Wafer glass slide blank rough polishing device

Abstract

The utility model discloses a wafer glass slide blank rough polishing device which comprises a base, an installation box is fixed to one end of the top of the base, a second motor is arranged in the installation box, and an output shaft of the second motor penetrates through the installation box and is connected with a rotary disc. A support frame is mounted at the other end of the top of the base; the adjusting mechanism comprises a second hydraulic cylinder mounted at the top of the supporting frame, a connecting rod connected with the output end of the second hydraulic cylinder, a first hydraulic cylinder slidably arranged on the base, a fastening plate mounted on the side surface of the first hydraulic cylinder, and a fastening rod arranged on the side surface of the fastening plate and connected with the connecting rod; the movable plate is arranged at the output end of the first hydraulic cylinder, the first motor is installed at the bottom of the movable plate, and the polishing disc is connected with an output shaft of the first motor; the rough polishing device has the beneficial effects that the left-right adjustment of the first hydraulic cylinder can be realized through the designed adjusting mechanism, so that the adjustment of the distance between the polishing disc and a blank is facilitated, and the rough polishing efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer glass carrier polishing, and particularly relates to a rough polishing device for wafer glass carrier blanks. Background Art

[0002] The main purpose of rough polishing is to remove the rough layer on the surface of the wafer glass carrier blank. These rough layers may come from previous processes such as cutting and grinding, which will affect the quality of subsequent processing. By rough polishing, the surface roughness of the wafer can be significantly reduced, laying a good foundation for subsequent fine polishing and other processing technologies. In semiconductor manufacturing, the flatness of the wafer surface has a crucial impact on the performance and yield of the chip.

[0003] A wafer thinning and polishing device with the publication number of CN216030081U. This patent discloses a device including a motor, a clamping plate, an upper sandwich layer, a deformation shell, a polishing head, an inner pressure column, a fixing plate, an upper pressure column, a limiting column, an extrusion chamber, a housing, a rubber plate, a backing plate, an inner guide column, a partition plate, an oil pressure column, a limiting ring, a lifting spring, a slow-release spring, an inner damper, a slow-release chamber, a slow-release column, a polishing disc, a telescopic column, and a handle. The clamping plate is installed outside the middle position of the motor, the deformation shells are installed at the lower ends of the left and right sides of the upper sandwich layer, the polishing head is installed on the lower end surface of the deformation shell, the upper pressure column is installed on the lower end surface of the fixing plate, and the limiting column is installed outside the middle position of the upper pressure column.

[0004] The existing rough polishing device for wafer glass carrier blanks cannot adjust the distance between the polishing disc and the blank during use, which affects the polishing performance. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a rough polishing device for wafer glass carrier blanks, which can realize the adjustment of the distance between the polishing disc and the blank.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A rough polishing device for wafer glass carrier blanks, including

[0007] A base, one end of the top of the base is fixed with an installation box, a second motor is arranged inside the installation box, and the output shaft of the second motor penetrates through the installation box and is connected with a turntable; the other end of the top of the base is provided with a support frame;

[0008] An adjusting mechanism, the adjusting mechanism includes a second hydraulic cylinder installed on the top of the support frame, a connecting rod connected to the output end of the second hydraulic cylinder, a first hydraulic cylinder slidably arranged on the base, a fastening plate installed on the side surface of the first hydraulic cylinder, a fastening rod arranged on the side surface of the fastening plate and connected with the connecting rod, a movable plate arranged at the output end of the first hydraulic cylinder, a first motor installed at the bottom of the movable plate, and a polishing disc connected to the output shaft of the first motor.

[0009] Preferably, it further includes a chute opened on the top of the base and a slider arranged at the bottom of the first hydraulic cylinder and slidable in the chute.

[0010] Preferably, it further includes a controller installed on the top of the base and a box cover hinged to the front surface of the installation box.

[0011] Preferably, one end of the fastening rod is provided with an extension part, and an external thread is arranged on the extension part.

[0012] Preferably, one end of the connecting rod is provided with a groove, and an internal thread connected to the external thread is arranged inside the groove.

[0013] Preferably, it further includes a vertical plate installed on the top of the turntable and a horizontal plate arranged on the side surface of the vertical plate, and a pressing component is arranged on the horizontal plate.

[0014] Preferably, the pressing component includes a third hydraulic cylinder installed on the top of the horizontal plate, and the output end of the third hydraulic cylinder penetrates through the horizontal plate and is connected with a pressing piece for pressing the wafer glass carrier blank on the turntable.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] Through the designed adjusting mechanism, the left - right adjustment of the first hydraulic cylinder can be realized, which helps to adjust the distance between the polishing disc and the blank and increases the efficiency of rough polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the present utility model;

[0018] Figure 2 is the Figure 1 enlarged structural schematic diagram of area B in;

[0019] Figure 3 is the spliced structural schematic diagram of the fastening rod and the connecting rod of the present utility model;

[0020] Figure 4 is the Figure 3 enlarged structural schematic diagram of area D in;

[0021] In the figure: 1. Base; 11. Installation box; 110. Box cover; 12. Chute; 13. Controller; 14. Support frame; 2. Turntable; 21. Vertical plate; 3. Second hydraulic cylinder; 31. Connecting rod; 310. Groove; 3101. Internal thread; 4. Fastening rod; 41. Extension part; 410. External thread; 5. Fastening plate; 6. First hydraulic cylinder; 7. Movable plate; 71. First motor; 710. Polishing disc; 8. Horizontal plate; 81. Third hydraulic cylinder; 810. Pressing piece. DETAILED DESCRIPTION OF THE INVENTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0023] Embodiment 1

[0024] Please refer to Figures 1-4 , which is the first embodiment of the present utility model. This embodiment provides a rough polishing device for a wafer glass carrier blank, including

[0025] A base 1, which enhances the stable support performance of the base 1. One end of the top of the base 1 is fixedly provided with an installation box 11, realizing the addition of the installation box 11. A second motor is arranged inside the installation box 11. The installation box 11 can enhance the protection of the second motor. The output shaft of the second motor penetrates through the installation box 11 and is connected to a turntable 2. When the second motor operates, it can drive the turntable 2 to rotate. The blank to be roughly polished is placed on the turntable 2; the other end of the top of the base 1 is provided with a support frame 14, realizing the addition of the support frame 14;

[0026] An adjustment mechanism, which includes a second hydraulic cylinder 3 installed on the top of the support frame 14. The support frame 14 enhances the support for the second hydraulic cylinder 3, a connecting rod 31 connected to the output end of the second hydraulic cylinder 3. When the second hydraulic cylinder 3 operates, it can drive the connecting rod 31 to move left and right. A first hydraulic cylinder 6 slidably arranged on the base 1, the first hydraulic cylinder 6 can slide, enhancing the convenience of movement. A fastening plate 5 installed on the side surface of the first hydraulic cylinder 6 through screws, realizing the stable installation of the fastening plate 5. A fastening rod 4 arranged on the side surface of the fastening plate 5 and connected to the connecting rod 31. When the connecting rod 31 moves left and right, it drives the fastening rod 4 to move left and right. When the fastening rod 4 moves left and right, it drives the first hydraulic cylinder 6 to move left and right through the fastening plate 5. An activity plate 7 arranged at the output end of the first hydraulic cylinder 6. When the first hydraulic cylinder 6 operates, it can drive the activity plate 7 to adjust the height. A first motor 71 installed at the bottom of the activity plate 7, realizing the addition of the first motor 71. A polishing disc 710 connected to the output shaft of the first motor 71. When the first motor 71 operates, it drives the polishing disc 710 to rotate, and the blank is polished by using the polishing disc 710.

[0027] In this embodiment, preferably, it further includes a chute 12 opened on the top of the base 1, realizing the opening of the chute 12. A slider arranged at the bottom of the first hydraulic cylinder 6 and slidable in the chute 12. By the cooperation of the slider and the chute 12, the smooth sliding of the first hydraulic cylinder 6 is enhanced.

[0028] In this embodiment, preferably, it further includes a controller 13 installed on the top of the base 1, realizing the addition of the controller 13. The first motor 71, the second motor, the first hydraulic cylinder 6, and the second hydraulic cylinder 3 are all electrically connected to the controller 13, which facilitates operation by increasing the convenience of using the controller 13. The lid 110 hinged to the front surface of the installation box 11 can open the lid 110, increasing the convenience of maintaining the second motor.

[0029] In this embodiment, preferably, one end of the fastening rod 4 is provided with an extension part 41, realizing the addition of the extension part 41, and an external thread 410 is provided on the extension part 41, realizing the addition of the external thread 410.

[0030] In this embodiment, preferably, a groove 310 is opened at one end of the connecting rod 31, realizing the opening of the groove 310, and an internal thread 3101 connected to the external thread 410 is provided inside the groove 310. The cooperation of the external thread 410 and the internal thread 3101 helps to realize the stable splicing of the fastening rod 4 and the connecting rod 31, and also facilitates disassembly as needed, increasing the convenience of use.

[0031] Embodiment 2

[0032] Please refer to Figures 1-4 , which is the second embodiment of the present utility model. This embodiment is based on the previous embodiment, and the difference is:

[0033] It further includes a vertical plate 21 installed on the top of the turntable 2, realizing the addition of the vertical plate 21, and a horizontal plate 8 provided on the side surface of the vertical plate 21, realizing the addition of the horizontal plate 8. A pressing member is provided on the horizontal plate 8. The pressing member includes a third hydraulic cylinder 81 installed on the top of the horizontal plate 8, realizing the addition of the third hydraulic cylinder 81. The output end of the third hydraulic cylinder 81 penetrates the horizontal plate 8 and is connected to a pressing piece 810 that presses the wafer glass carrier blank on the turntable 2. When the third hydraulic cylinder 81 works, it can drive the pressing piece 810 to move up and down.

[0034] The working principle and usage process of the present utility model: When in use, place the blank to be rough polished on the turntable 2. The third hydraulic cylinder 81 works to drive the pressing piece 810 to press on the blank. The second hydraulic cylinder 3 works to drive the connecting rod 31 to move. When the connecting rod 31 moves, it drives the fastening rod 4 to move. When the fastening rod 4 moves, it drives the first hydraulic cylinder 6 to move through the fastening plate 5, adjusting the distance between the first hydraulic cylinder 6 and the installation box 11. The first hydraulic cylinder 6 works to drive the height adjustment of the movable plate 7. The first motor 71 on the movable plate 7 works to drive the polishing disc 710 to rotate, and the blank is polished by using the polishing disc 710.

[0035] Although embodiments of the present utility model have been shown and described, see the above detailed description, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model, and the scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A rough polishing device for wafer glass carrier blanks, characterized in that: include A base (1), wherein a mounting box (11) is fixed at one end of the top of the base (1), a second motor is arranged inside the mounting box (11), and an output shaft of the second motor passes through the mounting box (11) and is connected to the turntable (2); a support frame (14) is installed at the other end of the top of the base (1); An adjustment mechanism, the adjustment mechanism comprising a second hydraulic cylinder (3) mounted on the top of a support frame (14), a connecting rod (31) connected to the output end of the second hydraulic cylinder (3), a first hydraulic cylinder (6) slidably arranged on a base (1), a fastening plate (5) mounted on the side surface of the first hydraulic cylinder (6), a fastening rod (4) arranged on the side surface of the fastening plate (5) and connected to the connecting rod (31), a movable plate (7) arranged at the output end of the first hydraulic cylinder (6), a first motor (71) mounted at the bottom of the movable plate (7), and a polishing plate (710) connected to the output shaft of the first motor (71).

2. The rough polishing device for wafer glass carrier blank according to claim 1, characterized in that: It also includes a slide groove (12) opened on the top of the base (1), and a sliding block arranged at the bottom of the first hydraulic cylinder (6) and capable of sliding in the slide groove (12).

3. The rough polishing device for wafer glass carrier blank according to claim 1, characterized in that: It also includes a controller (13) installed on the top of the base (1), and a box cover (110) hinged to the front surface of the installation box (11).

4. The rough polishing device for wafer glass carrier blank according to claim 1, characterized in that: An extension portion (41) is provided at one end of the fastening rod (4), and an external thread (410) is provided on the extension portion (41).

5. The rough polishing device for wafer glass carrier blank according to claim 4, characterized in that: A groove (310) is formed at one end of the connecting rod (31), and an internal thread (3101) connected to the external thread (410) is formed inside the groove (310).

6. The rough polishing device for wafer glass carrier blank according to claim 1, characterized in that: It also includes a vertical plate (21) installed on the top of the turntable (2), a horizontal plate (8) arranged on the side surface of the vertical plate (21), and a downward pressing component is arranged on the horizontal plate (8).

7. The rough polishing device for wafer glass carrier blank according to claim 6, characterized in that: The pressing component comprises a third hydraulic cylinder (81) installed on the top of the horizontal plate (8), and the output end of the third hydraulic cylinder (81) passes through the horizontal plate (8) and is connected to a pressing plate (810) for pressing the wafer glass carrier blank onto the turntable (2).

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