Cooling device used in solid gum filling process

Abstract

The utility model provides a cooling device used in a solid gum filling process, and belongs to the technical field of machinery. A cooling device used in the solid gum filling process comprises a box body, the box body is provided with a cooling channel, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are communicated with the cooling channel, the box body is provided with a plate face, and a mounting hole communicated with the cooling channel is formed in the plate face. And the containing pipes correspond to the mounting holes one to one, the containing pipes are detachably mounted at the mounting holes, and a plurality of cooling fins are fixed to the containing pipes and located in the cooling channel. The cooling device has the advantage of high cooling efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of machinery, and particularly relates to a cooling device for the solid glue filling process. Background Technique

[0002] Before the solid glue is formed, it needs to be heated and melted first, and then imported into a specific mold, and then cooled to form. However, the traditional cooling method is natural cooling, and the temperature of the corresponding cooling workshop is relatively high, which further reduces the efficiency of natural cooling, thus reducing the efficiency of the assembly line production. Summary of the Invention

[0003] The purpose of the utility model is to provide a cooling device for the solid glue filling process, which has the characteristics of high cooling efficiency, aiming at the above problems existing in the prior art.

[0004] The purpose of the utility model can be achieved by the following technical solutions:

[0005] A cooling device for the solid glue filling process, comprising

[0006] a box body, the box body has a cooling channel, as well as a liquid inlet and a liquid outlet communicated with the cooling channel, the box body has a plate surface, and an installation hole communicated with the cooling channel is opened on the plate surface;

[0007] a plurality of accommodating tubes, the accommodating tubes correspond to the installation holes one by one, and the accommodating tubes are detachably installed at the installation holes, and a plurality of cooling fins are fixed on the accommodating tubes, and the cooling fins are located in the cooling channel.

[0008] In the above cooling device for the solid glue filling process, the installation holes are distributed in an array on the plate surface.

[0009] In the above cooling device for the solid glue filling process, a plurality of counterbores are arranged on the plate surface, the counterbores correspond to the installation holes one by one, and the installation holes are located in the middle of the bottom wall of the counterbores.

[0010] In the above cooling device for the solid glue filling process, an installation part is fixed at the pipe end position of the accommodating tube, a plurality of sealing rings are arranged on the installation part, when the installation part is installed in the counterbore, the installation part abuts against the bottom wall of the counterbore, and the sealing ring can seal the gap between the installation part and the inner wall of the counterbore.

[0011] In the above cooling device used in the process of solid glue filling, an insertion hole is formed at the bottom of the accommodating tube. A lifting block is installed in the accommodating tube, and the lifting block closes the insertion hole of the accommodating tube. The lifting block is connected to the bottom of the accommodating tube through a tension spring, and the lifting block can push out the solid glue cooled in the accommodating tube.

[0012] In the above cooling device used in the process of solid glue filling, a pushing mechanism is further included. The pushing mechanism includes a push rod motor, a push plate, and a plurality of ejector rods. The push rod is fixed on the push rod of the push rod motor, and the ejector rods are fixed on the push plate and correspond to the insertion holes one by one.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] By adopting the method of circulating coolant in the cooling channel and the design of cooling fins, the cooling efficiency is greatly improved. Compared with the traditional natural cooling method, the temperature of the solid glue can be reduced faster, enabling it to be quickly cooled and formed, thus significantly improving the production efficiency of the assembly line. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a sectional structure diagram of the present application;

[0016] Figure 2 is a schematic structural diagram of the position of the accommodating tube on the box body of the present application;

[0017] Figure 3 is a schematic structural diagram of the accommodating tube removed from the box body of the present application;

[0018] In the figure,

[0019] 2. Box body; 21. Cooling channel; 22. Liquid inlet; 23. Liquid outlet; 24. Plate surface; 241. Mounting hole; 242. Counterbore;

[0020] 3. Accommodating tube; 31. Cooling fins; 32. Mounting part; 33. Sealing ring; 34. Insertion hole; 35. Lifting block; 36. Tension spring;

[0021] 4. Pushing mechanism; 41. Push rod motor; 42. Push plate; 43. Ejector rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following further describes the present application in conjunction with the appended Figures 1 - 3 drawings and specific embodiments:

[0023] First of all, it should be noted here that in the description of this application, when terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other orientation words appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings. It is only for the convenience of description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to this application; in addition, when terms such as "first", "second", "third" and other numerical quantifiers appear, they are only for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in this application, unless otherwise clearly specified and limited, when terms such as "installation", "connection", "connection" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an interference fit, a transition fit and other limiting connections, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium; therefore, for those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] As Figures 1 to 3 shown, a cooling device for the solid glue filling process includes a box body 2 and a number of accommodating tubes 3. The box body 2 has a cooling channel 21, as well as a liquid inlet 22 and a liquid outlet 23 communicating with the cooling channel 21. The box body 2 has a plate surface 24, and an installation hole 241 communicating with the cooling channel 21 is opened on the plate surface 24; the accommodating tubes 3 correspond to the installation holes 241 one by one, and the accommodating tubes 3 are detachably installed at the installation holes 241. A number of cooling fins 31 are fixed on the accommodating tubes 3, and the cooling fins 31 are located in the cooling channel 21.

[0025] In this application, the coolant enters the cooling channel 21 of the box body 2 from the liquid inlet 22. The cooling channel 21 is a path designed inside the box body 2 for the coolant to flow through, and it communicates with the liquid inlet 22 and the liquid outlet 23. The coolant flows in the cooling channel 21. The accommodating tubes 3 are installed at the installation holes 241 on the plate surface 24 of the box body 2 and correspond to the installation holes 241 one by one. When the fixing glue is poured into the accommodating tubes 3 for cooling and forming, a number of cooling fins 31 fixed on the accommodating tubes 3 are located in the cooling channel 21. The cooling fins 31 increase the contact area with the coolant, and the cooling fins 31 can more efficiently transfer the heat of the fixing glue absorbed by the accommodating tubes 3 to the coolant, accelerating the heat exchange.

[0026] By adopting the way of the coolant circulating in the cooling channel 21 and the design of the cooling fins 31, the cooling efficiency is greatly improved. Compared with the traditional natural cooling method, it can reduce the temperature of the fixing glue faster and make it cool and form quickly, thus significantly improving the production efficiency of the production line.

[0027] Specifically, the installation holes 241 are arranged in an array on the plate surface 24.

[0028] Specifically, a plurality of counterbores 242 are provided on the plate surface 24, and the counterbores 242 correspond to the mounting holes 241 one by one. The mounting holes 241 are located in the middle of the bottom wall of the counterbores 242.

[0029] Specifically, an installation part 32 is fixed at the pipe end position of the accommodating pipe 3. A plurality of sealing rings 33 are provided on the installation part 32. When the installation part 32 is installed in the counterbore 242, the installation part 32 abuts against the bottom wall of the counterbore 242, and the sealing ring 33 can seal the gap between the installation part 32 and the inner wall of the counterbore 242.

[0030] This design can conveniently replace the accommodating pipe 3. The accommodating pipe 3 can be provided according to the models of solid glue with different sizes, which is very convenient. After the installation part 32 is inserted into the counterbore 242, the cooling channel 21 can be effectively isolated, and the replacement is convenient.

[0031] Specifically, an insertion hole 34 is opened at the bottom of the accommodating pipe 3. A lifting block 35 is installed in the accommodating pipe 3, and the lifting block 35 closes the insertion hole 34 of the accommodating pipe 3. The lifting block 35 is connected to the bottom of the accommodating pipe 3 through a tension spring 36, and the lifting block 35 can push out the solid glue cooled in the accommodating pipe 3.

[0032] After the heated and melted fixing glue is injected into the accommodating pipe 3, the fixing glue begins to cool and solidify in the accommodating pipe 3. During this process, the lifting block 35 is still under the pulling force of the tension spring 36 and remains at the bottom of the accommodating pipe 3. At the same time, as the fixing glue gradually cools, the lifting block 35 is in close contact with the upper surface of the fixing glue, but its position does not change significantly. When the fixing glue is completely cooled and solidified, it needs to be taken out of the accommodating pipe 3. At this time, through an external operation (for example, a push rod or other tools can be used to apply a certain pressure downward from the top of the accommodating pipe 3), the pulling force of the tension spring 36 is overcome, and the lifting block 35 moves upward. During the upward movement of the lifting block 35, the cooled solid glue is pushed out of the accommodating pipe 3.

[0033] The lifting block 35 can push out the cooled solid glue from the accommodating pipe 3, which greatly facilitates the unloading operation. Compared with the traditional method of manually or using other complex tools to take out the solid glue from the accommodating pipe 3, this operation is relatively simple.

[0034] Specifically, it further includes a pushing mechanism 4. The pushing mechanism 4 includes a push rod motor 41, a push plate 42 and a plurality of ejector rods 43. The push rod is fixed on the push rod of the push rod motor 41, and the ejector rods 43 are fixed on the push plate 42 and correspond to the insertion holes 34 one by one.

[0035] After the fixing glue is cooled in the receiving tube 3, a discharging operation is required. At this time, the pushing mechanism 4 is in the initial state, the push rod motor 41 is not started, the push plate 42 and the ejector rod 43 are stationary, and the position of the ejector rod 43 corresponds to the insertion hole 34 at the bottom of the receiving tube 3, preparing for the subsequent pushing operation.

[0036] Start the push rod motor 41, and the push rod of the push rod motor 41 begins to extend. The extending movement of the push rod pushes the push plate 42 fixedly connected thereto to move forward. Since the ejector rod 43 is fixed on the push plate 42, the movement of the push plate 42 drives the ejector rod 43 to move upward synchronously. As the push plate 42 advances, the ejector rod 43 gradually inserts into the insertion hole 34 at the bottom of the receiving tube 3. After the ejector rod 43 is inserted into the insertion hole 34, it continues to move forward and contacts the lifting block 35 in the receiving tube 3. The ejector rod 43 exerts an upward thrust on the lifting block 35, overcoming the pulling force of the tension spring 36, causing the lifting block 35 to move upward. Under the push of the ejector rod 43, the cooled solid glue is pushed out of the receiving tube 3. When the solid glue is completely pushed out of the receiving tube 3, the push rod of the push rod motor 41 contracts, driving the push plate 42 and the ejector rod 43 to move backward to the initial position. At this time, the lifting block 35 also returns to the bottom of the receiving tube 3 under the action of the pulling force of the tension spring 36, and the receiving tube 3 is ready to receive the next batch of heated and melted fixing glue for the next round of cooling and forming operation.

[0037] It should be noted that the above embodiments are only used to illustrate the present application and do not limit the technical solutions described in the present application. Although this specification has described the present application in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the technical field can still modify or equivalently replace the present application. All technical solutions and their improvements that do not depart from the spirit and scope of the present application shall be covered within the scope of the claims of the present application.

Claims

1. A cooling device used in the solid glue filling process, characterized in that: include: A box body (2), the box body (2) having a cooling channel (21), and a liquid inlet (22) and a liquid outlet (23) in communication with the cooling channel (21); the box body (2) having a plate surface (24), and a mounting hole (241) in communication with the cooling channel (21) being formed on the plate surface (24); A plurality of accommodating tubes (3), the accommodating tubes (3) corresponding to the mounting holes (241) one by one, and the accommodating tubes (3) being detachably mounted at the mounting holes (241), a plurality of cooling fins (31) being fixed on the accommodating tubes (3), and the cooling fins (31) being located in the cooling channel (21).

2. The cooling device for solid glue filling according to claim 1, characterized in that: The mounting holes (241) are distributed in an array on the board surface (24).

3. The cooling device for solid glue filling according to claim 2, characterized in that: A plurality of countersunk holes (242) are arranged on the plate surface (24), the countersunk holes (242) correspond one by one to the mounting holes (241), and the mounting holes (241) are located in the middle of the bottom wall of the countersunk holes (242).

4. The cooling device for solid glue filling according to claim 3, characterized in that: A mounting portion (32) is fixed at the tube end of the accommodating tube (3), and a plurality of sealing rings (33) are arranged on the mounting portion (32). The mounting portion (32) is mounted in the counterbore (242), the mounting portion (32) abuts against the bottom wall of the counterbore (242), and the sealing ring (33) can seal the gap between the mounting portion (32) and the inner wall of the counterbore (242).

5. The cooling device for solid glue filling according to claim 1, characterized in that: An insertion hole (34) is provided at the bottom of the accommodating tube (3), a lifting block (35) is installed in the accommodating tube (3) and the lifting block (35) closes the insertion hole (34) of the accommodating tube (3), the lifting block (35) is connected to the bottom of the accommodating tube (3) via a tension spring (36), and the lifting block (35) can push out the solid glue that has been cooled in the accommodating tube (3).

6. The cooling device for solid glue filling according to claim 5, characterized in that: The invention also comprises a pushing mechanism (4), wherein the pushing mechanism (4) comprises a pushing rod motor (41), a pushing plate (42) and a plurality of push rods (43), wherein the pushing rod is fixed on the pushing rod of the pushing rod motor (41), and the push rods (43) are fixed on the pushing plate (42) and correspond one to one with the insertion holes (34).

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