Ultrasonic transducer and ultrasonic probe

Abstract

The ultrasonic probe comprises a lens layer, a matching layer, a piezoelectric layer, a backing layer and a flexible circuit board, the piezoelectric layer comprises piezoelectric array elements, the flexible circuit board comprises a base layer, circuits and terminals, the circuits and the terminals are integrally formed on the same base layer, the circuits comprise a testing circuit and a connecting circuit, and the testing circuit is connected with the testing circuit. And the terminals comprise array element connecting terminals and conversion terminals. In the flexible circuit board connected by the piezoelectric layer, the circuit and the terminal are integrally formed on the same base layer, the circuit comprises the test circuit for testing and the connection circuit for transmitting signals, and the terminal comprises the array element connection terminal and the conversion terminal, so that the flexible circuit board has the functions of testing and signal transmission; the integrally-formed flexible circuit board can replace a traditional combination of the switching FPC and the lead FPC, welding work of the switching FPC and the lead FPC is not needed, the stability of signal transmission can be guaranteed, and the performance of a sound head is guaranteed.

Description

Technical Field

[0001] The utility model relates to medical detection equipment, in particular to an ultrasonic transducer and an ultrasonic probe. Background Art

[0002] A lead FPC and a transfer FPC are connected to a piezoelectric layer of an ultrasonic probe. The lead FPC is connected to the piezoelectric layer, and the transfer FPC is welded to the lead FPC. The transfer FPC is exposed outside the transducer so that the transfer FPC can be connected to a control board of the ultrasonic probe through another FPC, realizing the signal connection between the piezoelectric layer and the control board.

[0003] Among them, the lead FPC and the transfer FPC, as the carriers of the positive electrode signal of the sound head, often need to take into account the functions of pre-testing and connecting signal cables. Limited by the volume of the connector, and at the same time requiring a small size of the sound head and having test terminals, the signal cables connected to the lead FPC and the transfer FPC generally adopt a welding form, and the test terminals adopt a connector form. Therefore, the lead FPC and the transfer FPC are usually designed into two parts: a lead end and a transfer end, and test terminals are provided on both of them. After the test is completed, the test terminals are cut off, and then the two are welded to form the output carrier of the positive electrode signal. However, before welding, both of them need to be bent neatly and uniformly to ensure firm welding and no dislocation. This welding process method has higher requirements for operators. If misaligned welding occurs, it will directly affect signal transmission and further affect the performance of the sound head. Summary of the Utility Model

[0004] The utility model provides an ultrasonic transducer and an ultrasonic probe, which are used to solve the problem that it is difficult to align the welding of the lead FPC and the transfer FPC, affecting signal transmission and further affecting the performance of the sound head.

[0005] In one embodiment, an ultrasonic transducer is provided, which includes a lens layer, a matching layer, a piezoelectric layer, and a backing layer stacked in sequence, and a flexible circuit board.

[0006] The piezoelectric layer includes piezoelectric elements.

[0007] The flexible circuit board includes a base layer, a circuit, and terminals. The circuit and the terminals are integrally formed on the same base layer. The circuit includes a test circuit and a connection circuit. The terminals include element connection terminals and transfer terminals.

[0008] The flexible circuit board is divided into a first part and a second part along a plane perpendicular to the base layer. The first part is located between the piezoelectric layer and the backing layer, and the second part is exposed on the side surfaces of the piezoelectric layer and the backing layer.

[0009] The array element connection terminals are located in the first part, and the array element connection terminals are electrically connected to the piezoelectric array elements. The array element connection terminals are respectively electrically connected to the test circuit and the connection circuit; the adapter terminals are located in the second part, and the adapter terminals are used to connect the control board of the ultrasonic probe, and the adapter terminals are electrically connected to the connection circuit.

[0010] In one embodiment, the piezoelectric layer includes a plurality of the piezoelectric array elements, the circuit includes a plurality of the test circuits and a plurality of the connection circuits, and the terminals include a plurality of the array element connection terminals and a plurality of the adapter terminals; the plurality of piezoelectric array elements are respectively electrically connected to the plurality of array element connection terminals in one-to-one correspondence, and each array element connection terminal is electrically connected to one test circuit and one connection circuit in one-to-one correspondence, and the plurality of adapter terminals are electrically connected to the plurality of connection circuits in one-to-one correspondence.

[0011] In one embodiment, the plurality of array element connection terminals are distributed in a straight line or in an array. The plurality of test circuits are distributed on one side of the plurality of array element connection terminals away from the plurality of adapter terminals, and the plurality of connection circuits are distributed on the other side of the plurality of array element connection terminals close to the plurality of adapter terminals.

[0012] In one embodiment, a first bending portion is formed by bending at the joint of the first part and the second part.

[0013] In one embodiment, the second part includes a plurality of spaced-apart first sub-parts, and the plurality of first sub-parts are respectively connected to the first bending portion.

[0014] In one embodiment, one or more first separating wire grooves are provided in the second part. One end of the first separating wire groove extends to the first bending portion, and the other end of the first separating wire groove extends to the edge of the second part away from the first bending portion. The first separating wire groove divides the second part into a plurality of the first sub-parts.

[0015] In one embodiment, one or more hollow holes or grooves are provided in the first bending portion; and / or, the thickness of the first bending portion is less than the thickness of the first part or the second part.

[0016] In one embodiment, the flexible circuit board is bent into an L-shaped structure.

[0017] In one embodiment, a second bending portion is provided in the second part. One part of the second part is located on the side of the backing layer, and the other part of the second part is located on the bottom surface of the backing layer facing away from the piezoelectric layer.

[0018] In one embodiment, the portion of the second part located on the bottom surface of the backsheet layer includes a plurality of second sub-parts spaced apart from each other, and the plurality of second sub-parts are respectively connected to the second bending part.

[0019] In one embodiment, one or more second separating grooves are provided in the portion of the second part located on the bottom surface of the backsheet layer. One end of the second separating groove extends to the second bending part, and the other end of the second separating groove extends to the edge of the second part away from the second bending part. The second separating groove divides the portion of the second part located on the bottom surface of the backsheet layer into a plurality of the second sub-parts.

[0020] In one embodiment, one or more hollow holes or grooves are provided in the second bending part; and / or, the thickness of the second bending part is less than the thickness of the second part.

[0021] In one embodiment, the flexible circuit board is bent into a U-shaped structure.

[0022] In one embodiment, an ultrasonic probe is provided, which includes the above ultrasonic transducer.

[0023] In one embodiment, the ultrasonic probe further includes a handle and a detection tube;

[0024] The detection tube has a first end and a second end that are relatively far apart. The first end is used for insertion into the cavity for detection, the second end is connected to the handle, and the ultrasonic transducer is disposed in the detection tube.

[0025] In one embodiment, the ultrasonic probe further includes a driving assembly, and the driving assembly includes a driving member and a hollow shaft. The driving member is disposed in the handle, the hollow shaft is disposed in the detection tube, the ultrasonic transducer is connected to the hollow shaft, and the driving member is connected to the hollow shaft or the ultrasonic transducer for driving the ultrasonic transducer to rotate or swing.

[0026] According to the ultrasonic transducer and the ultrasonic probe of the above embodiments, in the flexible circuit board connected to the piezoelectric layer, the circuit and the terminals are integrally formed on the same base layer, and the circuit includes a test circuit for testing and a connection circuit for transmitting signals, and the terminals include element connection terminals for connecting elements and adapter terminals for external connection. Therefore, the flexible circuit board has both the functions of testing and signal transmission. In other words, this integrally formed flexible circuit board can replace the combination of a traditional adapter FPC and a lead FPC, and there is no need to perform the welding work of the adapter FPC and the lead FPC, which can ensure the stability of signal transmission and the performance of the acoustic head. Description of the Drawings

[0027] Figure 1 It is a side view of the ultrasonic transducer in one embodiment;

[0028] Figure 2 It is a schematic structural diagram of a flexible circuit board in an embodiment;

[0029] Figure 3 It is a schematic structural diagram of a flexible circuit board in an embodiment;

[0030] Figure 4 It is a schematic structural diagram of a flexible circuit board in an embodiment;

[0031] Figure 5 It is a schematic structural diagram of a flexible circuit board in an embodiment;

[0032] Figure 6 It is a schematic structural diagram of an ultrasonic transducer in an embodiment;

[0033] Figure 7 It is a schematic structural diagram of a flexible circuit board in an embodiment;

[0034] Figure 8 It is a schematic structural diagram of an ultrasonic transducer in an embodiment;

[0035] Figure 9 It is a schematic structural diagram of an ultrasonic transducer in an embodiment;

[0036] Figure 10 It is a schematic structural diagram of the connection between an ultrasonic transducer and a hollow rotating shaft in an embodiment;

[0037] Figure 11 It is a schematic structural diagram of a driving component in an embodiment;

[0038] The reference numerals are as follows:

[0039] 1 - lens layer;

[0040] 2 - matching layer;

[0041] 3 - piezoelectric layer, 31 - piezoelectric element;

[0042] 4 - backing layer, 41 -;

[0043] 5 - flexible circuit board, 51 - base layer, 52 - circuit, 521 - test circuit, 522 - connection circuit, 53 - terminal, 54 - test terminal, 531 - element connection terminal, 532 - transfer terminal, 501 - first part, 502 - second part, 5021 - first sub - part, 5022 - first separation wire groove, 5023 - second sub - part, 5024 - first sub - part, 5012 - first separation wire groove, 503 - third part, 504 - first bending part, 505 - second bending part;

[0044] 10 - handle;

[0045] 20 - Detection tube;

[0046] 30 - Ultrasonic transducer;

[0047] 40 - Driving assembly, 401 - Driving part, 402 - Hollow shaft, 403 - Gear set;

[0048] A - Cutting line. Detailed implementation mode

[0049] The present utility model will be further described in detail below in conjunction with the accompanying drawings through specific implementation modes. Similar elements in different implementation modes are labeled with related similar element numbers. In the following implementation modes, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overshadowing the core part of the present application. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0050] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various implementation modes. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment and do not mean a necessary sequence unless it is stated that a certain sequence must be followed.

[0051] The serial numbers assigned to the components in this article, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. And the "connection" and "coupling" mentioned in the present application, unless otherwise specified, both include direct and indirect connections.

[0052] In one embodiment, an ultrasonic transducer is provided. This ultrasonic transducer is used to convert an electrical signal into ultrasonic waves and emit ultrasonic waves, and is also used to receive the ultrasonic echo reflected by the object to be detected and convert the ultrasonic echo into an echo signal. This ultrasonic transducer can be applied to an intracavitary probe or an extracorporeal probe.

[0053] The ultrasonic transducer of this embodiment uses a flexible circuit board with an integrated structure to connect with the piezoelectric layer, eliminating the soldering process of combining two flexible circuit boards and avoiding the problem of misalignment of the two flexible circuit boards during the soldering process, which can ensure the stability and accuracy of signal transmission.

[0054] Please refer to Figures 1 to 3 , the ultrasonic transducer of this embodiment mainly includes a lens layer 1, a matching layer 2, a piezoelectric layer 3, a backing layer 4, and a flexible circuit board 5. Among them, the lens layer 1, the matching layer 2, the piezoelectric layer 3, and the backing layer 4 are stacked and fixed in sequence. A part of the flexible circuit board 5 is located between the piezoelectric layer 3 and the backing layer 4, and the other parts of the piezoelectric layer 3 and the backing layer 4 are exposed for connecting external connection components such as other flexible circuit boards. The flexible circuit board 5 is electrically connected to the piezoelectric layer 3, and the flexible circuit board 5 is used to connect the piezoelectric layer 3 to external devices. For example, the flexible circuit board 5 is used to connect the piezoelectric layer 3 to the control board of the probe, and to realize the positive signal transmission between the piezoelectric layer 3 and the control board of the probe.

[0055] In this embodiment, the piezoelectric layer 3 includes piezoelectric array elements 31. There are multiple piezoelectric array elements 31, and the multiple piezoelectric array elements 31 are distributed in a straight line or an array manner. The distribution manner of the multiple piezoelectric array elements 31 can be set according to the scanning strategy imaging requirements.

[0056] The flexible circuit board 5 is an integrally formed structure. The flexible circuit board 5 mainly includes a base layer 51, circuits 52, and terminals 53. The flexible circuit board 5 also includes other layer structures, such as an insulating layer, etc. The flexible circuit board 5 has a base layer 51, and the base layer 51 is a flexible thin plate structure that can be bent and folded. The circuits 52 and the terminals 53 can be integrally formed on the same base layer 51 by printing or other means. The circuits 52 and the terminals 53 are arranged on the same surface of the base layer 51. The circuits 52 and the terminals 53 can be stacked on the same surface of the base layer 51. The terminals 53, the circuits 52, and the base layer 51 are stacked in sequence. The circuits 52 and the terminals 53 can also be arranged side by side on the same surface of the base layer 51.

[0057] In other embodiments, one or both of the circuits 52 and the terminals 53 can be arranged on the base layer 51 in an embedded manner. Among them, the terminals 53 are exposed on the surface of the base layer 51. The circuits 52 can be exposed on the surface of the base layer 51 and then covered by other insulating layers, or the circuits 52 can be located inside the base layer 51.

[0058] In this embodiment, the flexible circuit board 5 is divided into a first part 501 and a second part 502 along the plane perpendicular to the base layer 51. Both the first part 501 and the second part 502 include the base layer 51, the circuits 52, and the terminals 53. Among them, the first part 501 belongs to the hidden connection part, and the second part 502 is the exposed connection part. The first part 501 is located between the piezoelectric layer 3 and the backing layer 4 and is electrically connected to the piezoelectric array elements 31. The second part 502 is exposed on the side of the piezoelectric layer 3 and the backing layer 4, that is, the second part 502 is exposed on the side of the combination formed by laminating the lens layer 1, the matching layer 2, the piezoelectric layer 3, and the backing layer 4.

[0059] The terminal 53 includes a plurality of array element connection terminals 531 and a plurality of adapter terminals 532 of the same number. The plurality of array element connection terminals 531 are arranged in the first part 501, and the plurality of array element connection terminals 531 are located between the piezoelectric layer 3 and the backing layer 4. The number of the plurality of array element connection terminals 531 is the same as the number of the plurality of piezoelectric array elements 31, and the arrangement of the plurality of array element connection terminals 531 is the same as the arrangement of the plurality of piezoelectric array elements 31. The plurality of array element connection terminals 531 are electrically connected to the plurality of piezoelectric array elements 31 in a one-to-one correspondence, and the piezoelectric array elements 31 can be electrically connected to the array element connection terminals 531 by means of conductive adhesive bonding. The plurality of adapter terminals 532 are arranged in the second part 502, and the plurality of adapter terminals 532 are located on the outside of the side of the piezoelectric layer 3 and the backing layer 4. The plurality of adapter terminals 532 are used for welding and connecting other connection components such as flexible circuit boards.

[0060] The circuit 52 includes a plurality of test circuits 521 and a plurality of connection circuits 522. The plurality of test circuits 521 are arranged in the first part 501. The number of the plurality of test circuits 521 is the same as the number of the plurality of array element connection terminals 531. The plurality of test circuits 521 are electrically connected to the plurality of array element connection terminals 531 in a one-to-one correspondence. The test circuits 521 are used to connect the cut test terminals to test whether the conductivity of the plurality of array element connection terminals 531 is normal. The plurality of connection circuits 522 are arranged in the first part 501 and the second part 502. The number of the plurality of connection circuits 522 is the same as the number of the plurality of array element connection terminals 531 and the plurality of adapter terminals 532. Each array element connection terminal 531 is electrically connected to a adapter terminal 532 through a connection circuit 522, that is, one end of the connection circuit 522 is located in the first part 501 and is electrically connected to the array element connection terminal 531, and the other end of the connection circuit 522 extends to the second part 502 and is electrically connected to the adapter terminal 532. The connection circuit 522 is used to transmit positive signals. The negative signal of the piezoelectric array element 31 can be transmitted through other components. For example, the piezoelectric array element 31 can be connected to the control board through a conductive shielding structure to achieve the transmission of the negative signal.

[0061] Please refer to Figure 4 and Figure 5In this embodiment, a plurality of test circuits 521 are arranged in the first part 501, the plurality of test circuits 521 are distributed on one side of the plurality of array element connection terminals 531 away from the plurality of adapter terminals 532, and the plurality of connection circuits 522 are distributed on the other side of the plurality of array element connection terminals 531 close to the plurality of adapter terminals 532. The test circuits 521 and the connection circuits 522 are respectively connected to the two sides of the array element connection terminals 531, so as to avoid mutual interference between the test circuits 521 and the connection circuits 522. In addition, a third part 503 can be extended and arranged at the boundary of the first part 501 away from the second part 502, the third part 503 has an extended base layer 51, and a test terminal 54 is arranged on the base layer 51. One end of the test circuit 521 away from the array element connection terminal 531 extends to the third part 503 and is electrically connected to the test terminal 54, so as to test whether the conduction of the plurality of array element connection terminals 531 is normal through the test terminal 54. After the test is completed, the third part 503 can be cut off along the cutting line A between the first part 501 and the third part 503 , that is, the flexible circuit board 5 having the test terminal 54 can be cut off.

[0062] In other embodiments, the plurality of test lines 521 may also extend to the second portion 502 , and the third portion 503 may be extended from the second portion 502 away from the boundary of the first portion 501 , so as to implement conductive testing of the plurality of array element connection terminals 531 , and the third portion 503 may also be cut off.

[0063] In the present embodiment, in the flexible circuit board 5 connected to the piezoelectric layer 3, the circuit 52 and the terminal 53 are integrally formed on the same base layer 51, and the circuit 52 includes a test circuit 521 for testing and a connection circuit 522 for transmitting signals, and the terminal 53 includes an array element connection terminal 531 for connecting an array element and a transfer terminal 532 for external connection, so that the flexible circuit board 5 has both the functions of testing and signal transmission. In other words, the integrated flexible circuit board 5 can replace the combination of the traditional transfer FPC and the lead FPC, and there is no need to perform welding work between the transfer FPC and the lead FPC, which can ensure the stability of signal transmission and the performance of the sound head.

[0064] Please refer to 4 to Figure 6, in one embodiment, the flexible circuit board 5 is bent. The flexible circuit board 5 is bent at the connection between the first part 501 and the second part 502. A first bending portion 504 is formed at the connection between the first part 501 and the second part 502. For example, the second part 502 is bent 90° relative to the first part 501, and the first part 501 and the second part 502 are bent into an L-shaped structure, so that the second part 502 can be attached to or parallel to the side surface of the combined body formed by laminating the lens layer 1, the matching layer 2, the piezoelectric layer 3, and the backing layer 4, and the side of the second part 502 with the transfer terminal 532 faces outward. Such a setting makes the second part 502 as close as possible to the side surface of the combined body formed by laminating the lens layer 1, the matching layer 2, the piezoelectric layer 3, and the backing layer 4, so as to reduce the space occupied by the opening of the second part 502, so that the ultrasonic transducer can be installed in a relatively narrow space. For example, the ultrasonic transducer can be installed in the detection tube of the intracavitary probe.

[0065] Wherein, the second part 502 includes a plurality of first sub-parts 5021 spaced from each other. One end of the first sub-part 5021 is connected to the first bending portion 504, and the other end of the first bending portion 504 is a free end. The plurality of first sub-parts 5021 are spaced side by side to form a comb-like structure. Such a setting enables the first sub-parts 5021 to be bent one by one in sequence when the second part 502 is bent, which can avoid the bending rupture caused by the simultaneous bending of the entire second part 502 and prevent the connection line 522 from being damaged during the bending process, thereby ensuring the stability and accuracy of signal transmission.

[0066] The second part 502 may be provided with one or more first dividing slots 5022. The first dividing slots 5022 are formed by cutting to form a plurality of first sub-parts 5021 spaced from each other. The first dividing slots 5022 are avoided from the connection line 522, and the first dividing slots 5022 are arranged at the area positions between the plurality of connection lines 522.

[0067] In other embodiments, the second part 502 may be provided with one or more dividing regions, and the dividing regions have a width larger than that of the first dividing slots 5022. This structure can be adapted to the case where the number of connection lines 522 is small.

[0068] In other embodiments, the first bending portion 504 may be provided with one or more hollow holes or grooves to reduce the structural strength of the first bending portion 504, so that when the first bending portion 504 is bent, no forging or cracks will occur, thereby protecting the connection line 522 and also ensuring the stability and accuracy of signal transmission.

[0069] In other embodiments, the thickness of the first bending portion 504 is thinned, and the thickness of the first bending portion 504 is less than that of the first portion 501 or the second portion 502. Thinning the thickness at the first bending portion 504 can also reduce the structural strength of the first bending portion 504, and when the first bending portion 504 is bent, it will not cause fracture or cracks, thereby protecting the connection line 522 and ensuring the stability and accuracy of signal transmission.

[0070] Please refer to Figure 7 and Figure 8 , in one embodiment, the second portion 502 is provided with a second bending portion 505. The second bending portion 505 is close to the first bending portion 504, and the distance between the first bending portion 504 and the second bending portion 505 is equal to the thickness of the backing layer 4, so that the flexible circuit board 5 forms a U-shaped structure after being bent twice. The second portion 502 wraps the side surface of the backing layer 4 and the bottom surface facing away from the piezoelectric layer 3. The flexible circuit board 5 is folded twice, so that the exposed second portion 502 of the flexible circuit board 5 can be arranged around the combination formed by laminating the lens layer 1, the matching layer 2, the piezoelectric layer 3 and the backing layer 4, which can further reduce the occupied space of the second portion 502, so that the ultrasonic transducer can be installed in a relatively narrow space. For example, the ultrasonic transducer can be installed in the detection tube of the intracavitary probe.

[0071] Wherein, the side surface and the bottom surface of the second portion 502 having the adapter terminal 532 face away from the backing layer 4, so that the exposed adapter terminal 532 can be used for connection with other connection components.

[0072] One or more second partition grooves 5024 are provided in the portion of the second portion 502 located on the bottom surface of the backing layer 4. One end of the second partition groove 5024 extends to the second bending portion 505, and the other end of the second partition groove 5024 is a free end. The second partition groove 5024 divides the second portion 502 into a plurality of second sub-portions 5023. One or more hollow holes or grooves can be provided in the first bending portion 504 to reduce the structural strength of the first bending portion 504. During the first bending process, the first bending portion 504 with relatively lower structural strength can avoid damaging the flexible circuit board 5 during the first bending process; during the second bending process, bending the plurality of second sub-portions 5023 in sequence can avoid damaging the flexible circuit board 5 during the second bending process and ensure the stability and accuracy of signal transmission.

[0073] In other embodiments, one or more partition regions are provided in the portion of the second portion 502 located on the bottom surface of the backing layer 4, and the partition regions have a width larger than that of the second partition groove 5024. This structure can be adapted to the case where the number of connection lines 522 is small.

[0074] In other embodiments, the second bending portion 505 may also be provided with one or more hollow holes or grooves. By reducing the structural strength of the second bending portion 505, it is also possible to ensure that no breakage occurs during the second bending process.

[0075] In other embodiments, the thickness of the second bending portion 505 is less than the thickness of the second portion 502, which can also reduce the structural strength of the second bending portion 505 and ensure that no breakage occurs during the second bending process.

[0076] In other embodiments, the first bending portion 504 and the second bending portion 505 may be respectively provided with a combination of hollow holes, grooves, and thickness reduction structures, which can also achieve reducing the structural strengths of the first bending portion 504 and the second bending portion 505 and avoiding breakage caused by bending.

[0077] Please refer to Figures 9 to 11 , in one embodiment, an ultrasonic probe is provided. This ultrasonic probe can be an intracavitary ultrasonic probe or an extracorporeal ultrasonic probe. The following will take the intracavitary ultrasonic probe as an example for illustration.

[0078] The ultrasonic probe includes a handle 10, a detection tube 20, and the ultrasonic transducer 30 in any of the above embodiments. The handle 10 has a cavity inside. Components such as a control board can be installed in the cavity of the handle 10. The handle 10 has a front end and a rear end. The rear end of the handle 10 can be connected to the host through a cable to achieve charging and signal transmission.

[0079] The detection tube 20 has a first end and a second end that are relatively far apart. The first end of the detection tube 20 is the front end, and the first end of the detection tube 20 is used to insert into the cavity for detection. The second end of the detection tube 20 is the rear end, and the second end of the detection tube 20 is connected to the front end of the handle 10. The detection tube 20 is a hollow tube, and the detection tube 20 has an accommodation cavity inside. And the accommodation cavity of the detection tube 20 is communicated with the cavity of the handle 10, so that the components inside the handle 10 and the components inside the detection tube 20 can achieve physical connection and signal connection. The ultrasonic transducer 30 is arranged inside the detection tube 20.

[0080] In this embodiment, the ultrasonic probe further includes a driving assembly 40. The driving assembly 40 includes a driving member 401 and a hollow shaft 402. The driving member 401 is arranged inside the cavity of the handle 10, and the driving member 401 can be a driving structure such as a motor. The hollow shaft 402 is arranged inside the accommodation cavity of the detection tube 20. One end of the hollow shaft 402 extends into the handle 10 and is connected to the driving member 401. The driving member 401 can be connected to the hollow shaft 402 through a transmission assembly such as a gear set 403. The driving member 401 is used to drive the hollow shaft 402 to rotate along the central axis of the hollow shaft 402, and it can be set that the hollow shaft 402 can achieve a 360° rotation or a rotation within a specific angle range.

[0081] The ultrasonic transducer 30 can be installed on the circumferential side of the hollow shaft 402, and the driving member 401 can drive the ultrasonic transducer 30 to rotate through the hollow shaft 402. The ultrasonic transducer 30 can also be swingably installed at the axial end of the hollow shaft 402, and the driving member 401 is connected to the ultrasonic transducer 30 through a transmission member such as a rope, and the driving member 401 can drive the ultrasonic transducer 30 to swing through a transmission member such as a rope.

[0082] In other embodiments, the ultrasonic probe further includes a driving assembly 40, and the ultrasonic transducer 30 is fixedly installed in the detection tube 20, and ultrasonic detection in a specific scenario can also be realized.

[0083] In this embodiment, a control board can be provided in the handle 10. The flexible circuit board 5 can be electrically connected to the control board through a longer flexible circuit board to achieve the electrical connection between the ultrasonic transducer 30 and the positive pole of the control board, and the ultrasonic transducer 30 can be negatively connected to the control board through other flexible circuit boards.

[0084] The above uses specific examples to elaborate on the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the technical field to which the present invention belongs, according to the idea of the present invention, several simple deductions, deformations or substitutions can also be made.

Claims

1. An ultrasonic transducer, characterized in that: It includes a lens layer, a matching layer, a piezoelectric layer and a backing layer stacked in sequence, and a flexible circuit board; The piezoelectric layer includes piezoelectric array elements; The flexible circuit board comprises a base layer, a circuit and a terminal, wherein the circuit and the terminal are integrally formed on the same base layer, the circuit comprises a test circuit and a connection circuit, and the terminal comprises an array element connection terminal and a transfer terminal; The flexible circuit board is divided into a first part and a second part along a plane perpendicular to the base layer, the first part is located between the piezoelectric layer and the backing layer, and the second part is exposed on the side surfaces of the piezoelectric layer and the backing layer; The array element connection terminal is located in the first part, the array element connection terminal is electrically connected to the piezoelectric array element, and the array element connection terminal is electrically connected to the test circuit and the connection circuit respectively; the adapter terminal is located in the second part, the adapter terminal is used to connect the control board of the ultrasound probe, and the adapter terminal is electrically connected to the connection circuit.

2. The ultrasonic transducer according to claim 1, characterized in that: The piezoelectric layer includes a plurality of piezoelectric array elements, the circuit includes a plurality of test circuits and a plurality of connection circuits, and the terminals include a plurality of array element connection terminals and a plurality of adapter terminals; the plurality of piezoelectric array elements are electrically connected to the plurality of array element connection terminals in a one-to-one correspondence, each array element connection terminal is electrically connected to one of the test circuits and one of the connection circuits in a one-to-one correspondence, and the plurality of adapter terminals are electrically connected to the plurality of connection circuits in a one-to-one correspondence.

3. The ultrasonic transducer according to claim 2, characterized in that: The plurality of array element connection terminals are distributed along a straight line or an array, the plurality of test lines are distributed on one side of the plurality of array element connection terminals away from the plurality of adapter terminals, and the plurality of connection lines are distributed on the other side of the plurality of array element connection terminals close to the plurality of adapter terminals.

4. The ultrasonic transducer according to claim 1, characterized in that: A connection between the first portion and the second portion is bent to form a first bent portion.

5. The ultrasonic transducer according to claim 4, characterized in that: The second portion includes a plurality of first sub-portions spaced apart from each other, and the plurality of first sub-portions are respectively connected to the first bending portions.

6. The ultrasonic transducer according to claim 5, characterized in that: The second part is provided with one or more first dividing grooves, one end of the first dividing groove extends to the first bending portion, and the other end of the first dividing groove extends to the edge of the second part away from the first bending portion, and the first dividing groove divides the second part into multiple first sub-parts.

7. The ultrasonic transducer according to claim 4, characterized in that: The first bending portion is provided with one or more hollow holes or grooves; and / or the thickness of the first bending portion is smaller than the thickness of the first part or the second part.

8. The ultrasonic transducer according to claim 4, characterized in that: The flexible circuit board is bent into an L-shaped structure.

9. The ultrasonic transducer according to claim 4, characterized in that: The second portion is provided with a second bending portion, a portion of the second portion is located at a side surface of the backing layer, and another portion of the second portion is located at a bottom surface of the backing layer facing away from the piezoelectric layer.

10. The ultrasonic transducer according to claim 9, characterized in that: The second portion located on the bottom surface of the backing layer includes a plurality of second sub-portions spaced apart from each other, and the plurality of second sub-portions are respectively connected to the second bending portions.

11. The ultrasonic transducer according to claim 10, characterized in that: The portion of the second part located on the bottom surface of the backing layer is provided with one or more second dividing line grooves, one end of the second dividing line groove extends to the second bending portion, and the other end of the second dividing line groove extends to the edge of the second part away from the second bending portion, and the second dividing line groove divides the portion of the second part located on the bottom surface of the backing layer into a plurality of second sub-parts.

12. The ultrasonic transducer according to claim 9, characterized in that: The second bending portion is provided with one or more hollow holes or grooves; and / or the thickness of the second bending portion is smaller than the thickness of the second part.

13. The ultrasonic transducer according to claim 9, characterized in that: The flexible circuit board is bent into a U-shaped structure.

14. An ultrasonic probe, characterized in that: The ultrasonic transducer comprises the ultrasonic transducer according to any one of claims 1 to 13.

15. The ultrasonic probe according to claim 14, characterized in that: The ultrasonic probe also includes a handle and a detection tube; The detection tube has a first end and a second end that are relatively far apart, the first end is used for inserting into the cavity for detection, the second end is connected to the handle, and the ultrasonic transducer is arranged in the detection tube.

16. The ultrasonic probe according to claim 15, characterized in that: The ultrasonic probe also includes a driving assembly, which includes a driving member and a hollow shaft. The driving member is arranged in the handle, the hollow shaft is arranged in the detection tube, the ultrasonic transducer is connected to the hollow shaft, and the driving member is connected to the hollow shaft or the ultrasonic transducer for driving the ultrasonic transducer to rotate or swing.

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