Deposition ring shielding device for metal deposition

Abstract

The utility model belongs to a deposition ring shielding device for metal deposition in the technical field of semiconductor manufacturing process. Comprising an upper shielding part (1) and a lower shielding part (2), the upper shielding part (1) is provided with a plurality of positioning holes (3), the lower shielding part (2) is provided with a plurality of positioning pins (4), the inner side of the upper shielding part (1) is provided with an upper bending limiting part (5) which is bent downwards, and the inner side of the lower shielding part (2) is provided with a lower bending limiting part (6) which is bent upwards. The deposition ring shielding device for metal deposition is simple in structure, a sand blasting adhesive tape shielding protection mode is not used any more, shielding of a to-be-shielded part of a to-be-sprayed deposition ring can be conveniently and rapidly achieved, the problems of adhesive residues and marks are avoided, installation is easy, shielding and positioning of the device and the deposition ring are accurate, disassembly is convenient, and cost is low. The production efficiency is effectively improved, and the skill requirements on operators are low.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing processes, and more specifically, it relates to a deposition ring shielding device for metal deposition. Background Art

[0002] PVD is a coating technology in semiconductor manufacturing processes. It vaporizes the surface of solid or liquid materials into gaseous atoms, molecules, or partially ionizes them into ions under vacuum conditions, and deposits a thin film with a certain special function on the substrate surface through a low-pressure gas (or plasma) process. During the process of depositing metal substances, generally only the metal substances are expected to be deposited on the surface of the silicon wafer. Therefore, other structures inside the machine need to be shielded. Among them, the deposition ring is a key component, which is closely related to the silicon wafer. In order to adsorb metal deposits to the maximum extent, the sandblasting process is used to roughen its surface during the regeneration cleaning process. Before sandblasting and roughening, the specific positions need to be shielded and protected with sandblasting tape to prevent grit from splashing onto the smooth surface. For the shielding and protection of sandblasting components, the conventional method is to use sandblasting tape to tape and protect the parts that do not need sandblasting. For components with a large number of protected positions, the operation of taping by employees is time-consuming and laborious. Moreover, during sandblasting, the tape is easily broken by the abrasive material, or the parts are contaminated and the smooth surface is damaged due to human operation errors such as not sticking tightly. And it is easy to leave residual glue when removing the tape.

[0003] There is a technology with the name of "a fixture ring for the deposition chamber of the aluminum process of a metal sputtering machine" and the publication number of "CN105441896B" in the prior art. This technology provides a fixture ring for the deposition chamber of the aluminum process of a metal sputtering machine, including a fixture ring body and a shielding part. The shielding parts are arranged in pairs at both ends of the circumference diameter where the inner edge of the fixture ring body is located. The inner diameter of the fixture ring is 192.77 mm - 193.05 mm, and the inner diameter of the shielding part between two opposite shielding parts is 190.64 mm - 190.94 mm. Configuring the fixture ring of the present invention in the deposition chamber of a metal sputtering machine can produce the first layer of 0.35 and H30 metal wire layers without particularly controlling the power of the deposition chamber and effectively avoid the problem of titanium peeling at the crystal edge.

[0004] However, this technology does not involve the technical problems and technical solutions of the present application. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is: aiming at the deficiencies of the prior art, to provide a deposition ring shielding device for metal deposition with a simple structure, no longer using the sandblasting tape shielding and protection method, which can conveniently and quickly shield the parts to be shielded of the deposition ring to be sprayed, avoid the problems of residual glue and marks, and has simple installation, accurate shielding and positioning between the device and the deposition ring, convenient disassembly, effectively improving production efficiency and having low requirements for the skills of operators.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present utility model is as follows:

[0007] The present utility model relates to a deposition ring shielding device for metal deposition, which comprises an upper shielding component and a lower shielding component. A plurality of positioning holes are arranged on the upper shielding component, and a plurality of positioning pins are arranged on the lower shielding component. An upper bending limiting part that bends downward is arranged inside the upper shielding component, and a lower bending limiting part that bends upward is arranged inside the lower shielding component.

[0008] The deposition ring is of a disc-shaped structure. The middle of the surface of the deposition ring is the part to be sprayed, and the outer ring of the surface of the deposition ring is the part to be shielded.

[0009] Both the upper shielding component and the lower shielding component are of an annular structure.

[0010] A plurality of positioning holes are arranged along the circumference of the surface of the upper shielding component, and the positioning holes penetrate through the upper shielding component; a plurality of positioning pins are arranged along the circumference of the upper surface of the lower shielding component, and the number and positions of the positioning pins correspond to those of the positioning holes one by one.

[0011] The deposition ring shielding device for metal deposition further comprises a plurality of screws, and screw holes are arranged on the upper parts of the positioning pins.

[0012] The height of the positioning pin is greater than the thickness of the upper shielding component.

[0013] The height of the positioning pin is greater than the thickness of the deposition ring.

[0014] Both the upper shielding component and the lower shielding component are structures made of metal materials.

[0015] The sum of the heights of the upper bending limiting part and the lower bending limiting part is equal to the thickness of the part to be shielded of the deposition ring.

[0016] By adopting the technical solution of the present utility model, the working principle and beneficial effects are as follows:

[0017] The deposition ring shielding device for metal deposition described in the present utility model is respectively provided with an upper shielding component and a lower shielding component. The upper shielding component is provided with a positioning hole and an upper bending limiting portion, and the lower shielding component is provided with a positioning pin and a lower bending limiting portion. Before spraying the deposition ring, the upper shielding component and the lower shielding component are used in cooperation to shield the portion to be shielded of the deposition ring. Specifically, the upper shielding portion is moved to the upper surface of the deposition ring, and the lower shielding portion is moved to the lower surface of the deposition ring. Then, the positioning pin on the lower shielding portion passes through the through hole at the position of the portion to be shielded on the deposition ring. The positioning pin will pass through the deposition ring and extend into a corresponding positioning hole in the upper shielding portion to achieve the horizontal position positioning of the upper shielding portion and the lower shielding portion. At the same time, the upper bending limiting portion contacts the lower bending limiting portion to achieve the upper and lower position limiting of the upper shielding component and the lower shielding component, and reliably achieve the reliable positioning between the upper shielding component, the lower shielding component and the deposition ring. The upper shielding component fits the portion to be shielded on the upper surface of the deposition ring, and the lower shielding component fits the portion to be shielded on the lower surface of the deposition ring. And the portion to be sprayed of the deposition ring is exposed outside. It is convenient and fast to shield the portion to be shielded, facilitating the spraying of the portion to be sprayed of the deposition ring without spraying on the portion to be shielded. The deposition ring shielding device for metal deposition is convenient to install, accurately positioned, and also convenient and fast to disassemble on the deposition ring. It effectively meets the use requirements and ensures the spraying quality of the deposition ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following briefly describes the content expressed in each drawing of this specification and the marks in the drawings:

[0019] Figure 1 It is a schematic structural diagram of the deposition ring described in the present utility model;

[0020] Figure 2 It is a top view structural diagram of the upper shielding component of the deposition ring shielding device for metal deposition described in the present utility model;

[0021] Figure 3 It is a cross-sectional structural diagram of the upper shielding component of the deposition ring shielding device for metal deposition described in the present utility model;

[0022] Figure 4 It is a top view structural diagram of the lower shielding component of the deposition ring shielding device for metal deposition described in the present utility model;

[0023] Figure 5 It is a cross-sectional structural diagram of the lower shielding component of the deposition ring shielding device for metal deposition described in the present utility model;

[0024] Figure 6 It is a cross-sectional structural diagram of the deposition ring shielding device for metal deposition described in the present utility model when shielding the portion to be shielded of the deposition ring;

[0025] The labels in the attached drawings are respectively: 1. upper shielding member; 2. lower shielding member; 3. positioning hole; 4. positioning pin; 5. upper bending limit portion; 6. lower bending limit portion; 7. portion to be sprayed; 8. portion to be shielded; 9. deposition ring; 10. through hole; 11. screw hole; 12. screw. Detailed implementation manners

[0026] The following further elaborates in detail on the specific implementation manners of the present utility model, such as the shapes, structures of the various components involved, the mutual positions and connection relationships between the various parts, the functions and working principles of the various parts, etc., by describing the embodiments with reference to the attached drawings:

[0027] As shown in the attached Figure 1 - attached Figure 6As shown in the figure, the utility model relates to a deposition ring shielding device for metal deposition, which includes an upper shielding component 1 and a lower shielding component 2. A plurality of positioning holes 3 are arranged on the upper shielding component 1, and a plurality of positioning pins 4 are arranged on the lower shielding component 2. An upper bending limiting part 5 that bends downward is arranged inside the upper shielding component 1, and a lower bending limiting part 6 that bends upward is arranged inside the lower shielding component 2. For the deficiencies in the prior art, the above structure proposes an improved technical solution. When setting the structure, the upper shielding component 1 and the lower shielding component 2 are respectively set. The upper shielding component 1 is provided with positioning holes 3 and an upper bending limiting part 5, and the lower shielding component 2 is provided with positioning pins 4 and a lower bending limiting part 6. Before spraying the deposition ring 9, the upper shielding component 1 and the lower shielding component 2 are used in cooperation to shield the part to be shielded of the deposition ring 9. Specifically, the upper shielding part is moved to the upper surface of the deposition ring 9, and the lower shielding part is moved to the lower surface of the deposition ring. Then, the positioning pins 4 on the lower shielding component 2 pass through the through holes 10 at the positions of the parts to be shielded on the deposition ring 9. The positioning pins 4 will pass through the deposition ring 9 and extend into a corresponding positioning hole 4 in the upper shielding component 1, realizing the horizontal position positioning of the upper shielding part and the lower shielding part. At the same time, the upper bending limiting part 5 contacts the lower bending limiting part 6, realizing the upper and lower position limiting of the upper shielding component 1 and the lower shielding component 2, and reliably realizing the reliable positioning between the upper shielding component, the lower shielding component and the deposition ring 9. At this time, the upper shielding component 1 fits the part to be shielded on the upper surface of the deposition ring 9, and the lower shielding component 2 fits the part to be shielded on the lower surface of the deposition ring 9. And the part to be sprayed of the deposition ring 9 is exposed outside. At this time, it is convenient and fast to shield the part to be shielded, which is convenient for spraying the part to be sprayed of the deposition ring 9 without spraying on the part to be shielded. The deposition ring shielding device for metal deposition is convenient to install and accurately position on the deposition ring 9, and is also convenient and fast to disassemble. It effectively meets the use requirements and ensures the spraying quality of the deposition ring. The deposition ring shielding device for metal deposition described in the utility model has a simple structure, no longer uses the sandblasting tape shielding protection method, can conveniently and quickly shield the parts to be shielded of the deposition ring to be sprayed, avoids the problems of residual glue and marks, and has a simple installation. The device and the deposition ring are accurately shielded and positioned, and are convenient to disassemble, effectively improving the production efficiency and having low requirements for the skills of operators.

[0028] The deposition ring 9 is of a disc-shaped structure. The middle of the surface of the deposition ring 9 is the part to be sprayed 7, and the outer ring of the surface of the deposition ring 9 is the part to be shielded 8. The upper shielding component 1 and the lower shielding component 2 are both of an annular structure. For the above structure, since the deposition ring 9 is of a disc-shaped structure, the upper shielding component 1 and the lower shielding component 2 are set according to the size of the specific deposition ring 9. That is, the outer diameter of the upper shielding component 1 is equal to the outer diameter of the part to be shielded, and the outer diameter of the lower shielding component 2 is equal to the outer diameter of the part to be shielded. In this way, it is convenient to realize the cooperation between the upper shielding component 1, the lower shielding component 2 and the deposition ring 9 with specific dimensions, meeting the shielding requirements.

[0029] A plurality of positioning holes 3 are arranged along the circumference of the surface of the upper shielding member 1, and the positioning holes 3 penetrate through the upper shielding member 1; a plurality of positioning pins 4 are arranged along the circumference of the upper surface of the lower shielding member 2, and the number and positions of the positioning pins 4 correspond one-to-one to those of the positioning holes 3. The deposition ring shielding device for metal deposition further includes a plurality of screws, and a threaded hole 11 is provided at the upper part of the positioning pin 4. In the above structure, after the positioning pin 4 on the lower shielding part 2 passes through the through hole 10 at the position to be shielded on the deposition ring 9, the positioning pin 4 will extend into a corresponding positioning hole 3 in the upper shielding part 1, realizing the horizontal position positioning of the upper shielding part 1 and the lower shielding part 2. At the same time, the upper bending limiting part 5 contacts the lower bending limiting part 6, realizing the upper and lower position limiting of the upper shielding member 1 and the lower shielding member 2, and reliably realizing the reliable positioning among the upper shielding member, the lower shielding member and the deposition ring 9. After the screw is screwed into the threaded hole, the end of the screw abuts against the upper surface of the upper shielding member 1, realizing the reliable fixation of the upper shielding member and the lower shielding member, and the shielding device will not separate from the deposition ring.

[0030] The height of the positioning pin 4 is greater than the thickness of the upper shielding part 1. The height of the positioning pin 4 is greater than the thickness of the deposition ring. In the above structure, it is ensured that after the positioning pin passes through the deposition ring, it will also extend into a positioning hole in the upper shielding member, realizing horizontal limiting.

[0031] Both the upper shielding member 1 and the lower shielding member 2 are structures made of metal materials.

[0032] The sum of the height of the upper bending limiting part 5 and the height of the lower bending limiting part 6 is equal to the thickness of the part to be shielded 8 of the deposition ring 9. In the above structure, after the upper shielding member 1 and the lower shielding member 2 are connected by screws, the upper bending limiting part 5 reliably fits the lower bending limiting part 6, realizing limiting. At the same time, the upper shielding member 1 reliably fits the part to be shielded 8 on the upper surface of the deposition ring 9, and the lower shielding member 2 reliably fits the part to be shielded 8 on the lower surface of the deposition ring 9.

[0033] For the deposition ring shielding device for metal deposition described in the present utility model, when the structure is arranged, an upper shielding component 1 and a lower shielding component 2 are respectively arranged. The upper shielding component 1 is provided with a positioning hole 3 and an upper bending limiting part 5, and the lower shielding component 2 is provided with a positioning pin 4 and a lower bending limiting part 6. Before spraying the deposition ring 9, the upper shielding component 1 and the lower shielding component 2 are used in cooperation to shield the part to be shielded of the deposition ring 9. Specifically, the upper shielding component is moved to the upper surface of the deposition ring 9, and the lower shielding component is moved to the lower surface of the deposition ring. Then, the positioning pin 4 on the lower shielding component 2 passes through the through hole 10 at the position of the part to be shielded on the deposition ring 9. The positioning pin 4 will pass through the deposition ring 9 and extend into a corresponding positioning hole 4 in the upper shielding component 1 to realize the horizontal position positioning of the upper shielding part and the lower shielding part. At the same time, the upper bending limiting part 5 contacts the lower bending limiting part 6 to realize the upper and lower position limiting of the upper shielding component 1 and the lower shielding component 2, and reliably realize the reliable positioning between the upper shielding component, the lower shielding component and the deposition ring 9. At this time, the upper shielding component 1 fits the part to be shielded on the upper surface of the deposition ring 9, and the lower shielding component 2 fits the part to be shielded on the lower surface of the deposition ring 9. And the part to be sprayed of the deposition ring 9 is exposed outside. At this time, it is convenient and fast to shield the part to be shielded, which is convenient for spraying the part to be sprayed of the deposition ring 9 without spraying on the part to be shielded. The deposition ring shielding device for metal deposition is convenient to install and accurately position on the deposition ring 9, and is also convenient and fast to disassemble. It effectively meets the use requirements and guarantees the spraying quality of the deposition ring.

[0034] The present utility model has been described exemplarily above in conjunction with the accompanying drawings. Obviously, the specific implementation of the present utility model is not limited by the above-mentioned manner. As long as various improvements are made by adopting the method concept and technical solution of the present utility model, or the concept and technical solution of the present utility model are directly applied to other occasions without improvement, they are all within the protection scope of the present utility model.

Claims

1. A deposition ring shielding device for metal deposition, characterized in that: The invention comprises an upper shielding component (1) and a lower shielding component (2), wherein a plurality of positioning holes (3) are arranged on the upper shielding component (1), a plurality of positioning pins (4) are arranged on the lower shielding component (2), an upper bending limit portion (5) bent downward is arranged on the inner side of the upper shielding component (1), and a lower bending limit portion (6) bent upward is arranged on the inner side of the lower shielding component (2).

2. The deposition ring shielding device for metal deposition according to claim 1, characterized in that: The deposition ring (9) is a disc-shaped structure, the middle of the surface of the deposition ring (9) is the portion to be sprayed (7), and the outer ring of the surface of the deposition ring (9) is the portion to be shielded (8).

3. The deposition ring shielding device for metal deposition according to claim 2, characterized in that: The upper shielding component (1) and the lower shielding component (2) are both annular structures.

4. The deposition ring shielding device for metal deposition according to claim 3, characterized in that: A plurality of positioning holes (3) are arranged around the surface of the upper shielding component (1), and the positioning holes (3) penetrate the upper shielding component (1); a plurality of positioning pins (4) are arranged around the upper surface of the lower shielding component (2), and the number and positions of the positioning pins (4) correspond one to one with the positioning holes (3).

5. The deposition ring shielding device for metal deposition according to claim 4, characterized in that: The deposition ring shielding device for metal deposition also includes a plurality of screws, and a screw hole is arranged on the upper part of the positioning pin (4).

6. The deposition ring shielding device for metal deposition according to claim 5, characterized in that: The height of the positioning pin (4) is greater than the thickness of the upper shielding component (1).

7. The deposition ring shielding device for metal deposition according to claim 6, characterized in that: The height of the positioning pin (4) is greater than the thickness of the deposition ring.

8. The deposition ring shielding device for metal deposition according to claim 1 or 2, characterized in that: The upper shielding component (1) and the lower shielding component (2) are both structures made of metal materials.

9. The deposition ring shielding device for metal deposition according to claim 1 or 2, characterized in that: The sum of the height of the upper bending limit portion (5) and the height of the lower bending limit portion (6) is equal to the thickness of the portion to be shielded (8) of the deposition ring (9).

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