Rapid refrigerating and heating device

Abstract

The utility model discloses a rapid refrigerating and heating device, which belongs to the technical field of daily necessities and comprises a seat body, an outer barrel is arranged at the top of the seat body, a lateral fan is arranged on one side of the outer barrel, a conduction barrel is arranged in the outer barrel, the top of the outer barrel and the top of the conduction barrel are respectively opened, and air convection holes are respectively arranged corresponding to the lateral fan. A semiconductor refrigerating / heating assembly and an electric control board are arranged in the base body, and the electric control board is connected with the lateral fan and the semiconductor refrigerating / heating assembly in an electric control mode. According to the structure, the lateral fan is matched with the semiconductor refrigerating / heating assembly, so that cooling / heating and heat preservation of the container can be realized; and meanwhile, the problems that the lateral fan rotates to open and close to cause rollover, air blowing or air draft cannot really act on the container, the container is exposed to cause accidental touch of a user, condensate water leaks to cause product damage and environmental pollution and the like can be avoided, so that the use stability and safety of the product and the cooling / heating and heat preservation efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of daily necessities, and particularly relates to a device for rapid refrigeration and heating. Background Art

[0002] The utility model patent with the Chinese patent number CN202023024217.6 discloses a coaster for facilitating temperature reduction, which comprises a base, a groove, a first connecting rod, a second connecting rod, a top seat, a fan, holes, and hexagonal threads. A groove is provided at the top of the base. The bottom of one end of the base is welded to the bottom of the first connecting rod. The top of the first connecting rod is in clearance fit with the bottom of the second connecting rod. The top of the second connecting rod is welded to the bottom of the top seat. The fan is installed at the bottom of the top seat. A plurality of holes are provided on the first connecting rod and the second connecting rod, and the hexagonal threads penetrate through the first ends of the holes. The top seat comprises a support seat, a motor, a transmission shaft, a first bevel gear, a second bevel gear, and a shaft. The support seat is installed inside the top seat, and a motor is provided at the top of the support seat. The first end of the motor is in clearance fit with the end of the transmission shaft. The above structure can only cool the liquid in the container by using the rotating fan, and has a single function.

[0003] Another example is that the invention application with the Chinese patent number CN202211453561.8 discloses a container pad and a container set, which comprises a heating seat for supporting a container and heating the liquid in the container; an air-cooling component is arranged on the heating seat, and the air-cooling component can blow cooling air towards the container to cool the liquid in the container. The above structure combines heating and heat preservation and cooling of the liquid in the container through the cooperation of the heating seat and the air-cooling component. However, the air-cooling component is arranged in a form of rotating opening and closing, and it will tip over due to vibration during operation, resulting in low use stability. In addition, the cooling air blown by the air-cooling component diffuses outwards during operation and cannot act on the container concentratedly, resulting in low cooling efficiency. Moreover, the container is placed on the heating seat in an exposed manner, and users are prone to accidentally touch it and cause it to tip over during use, resulting in low use safety.

[0004] Therefore, it is necessary to further improve. Content of the Utility Model

[0005] The utility model aims to provide a device for rapid refrigeration and heating to overcome the deficiencies in the prior art.

[0006] A device for rapid refrigeration and heating designed for this purpose includes a base body. A outer barrel is provided at the top of the base body. A lateral fan is provided on one side of the outer barrel. A conduction barrel is provided inside the outer barrel. The tops of the outer barrel and the conduction barrel are respectively open, and air convection holes are respectively provided corresponding to the lateral fan. A semiconductor refrigeration / heating component and an electronic control board are further provided in the base body, and the electronic control board is electrically connected to the lateral fan and the semiconductor refrigeration / heating component respectively.

[0007] A support portion is provided at the bottom of the outer barrel and / or the conduction barrel. The semiconductor refrigeration / heating component is located below the support portion, and the two rely on each other or are spaced and cooperated.

[0008] One side of the outer barrel is open, the lateral fan is laterally fixed on the open side of the outer barrel, and a plurality of outer barrel air convection holes are provided on the other side of the outer barrel.

[0009] A plurality of first conduction barrel air convection holes and second conduction barrel air convection holes are respectively provided on the two symmetrical sides of the conduction barrel. The second conduction barrel air convection holes correspond to the outer barrel air convection holes. The lateral fan is located outside the first conduction barrel air convection holes and blows or sucks air in the direction of the second conduction barrel air convection holes and the outer barrel air convection holes.

[0010] The base body includes an upper shell and a lower shell. The upper shell and the lower shell are fixedly cooperated with each other, and an assembly cavity is formed therebetween. The outer barrel is integrally formed or fixedly separated on the top of the upper shell. The semiconductor refrigeration / heating component and the electronic control board are respectively located in the assembly cavity and fixed on the upper shell or the lower shell.

[0011] The outer barrel is communicated with the upper shell and a receiving frame is provided. The receiving frame is fixedly provided on the upper shell. The conduction barrel is placed in the outer barrel, and a support portion is provided at its bottom and is supported on the receiving frame through the support portion.

[0012] A receiving frame opening is provided on the receiving frame. The semiconductor refrigeration / heating component is located below the receiving frame, and its working end face is located on the receiving frame opening and relies on or is spaced and cooperated with the bottom surface of the support portion.

[0013] The semiconductor refrigeration / heating component includes a semiconductor, a radiator, and a cooling fan. Among them, the radiator is fixedly provided at the bottom of the upper shell. The semiconductor is fixedly provided on the top of the radiator and its working end face is located on the receiving frame opening. The cooling fan is fixedly provided on the lower shell. The electronic control board is fixedly provided on the lower shell and is electrically connected to the semiconductor and the cooling fan.

[0014] A display control board is further arranged in the assembly cavity. The display control board is fixedly arranged on the upper shell. The upper shell is further provided with a display hole and a control hole corresponding to the display control board. The electronic control board is electrically connected to the display control board. A plurality of seat body heat dissipation holes are further arranged on the lower shell and / or the upper shell, and the plurality of seat body heat dissipation holes are communicated with the assembly cavity.

[0015] A cover plate is arranged at the top of the outer barrel or the conduction barrel, and the cover plate is turned over or disassembled and assembled at the top of the outer barrel or the conduction barrel.

[0016] The utility model uses a semiconductor refrigeration / heating component to cool / heat and keep warm the container. At the same time, the conduction barrel is used for placing the container, so that the container can be placed in the chamber. A lateral fan is arranged laterally to blow air into or extract air from the inside of the conduction barrel, so that air can quickly enter or exit the conduction barrel, effectively avoiding the problems of tipping over caused by the rotation and opening and closing of the lateral fan, the failure of blowing or extracting air to actually act on the container, and the exposure of the container causing accidental touch by the user, so as to improve the use stability, safety, and cooling / heating and heat preservation efficiency of the product. In addition, since the container is placed in the conduction barrel, the condensed water generated when the container is cooled can be collected to avoid problems such as product damage and environmental pollution caused by the leakage of condensed water. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic assembly structure diagram of the closed state of the cover plate according to an embodiment of the utility model.

[0018] Figure 2 It is another perspective schematic assembly structure diagram of the closed state of the cover plate according to an embodiment of the utility model.

[0019] Figure 3 It is a schematic assembly structure diagram of the open state of the cover plate according to an embodiment of the utility model.

[0020] Figure 4 It is another perspective schematic assembly structure diagram of the open state of the cover plate according to an embodiment of the utility model.

[0021] Figure 5 It is a schematic sectional assembly structure diagram according to an embodiment of the utility model.

[0022] Figure 6 It is a schematic exploded structure diagram according to an embodiment of the utility model.

[0023] Figure 7 It is another perspective schematic exploded structure diagram according to an embodiment of the utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following will describe in detail the specific embodiments of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0025] The following further describes the present utility model with reference to the accompanying drawings and embodiments.

[0026] See Figures 1-7 , this device for rapid refrigeration and heating includes a base body. An outer barrel 1 is provided at the top of the base body. A lateral fan 2 is provided on one side of the outer barrel 1. A conduction barrel 3 is provided inside the outer barrel 1. The tops of the outer barrel 1 and the conduction barrel 3 are respectively open, and air convection holes are respectively provided corresponding to the lateral fan 2. A semiconductor refrigeration / heating component and an electronic control board 4 are also provided inside the base body. The electronic control board 4 is electrically connected to the lateral fan 2 and the semiconductor refrigeration / heating component respectively.

[0027] The device of this embodiment is applicable to the rapid refrigeration and heating of containers. Among them, the container can specifically be a cup, and users can use the device of this embodiment to achieve rapid refrigeration and heating of the liquid in the cup.

[0028] The semiconductor refrigeration / heating component is used to cool down or heat and keep warm the container. At the same time, the conduction barrel 3 is used for placing the container, so that the container can be placed in the chamber. The laterally arranged lateral fan 2 blows air or sucks air into the conduction barrel 3, enabling air to quickly enter or exit the conduction barrel 3, effectively avoiding problems such as tipping over caused by the rotation and opening / closing of the lateral fan 2, the inability of blowing or sucking air to truly act on the container, and the exposure of the container causing accidental touch by users, so as to improve the use stability, safety, and the efficiency of cooling down or heating and keeping warm of the product. In addition, since the container is placed in the conduction barrel 3, the condensed water generated when the liquid in the container cools down can be collected, so as to avoid problems such as product damage and environmental pollution caused by the leakage of condensed water.

[0029] A support portion 5 is provided at the bottom of the outer barrel 1 and / or the conduction barrel 3. The semiconductor refrigeration / heating component is located below the support portion 5 and the two rely on each other or are spaced and cooperated.

[0030] One side of the outer barrel 1 is open. The lateral fan 2 is laterally fixed to the open side of the outer barrel 1. A plurality of outer barrel air convection holes 6 are provided on the other side of the outer barrel 1.

[0031] On the symmetric two sides of the conduction barrel 3, a plurality of first air convection holes 7 and second air convection holes 8 of the conduction barrel are respectively arranged. The second air convection holes 8 of the conduction barrel correspond to the outer barrel air convection holes 6. The lateral fan 2 is located outside the first air convection holes 7 of the conduction barrel and blows air or sucks air in the direction of the second air convection holes 8 of the conduction barrel and the outer barrel air convection holes 6.

[0032] In this embodiment, the lateral fan 2 is a blowing fan, which is arranged on the open side of the outer barrel 1 in a lateral manner, so that the lateral fan 2 generates lateral blowing during operation and blows into the conduction barrel 3 through the first air convection holes 7 of the conduction barrel. Since the container is placed in the conduction barrel 3, the lateral wind generated by the lateral fan 2 will act on the container in the conduction barrel 3 entirely, which can quickly improve the air flow on the surface of the container. The air in the conduction barrel 3 then blows out of the conduction barrel 3 through the second air convection holes 8 of the conduction barrel and the outer barrel air convection holes 6 in sequence.

[0033] In this embodiment, the lateral fan 2, the first air convection holes 7 of the conduction barrel, the second air convection holes 8 of the conduction barrel, and the outer barrel air convection holes 6 are arranged in the same straight line, so that the air can flow rapidly in one direction, improving the cooling efficiency.

[0034] The seat body includes an upper shell 9 and a lower shell 10. The upper shell 9 and the lower shell 10 are fixedly matched with each other, and an assembly cavity 11 is formed therebetween. The outer barrel 1 is integrally formed or fixedly separated on the top of the upper shell 9. The semiconductor refrigeration / heating component and the electronic control board 4 are respectively located in the assembly cavity 11 and fixed on the upper shell 9 or the lower shell 10.

[0035] In this embodiment, the upper shell 9 and the lower shell 10 are fixed to each other by buckles or fasteners, with simple structure and convenient assembly. The outer barrel 1 is integrally formed on the top of the upper shell 9.

[0036] The outer barrel 1 is interconnected with the upper shell 9, and a receiving frame 12 is provided. The receiving frame 12 is fixedly arranged on the upper shell 9. The conduction barrel 3 is placed in the outer barrel 1, and a supporting part 5 is arranged at its bottom and is supported on the receiving frame 12 through the supporting part 5.

[0037] In this embodiment, the conduction barrel 3 is a metal part, having good heat transfer performance to improve the cooling / heating and heat preservation efficiency. At the same time, the conduction barrel 3 can be disassembled and assembled in the outer barrel 1 through the open opening at the top of the outer barrel 1. When assembled, the conduction barrel 3 is supported on the receiving frame 12 through the supporting part 5.

[0038] The receiving frame 12 is provided with a receiving frame opening 13. The semiconductor refrigeration / heating component is located below the receiving frame 12, and its working end face is located on the receiving frame opening 13 and is in mutual contact or spaced cooperation with the bottom surface of the supporting part 5.

[0039] The semiconductor refrigeration / heating component includes a semiconductor 14, a radiator 15, and a cooling fan 16. Among them, the radiator 15 is fixedly arranged at the bottom of the upper shell 9, the semiconductor 14 is fixedly arranged on the top of the radiator 15, and its working end face is located on the opening 13 of the receiving frame. The cooling fan 16 is fixedly arranged on the lower shell 10, and the electronic control board 4 is fixedly arranged on the lower shell 10 and is electrically connected to the semiconductor 14 and the cooling fan 16.

[0040] In this embodiment, the semiconductor 14 is located on the opening 13 of the receiving frame. Its surface is the working end face and leans against the bottom surface of the supporting part 5. The bottom surface of the semiconductor 14 leans against the surface of the radiator 15, and the cooling fan 16 leans against the bottom surface of the radiator 15.

[0041] When the electronic control board 4 is working, it can control the semiconductor 14 to generate cold on its surface or generate heat. When controlling the semiconductor 14 to generate cold on its surface, heat is generated on its bottom surface. The cold on the surface is transferred to the supporting part 5 to cool the container in the conduction barrel 3. The heat on the bottom surface is dissipated by the cooling fan 16. When controlling the semiconductor 14 to generate heat on its surface, cold is generated on its bottom surface. The heat on the surface is transferred to the supporting part 5 to heat and keep warm the container in the conduction barrel 3. The heat on the bottom surface is blown by the cooling fan 16.

[0042] A display control board 17 is also arranged in the assembly cavity 11. The display control board 17 is fixedly arranged on the upper shell 9. The upper shell 9 is also provided with a display hole and a control hole corresponding to the display control board 17. The electronic control board 4 is electrically connected to the display control board 17. A plurality of seat body heat dissipation holes 18 are also arranged on the lower shell 10 and / or the upper shell 9. The plurality of seat body heat dissipation holes 18 communicate with the assembly cavity 11.

[0043] In this embodiment, the user can control the product through the control area of the display control board 17 and observe the working state of the product through the display area of the display control board 17.

[0044] A cover plate 19 is arranged on the top of the outer barrel 1 or the conduction barrel 3. The cover plate 19 is turned over or disassembled and assembled on the top of the outer barrel 1 or the conduction barrel 3.

[0045] In this embodiment, a hinge part 20 is arranged on one side of the cover plate 19, and a hinge mating part is arranged on the open side of the outer barrel 1. The cover plate 19 is turned over and opened and closed on the hinge mating part of the outer barrel 1 through the hinge part 20. In addition, a positioning part 21 is also arranged on the outer barrel 1. When the cover plate 19 is turned over and opened to the terminal position, it is positioned on the positioning part 21 to limit the opening angle of the cover plate 19. When the cover plate 19 is turned over and closed, it covers the top open openings of the outer barrel 1 and the conduction barrel 3.

[0046] The above is the preferred embodiment of the present utility model, which shows and describes the basic principle, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling and heating device, comprising a seat, characterized in that: An outer barrel (1) is arranged on the top of the seat body, a lateral fan (2) is arranged on one side of the outer barrel (1), a conduction barrel (3) is arranged inside the outer barrel (1), the tops of the outer barrel (1) and the conduction barrel (3) are respectively open, and air convection holes are respectively arranged corresponding to the lateral fan (2), and a semiconductor cooling / heating component and an electric control board (4) are also arranged inside the seat body, and the electric control board (4) is electrically connected to the lateral fan (2) and the semiconductor cooling / heating component respectively.

2. The rapid cooling and heating device according to claim 1, characterized in that: A support portion (5) is provided at the bottom of the outer barrel (1) and / or the conductive barrel (3), the semiconductor refrigeration / heating component is located below the support portion (5), and the two are mutually dependent or spaced apart.

3. The rapid cooling and heating device according to claim 1, characterized in that: One side of the outer barrel (1) is open, the lateral fan (2) is laterally fixed to the open side of the outer barrel (1), and a plurality of outer barrel air convection holes (6) are provided on the other side of the outer barrel (1).

4. The rapid cooling and heating device according to claim 3, characterized in that: A plurality of first air convection holes (7) and second air convection holes (8) of the conduction barrel are respectively arranged on two symmetrical sides of the conduction barrel (3); the second air convection holes (8) of the conduction barrel correspond to the air convection holes (6) of the outer barrel; and the lateral fan (2) is located outside the first air convection holes (7) of the conduction barrel and blows or draws air in the direction of the second air convection holes (8) of the conduction barrel and the air convection holes (6) of the outer barrel.

5. The rapid cooling and heating device according to claim 1, characterized in that: The seat body comprises an upper shell (9) and a lower shell (10), the upper shell (9) and the lower shell (10) are fixedly matched with each other and an assembly cavity (11) is formed between the two, the outer barrel (1) is integrally formed or separately fixed on the top of the upper shell (9), and the semiconductor refrigeration / heating component and the electric control board (4) are respectively located in the assembly cavity (11) and fixed to the upper shell (9) or the lower shell (10).

6. The rapid cooling and heating device according to claim 5, characterized in that: The outer barrel (1) and the upper shell (9) are connected to each other and are provided with a receiving frame (12). The receiving frame (12) is fixedly arranged on the upper shell (9). The conduction barrel (3) is placed in the outer barrel (1) and is provided with a supporting portion (5) at its bottom, and is supported on the receiving frame (12) by the supporting portion (5).

7. The rapid cooling and heating device according to claim 6, characterized in that: The receiving frame (12) is provided with a receiving frame opening (13), the semiconductor refrigeration / heating component is located below the receiving frame (12), and its working end surface is located on the receiving frame opening (13), and is mutually dependent on or spaced from the bottom surface of the support portion (5).

8. The rapid cooling and heating device according to claim 7, characterized in that: The semiconductor cooling / heating component comprises a semiconductor (14), a radiator (15), and a cooling fan (16), wherein the radiator (15) is fixedly arranged at the bottom of the upper shell (9), the semiconductor (14) is fixedly arranged at the top of the radiator (15), and its working end surface is located on the receiving frame opening (13), the cooling fan (16) is fixedly arranged on the lower shell (10), and the electric control board (4) is fixedly arranged on the lower shell (10) and is electrically connected to the semiconductor (14) and the cooling fan (16).

9. The rapid cooling and heating device according to claim 8, characterized in that: A display control panel (17) is also provided in the assembly cavity (11); the display control panel (17) is fixedly provided on the upper shell (9); the upper shell (9) is also provided with a display hole and a control hole corresponding to the display control panel (17); the electric control panel (4) is electrically connected to the display control panel (17); a plurality of seat body heat dissipation holes (18) are also provided on the lower shell (10) and / or the upper shell (9); and the plurality of seat body heat dissipation holes (18) are in communication with the assembly cavity (11).

10. The rapid cooling and heating device according to claim 1, characterized in that: A cover plate (19) is provided on the top of the outer barrel (1) or the conduction barrel (3), and the cover plate (19) is turned over or detached on the top of the outer barrel (1) or the conduction barrel (3).

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