Wafer fixing device and wafer edge grinding device
By designing a wafer fixing device including a fixing frame, a positioning chamber, a grinding window and a rotatable clamp, the problem of prone to cracks on the wafer edge is solved, and stable grinding and uniform grinding of the wafer edge is achieved.
Patent Information
- Application Number
- CN202421860984.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-01
AI Technical Summary
The wafer is prone to cracks or concave surfaces at the edges, which leads to easy peeling and falling off under the action of external forces, and the edges of the wafer need to be polished.
A wafer fixing device is designed, including a fixing frame, a positioning cavity, a grinding window, a clamping member and other components. The wafer is clamped in the thickness direction of the wafer through the clamping member, and the edge of the wafer can even contact the grinding window through the rotatable clamping member, thereby achieving grinding the wafer edge.
The wafer edge is stable grinding, which improves the position stability and grinding stability of the wafer on the fixing device, and ensures uniform grinding of the wafer edge.
Smart Images
Figure CN222986534U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to a wafer fixing device and a wafer edge grinding device. Background Art
[0002] In the processing of semiconductor materials, wafers are made from silicon ingots after grinding, polishing, and slicing. After the silicon ingot is sliced into wafers, cracks or surface irregularities are likely to exist at the edges of the wafers, which can easily affect the overall structure of the wafers, resulting in easy peeling and falling off of the wafer slices under the action of external forces. Therefore, it is necessary to grind the edges of the wafers. Summary of the Utility Model
[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a wafer fixing device, which can fix the wafer in the thickness direction of the wafer, facilitating the grinding of the edge of the wafer.
[0004] The utility model also provides a wafer edge grinding device having the above wafer fixing device.
[0005] According to the wafer fixing device of the embodiment of the utility model, it includes: a fixing frame, a positioning cavity is formed inside the fixing frame, the positioning cavity has a grinding window, the wafer is adapted to be arranged inside the positioning cavity and part of the edge of the wafer is placed at the grinding window, and the thickness direction of the wafer is arranged along the first direction; two clamping members, the two clamping members are respectively rotatably connected to the fixing frame, the two clamping members are arranged at intervals along the first direction, the rotation axes of the two clamping members coincide, and the wafer is adapted to be clamped between the two clamping members.
[0006] According to the wafer fixing device of the embodiment of the utility model, the wafer is clamped between the two clamping members in the thickness direction, so that the position of the wafer in the wafer fixing device is fixed, and part of the edge of the wafer is located at the grinding window, facilitating the grinding of the edge of the wafer. At the same time, the two clamping members are rotatably connected to the fixing frame, enabling the wafer to rotate with the clamping members, so that all parts of the edge of the wafer can be rotated to the grinding window, thereby realizing the grinding of the edge of the wafer. Among them, the rotation axes of the two clamping members coincide, enabling the wafer to rotate synchronously with the two clamping members, improving the clamping stability of the two clamping members on the wafer and the rotation stability of the wafer with the clamping members, thereby improving the grinding stability of the edge of the wafer.
[0007] In some embodiments, the wafer fixing device further includes: a positioning member, the positioning member is connected to the fixing frame and at least part of it is located inside the positioning cavity, the positioning member is arranged at an interval from the clamping member and is used to abut against the edge of the wafer.
[0008] Further, the positioning member includes at least one positioning post, the positioning post extends along the first direction, and the outer peripheral surface of the positioning post is adapted to contact the wafer; when the positioning member includes at least two positioning posts, all the positioning posts are arranged at intervals around the rotation axis of the clamping member.
[0009] Further, the positioning post is rotatably connected to the fixing frame, and the rotation axis of the positioning post is parallel to the rotation axis of the clamping member.
[0010] In some embodiments, at least one of the clamping members is floatingly connected to the fixing frame along the first direction.
[0011] In some embodiments, the fixing frame includes: a main frame body; a positioning cross beam, the positioning cross beam is rotatably and / or movably connected to one end of the main frame body, and the main frame body and the positioning cross beam enclose to form the positioning cavity; wherein, the two clamping members are respectively rotatably connected to the main frame body and the positioning cross beam.
[0012] Further, a plurality of threaded holes facing the positioning cross beam are provided on the main frame body, and a plurality of through holes corresponding to the threaded holes are provided on the positioning cross beam; the wafer fixing device further includes: a plurality of threaded fasteners, the plurality of threaded fasteners pass through the through holes and are threadedly connected to the threaded holes.
[0013] In some embodiments, the clamping member includes an integrally formed limiting post and a clamping plate, the clamping plate is located at one end of the limiting post facing the positioning cavity; the wafer fixing device further includes: two rotating bearings, the two rotating bearings are provided on the fixing frame, and the two clamping members are respectively connected to the two rotating bearings; wherein, the rotating bearing is provided with a central hole, and the limiting post passes through the central hole.
[0014] The wafer edge grinding device according to an embodiment of the present invention includes: the wafer fixing device described in the above embodiment; a lifting device, a movable lifting seat is provided on the lifting device, and the wafer fixing device is connected to the lifting seat; a grinding device, the grinding device is provided on one side of the wafer fixing device where the grinding window is provided to grind the edge of the wafer, and the distance between the wafer fixing device and the grinding device is adjusted during the movement of the lifting seat.
[0015] The wafer edge grinding device according to an embodiment of the present invention, by adopting the wafer fixing device of the above embodiment, can clamp the wafer in the thickness direction of the wafer, so that the edge of the wafer can contact the grinding device at the grinding window and be ground, and can improve the position stability of the wafer on the wafer fixing device and the stability of grinding the edge of the wafer.
[0016] In some embodiments, the lifting seat is provided with a slot extending in the second direction, and the fixing frame is provided with a rib extending in the second direction, and the rib is inserted into the slot in the second direction; alternatively, the lifting seat is provided with a rib extending in the second direction, and the fixing frame is provided with a slot extending in the second direction, and the rib is inserted into the slot in the second direction.
[0017] Further, the fixing frame forms positioning holes on at least one side in the third direction, and the lifting seat is provided with avoidance holes corresponding to the positioning holes; the lifting device further includes: a limiting member, the limiting member is movable in the third direction, and when the fixing frame is connected to the lifting seat, the limiting member passes through the avoidance hole in the third direction and is inserted into the positioning hole.
[0018] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:
[0020] Figure 1 is a cross-sectional structural view of a wafer fixing device according to an embodiment of the present invention;
[0021] Figure 2 is a three-dimensional structural view of a wafer fixing device according to an embodiment of the present invention;
[0022] Figure 3 is a cross-sectional structural view of the wafer fixing device from another angle according to an embodiment of the present invention;
[0023] Figure 4 is a structural schematic diagram of a lifting device of a wafer edge grinding device according to an embodiment of the present invention;
[0024] Figure 5 is Figure 4 an enlarged structural schematic diagram at the lifting seat in
[0025] Figure 6 is a structural schematic diagram of a wafer edge grinding device according to an embodiment of the present invention;
[0026] Figure 7 is Figure 6 an enlarged structural schematic diagram at the lifting seat in
[0027] Reference numerals:
[0028] wafer edge grinding device 1000,
[0029] Wafer fixing device 100,
[0030] Wafer 10,
[0031] Fixing frame 20, positioning cavity 21, grinding window 22, main frame body 23, positioning cross beam 24, threaded hole 25, perforation 26, rib 27, positioning hole 28,
[0032] Clamping member 30, limiting post 31, clamping plate 32,
[0033] Positioning post 40,
[0034] Threaded fastener 50,
[0035] Rotating bearing 60, central hole 61,
[0036] Lifting device 200, lifting seat 210, slot 211. Detailed implementation mode
[0037] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.
[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the features defined with "first", "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.
[0039] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0040] The wafer fixing device 100 and the wafer edge grinding device 1000 according to the embodiments of the present utility model will be described below with reference to the accompanying drawings.
[0041] As Figure 1 、 Figure 2 shown, the wafer fixing device 100 according to the embodiments of the present utility model includes: a fixing frame 20 and two clamping members 30. A positioning cavity 21 is formed inside the fixing frame 20. The positioning cavity 21 has a grinding window 22. The wafer 10 is adapted to be disposed inside the positioning cavity 21 and a partial edge of the wafer 10 is placed at the grinding window 22. The thickness direction of the wafer 10 is arranged along the first direction. The two clamping members 30 are respectively rotatably connected to the fixing frame 20. The two clamping members 30 are arranged at intervals along the first direction. The rotation axes of the two clamping members 30 coincide. The wafer 10 is adapted to be clamped between the two clamping members 30.
[0042] Thus, the wafer 10 is clamped between the two clamping members 30 along the thickness direction, so that the position of the wafer 10 in the wafer fixing device 100 is fixed, and a partial edge of the wafer 10 is located at the grinding window 22, facilitating the grinding of the edge of the wafer 10. At the same time, the two clamping members 30 are rotatably connected to the fixing frame 20, enabling the wafer 10 to rotate with the clamping members 30, so that all parts of the edge of the wafer 10 can be rotated to the grinding window 22, thereby realizing the grinding of the edge of the wafer 10.
[0043] Among them, the rotation axes of the two clamping members 30 coincide, enabling the wafer 10 to rotate synchronously with the two clamping members 30, improving the clamping stability of the two clamping members 30 on the wafer 10 and the rotation stability of the wafer 10 with the clamping members 30, thereby improving the grinding stability of the edge of the wafer 10.
[0044] In this application, the number of wafers 10 clamped by the clamping members 30 is not limited. The distance between the two clamping members 30 along the first direction can be set according to the number of wafers 10 to be clamped.
[0045] Preferably, when the wafer 10 is clamped between the two clamping members 30, the center of the wafer 10 is located on the rotation axis of the clamping members 30.
[0046] In some embodiments, as Figure 1 、Figure 3 As shown in Figure 3 , the wafer fixing device 100 further includes: a positioning member, which is connected to the fixing frame 20 and at least partially located in the positioning cavity 21. The positioning member is spaced apart from the clamping member 30 and is used to abut against the edge of the wafer 10.
[0047] Thus, the positioning member can limit the position of the wafer 10 in the positioning cavity 21, improve the stability of the position of the wafer 10 relative to the clamping member 30, and thereby improve the stability of grinding the edge of the wafer 10.
[0048] Meanwhile, when the wafer 10 is placed in the positioning cavity 21, the positioning member can position the placement position of the wafer 10, that is, by abutting the wafer 10 against the positioning member, the wafer 10 is placed in the correct position, so as to ensure that the two clamping members 30 can stably clamp the wafer 10, improve the accuracy of the placement position of the wafer 10 in the positioning cavity 21 and reduce the setting difficulty of the wafer 10 in the positioning cavity 21, playing a role in preventing mistakes.
[0049] Furthermore, the positioning member includes at least one positioning post 40, the positioning post 40 extends along a first direction, and the outer peripheral surface of the positioning post 40 is adapted to contact the wafer 10.
[0050] Thus, the positioning post 40 extends along the thickness direction of the wafer 10, enabling the wafer 10 to abut against the outer peripheral surface of the positioning post 40 at different positions in the thickness direction, improving the position stability when the wafer 10 abuts against the positioning post 40. When a plurality of wafers 10 are clamped between the two clamping members 30, the plurality of wafers 10 can all be abutted by the positioning post 40, making the positions of the plurality of wafers 10 in the positioning cavity 21 more stable.
[0051] In addition, when the positioning post 40 contacts the wafer 10, the contact surface between the wafer 10 and the positioning post 40 is small, which can reduce the friction of the positioning post 40 on the wafer 10.
[0052] Meanwhile, when the positioning member includes at least two positioning posts 40, all the positioning posts 40 are arranged at intervals around the rotation axis of the clamping member 30. It can be understood that the shape of the wafer 10 is usually circular.
[0053] Preferably, the positioning post 40 is provided on the side of the accommodating cavity away from the grinding window 22, so as to be able to reduce or avoid the shielding of the positioning post 40 from the grinding of the wafer 10 at the grinding window 22.
[0054] Thus, when the wafer 10 abuts against a plurality of positioning posts 40 simultaneously, the rotation axis of the wafer 10 is fixed, thereby improving the stability of the rotation of the wafer 10 with the clamping member 30.
[0055] Furthermore, the positioning post 40 is rotatably connected to the fixing frame 20, and the rotation axis of the positioning post 40 is parallel to the rotation axis of the clamping member 30.
[0056] It is understandable that when the edge of the wafer 10 is polished, in order to enable all parts of the edge of the wafer 10 to be polished, the wafer 10 rotates with the clamping member 30.
[0057] Thus, when the wafer 10 rotates, the positioning post 40 can rotate with the wafer 10, reducing or avoiding the friction between the wafer 10 and the positioning post 40, thereby reducing or avoiding wear on the edge of the wafer 10 due to friction with the positioning post 40, and at the same time reducing the resistance suffered by the wafer 10 when it rotates.
[0058] In some embodiments, at least one clamping member 30 is floatingly connected to the fixing frame 20 in a first direction. Thus, by adjusting the position of the clamping member 30 in the first direction, the distance between the two clamping members 30 can be adjusted, thereby adjusting the number of wafers 10 that can be clamped between the two clamping members 30.
[0059] In addition, by adjusting the increase in the distance between the two clamping members 30 in the first direction, it is convenient to place the wafer 10 between the two clamping members 30. After the wafer 10 is placed between the two clamping members 30, the position stability of the wafer 10 between the two clamping members 30 can be achieved by adjusting the decrease in the distance between the two clamping members 30 in the first direction so that the clamping member 30 can clamp the wafer 10 in the first direction.
[0060] In some embodiments, as Figure 1 、 Figure 2 shown, the fixing frame 20 includes: a main frame body 23 and a positioning cross beam 24. The positioning cross beam 24 is rotatably, or movably, or both rotatably and movably connected to one end of the main frame body 23, and the main frame body 23 and the positioning cross beam 24 enclose a positioning cavity 21. Among them, the two clamping members 30 are respectively rotatably connected to the main frame body 23 and the positioning cross beam 24.
[0061] Thus, when it is necessary to place the wafer 10 between the two clamping members 30, by moving the position of the positioning cross beam 24 relative to the main frame body 23, the distance between the two clamping members 30 can be increased, facilitating the placement of the wafer 10 between the two clamping members 30. After the wafer 10 is placed between the two clamping members 30, the position stability of the wafer 10 between the two clamping members 30 can be achieved by connecting the positioning cross beam 24 to the main frame body 23 so that the clamping member 30 can clamp the wafer 10 in the first direction.
[0062] Furthermore, a plurality of threaded holes 25 facing the positioning cross beam 24 are provided on the main frame body 23, and a plurality of through holes 26 are provided on the positioning cross beam 24 corresponding to the threaded holes 25. The wafer fixing device 100 further includes: a plurality of threaded fasteners 50, and the plurality of threaded fasteners 50 pass through the through holes 26 and are threadedly connected to the threaded holes 25.
[0063] Thus, the positioning crossbeam 24 is pressed against the main frame 23 by the threaded fastener 50, making the connection of the positioning crossbeam 24 to the main frame 23 detachable, which facilitates the installation and removal of the positioning crossbeam 24 on the main frame 23. Among them, when different numbers of wafers 10 are clamped between the two clamping members 30, the threaded fastener 50 can have different mating lengths corresponding in the threaded hole 25, so as to adjust the distance between the positioning crossbeam 24 and the main frame 23, and adjust the distance between the two clamping members 30, enabling the clamping members 30 to clamp different numbers of wafers 10.
[0064] In some embodiments, as Figure 1 shown, the clamping member 30 includes an integrally formed limit post 31 and a clamping plate 32. The clamping plate 32 is located at one end of the limit post 31 facing the positioning cavity 21, so that the wafer 10 can be clamped between the two clamping plates 32, and a relatively large contact area can be provided between the clamping plate 32 and the wafer 10, thereby improving the stability and reliability of the clamping plate 32 for clamping the wafer 10.
[0065] The wafer fixing device 100 further includes: two rotating bearings 60. The two rotating bearings 60 are provided on the fixing frame 20, and the two clamping members 30 are respectively connected to the two rotating bearings 60, making the two clamping members 30 rotatably connected to the fixing frame 20.
[0066] Among them, the rotating bearing 60 is provided with a central hole 61, and the limit post 31 passes through the central hole 61, enabling the limit post 31 to rotate coaxially with the rotating bearing 60, and the limit post 31 contacts the inner wall of the central hole 61 of the rotating bearing 60 along the axial direction of the rotating bearing 60, which can improve the position stability of the limit post 31 in the central hole 61 and the rotation stability of the clamping member 30.
[0067] In this application, the shapes of the central hole 61 and the limit post 31 are not limited, and the shape of the limit post 31 is set corresponding to the central hole 61. For example, the central hole 61 is a circular hole, and the limit post 31 is correspondingly set as a cylinder. Another example is that the central hole 61 is a square hole, and the limit post 31 is correspondingly set as a cuboid.
[0068] As Figures 4 - 7 shown, according to the wafer edge grinding device 1000 of the embodiment of the present utility model, it includes: the wafer fixing device 100, a lifting device 200 and a grinding device (not shown in the figure) of the above embodiment.
[0069] Among them, a movable lifting seat 210 is provided on the lifting device 200, and the wafer fixing device 100 is connected to the lifting seat 210. The grinding device is arranged on one side of the wafer fixing device 100 provided with a grinding window 22 to grind the edge of the wafer 10, and the distance between the wafer fixing device 100 and the grinding device is adjusted during the movement of the lifting seat 210.
[0070] It can be understood that by moving the lifting seat 210, the distance between the wafer fixing device 100 and the grinding device can be increased, facilitating the connection of the wafer fixing device 100 to the lifting seat 210. When the wafer fixing device 100 is connected to the lifting seat 210, by moving the lifting seat 210, the wafer fixing device 100 gradually moves towards the grinding device, so that the wafer 10 contacts the grinding device at the edge, and the edge of the wafer 10 is ground.
[0071] For the wafer edge grinding device 1000 of the present application, by adopting the wafer fixing device 100 of the above embodiment, the wafer 10 can be clamped in the thickness direction of the wafer 10, so that the edge of the wafer 10 can contact the grinding device at the grinding window 22 and be ground, and the position stability of the wafer 10 on the wafer fixing device 100 can be improved, and the stability of grinding the edge of the wafer 10 can be improved. At the same time, the wafer fixing device 100 can improve the accuracy of the placement position of the wafer 10 in the positioning cavity 21 and reduce the setting difficulty of the wafer 10 in the positioning cavity 21, playing a role in preventing mistakes.
[0072] It should be noted that the moving mode of the lifting seat 210 can be linear movement, or curved movement, or rotation. In Figure 4 、 Figure 6 's example, the lifting seat 210 moves linearly in the third direction.
[0073] Preferably, the third direction is the up and down direction. When the wafer fixing device 100 is arranged on the lifting seat 210, the grinding window 22 faces downwards, and the grinding device is located below the wafer fixing device 100. Thus, when the wafer 10 is ground at the grinding window 22, the generated debris can fall and leave the wafer 10, reducing or avoiding the influence of the debris on the grinding effect of the wafer 10.
[0074] In the present application, the type of the grinding device is not limited. For example, the grinding device adopts a belt grinder, and the grinding window 22 of the wafer fixing device 100 faces the sand belt.
[0075] In some embodiments, as Figure 2 、 Figure 3 、 Figure 5 and Figure 7 shown, the lifting seat 210 is provided with a slot 211 extending in the second direction, and the fixing frame 20 is provided with a rib 27 extending in the second direction. The rib 27 is inserted into the slot 211 in the second direction. Or, the lifting seat 210 is provided with a rib 27 extending in the second direction, and the fixing frame 20 is provided with a slot 211 extending in the second direction. The rib 27 is inserted into the slot 211 in the second direction.
[0076] Thus, the wafer fixing device 100 can be detachably connected to the lifting seat 210, and the installation operation of the wafer fixing device 100 on the lifting seat 210 can be simplified. At the same time, through the cooperation of the slot 211 and the rib 27, a guiding effect can be achieved on the connection position of the wafer fixing device 100 on the lifting seat 210, improving the accuracy of the connection position of the wafer fixing device 100 on the lifting seat 210.
[0077] Preferably, the first direction is parallel to the second direction.
[0078] Furthermore, the fixing frame 20 forms positioning holes 28 on at least one side in the third direction, and the lifting seat 210 is provided with avoidance holes corresponding to the positioning holes 28. The lifting device 200 further includes: a limiting member, the limiting member is movable along the third direction, and when the fixing frame 20 is connected to the lifting seat 210, the limiting member passes through the avoidance hole along the third direction and inserts into the positioning hole 28.
[0079] Thus, when the wafer fixing device 100 is connected to the lifting seat 210, the limiting member can limit the position of the wafer fixing device 100 relative to the lifting seat 210 in the second direction, thereby improving the position stability of the wafer fixing device 100 connected to the lifting seat 210, that is, improving the position stability of the wafer 10 relative to the lifting seat 210, and thus improving the stability of the grinding device for grinding the wafer 10.
[0080] Preferably, the third direction is perpendicular to the second direction.
[0081] The other configurations and operations of the wafer fixing device 100 and the wafer edge grinding device 1000 according to the embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail here.
[0082] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0083] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention, and the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A wafer fixing device, characterized in that: include: A fixing frame, wherein a positioning cavity is formed in the fixing frame, the positioning cavity has a grinding window, a wafer is suitable for being arranged in the positioning cavity and a part of the edge of the wafer is placed at the grinding window, and a thickness direction of the wafer is arranged along a first direction; Two clamping members, the two clamping members are rotatably connected to the fixing frame respectively, the two clamping members are arranged at intervals along the first direction, the rotation axes of the two clamping members coincide, and the wafer is suitable for being clamped between the two clamping members.
2. The wafer fixing device according to claim 1, characterized in that: Also includes: A positioning member is connected to the fixing frame and is at least partially located in the positioning cavity. The positioning member is spaced apart from the clamping member and is used to stop at the edge of the wafer.
3. The wafer fixing device according to claim 2, characterized in that: The positioning member comprises at least one positioning post, the positioning post is extended along the first direction, and the outer peripheral surface of the positioning post is suitable for contacting with the wafer; When the positioning member includes at least two positioning posts, all the positioning posts are arranged at intervals around the rotation axis of the clamping member.
4. The wafer fixing device according to claim 3, characterized in that: The positioning column is rotatably connected to the fixing frame, and the rotation axis of the positioning column is parallel to the rotation axis of the clamping member.
5. The wafer fixing device according to claim 1, characterized in that: At least one of the clamping members is connected to the fixing frame in a floating manner along the first direction.
6. The wafer fixing device according to claim 1, characterized in that: The fixing frame comprises: Main frame; A positioning beam, the positioning beam is rotatably and / or movably connected to one end of the main frame, and the main frame and the positioning beam enclose the positioning cavity; Wherein, the two clamping members are rotatably connected to the main frame and the positioning beam respectively.
7. The wafer fixing device according to claim 6, characterized in that: The main frame is provided with a plurality of threaded holes facing the positioning beam, and the positioning beam is provided with a plurality of through holes corresponding to the threaded holes; The wafer fixing device further includes: a plurality of threaded fasteners, which are passed through the through holes and threadedly connected to the threaded holes.
8. The wafer fixing device according to claim 1, characterized in that: The clamping member comprises an integrally formed limiting column and a clamping plate, wherein the clamping plate is located at one end of the limiting column facing the positioning cavity; The wafer fixing device further comprises: two rotating bearings, the two rotating bearings are arranged on the fixing frame, and the two clamping members are respectively connected to the two rotating bearings; Wherein, the rotating bearing is provided with a center hole, and the limiting column is passed through the center hole.
9. A wafer edge grinding device, characterized in that: include: The wafer fixing device as claimed in any one of claims 1 to 8; A lifting device, wherein a movable lifting seat is provided on the lifting device, and the wafer fixing device is connected to the lifting seat; A grinding device is arranged on a side of the wafer fixing device where the grinding window is arranged to grind the edge of the wafer, and the distance between the wafer fixing device and the grinding device is adjusted during the movement of the lifting seat.
10. The wafer edge grinding device according to claim 9, characterized in that: The lifting seat is provided with a slot extending along a second direction, the fixing frame is provided with a convex rib extending along the second direction, and the convex rib is plugged into the slot along the second direction; Alternatively, the lifting seat is provided with a convex rib extending along the second direction, the fixing frame is provided with a slot extending along the second direction, and the convex rib is plugged into the slot along the second direction.
11. The wafer edge grinding device according to claim 10, characterized in that: The fixing frame is formed with a positioning hole on at least one side in the third direction, and the lifting seat is provided with an avoidance hole corresponding to the positioning hole; The lifting device further includes: a limiting member, which is movable along the third direction. When the fixing frame is connected to the lifting seat, the limiting member passes through the avoidance hole along the third direction and is inserted into the positioning hole.