, it can be clamped and connected to the anti-clamping blocks and the clamping grooves through a special fixture, effectively avoiding the situation of clamping damage caused by directly clamping on the circuit board body.
[0019] 3. By providing a bonding card slot structure with a frosted layer on the anti-clamping block, the stability of the anti-clamping block clamped and bonded to the circuit board body is overall improved. Description of the Drawings
[0020] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present utility model;
[0021] Figure 2 For the present utility model Figure 1 Partial enlarged view at position A in
[0022] Figure 3 Top view schematic diagram of the overall structure of the present utility model
[0023] Figure 4 For the present utility model Figure 3 Cross-sectional view taken along line B-B in
[0024] Figure 5 For the present utility model Figure 2 Schematic three-dimensional view of the anti-clamping block in
[0025] In the figure: 1 circuit board body; 10 heat dissipation film layer; 11 mounting holes; 2 clamping grooves; 3 heat dissipation grooves; 31 heat dissipation ribs; 4 anti-clamping blocks; 41 clamping grooves; 42 pressure-resistant and wear-resistant layer; 5 bonding coating; 6 bonding card slots; 61 abrasive layer; 7 heat dissipation coating. Specific embodiments
[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.
[0027] Referring to Figures 1-5 , a composite PCB circuit board includes a circuit board body 1, mounting holes 11 are provided on the circuit board body 1, a heat dissipation film layer 10 is provided on the circuit board body 1, heat dissipation grooves 3 and clamping grooves 2 are provided on the side wall of the circuit board body 1, heat dissipation ribs 31 are provided in the heat dissipation grooves 3, a heat dissipation coating 7 is provided on the heat dissipation grooves 3 and the heat dissipation ribs 31, an anti-clamping block 4 is clamped in the clamping groove 2, clamping grooves 41 and a pressure-resistant and wear-resistant layer 42 are provided on the anti-clamping block 4, a bonding coating 5 is provided on the circuit board body 1, bonding card slots 6 are provided on the anti-clamping block 4, and an abrasive layer 61 is provided on the bonding card slots 6. The circuit board body 1 is a commonly used composite PCB circuit board, which is prior art, and required electronic components will be welded thereon. Some existing structures are not drawn and marked, so there is no need to elaborate.
[0028] Specifically, the heat dissipation film layer 10 is uniformly provided along the lower end surface of the circuit board body 1, and the heat dissipation film layer 10 is a fluoroplastic film with a thickness of sixty to seventy microns. The fluoroplastic film has both heat conduction and insulation properties.
[0029] Furthermore, the heat dissipation grooves 3 are uniformly formed along the side wall surface of the circuit board body 1. The top view cross-section of the heat dissipation grooves 3 is a structure that diffuses outward. The heat dissipation ribs 31 are made of aluminum alloy, and the aluminum alloy material has excellent heat conduction and heat dissipation properties. The heat dissipation grooves 3 with a diffused structure and the heat dissipation rib 31 structure together improve the effective heat dissipation area for heat.
[0030] The overall heat dissipation rib 31 is in a long strip shape and its upper and lower ends are not higher than the heat dissipation groove 3, so as to prevent the upper and lower ends of the heat dissipation rib 31 from protruding and affecting the flatness of the upper and lower end faces of the circuit board body 1.
[0031] Furthermore, the heat dissipation coating 7 is uniformly provided along the surfaces of the heat dissipation grooves 3 and the heat dissipation ribs 31. The heat dissipation coating 7 is a carbon-based coating with a thickness of 40 to 50 microns. The carbon-based coating material has extremely high thermal conductivity and good electrical insulation.
[0032] More specifically, the pressure-resistant and wear-resistant layer 42 is uniformly provided along the inner groove wall surface of the clamping groove 41 and the upper and lower end faces of the anti-clamping block 4. The pressure-resistant and wear-resistant layer 42 is made of PTFE (polytetrafluoroethylene) coating material. The PTFE coating material has excellent pressure-resistant and wear-resistant properties, which improves the anti-clamping injury resistance when the inner groove wall surface of the clamping groove 41 and the upper and lower end faces of the anti-clamping block 4 are clamped by a fixture.
[0033] Generally speaking, the top view cross-section of the anti-clamping block 4 is a U-shaped structure. The anti-clamping block 4 is made of plastic steel, which is a thermoplastic plastic with low cost, strong corrosion resistance, excellent insulation and weather resistance, and high strength and durability.
[0034] Finally, the anti-clamping block 4 is clamped with the clamping groove 2 through the bonding slot 6. The bonding coating 5 is provided on the upper and lower end faces of the circuit board body 1. The bonding coating 5 uses epoxy resin glue, which is an epoxy resin-based adhesive. It has excellent bonding strength, chemical corrosion resistance, electrical insulation performance, as well as good heat resistance and aging resistance.
[0035] The circuit board body 1 is in extrusion contact with the frosted layer 61 on the anti-clamping block 4 through the bonding coating 5. The frosted layer 61 greatly improves the effective bonding contact area between the bonding slot 6 of the anti-clamping block 4 and the bonding coating 5, thereby improving the firm bonding property of the anti-clamping block 4.
[0036] Working mode: When the circuit board body 1 is powered on, when the electronic components soldered on the circuit board body 1 are powered on, heat will be generated (prior art). The heat will not only be quickly transferred and dissipated through the heat dissipation film layer 10. At the same time, the heat near the side wall surface of the circuit board body 1 will also be quickly transferred to each heat dissipation groove 3, and then through the heat dissipation groove 3 and the heat dissipation ribs 31 and combined with the heat dissipation coating 7 to be quickly dissipated to the outside, improving the overall heat dissipation of the circuit board body 1 and ensuring the normal use of the electronic components soldered on the circuit board body 1.
[0037] Moreover, before soldering the electronic components, it can be clamped and connected to the surface of the anti-clamping block 4 and the clamping groove 41 through a special fixture (prior art), and then the electronic components required for soldering can be carried out on the surface of the circuit board body 1 that is stably clamped, effectively avoiding the clamping damage caused by directly clamping on the circuit board body 1.
[0038] In addition, now the bonding coating 5 is evenly coated on the upper and lower end faces of the circuit board body 1 and located in the clamping groove 2, and then the anti-clamping block 4 is clamped in the clamping groove 2 through the bonding clamping groove 6. At this time, the bonding coating 5 has fully contacted the matte layer 61, and at the same time, the bonding coating 5 firmly bonds the anti-clamping block 4 in the clamping groove 2 through the matte layer 61, overall improving the stability of the anti-clamping block 4 clamped and bonded on the circuit board body 1.
[0039] The above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.
Claims
1. A composite PCB circuit board, comprising a circuit board body (1), characterized in that: The circuit board body (1) is provided with a mounting hole (11), the circuit board body (1) is provided with a heat dissipation film layer (10), the side wall of the circuit board body (1) is provided with a heat dissipation groove (3) and a clamping groove (2), the heat dissipation groove (3) is provided with a heat dissipation convex strip (31), the heat dissipation groove (3) and the heat dissipation convex strip (31) are provided with a heat dissipation coating (7), the clamping groove (2) is clamped with an anti-clamping block (4), the anti-clamping block (4) is provided with a clamping groove (41) and a pressure-resistant and wear-resistant layer (42), the circuit board body (1) is provided with an adhesive coating (5), the anti-clamping block (4) is provided with an adhesive groove (6), and the adhesive groove (6) is provided with a frosted layer (61).
2. A composite PCB circuit board according to claim 1, characterized in that: The heat dissipation film layer (10) is evenly arranged along the lower end surface of the circuit board body (1); the heat dissipation film layer (10) is a fluoroplastic film with a thickness of sixty to seventy micrometers.
3. A composite PCB circuit board according to claim 1, characterized in that: The heat dissipation grooves (3) are evenly formed along the side wall surface of the circuit board body (1); the top view cross section of the heat dissipation grooves (3) is a structure that diffuses outwards; the heat dissipation ridges (31) are overall long strip-shaped structures with both upper and lower ends not higher than the heat dissipation grooves (3); and the heat dissipation ridges (31) are made of aluminum alloy.
4. The composite PCB circuit board according to claim 1, characterized in that: The heat dissipation coating (7) is evenly arranged along the surfaces of the heat dissipation grooves (3) and the heat dissipation ridges (31); the heat dissipation coating (7) is a carbon-based coating and has a thickness of forty to fifty micrometers.
5. The composite PCB circuit board according to claim 1, characterized in that: The pressure-resistant and wear-resistant layer (42) is evenly arranged along the inner groove wall surface of the clamping groove (41) and the upper and lower end surfaces of the anti-clamping block (4), and the pressure-resistant and wear-resistant layer (42) is made of PTFE polytetrafluoroethylene coating material.
6. The composite PCB circuit board according to claim 1, characterized in that: The top-view cross-section of the anti-pinch block (4) is a U-shaped structure, and the anti-pinch block (4) is made of plastic steel.
7. The composite PCB circuit board according to claim 1, characterized in that: The anti-pinching block (4) is clamped with the clamping groove (2) via an adhesive clamping groove (6), the adhesive coating (5) is arranged on the upper and lower end surfaces of the circuit board body (1), and the circuit board body (1) is in extrusion contact with the frosted layer (61) on the anti-pinching block (4) via the adhesive coating (5).