Wafer grinding processing assembly

Abstract

The utility model discloses a wafer grinding processing assembly, which relates to the field of wafer processing equipment and comprises a bottom plate and a wafer, and the bottom plate is provided with a plurality of grooves at intervals. The wafer is fixedly adhered to the bottom plate through curing glue, and the curing glue is filled in the plurality of grooves. When the wafer is fixedly adhered to the bottom plate through the curing adhesive, air and adhesive are discharged through the grooves, bubbles in the adhesive layer are reduced, and the adhesion strength of the wafer and the bottom plate is improved. And meanwhile, the groove is filled with the curing glue, so that the contact area between the curing glue and the bottom plate is increased, and the bonding strength is further enhanced. In addition, the advantages allow the thickness of the curing glue to be thinner, so that the dosage of the curing glue is reduced.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing equipment, in particular to a wafer grinding and processing component. Background Art

[0002] As a standard-shaped optical material, a wafer is a relatively common original crystal form. Under the conditions of a long processing flow for small-piece products and an increasing demand for processing large-size products, shortening the process path and reducing costs. Starting from the wafer for processing is a direction of development. The wafer back grinding or wafer thinning process is a key step in semiconductor manufacturing because it can reduce the thickness of the wafer to improve the performance and form factor of the final device. In the existing wafer thinning process, in order to facilitate loading and unloading and control the grinding thickness, a bottom plate (i.e., a disassembly plate) is usually fixedly installed on the non-grinding end face of the wafer by means of gluing or the like; the surface of the existing bottom plate is usually flat. When the bottom plate and the wafer are pasted together by applying pressure, it is not conducive to the discharge of air, and air bubbles are easily formed between the bottom plate and the wafer, affecting the bonding strength and thus affecting the grinding of the wafer. Summary of the Invention

[0003] The purpose of the utility model is to provide a wafer grinding and processing component, aiming to overcome the above problems existing in the prior art.

[0004] To achieve the above purpose, the utility model provides the following technical solutions:

[0005] A wafer grinding and processing component includes a wafer and a bottom plate. The bottom plate has a first end face, and a plurality of grooves are spacedly arranged on the first end face; the wafer has a second end face, and the second end face is fixedly pasted to the first end face through a curing adhesive, and the curing adhesive fills the plurality of grooves, and at least one end of the groove extends beyond the projection area of the second end face.

[0006] Further, the grooves extend linearly, and the width of the grooves gradually decreases from the groove opening to the groove bottom.

[0007] Further, the cross-sectional profile of the groove is an inverted triangle.

[0008] Furthermore, the inverted triangle is an equilateral triangle.

[0009] Further, the plurality of grooves are parallel and equidistantly arranged.

[0010] Further, both ends of the groove penetrate the first end face.

[0011] Further, the bottom plate is a glass product.

[0012] Further, the curing adhesive is a UV adhesive.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] Firstly, the utility model includes a base plate and a wafer, and the base plate is provided with a plurality of grooves at intervals. The wafer is fixed to the base plate by curing glue, and the curing glue is filled in the plurality of grooves. The grooves are used to exhaust air and glue, reduce bubbles in the glue layer, improve the bonding strength between the wafer and the base plate, and facilitate better grinding and thinning of the wafer. At the same time, since the grooves are filled with curing glue, the contact area between the curing glue and the base plate is increased, and the bonding strength is further enhanced. Compared with the prior art, with the support of the above-mentioned beneficial effects, even if the thickness of the curing glue between the first end face of the base plate and the second end face of the wafer is reduced, the bonding strength between the base plate and the wafer can still be guaranteed or even improved, thereby saving the amount of curing glue and controlling costs.

[0015] Secondly, in the present invention, the groove is extended along a straight line, and the width of the groove gradually decreases from the groove mouth to the groove bottom, further improving the ability of the groove to discharge air and glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an isometric view of the utility model.

[0017] Figure 2 It is the front view of the utility model.

[0018] Figure 3 for Figure 2 A partial enlarged view of part A.

[0019] Figure 4 This is a top view of the bottom plate in the present invention. DETAILED DESCRIPTION

[0020] The specific implementation of the present invention is described below with reference to the accompanying drawings. In order to fully understand the present invention, many details are described below, but for those skilled in the art, the present invention can be implemented without these details.

[0021] like Figures 1 to 4 A wafer grinding processing assembly includes a base plate 1 and a wafer 2, wherein the base plate 1 has a first end surface 11, and the first end surface 11 is provided with a plurality of grooves 10 at intervals. The wafer 2 has a second end surface 21, and the second end surface 21 is fixedly attached to the first end surface 11 by a curing adhesive 3, and the curing adhesive 3 is filled in the plurality of grooves 10, and at least one end of the groove 10 extends beyond the projection area of ​​the second end surface 21.

[0022] like Figures 1 to 4, It should be noted that in order to ensure that the wafer 2 can be ground and thinned subsequently, after the wafer 2 is fixedly pasted to the bottom plate 1, the projection area of the first end face 11 should be within the second end face 21. In other words, taking the bottom plate 1 and the wafer 2 as circles for example, the diameter of the wafer 2 should be less than or equal to that of the bottom plate 1.

[0023] Such as Figures 1 to 4 , the bottom plate 1 includes but is not limited to being a glass product. The curing glue 3 includes but is not limited to being a UV glue. The curing glue 3 is used to temporarily fix the bottom plate 1 and the wafer 2; after the grinding and thinning process of the wafer 2 is completed, the two are separated, and the UV glue is removed. Among them, the bottom plate 1 after the curing glue is removed can be reused.

[0024] Such as Figures 1 to 4 , in a specific embodiment, the groove 10 extends linearly, and the width of the groove 10 gradually decreases from the groove opening to the groove bottom. In this way, it helps the curing glue 3 before curing to fill into the groove 10, discharge the glue outward along the groove 10, and facilitate the later cleaning of the cured glue 3, etc. The width of the groove opening of the groove 10 is preferably 2 mm - 8 mm.

[0025] Such as Figures 1 to 4 , preferably, the cross-sectional profile of the groove 10 is an inverted triangle, and the inverted triangle includes but is not limited to being an equilateral triangle. Of course, the cross-sectional profile of the groove 10 can also be an inverted trapezoid, or other shapes such as a concave arc, as long as it satisfies the feature that "the width of the groove 10 gradually decreases from the groove opening to the groove bottom".

[0026] Such as Figures 1 to 4 , both ends of the groove 10 extend beyond the projection area of the second end face 21. Preferably, both ends of the groove 10 penetrate the first end face 11.

[0027] Such as Figures 1 to 4 , a plurality of grooves 10 are arranged parallel and equidistant from each other, making the force on the wafer more uniform. Of course, a plurality of grooves 10 can also be arranged in a V-shape.

[0028] Such as Figures 1 to 4 , let the distance between two adjacent grooves 10 be d, and the width of the wafer 2 be D. Then the value range of the distance between two adjacent grooves 10 is preferably: (1 / 7)D ≤ d ≤ (1 / 4)D. If the value of d is too large, the number of grooves under the first end face 11 is small, the grooves are sparse, and it is easy to cause insufficient fixing connection strength between the bottom plate 1 and the wafer 2 through the curing glue 3, resulting in accidental separation; if the value of d is too small, the number of grooves under the first end face 11 is large, the grooves are dense, and it is easy to cause waste of the curing glue. Taking the most common 12-inch (300 mm) circular wafer as an example, (1 / 7)D = 42.85 mm ≤ d ≤ 75.00 mm = (1 / 4)D.

[0029] Such asFigures 1 to 4 When the present utility model is assembled, first apply a curing adhesive on the second end face 21; then, through external pressure, press the first end face 11 of the bottom plate 1 towards the second end face 21 coated with the curing adhesive 3, and the excess curing adhesive 3 after being pressed out is discharged outward through the groove 10; the curing adhesive 3 is cured, so that the wafer 2 is fixedly adhered to the bottom plate 1 through the curing adhesive 3. Wherein, the layer thickness of the curing adhesive 3 can be controlled by the magnitude of the external pressure. When the back surface of the wafer 3 needs to be ground, the bottom plate 1 of the present utility model is fixedly installed on the workbench of the existing wafer grinding machine by means of film pasting, wax sticking or negative pressure adsorption, etc., and the wafer 2 is ground and thinned by the grinding wheel of the wafer grinding machine; after the grinding and thinning is completed, then separate the two and remove the UV adhesive.

[0030] The above is only the specific embodiment of the present utility model, but the design concept of the present utility model is not limited thereto. Any non-substantive modification made to the present utility model using this concept shall fall within the scope of infringement of the protection scope of the present utility model.

Claims

1. A wafer grinding processing assembly, comprising a wafer and a base plate, characterized in that: The base plate has a first end face, and a plurality of grooves are arranged at intervals on the first end face; the wafer has a second end face, and the second end face is fixed to the first end face by means of curing glue, and the curing glue fills the plurality of grooves, and at least one end of the groove extends beyond the projection area of ​​the second end face.

2. The wafer grinding assembly according to claim 1, characterized in that: The groove is extended along a straight line, and the width of the groove gradually decreases from the groove opening to the groove bottom.

3. A wafer grinding assembly according to claim 2, characterized in that: The cross-sectional profile of the groove is an inverted triangle.

4. The wafer grinding assembly according to claim 3, characterized in that: The inverted triangle is an equilateral triangle.

5. The wafer grinding assembly according to claim 2, characterized in that: The plurality of grooves are arranged parallel to each other and at equal distances.

6. The wafer grinding assembly according to claim 2, characterized in that: Both ends of the groove pass through the first end surface.

7. A wafer grinding assembly according to any one of claims 1 to 6, characterized in that: The bottom plate is made of glass.

8. A wafer grinding assembly according to any one of claims 1 to 6, characterized in that: The curing glue is UV glue.

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