Chip sorting equipment

Abstract

The utility model discloses chip sorting equipment, which relates to the technical field of chip sorting and comprises a machine table. The sorting module is installed on the machine table and used for inputting materials and detecting the materials; the transmission module is mounted on the machine table and is used for receiving the qualified materials in the sorting module and transporting the qualified materials; the braiding module is installed on the machine table, the braiding module comprises a transferring assembly and two braiding assemblies, the two braiding assemblies are arranged on the two sides of the conveying module respectively, the transferring assembly is used for receiving qualified materials in the conveying module and conveying the qualified materials to the braiding assemblies, and the conveying assembly is used for conveying the qualified materials to the braiding assemblies. And the braiding assembly is used for outputting qualified material braids. According to the technical scheme provided by the utility model, the problem that the existing chip sorting equipment is relatively long in overall length and is inconvenient to use in a plant can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip sorting, and particularly relates to a chip sorting device. Background Art

[0002] The chip sorting device has the functions of testing, sorting, and taping and packing chips. In order to ensure the working efficiency of the chip sorting device during the process of taping and packing chips, multiple taping components are set to pack chips simultaneously. However, setting more taping components in the existing chip sorting device will result in a longer overall length of the chip sorting device, and also lead to a longer transmission distance of the transmission component, which is not convenient for material transmission. At the same time, the longer overall length of the sorting device is not convenient for use in the factory building. Summary of the Utility Model

[0003] The main purpose of the utility model is to propose a chip sorting device, aiming to solve the problem that the existing chip sorting device has a longer overall length and is not convenient for use in the factory building.

[0004] To achieve the above purpose, the chip sorting device proposed by the utility model includes:

[0005] A machine table;

[0006] A sorting module, installed on the machine table, used for material input and material detection;

[0007] A transmission module, installed on the machine table, used for receiving the qualified materials in the sorting module and transporting the qualified materials; and

[0008] A taping module, installed on the machine table, the taping module includes a transfer component and two groups of taping components. The two groups of taping components are respectively arranged on both sides of the transmission module. The transfer component is used for receiving the qualified materials in the transmission module and transporting the qualified materials to the taping component. The taping component is used for taping and outputting the qualified materials.

[0009] In an embodiment, the transmission module includes two parallel transmission components. The transmission component includes a material receiving part and a multi-axis driving part. The material receiving part is used for receiving the qualified materials; the multi-axis driving part is used for driving the material receiving part to move along the first direction.

[0010] In an embodiment, the transfer component includes a grasping part and a first vision component. The grasping part is used for transporting the materials in the material receiving part to the taping component and putting them into the taping component. The first vision component is used for obtaining the image information of the qualified materials so that the grasping part can adjust the position of the qualified materials.

[0011] In one embodiment, the taping component includes a tape which has pockets for placing qualified materials.

[0012] The chip sorting device further includes a side vision detection component which is arranged corresponding to the taping component and is used for obtaining side image information of the tape to detect the positions of the pockets and the qualified materials.

[0013] In one embodiment, the side vision detection component includes a detection position, a light source and a camera. The tape passes through the detection position. The light source is arranged on one side of the detection position and emits light towards the detection position. The camera is arranged on the other side of the detection position and is used for obtaining image information of the pockets and the qualified materials located at the detection position.

[0014] In one embodiment, the sorting module includes a loading module and a detection module. The loading module is used for transporting materials to the detection module, and the detection module is used for detecting the materials.

[0015] In one embodiment, the detection module includes a turret, a first suction nozzle, a pick-up pressing component, a calibration component, a 3D5S vision detection component, a transfer pressing component and a reject bin. The turret drives the first suction nozzle to rotate. The pick-up pressing component is used for pressing down the first suction nozzle so that the first suction nozzle can grab materials and is arranged corresponding to the loading module. The calibration component is used for calibrating the positions of the materials. The 3D5S vision detection component is used for detecting the materials. The transfer pressing component is used for pressing down the first suction nozzle so that the first suction nozzle can transfer the qualified materials to the transfer component. The reject bin is used for receiving the unqualified materials.

[0016] In one embodiment, the loading module includes a first loading component which includes a wafer cassette, a wafer handle, a wafer stage, a second vision component and a die bonding component. The wafer cassette is used for storing materials. The wafer handle is used for transporting materials to the wafer stage. The second vision component is used for obtaining image information of the materials in the wafer stage. The die bonding component is used for ejecting the materials for the first suction nozzle to pick up.

[0017] In one embodiment, the loading module further includes a second loading component which is configured as a Detaper structure. The Detaper structure is installed on the machine table and is used for inputting the materials in the tape into the detection module.

[0018] In one embodiment, the machine platform includes a first machine platform and a second machine platform; the sorting module is installed on the first machine platform, the taping module is installed on the second machine platform, and the transmission module is installed on the first machine platform and the second machine platform.

[0019] The technical solution of the present utility model adopts the arrangement of two sets of taping components on both sides of the transmission module respectively. Since the two sets of taping components are arranged on both sides of the transmission module respectively, it makes the transmission module located at the middle position of the transfer component. At this time, when the transfer component transports the material to the taping component farthest from the transmission module, its transportation distance can be effectively reduced. At the same time, setting more taping components in the present application can effectively improve the working efficiency of the chip sorting device. Compared with the prior art where multiple taping components are arranged on one side of the transmission module, arranging two sets of taping components on both sides of the transmission module respectively can reduce the overall length of the chip sorting device, thereby solving the technical problems existing in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0021] Figure 1 It is a schematic structural diagram of an embodiment of the chip sorting device provided by the present utility model;

[0022] Figure 2 For Figure 1 the top view schematic diagram of the chip sorting device in

[0023] Figure 3 For Figure 2 the enlarged view of a part of the structure in

[0024] Figure 4 For Figure 2 the enlarged view of another part of the structure in

[0025] Figure 5 For Figure 4 the enlarged view of a part of the structure in

[0026] Figure 6 For Figure 1 the side view schematic diagram of the chip sorting device in

[0027] Figure 7 For Figure 6 the schematic diagram of a part of the structure in

[0028] Figure 8 For Figure 1 Structural schematic diagram of an embodiment of the side vision detection component in a chip sorting device;

[0029] Figure 9 For Figure 8 Structural schematic diagram of an embodiment of the side vision detection component of;

[0030] Figure 10 For Figure 1 Enlarged view of location A in;

[0031] Figure 11 For Figure 2 Structural schematic diagram of the transfer module in;

[0032] Figure 12 For Figure 11 Enlarged view of a partial structure in.

[0033] Explanation of reference numerals in the drawings:

[0034] 100, machine platform; 110, first machine platform; 120, second machine platform;

[0035] 200, sorting module; 210, loading module; 211, wafer cassette; 212, wafer gripper; 213, wafer stage; 214, Detaper structure; 220, detection module; 221, turret; 222, first suction nozzle; 223, pick-up and unloading part; 224, calibration component; 225, 3D5S vision detection component; 226, transfer and pressing component; 227, reject box;

[0036] 300, transfer module; 310, transfer component; 311, receiving part; 312, multi-axis drive part; 3121, first linear drive module; 3122, second linear drive module;

[0037] 400, taping module; 410, transfer component; 411, gripping part; 4111, manipulator; 4112, guide rail; 412, first vision component; 420, taping component; 421, tape; 422, pocket; 430, pocket vision component; 440, in-pocket vision component; 450, operation space;

[0038] 500, side vision detection component; 510, light source; 520, detection position; 530, camera; 540, light path turning part.

[0039] The realization, functional features and advantages of the object of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0041] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0042] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0043] The present utility model provides a chip sorting device for chip testing, sorting, and taping and packing.

[0044] Please refer to Figures 1 to 4 , in an embodiment of the present utility model, the chip sorting device includes a machine platform 100;

[0045] A sorting module 200, a transmission module 300, and a taping 421 module 400, wherein the sorting module 200, the transmission module 300, and the taping 421 module 400 are all installed on the machine platform 100. The sorting module 200 is used for material input and material detection. Further, a blanking position is provided in the sorting module 200, and the qualified materials enter the blanking position. The transmission module 300 is used to receive the qualified materials in the sorting module 200 and transport the qualified materials. Specifically, the transmission module 300 is provided corresponding to the blanking position in the sorting module 200, receives the qualified materials in the sorting module 200, and then transports the qualified materials.

[0046] Among them, the tape carrier 421 module 400 includes a transfer component 410 and two groups of tape carrier components 420. The two groups of tape carrier components 420 are respectively arranged on both sides of the transfer module 300. The transfer component 410 is used to receive the qualified materials in the transfer module 300 and transfer the qualified materials to the tape carrier components 420. The tape carrier components 420 are used to output the qualified materials in the form of tape carrier 421; in this embodiment, the number of tape carrier components 420 in each group of tape carrier components 420 is configured to be four. In other embodiments, the number of tape carrier components 420 in each group of tape carrier components 420 can be three or two. After the transfer module 300 transports the qualified materials to the transfer component 410, the transfer component 410 receives the qualified materials and transports them into the tape carrier components 420. Since the two groups of tape carrier components 420 are respectively arranged on both sides of the transfer module 300, it also makes the transfer module 300 located in the middle position of the transfer component 410. At this time, when the transfer component 410 transports the materials to the tape carrier component 420 farthest from the transfer module 300, its transportation distance can be effectively reduced. At the same time, setting more tape carrier components 420 in this application can effectively improve the working efficiency of the chip sorting device. Compared with the prior art where multiple tape carrier components 420 are arranged on one side of the transfer module 300, setting the two groups of tape carrier components 420 on both sides of the transfer module 300 respectively can reduce the overall length of the chip sorting device, thereby solving the technical problems existing in the prior art.

[0047] In one embodiment, referring to Figure 11 、 Figure 12, the transmission module 300 includes two parallel transmission components 310. The transmission component 310 includes a material receiving part 311 and a multi-axis driving part 312. The material receiving part 311 is used to receive qualified materials; the multi-axis driving part 312 is used to drive the material receiving part 311 to move in the first direction. In this embodiment, by two groups of parallel transmission components 310, the transmission efficiency of the transmission module 300 can be further improved. Specifically, when the material receiving part 311 in one transmission component 310 transports the qualified materials to the transfer component 410, the material receiving part 311 in the other transmission component 310 can be located at the material discharging position in the sorting module 200 to receive the qualified materials. By the alternating operation of the two groups of transmission components 310, the purpose of improving the transmission efficiency can be achieved. Further, in this embodiment, the multi-axis driving part 312 includes a first linear driving module 3121 and a second linear driving module 3122. The second linear driving module 3122 is installed on the first linear driving module 3121, and the material receiving part 311 is installed on the second linear driving module 3122. The second linear driving module 3122 drives the material receiving part 311 to approach or move away from the material discharging position. When the second linear driving module 3122 drives the material receiving part 311 to approach the material discharging position, the material receiving part 311 can receive the qualified materials in the sorting module 200. When the second linear driving module 3122 drives the material receiving part 311 to move away from the material discharging position, the first linear driving module 3121 can drive the second linear driving module 3122 and the material receiving part 311 to move in the first direction to the transfer component 410. Further, in this embodiment, the material receiving part 311 is configured as a second suction nozzle, where the second suction nozzle is configured as a vacuum suction nozzle, the first linear driving module 3121 is configured as a motor guide rail 4112 slide table assembly, and the second linear driving module 3122 is configured as a cylinder slide table assembly.

[0048] In one embodiment, refer to Figures 4 to 7, the transfer assembly 410 includes a gripping member 411 and a first vision assembly 412. The gripping member 411 is used to transfer the material in the material receiving member 311 to the taping assembly 420 and place it into the taping assembly 420. The gripping member 411 includes a manipulator 4111 and a guide rail 4112. The manipulator 4111 is slidably disposed on the guide rail 4112 and can move along the guide rail 4112. The manipulator 4111 is used to grip the material in the material receiving member 311, and then move along the guide rail 4112 to the taping assembly 420 to place the material into the taping assembly 420. The first vision assembly 412 is used to obtain the image information of the qualified material so that the gripping member 411 can adjust the position of the qualified material. After the manipulator 4111 grips the material from the material receiving member 311, the first vision assembly 412 first obtains the image information of the material, mainly to obtain the offset information of the material, and then adjusts the angle of the material so that the material can be smoothly placed into the taping assembly 420. In this embodiment, the first vision assembly 412 can be configured as a high-definition camera 530. The manipulator 4111 includes a third suction nozzle (not shown in the figure), a rotating motor (not shown in the figure), a third linear driving member (not shown in the figure), and a fourth linear driving (not shown in the figure) member. The third linear driving member is used to drive the rotating motor to move in a direction perpendicular to the guide rail 4112, and the fourth linear driving member is used to drive the rotating motor to move up and down. The third suction nozzle is installed at the output end of the rotating motor, and the material is adsorbed through the third suction nozzle, and then the offset angle of the material is adjusted by the rotating motor.

[0049] In one embodiment, referring to Figure 9 , the taping assembly 420 includes a tape 421. The tape 421 has pockets 422 for placing qualified materials. The taping assembly 420 further includes a cover tape sealer for sealing the cover tape on the tape 421.

[0050] In one embodiment, referring to Figures 8 to 10 , in order to detect whether the material is completely placed into the pocket 422 of the tape 421, the chip sorting device further includes a side vision detection assembly 500. The side vision detection assembly 500 is disposed corresponding to the taping assembly 420. The side vision detection assembly 500 is used to obtain the side image information of the tape 421 to detect the positions of the pocket 422 and the qualified material.

[0051] Furthermore, in this embodiment, referring to Figures 8 to 10, the side vision detection component 500 includes a detection position 520, a light source 510, and a camera 530. The tape 421 passes through the detection position 520. The light source 510 is disposed on one side of the detection position 520, and the emitted light is directed toward the detection position 520. The camera 530 is disposed on the other side of the detection position 520 for acquiring image information of the pocket 422 and qualified materials located at the detection position 520. The camera 530 can directly acquire the image information of the pocket 422 and qualified materials located at the detection position 520, or indirectly acquire the image information of the pocket 422 and qualified materials located at the detection position 520. When the camera 530 indirectly acquires the image information of the pocket 422 and qualified materials located at the detection position 520, the camera 530 indirectly acquires the image information of the pocket 422 and qualified materials located at the detection position 520 through an optical path deflecting member 540. In this embodiment, the optical path deflecting member 540 is configured as a prism, and the image information is fed back to the camera 530 through the prism. In this embodiment, the pocket 422 of the tape 421 is arranged upward. Since the light source 510 and the camera 530 are respectively disposed on both sides of the detection position 520, the upper part of the pocket 422 of the tape 421 located at the detection position 520 is in a vacant state, that is, an operation space 450 is formed above the pocket 422 of the tape 421 located at the detection position 520. When the material is not completely placed in the pocket 422, the gripping member 411 in the transfer component 410 can adjust the material to re-place the material into the pocket 422 so that the material completely enters the pocket 422. Specifically, in order to enable the gripping member 411 to adjust the material, a pocket vision component 430 (see Figure 7 ) and an in-pocket vision component 440 (see Figure 7 ) are further provided in the tape component 420. The pocket vision component 430 is used to detect the position deviation of the pocket 422 to adjust the placement position of the material, and the in-pocket vision component 440 is used to detect the front of the material to detect whether the material is a good product or a defective product. When the material is a good product, the tape continues to operate. When the material is a defective product, the defective product in the tape pocket is replaced. After the side vision detection component 500 detects that the material is not completely placed in the pocket 422, the pocket vision component 430 first acquires the image information of the material, then the gripping member 411 grabs the material, and then the pocket vision component 430 acquires the image information of the pocket 422 to obtain the position deviation of the pocket 422. At this time, the gripping member 411 adjusts the material according to the image information of the material acquired by the pocket vision component 430 and the position deviation of the pocket 422 so that the material corresponds to the pocket 422, and then completely places the material into the pocket 422.

[0052] In one embodiment, refer to Figure 1 、 Figure 2, the sorting module 200 includes a feeding module 210 and a detection module 220. The feeding module 210 is used to transfer materials to the detection module 220, and the detection module 220 is used to detect the materials.

[0053] Further, in this embodiment, referring to Figure 3 , the detection module 220 includes a turret 221, a first suction nozzle 222, a material-taking pressing-down component 227, a calibration component 224, a 3D5S vision detection component 225, a transmission pressing-down component 226, and a throwing box 227. Among them, in this embodiment, the first suction nozzle 222 is configured as a vacuum suction nozzle; the turret 221 drives the first suction nozzle 222 to rotate; the material-taking pressing-down component is used to press down the first suction nozzle 222 so that the first suction nozzle 222 grabs the material, and is arranged corresponding to the feeding module 210. In this embodiment, the material-taking pressing-down component is configured as a stepping voice coil motor component. The first suction nozzle 222 is driven to move downward by the stepping voice coil motor component, and then the material is sucked by the vacuum first suction nozzle 222, thereby completing the material-taking action; the calibration component 224 is used to calibrate the position of the material. The calibration component 224 is used to calibrate the position of the material so that when the material enters the 3D5S vision detection component 225, it can be accurately detected by the 3D5S vision detection component 225; the 3D5S vision detection component 225 is used to detect the material. The 3D5S vision detection component 225 performs AOI inspection on the four sides and the bottom surface of the material; the transmission pressing-down component 226 is used to press down the first suction nozzle 222 so that the first suction nozzle 222 transfers the qualified material to the transmission component 310. Among them, the transmission pressing-down component 226 and the material-taking pressing-down component have the same structure. By pressing down the first suction nozzle 222 through the transmission pressing-down component 226, the first suction nozzle 222 is close to the receiving part 311 in the transmission component 310, and then the first suction nozzle 222 cancels the vacuum adsorption to transfer the material to the receiving part 311; further, in this embodiment, when the 3D5S vision detection component 225 detects that the material is unqualified, the first suction nozzle 222 directly transfers the unqualified material to the throwing box 227, and the throwing box 227 is used to receive the unqualified material detected.

[0054] In one embodiment, referring to Figure 3, the loading module 210 includes a first loading component, and the first loading component includes a wafer cassette 211, a wafer gripper 212, a wafer stage 213, a second vision component, and a die-picking component. The wafer cassette 211 is used to store materials. The wafer gripper 212 is used to transfer the materials to the wafer stage 213. The second vision component is used to obtain the image information of the materials on the wafer stage 213. The die-picking component is used to eject the materials for the first suction nozzle 222 to pick up. In this embodiment, the wafer gripper 212 takes out the materials from the wafer cassette 211 and then places them on the wafer stage 213. At this time, the wafer stage 213 moves the materials to a preset position so that the materials correspond to the die-picking component. The second vision component obtains the material information on the wafer stage 213. When the materials on the wafer stage 213 correspond to the position of the die-picking component, the die-picking component ejects the materials on the wafer stage 213. At this time, the first suction nozzle 222 in the turret 221 picks up the materials on the die-picking component by vacuum adsorption.

[0055] In one embodiment, refer to Figure 3 , the loading module 210 further includes a second loading component, and the second loading component is configured as a Detaper structure 214. The Detaper structure 214 is installed on the machine platform 100, and the Detaper structure 214 is used to input the materials in the tape 421 into the detection module 220. In this embodiment, the Detaper structure 214 enables the present application to sort and detect the materials in the tape 421 and then re-tape 421, further improving the application range of the present application.

[0056] In one embodiment, refer to Figure 1 , for the convenience of the production and processing of the machine platform 100 in the present application and the transportation of the chip sorting equipment, the machine platform 100 includes a first machine platform 110 and a second machine platform 120; the sorting module 200 is installed on the first machine platform 110, the taping 421 module 400 is installed on the second machine platform 120, and the transmission module 300 is installed on the first machine platform 110 and the second machine platform 120. By modularizing the machine platform 100, the transportation of the machine platform 100 can be facilitated.

[0057] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied to other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A chip sorting device, characterized in that: include: Machine; A sorting module is installed on the machine to input materials and detect the materials; a transmission module, installed on the machine platform, for receiving qualified materials from the sorting module and transporting the qualified materials; and A braiding module is installed on the machine, and the braiding module includes a transfer component and two groups of braiding components. The two groups of braiding components are respectively arranged on both sides of the transmission module. The transfer component is used to receive qualified materials in the transmission module and transfer the qualified materials to the braiding component. The braiding component is used to braid the qualified materials for output.

2. The chip sorting device according to claim 1, characterized in that: The transmission module includes two transmission components arranged in parallel, and the transmission component includes a material receiving member and a multi-axis driving member. The material receiving member is used to receive qualified materials; the multi-axis driving member is used to drive the material receiving member to move along a first direction.

3. The chip sorting device according to claim 2, characterized in that: The transfer component includes a grabbing member and a first visual component. The grabbing member is used to transfer the material in the material receiving member to the braiding component and place it into the braiding component. The first visual component is used to obtain image information of qualified materials so that the grabbing member can adjust the position of the qualified materials.

4. The chip sorting device according to claim 3, characterized in that: The braid assembly includes a braid having a pocket for placing qualified materials; The chip sorting equipment also includes a side vision detection component, which is arranged corresponding to the braiding component and is used to obtain side image information of the braiding to detect the positions of the pocket and qualified materials.

5. The chip sorting device according to claim 4, characterized in that: The side visual inspection component includes a detection position, a light source and a camera. The braid passes through the detection position. The light source is arranged on one side of the detection position and emits light toward the detection position. The camera is arranged on the other side of the detection position to obtain image information of the pocket and qualified materials located at the detection position.

6. The chip sorting device according to claim 5, characterized in that: The sorting module includes a feeding module and a detection module. The feeding module is used to transfer materials to the detection module, and the detection module is used to detect materials.

7. The chip sorting device according to claim 6, characterized in that: The detection module includes a turret, a first suction nozzle, a material picking pressure assembly, a correction assembly, a 3D5S visual detection assembly, a transmission pressure assembly, and a material throwing box; the turret drives the first suction nozzle to rotate; the material picking pressure assembly is used to press down the first suction nozzle so that the first suction nozzle grabs the material and is set corresponding to the feeding module; the correction assembly is used to correct the material position; the 3D5S visual detection assembly is used to detect the material; the transmission pressure assembly is used to press down the first suction nozzle so that the first suction nozzle transfers the qualified material to the transmission assembly; the material throwing box is used to receive the unqualified material.

8. The chip sorting device according to claim 7, characterized in that: The loading module includes a first loading component, which includes a wafer box, a wafer handle, a wafer table, a second visual component, and a thorn crystal component. The wafer box is used to store materials, the wafer handle is used to transfer materials to the wafer table, the second visual component is used to obtain image information of the material in the wafer table, and the thorn crystal component is used to push out the material for the first suction nozzle to pick up the material.

9. The chip sorting device according to claim 8, characterized in that: The feeding module also includes a second feeding component, which is configured as a Detaper structure. The Detaper structure is installed on the machine platform, and the Detaper structure is used to input the material in the braid into the detection module.

10. The chip sorting device according to any one of claims 1 to 9, characterized in that: The machine comprises a first machine and a second machine; the sorting module is installed on the first machine, the braiding module is installed on the second machine, and the transmission module is installed on the first machine and the second machine.

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