Silicon rod and cutting net wire cleaning assembly, cleaning equipment and cutting system

Abstract

The utility model discloses a silicon rod and cutting net wire cleaning assembly, cleaning equipment and a cutting system. The cleaning assembly comprises a first pipeline used for conveying a cleaning agent; the second pipeline is movably installed on the cabin wall of the cutting machine, a matched pipeline channel is formed in the cabin wall of the cutting machine, the pipeline channel is provided with an opening communicated with the interior of the cutting machine, the width of the opening is smaller than the diameter of the pipeline channel, and a rack is formed on the outer wall of the second pipeline; when the second pipeline moves in the pipeline channel, the rack is located outside the opening of the pipeline channel; a plurality of nozzles are mounted on each second pipeline and are used for cleaning the interior of the cutting machine; the gear is matched with a rack formed on the outer wall of the second pipeline; and the first driving motor is used for driving the rack to move through the gear, so that the second pipeline and the nozzle move along the pipeline channel as a whole. The technical problem that the washing capacity of the cutting chamber is insufficient in the monocrystalline silicon wafer manufacturing process is solved.

Description

Technical Field

[0001] This application relates to the technical field of single-crystal silicon wafer production. Specifically, it relates to a cleaning component, cleaning equipment, and cutting system for silicon rods and cutting wire meshes. Background Art

[0002] In the production process of large-size single-crystal silicon wafers, silicon rods are cut by diamond wires to produce thin wafers. Before cutting the silicon rods, the silicon rods with adhesive applied are transported to the cutting station by a loading trolley. Then, through processes such as slicing, cleaning, and sorting, qualified single-crystal silicon wafers are produced. These single-crystal silicon wafers, as the basic raw materials for solar cell manufacturing, play an important role in the field of solar power generation.

[0003] During the manufacturing process of single-crystal silicon wafers, it is necessary to clean the surface of the silicon rods at the cutting station thoroughly. During continuous production, the cabin becomes extremely dirty due to the cutting process. Since the flushing pipes in the current cabin are fixed and the nozzles are small, there are problems of insufficient flushing ability for the silicon rods, diamond wires, and the cabin, and there are flushing dead corners in the cutting room. Therefore, manual flushing and cleaning with a water gun are required. Manual assisted flushing has problems such as large water consumption, uneven flushing, and easy over-flushing and missed flushing.

[0004] In response to the above problems, no effective solution has been proposed yet. Summary of the Utility Model

[0005] Embodiments of this application provide a cleaning component, cleaning equipment, and cutting system for silicon rods and cutting wire meshes to at least solve the technical problem of insufficient flushing ability for the cutting room during the manufacturing process of single-crystal silicon wafers.

[0006] According to one aspect of the embodiments of this application, a cleaning component for silicon rods and cutting wire meshes is provided, including: a first pipeline connected to a cleaning agent source for transporting the cleaning agent; a second pipeline movably installed on the cabin wall of a cutting machine. A pipeline channel adapted to the second pipeline is provided on the cabin wall of the cutting machine, and the pipeline channel has an opening communicating with the inside of the cutting machine. The width of the opening is shorter than the diameter of the pipeline channel. One end of the second pipeline is connected to the first pipeline through a hose. A rack is formed on the outer wall of the second pipeline. When the second pipeline moves in the pipeline channel, the rack is located outside the opening of the pipeline channel; a plurality of nozzles, with a plurality of nozzles installed on each second pipeline for cleaning the inside of the cutting machine; a gear adapted to the rack formed on the outer wall of the second pipeline; a first driving motor drivingly connected to the gear for driving the rack to move through the gear so that the second pipeline and the nozzles move as a whole along the pipeline channel.

[0007] Optionally, the cleaning assembly further includes: a first cylindrical gear and a second cylindrical gear that are adapted, the first cylindrical gear is sleeved on one end of the second pipe, and the second cylindrical gear meshes with the first cylindrical gear; a second driving motor, the second driving motor is drivingly connected to the second cylindrical gear, and is configured to drive the first cylindrical gear to rotate through the second cylindrical gear, so that the second pipe and the nozzle rotate as a whole.

[0008] Optionally, the radiation angles of the multiple nozzles installed on each second pipe are not exactly the same.

[0009] Optionally, there are multiple second pipes, and the multiple second pipes are arranged in parallel on the cabin wall of the cutting machine.

[0010] Optionally, the nozzle is a nozzle with a variable radiation angle or the orientations of multiple nozzles during installation are not exactly the same.

[0011] According to another aspect of the embodiments of the present application, a cleaning device is further provided, including the cleaning assembly for the silicon rod and the cutting wire mesh as described above.

[0012] According to another aspect of the embodiments of the present application, a cutting system is further provided, including the cleaning device as described above.

[0013] In the embodiments of the present application, the cleaning assembly includes: a first pipe, the first pipe is connected to a cleaning agent source and is configured to transport the cleaning agent; a second pipe, the second pipe is movably installed on the cabin wall of the cutting machine, a pipe channel adapted to the second pipe is provided on the cabin wall of the cutting machine, and the pipe channel has an opening communicating with the inside of the cutting machine, the width of the opening is shorter than the diameter of the pipe channel, one end of the second pipe is communicated with the first pipe through a hose, a rack is formed on the outer wall of the second pipe, and when the second pipe moves in the pipe channel, the rack is located outside the opening of the pipe channel; multiple nozzles, multiple nozzles are installed on each second pipe and are configured to clean the inside of the cutting machine; a gear, the gear is adapted to the rack formed on the outer wall of the second pipe; a first driving motor, the first driving motor is drivingly connected to the gear and is configured to drive the rack to move through the gear, so that the second pipe and the nozzle move along the pipe channel as a whole, thereby solving the technical problem of insufficient flushing ability of the cutting chamber during the manufacturing process of single crystal silicon wafers. Description of the Drawings

[0014] The accompanying drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:

[0015] Figure 1 is a schematic diagram of an optional cleaning assembly for a silicon rod and a cutting wire mesh according to an embodiment of the present application;

[0016] Figure 2 is a schematic diagram of a cabin wall of an optional cutting machine according to an embodiment of the present application;

[0017] Figure 3 is a schematic diagram of an optional gear drive structure according to an embodiment of the present application.

[0018] In the figure:

[0019] 1 - First pipeline, 2 - Second pipeline, 3 - Sprayer, 4 - Gear, 5 - Motor, 21 - Pipeline channel, 22 - Opening, A - Hose, B - Rack, 31 - First cylindrical gear, 32 - Second cylindrical gear 32. Detailed implementation manners

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0022] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0023] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0024] In addition, terms such as "horizontal", "vertical", "hanging" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0025] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0026] The following will describe in detail some embodiments of the present application with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0027] During the manufacturing process of single-crystal silicon wafers, it is necessary to clean the surface of the silicon rod at the cutting station thoroughly. During continuous production, the machine cabin will become extremely dirty due to the cutting process. Since the flushing pipes in the current machine cabin are fixed and the nozzles are small, there are problems of insufficient flushing ability for the silicon rod, wire saw, and machine cabin and flushing dead angles in the cutting room. Therefore, it is necessary to manually use a water gun for flushing and cleaning. Manual assisted flushing has problems such as large water consumption, uneven flushing, and easy over-flushing and missed flushing.

[0028] With the progress of industrialization and automation, the cleaning process in the machine cabin has been improved from the original manual assisted operation to fully automated operation. During the slicing process, the overall cleanliness of the machine cabin can be effectively improved, and the cleanliness has become an important factor affecting whether the slicing process can proceed smoothly. Therefore, the automatic cleaning device used at the present stage is directly related to the production capacity of the slicing process, affects the production cost of single-crystal silicon wafers, and is directly related to the enterprise's operation and management.

[0029] According to one aspect of the present application, an embodiment of a cleaning assembly for a silicon rod and a cutting wire is provided. As Figure 1 shown, the cleaning assembly may include:

[0030] A first pipeline 1, which is connected to a cleaning agent source (such as water) for transporting the cleaning agent. The first pipeline can be a rigid pipeline.

[0031] A second pipeline 2, which is movably installed on the cabin wall of the cutting machine.

[0032] As Figure 2 shown in the cross-sectional view of the cabin wall of the cutting machine, a pipeline channel 21 adapted to the second pipeline is provided on the cabin wall of the cutting machine, and the pipeline channel has an opening 22 communicating with the inside of the cutting machine (i.e., the opening shown by the dotted line. Actually, it is directly communicated with the internal space of the cutting machine here, and the dotted line is only for illustration). The width of the opening is shorter than the diameter of the pipeline channel. One end of the second pipeline is communicated with the first pipeline through a hose A. A rack B is formed on the outer wall of the second pipeline. When the second pipeline moves in the pipeline channel, the rack is located outside the opening of the pipeline channel.

[0033] Spray nozzles 3, and a plurality of spray nozzles are installed on each second pipeline for cleaning the inside of the cutting machine;

[0034] A gear 4, which is adapted to the rack formed on the outer wall of the second pipeline.

[0035] A first driving motor 5, which is drivingly connected to the gear and is used to drive the rack to move through the gear, so that the second pipeline and the spray nozzles move as a whole along the pipeline channel (i.e., move in the length direction of the pipeline channel), thereby expanding the cleaning range.

[0036] In order to increase the cleaning range, the radiation angles of the plurality of spray nozzles installed on the second pipeline are not completely the same. Specifically, spray nozzles with radiation angles that can change automatically (the radiation angles can be changed through mechanical structures or electrical controls) are used, or the orientations of the plurality of spray nozzles when installed are not completely the same, or the radiation angles of the spray nozzles can be adjusted by using a rotating structure (such as Figure 3As shown, it is specifically realized by a matched first spur gear 31, a second spur gear 32 and a second driving motor. The first spur gear is sleeved on one end of the second pipeline, that is, the second pipeline passes through the hollow part of the center of the first spur gear 31. The second spur gear meshes with the first spur gear, and the second driving motor is drivingly connected to the second spur gear for driving the first spur gear to rotate through the second spur gear, so that the second pipeline and the nozzle rotate as a whole), and then all nozzles can cover the entire cabin as much as possible by moving the second pipeline.

[0037] For some cabins with relatively large volumes, the nozzles on each second pipeline can only cover part of the area or the cleaning intensity of some areas drops significantly. At this time, multiple second pipelines can be configured. The multiple second pipelines are arranged in parallel on the cabin wall of the cutting machine, and the nozzles on each second pipeline are responsible for cleaning part of the area.

[0038] At the present stage, the cleaning process is that the water spraying system inside the cutting machine uses pipelines and nozzles at fixed positions for spraying and cleaning. This cleaning method will result in dead corners in the cleaning of the silicon rod and the diamond wire mesh before cutting, which cannot meet the cleaning requirements and has a greater impact on the subsequent cutting operation. In addition, since the cleaning degree inside the cabin is difficult to guarantee during this process, it is easy to form dirty lumps, further causing risks such as jumper wires and even network explosion, resulting in abnormal slicing.

[0039] Adopting the technical solution of the present application, since the radiation angle of the nozzle can be changed (such as by moving the second pipeline), compared with using nozzles with a fixed radiation angle, the technical problem of insufficient flushing ability of the cutting chamber during the manufacturing process of monocrystalline silicon wafers can be solved.

[0040] As an optional embodiment, the present application adopts a technical transformation method. A plurality of movable spray water pipes are arranged inside the cabin of the cutting machine. A plurality of spray nozzles are arranged on the spray water pipes. The spray nozzles can move along the length direction of the water pipe. The moving distance each time can be equal to the spacing between the spray nozzle openings. The spray water pipe has a certain circumferential degree of freedom or the radiation angle of the spray nozzle is relatively large, such as 45 - 60 degrees, which can meet the spray cleaning at multiple positions inside the cabin. That is, the existing spray pipeline is subjected to a telescopic treatment. The end of the spray pipeline adopts a corrugated pipe or a telescopic pipe to meet the requirement of moving along the spray pipeline. The process requirement of clean without dead corners is realized, the quality of automatically cleaning the cabin is improved, and it is beneficial to the cost reduction and efficiency increase of the enterprise. The technical solution of the present application will be further described in detail in the following in combination with specific embodiments:

[0041] In order to solve the problems of insufficient flushing capacity and flushing dead angles in the automatic cleaning process of single-crystalline silicon wafers in the machine cabin, this application provides an innovative spraying structure, which can meet the process requirements of dead-angle-free cleaning and reduce the use of manpower, material resources, and time.

[0042] The new spraying structure provided by this application consists of a movable spraying pipe and multiple spraying nozzles. Among them, the end of the spraying pipeline in the movable spraying pipe can adopt movable structures such as corrugated pipes or telescopic pipes; the nozzles adopt pressure flushing nozzles.

[0043] Adopting the above technical solution, the movable spraying pipe is divided into two parts: liquid transportation and telescoping. Laying pipelines in the machine cabin, fixing pipelines for fixed equipment, and laying non-fixed equipment such as pleats, diamond wire meshes, and main rollers with corrugated pipes or telescopic pipes to ensure dead-angle-free laying of pipelines.

[0044] Adopting the above technical solution, the nozzle device needs to meet the requirement that the water column flushing pressure reaches the standard. First, it is necessary to ensure the cleaning ability of the pipeline; furthermore, it is necessary to make the nozzle lighter and smaller in volume. When the above two points are met, the flushing range can be completed.

[0045] This application adopts a technical transformation method. When the cleaning ability is met, the amount of water can be adjusted, the number of nozzles can be adjusted, and the route of the telescopic pipe or corrugated pipe can be modified, saving costs and optimizing parameters, and realizing cost reduction and efficiency increase for the enterprise.

[0046] Adopting the above technical solution, by transforming the spraying pipeline structure and laying a denser cleaning network, the process of cleaning the machine cabin is simplified, the process goal of cleaning the machine cabin is completed, and the overall efficiency of the slicing process is improved. The production capacity of the equipment is released, and the consumption of material resources is saved.

[0047] This technical solution simplifies the operation of the slicing machine by personnel while improving the cleaning degree of the machine cabin, reduces the risk of personnel operation errors, saves the use of time and material resources, realizes the improvement of effects while reducing the energy consumption and loss of mechanical equipment. The cost of the slicing process is reduced.

[0048] This application is also equipped with the required processing equipment and electrical components and accessories for the PLC control system.

[0049] In summary, this application relates to the slicing process in the manufacturing process of large-size single-crystalline silicon wafers. It simplifies the operation of the slicing machine by personnel while improving the cleaning degree of the machine cabin, reduces the risk of personnel operation errors, saves the use of time and material resources, realizes the improvement of effects while reducing the energy consumption and loss of mechanical equipment. The cost of the slicing process is reduced, that is, the production cost of single-crystalline silicon wafers is reduced.

[0050] The above are only the preferred embodiments of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present application.

Claims

1. A cleaning assembly for silicon rods and cutting wires, characterized in that: include: a first pipeline, the first pipeline being connected to a cleaning agent source and used for conveying the cleaning agent; a second pipe, the second pipe is movably mounted on the cabin wall of the cutting machine, a pipe channel adapted to the second pipe is opened on the cabin wall of the cutting machine, and the pipe channel has an opening connected to the interior of the cutting machine, the width of the opening is shorter than the diameter of the pipe channel, one end of the second pipe is connected to the first pipe through a hose, a rack is formed on the outer wall of the second pipe, and the rack is located outside the opening of the pipe channel when the second pipe moves in the pipe channel; A plurality of nozzles, each of the second pipes is equipped with a plurality of nozzles for cleaning the interior of the cutting machine; a gear, the gear being adapted to a rack formed on an outer wall of the second pipe; A first driving motor is connected to the gear for driving the rack to move via the gear, so that the second pipeline and the nozzle move as a whole along the pipeline channel.

2. The cleaning assembly according to claim 1, characterized in that: The cleaning component also includes: A first cylindrical gear and a second cylindrical gear adapted to each other, wherein the first cylindrical gear is sleeved on one end of the second pipe, and the second cylindrical gear is meshed with the first cylindrical gear; A second driving motor is drivingly connected to the second cylindrical gear and is used to drive the first cylindrical gear to rotate through the second cylindrical gear, so that the second pipeline and the nozzle rotate as a whole.

3. The cleaning assembly according to claim 2, characterized in that: The radiation angles of the multiple nozzles installed on each of the second pipes are not completely the same.

4. The cleaning assembly according to claim 3, characterized in that: There are multiple second pipes, and the multiple second pipes are arranged in parallel on the cabin wall of the cutting machine.

5. The cleaning assembly according to claim 3, characterized in that: The nozzle is a nozzle with a variable radiation angle or the directions of the plurality of nozzles when installed are not completely the same.

6. A cleaning device, characterized in that: The cleaning device comprises a cleaning assembly for silicon rods and cutting mesh wires as described in any one of claims 1 to 5.

7. A cutting system, characterized in that: Includes the cleaning device as described in claim 6.

Images