Circuit board structure convenient to test
By setting power pads and GND pads in the test area of the circuit board and maintaining appropriate intervals, the problem of lack of GND test points near the power test points is solved, and the GND test points are quickly and accurately found, simplifying the test process and improving testing efficiency.
Patent Information
- Application Number
- CN202421847605.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-31
AI Technical Summary
During testing of existing circuit boards, there is a lack of GND test points near the power supply test points, or the GND test points are set far away from the power supply test points, which makes it difficult to identify the GND test points and is inconvenient to test, which increases the difficulty of testing and may affect the accuracy and efficiency of the test.
Design a circuit board structure that is convenient for testing. The power pad and GND pad are set in the test area and the appropriate distance is maintained. The power pad is square and the GND pad is round. A silk-print outer frame is also set in the test area, and there is a gap between the pad and the silk-print outer frame.
By setting power pads and GND pads on the circuit board and maintaining appropriate spacing, testers can quickly and accurately find GND test points, simplifying the test process, improving testing efficiency, and reducing errors caused by dispersed test points.
Smart Images
Figure CN222981744U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board design, and specifically, to a circuit board structure convenient for testing. Background Art
[0002] A circuit board, also known as a circuit board card or simply "board card", refers to a thin plate or sheet equipped with integrated circuits and other electronic components. The circuit board is one of the most important interconnection components in electronic devices, and its function is to provide connections between circuits, enabling current or signals to flow or transmit smoothly between various components. The circuit board is usually made of insulating materials (such as plastics or fiberglass), covered with a thin layer of copper foil, and the copper foil is engraved into the required circuit pattern through processes such as photolithography and etching. The circuit pattern is then connected to various electronic components (such as resistors, capacitors, transistors, integrated circuits, etc.) by welding or other means to form a complete circuit system.
[0003] Generally, test points are provided on the circuit board. After the circuit board is produced, testers usually use test probes such as oscilloscope probes, multimeter probes, and voltmeter probes to contact the test points to measure the voltage value, waveform, current value, etc. of the power supply network. However, when testing the circuit board, there are often no GND test points near the power test points, or the set position of the GND test points is relatively far from the power test points, resulting in the GND test points being difficult to identify and inconvenient for testing. This not only increases the difficulty of testing but also may affect the accuracy and efficiency of testing.
[0004] The above defects need to be solved urgently. Summary of the Utility Model
[0005] In order to solve the problem that there are no GND test points near the existing power test points, or the set position of the GND test points is relatively far from the power test points, resulting in the GND test points being difficult to identify and inconvenient for testing, the utility model provides a circuit board structure convenient for testing.
[0006] The technical solution of the utility model is as follows:
[0007] A circuit board structure convenient for testing includes a test area provided on the circuit board. A power pad and a GND pad are provided in the test area, and the power pad and the GND pad are arranged at intervals.
[0008] In the utility model according to the above solution, the power pad is square, and the GND pad is circular.
[0009] In the utility model according to the above solution, a power jack is provided in the power pad, and a GND jack is provided in the GND pad.
[0010] For the present utility model according to the above solution, the distance between the power pad and the GND pad is 75 mil to 150 mil.
[0011] For the present utility model according to the above solution, a silk-screen outer frame is further arranged in the test area, and the power pad and the GND pad are arranged within the silk-screen outer frame.
[0012] For the present utility model according to the above solution, there are gaps between the silk-screen outer frame and the peripheries of the power pad and the GND pad.
[0013] For the present utility model according to the above solution, the size of the gap is 15 mil to 25 mil.
[0014] For the present utility model according to the above solution, the width of the silk-screen outer frame is 100 mil to 200 mil.
[0015] For the present utility model according to the above solution, the length of the silk-screen outer frame is 175 mil to 300 mil.
[0016] For the present utility model according to the above solution, the shape of the silk-screen outer frame is an oval.
[0017] For the present utility model according to the above solution, its beneficial effects are as follows:
[0018] In the above circuit board structure convenient for testing, a power pad and a GND pad are arranged in the test area, and the power pad and the GND pad are arranged at intervals. Since the GND pad is arranged in the test area and keeps an appropriate interval from the power pad, the tester can quickly and accurately find the GND test point without searching the entire circuit board, which is convenient for testing and greatly improves the testing efficiency. In addition, arranging the GND pad near the power pad enables the tester to conveniently connect to the GND as a reference point during testing, thus simplifying the testing process and reducing the errors that may be caused by scattered test points. Description of the Drawings
[0019] Figure 1 It is a schematic diagram of the application of the present utility model on a circuit board;
[0020] Figure 2 It is a schematic structural diagram of the present utility model.
[0021] In the figure, 1. Circuit board; 11. Power pad; 111. Power jack; 12. GND pad; 121. GND jack; 13. Silk-screen outer frame. Detailed Embodiments
[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model more clear and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0023] In the design and production process of a circuit board, test points, as key interfaces for verifying its performance and functional integrity, play a crucial role. After the production process is completed, professional testers will use high-precision test tools such as oscilloscope probes, multimeter probes, and voltmeter probes to contact the test points on the circuit board to accurately measure core parameters such as the voltage level, waveform shape, and current intensity of the power supply network. However, in actual test practice, a common technical problem is that there is a lack of adjacent GND (ground) test points around the power supply test points, or the layout of GND test points is too scattered and far from the power supply test points, which greatly increases the complexity of the test operation. Since it is difficult to quickly and accurately identify and contact the GND test points, the test process is not only time-consuming and laborious, but also the accuracy of the test results may be impaired due to too long a test path or signal interference, thus affecting the overall test efficiency and the reliability of the evaluation.
[0024] As Figure 1 shown, in order to solve the above technical problems, the present utility model provides a circuit board structure convenient for testing, including a test area provided on the circuit board 1. In the test area, a power supply pad 11 and a GND pad 12 are provided, and the power supply pad 11 and the GND pad 12 are arranged at intervals. Since the GND pad 12 is provided in the test area and is kept at an appropriate interval from the power supply pad 11, testers can quickly and accurately find the GND test points without searching the entire circuit board 1, which is convenient for testing and greatly improves the test efficiency. In addition, by providing the GND pad 12 near the power supply pad 11, testers can conveniently connect to GND as a reference point at the same time when conducting tests, thus simplifying the test process and reducing the errors that may be caused by scattered test points.
[0025] As Figure 2As shown, in this embodiment, the power pad 11 is square. The square pad not only facilitates layout and wiring, ensuring that the power lines on the circuit board 1 can distribute power evenly and efficiently, but also effectively reduces resistance and inductance effects, reduces heat accumulation caused by excessive current, and protects circuit components from overheating damage. In addition, during the soldering process, due to its regular geometric shape, the square pad makes the solder joints more stable and reliable, contributing to improving the overall durability and reliability of the product. Moreover, the GND pad 12 is circular. The design of the circular pad reduces problems such as soldering defects or stress concentration that may be caused by sharp corners, further enhancing the strength and stability of soldering. At the same time, the circular pad is more visually prominent, facilitating engineers to quickly identify and operate during the design and production process of the circuit board 1. That is, by using different shapes for the power pad 11 and the GND pad 12, the power pad 11 and the GND pad 12 can be quickly identified, improving the test efficiency of the circuit board 1 and thus enhancing work efficiency. Of course, in actual design, the shapes of the power pad 11 and the GND pad 12 can be designed according to actual needs.
[0026] In an alternative embodiment, the power pad 11 is triangular, which not only facilitates layout and wiring, but also during the soldering process, due to its regular geometric shape, the triangular pad makes the solder joints more stable and reliable, contributing to improving the overall durability and reliability of the product. Moreover, the GND pad 12 is circular. The design of the circular pad reduces problems such as soldering defects or stress concentration that may be caused by sharp corners, further enhancing the strength and stability of soldering. At the same time, the circular pad is more visually prominent, facilitating engineers to quickly identify and operate during the design and production process of the circuit board 1. That is, by using different shapes for the power pad 11 and the GND pad 12, the power pad 11 and the GND pad 12 can be quickly identified, improving the test efficiency of the circuit board 1 and thus enhancing work efficiency. Of course, in actual design, the shapes of the power pad 11 and the GND pad 12 can be designed according to actual needs.
[0027] In another alternative embodiment, the power pad 11 is a regular hexagon, which is not only convenient for layout and wiring, but also during the soldering process, due to its regular geometric shape, the solder joints are more stable and reliable, contributing to enhancing the overall durability and reliability of the product. In addition, the GND pad 12 is circular. The design of the circular pad reduces the problems of soldering defects or stress concentration that may be caused by sharp corners, further enhancing the soldering strength and stability. At the same time, the circular pad is more visually prominent, facilitating rapid identification and operation by engineers during the design and production process of the circuit board 1. That is, by using different shapes for the power pad 11 and the GND pad 12, the power pad 11 and the GND pad 12 can be quickly identified, improving the testing efficiency of the circuit board 1 and thus enhancing the work efficiency. Of course, during actual design, the shapes of the power pad 11 and the GND pad 12 can be designed according to actual needs.
[0028] As Figure 2 shown, in this embodiment, the side length of the power pad 11 is equal to the diameter of the GND pad 12. Of course, it can also be designed such that the side length of the power pad 11 is greater than or less than the diameter of the GND pad 12. During actual design, the relationship between the side length of the power pad 11 and the diameter of the GND pad 12 can be designed according to actual needs. Preferably, the side length of the power pad 11 and the diameter of the GND pad 12 are both 44 mil. Of course, during actual design, the side length of the power pad 11 and the diameter of the GND pad 12 can be designed according to actual needs.
[0029] As Figure 2 shown, in this embodiment, a power jack 111 is provided inside the power pad 11, and a GND jack 121 is provided inside the GND pad 12. The test heads of the test tool are respectively inserted into the power jack 111 and the GND jack 121 to achieve the testing of the circuit board 1. The operator only needs to gently insert the corresponding parts of the test heads of the test tool into the power jack 111 and the GND jack 121 to quickly establish an electrical connection between the test tool and the circuit board 1. In addition, the radius of the power jack 111 is equal to the radius of the GND jack 121. Of course, during actual design, the relationship between the radius of the power jack 111 and the radius of the GND jack 121 can be designed according to actual needs. Preferably, the radius of the power jack 111 and the radius of the GND jack 121 are both 25 mil. Of course, during actual design, the radius of the power jack 111 and the radius of the GND jack 121 can be designed according to actual needs. Additionally, the cross-sections of the power jack 111 and the GND jack 121 are circular, which is convenient for production.
[0030] As Figure 2As shown, in this embodiment, the distance D1 between the power pad 11 and the GND pad 12 is 75 mil to 150 mil. The distance D1 between the power pad 11 and the GND pad 12 can be designed as 75 mil, 80 mil, 90 mil, 100 mil, 110 mil, 120 mil, 130 mil, 140 mil, 150 mil. In actual design, the size of the distance D1 between the power pad 11 and the GND pad 12 can be designed according to the actual required space size. If the space is sufficient, the distance between the power pad 11 and the GND pad 12 can be appropriately enlarged. However, it is necessary to prevent the distance between the power pad 11 and the GND pad 12 from being too large, which will be unfavorable for the utilization of the space of the circuit board 1.
[0031] As Figure 2 shown, in this embodiment, a silk screen outer frame 13 is also provided in the test area. The power pad 11 and the GND pad 12 are arranged inside the silk screen outer frame 13, enabling the tester to quickly identify and locate these two test pads, avoiding placing other devices inside the silk screen outer frame 13 and preventing interference with subsequent tests. At the same time, through the boundary reminder of the silk screen outer frame 13, the standardization and safety of the operation are enhanced. During the test process, the tester can accurately insert the test head of the test tool into the power jack 111 and the GND jack 121 according to the guidance of the silk screen outer frame 13, thereby establishing a stable and reliable electrical connection. That is, the silk screen outer frame 13 provided in the test area not only provides a clear and definite physical boundary for the power pad 11 and the GND pad 12, but also improves the overall efficiency and safety of the test process through its auxiliary role. In addition, there are gaps between the silk screen outer frame 13 and the peripheries of the power pad 11 and the GND pad 12. During the test or production process, these gaps can effectively prevent pad short circuits or damages caused by tool mis-touch or external force extrusion, thus ensuring the electrical performance and reliability of the circuit board 1. At the same time, the gaps also facilitate the tester to have sufficient operating space during the connection operation, improving the convenience and accuracy of the test.
[0032] As Figure 2 shown, in this embodiment, the size of the gap D2 between the silk screen outer frame 13 and the power pad 11 and the GND pad 12 is 15 mil to 25 mil, which can avoid being too close to other packaging structures, resulting in poor testing of the subsequent test probes or probes. In addition, the size of the gap D2 between the silk screen outer frame 13 and the power pad 11 and the GND pad 12 can be designed as 15 mil, 16 mil, 17 mil, 18 mil, 19 mil, 20 mil, 21 mil, 22 mil, 23 mil, 24 mil, 15 mil. In actual design, the size of the gap D2 between the silk screen outer frame 13 and the power pad 11 and the GND pad 12 can be designed according to actual needs.
[0033] AsFigure 2 As shown, in this embodiment, the width D3 of the silk-screen outer frame 13 is 100 mil to 200 mil. The width D3 of the silk-screen outer frame 13 can be designed as 100 mil, 110 mil, 120 mil, 130 mil, 140 mil, 150 mil, 160 mil, 170 mil, 180 mil, 190 mil, 200 mil. During actual design, the width D3 of the silk-screen outer frame 13 can be designed according to actual needs.
[0034] As Figure 2 shown, in this embodiment, the length D4 of the silk-screen outer frame 13 is 175 mil to 300 mil. The length D4 of the silk-screen outer frame 13 can be designed as 175 mil, 180 mil, 190 mil, 200 mil, 210 mil, 220 mil, 230 mil, 240 mil, 250 mil, 260 mil, 270 mil, 280 mil, 290 mil, 300 mil. During actual design, the length D4 of the silk-screen outer frame 13 can be designed according to actual needs.
[0035] As Figure 2 shown, in this embodiment, the shape of the silk-screen outer frame 13 is an oval. When the silk-screen outer frame 13 surrounds the power pad 11 and the GND pad 12, a protection barrier can be formed to enclose the power pad 11 and the GND pad 12. At the same time, the oval silk-screen outer frame 13 also enables a suitable gap to be naturally formed between it and the peripheries of the power pad 11 and the GND pad 12, which not only ensures the independence and safety of the pad area but also facilitates the operation and detection by testers and automated equipment. Of course, during actual design, the shape of the silk-screen outer frame 13 can be designed according to actual needs.
[0036] It should be understood that for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present utility model.
[0037] The above has made an exemplary description of the patent of the present utility model in conjunction with the drawings. Obviously, the implementation of the patent of the present utility model is not limited by the above methods. As long as various improvements are made by adopting the method concept and technical solution of the patent of the present utility model, or the concept and technical solution of the patent of the present utility model are directly applied to other occasions without improvement, they are all within the protection scope of the present utility model.
Claims
1. A circuit board structure that is convenient for testing, characterized in that: The invention comprises a test area arranged on a circuit board, wherein a power pad and a GND pad are arranged in the test area, and the power pad and the GND pad are arranged at intervals.
2. The circuit board structure for convenient testing according to claim 1, characterized in that: The power pad is square, and the GND pad is round.
3. The circuit board structure for convenient testing according to claim 2, characterized in that: The power pad is provided with a power jack, and the GND pad is provided with a GND jack.
4. The circuit board structure for convenient testing according to claim 1, characterized in that: The distance between the power pad and the GND pad is 75mil~150mil.
5. The circuit board structure for convenient testing according to claim 1, characterized in that: A silk-screen outer frame is also provided in the test area, and the power pad and the GND pad are provided in the silk-screen outer frame.
6. The circuit board structure for convenient testing according to claim 5, characterized in that: There is a gap between the silk-screen outer frame and the peripheries of the power pad and the GND pad.
7. The circuit board structure for convenient testing according to claim 6, characterized in that: The size of the gap is 15mil~25mil.
8. The circuit board structure for convenient testing according to claim 5, characterized in that: The width of the silk-screen outer frame is 100 mil to 200 mil.
9. The circuit board structure for convenient testing according to claim 5, characterized in that: The length of the silk screen outer frame is 175mil~300mil.
10. The circuit board structure for convenient testing according to claim 5, characterized in that: The shape of the silk-screen outer frame is oval.