Silicon wafer loading mechanism and coating equipment using same

Abstract

The utility model belongs to the technical field of coating, and particularly relates to a silicon wafer loading mechanism and coating equipment using the silicon wafer loading mechanism, the silicon wafer loading mechanism comprises a bearing plate and a bearing frame arranged on the bearing plate, the bearing frame is enclosed to form a bearing cavity, and the height of the bearing cavity corresponds to the thickness of a plurality of silicon wafers. According to the utility model, the silicon wafers are stacked on the same carrier, so that the side walls of the silicon wafers are coated, and the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the field of coating, and particularly relates to a silicon wafer loading mechanism and a coating device using the loading mechanism. Background Art

[0002] With the development of the times, scientific technology has also been rapidly improved. Nowadays, more and more scientific technologies have been discovered and gradually widely used. For example, the ion beam surface modification technology can completely change and subvert the pollution characteristics of traditional electroplating. After modification, the surface of the substrate has no oxidation, no deformation, and maintains high precision. Moreover, it hardly changes the dimensional accuracy and roughness of the modified product, and greatly improves the corrosion resistance and wear resistance. Therefore, such technology can be widely applied in many fields. However, when the existing ion coating machine coats the side walls of silicon wafers, since the side thickness of the silicon wafers is relatively thin, and the current loading carrier is suitable for single silicon wafers to be laid flat on the loading carrier, and the loading carrier enters the process chamber for coating, which greatly affects the coating efficiency of the product. Summary of the Utility Model

[0003] In order to solve the above technical problems, the utility model provides a silicon wafer loading mechanism, including

[0004] a bearing plate and a bearing frame arranged on the bearing plate, wherein,

[0005] the bearing frame encloses to form a bearing cavity, and the height of the bearing cavity corresponds to the thickness of several silicon wafers, so as to stack the silicon wafers in the bearing cavity.

[0006] Further, the cross-section of the bearing frame is L-shaped, and the bearing frame is located at the corner of the silicon wafer.

[0007] Further, a cover plate is further arranged above the bearing cavity, wherein,

[0008] the size of the cover plate is larger than the size of the bearing cavity

[0009] The utility model also provides a coating device using the loading mechanism, including a loading cavity and a process cavity which are communicated with each other, and guiding mechanisms are arranged in both the loading cavity and the process cavity, wherein,

[0010] the guiding mechanism is suitable for conveying the loading mechanism from the loading cavity to the process cavity.

[0011] Further, vacuum pumps are connected to the bottoms of both the loading cavity and the process cavity, wherein,

[0012] the vacuum pumps are suitable for evacuating the gas in the loading cavity and the process cavity.

[0013] Furthermore, the guide mechanism includes a roller group arranged in the loading chamber and the process chamber, wherein:

[0014] The roller group includes a plurality of rollers and drive motors respectively arranged on one side of the loading chamber and the process chamber. The plurality of rollers are connected to each other through a belt 1 transmission, and one of the rollers is connected to the output end of the drive motor through a belt 2 transmission.

[0015] Furthermore, coating mechanisms are provided on both sides of the process chamber.

[0016] Furthermore, a cylinder is provided on one side of the process chamber, an end cover is hinged on the upper part of the process chamber, a pull rod is hinged on one side of the end cover, and one end of the pull rod is hingedly connected to the push plate, wherein:

[0017] The piston rod of the cylinder is fixedly connected to the push plate to drive the push rod to move linearly.

[0018] The beneficial effect of the utility model is that the utility model performs side wall coating on the silicon wafers by stacking the silicon wafers on the same carrier, thereby greatly improving the working efficiency.

[0019] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of a loading mechanism of a preferred embodiment of the utility model;

[0023] Figure 2 It is a first schematic diagram of the internal structure of the coating equipment of the preferred embodiment of the utility model;

[0024] Figure 3 It is the second schematic diagram of the internal structure of the coating equipment of the preferred embodiment of the utility model.

[0025] In the figure: 100, carrier plate; 110, carrier frame; 120, cover plate.

[0026] 200, loading cavity; 210, process cavity; 220, guiding mechanism; 221, vacuum pump; 222, roller; 223, driving motor; 224, belt 1; 225, belt 2; 230, end cap. Specific embodiments

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope of protection of the present utility model.

[0028] Embodiment 1, as Figure 1 shown, a wafer loading mechanism of this embodiment includes a carrier plate 100 and a carrier frame 110 disposed on the carrier plate 100. Among them, the carrier frame 110 encloses to form a loading cavity, and the height of the loading cavity corresponds to the thickness of a plurality of wafers, so as to stack the wafers in the loading cavity. In the prior art, when side coating of wafers is required, a single wafer is placed in the loading mechanism and enters the coating equipment to coat the side walls of the wafer. Adopting the above solution will greatly reduce the coating efficiency. In some embodiments, a stacked loading mechanism is adopted to stack the wafers together for overall side wall coating, which greatly improves the coating efficiency. A plurality of loading cavities can be placed on the carrier plate 100 to improve the coating efficiency.

[0029] Specifically, the cross-section of the carrier frame 110 is L-shaped, and the carrier frame 110 is located at the corner of the wafer. The wafer is rectangular, and the two sides of the carrier frame 110 are arranged at 90°, so as to clamp the two sides at the corner of the wafer.

[0030] A cover plate 120 is further disposed above the loading cavity. Among them, the size of the cover plate 120 is larger than the size of the loading cavity. The cover plate 120 is suitable for covering the wafers to prevent the wafers from being displaced in the coating equipment and causing damage to the wafers. The side walls of the cover plate 120 will not block the wafers in the loading mechanism, so that the wafers can be coated on the side.

[0031] In some embodiments, a coating device of the above-mentioned loading mechanism is further provided, comprising a loading chamber 200 and a process chamber 210 which are interconnected, wherein a guide mechanism 220 is disposed in each of the loading chamber 200 and the process chamber 210, wherein the guide mechanism 220 is suitable for transporting the loading mechanism from the loading chamber 200 to the process chamber 210. The loading chamber 200 is suitable for transporting the loading mechanism loaded with silicon wafers to the process chamber 210 for coating.

[0032] The bottom of the loading chamber 200 and the process chamber 210 are both connected to a vacuum pump 221, wherein the vacuum pump 221 is suitable for evacuating the gas in the loading chamber 200 and the process chamber 210. Under vacuum conditions, the atoms and molecules of the evaporated material can fly freely without being hit by air molecules, thereby improving the uniformity and quality of the film. Moreover, the vacuum environment helps to maintain the stability of the coating process and avoid the intrusion of external contaminants, thereby ensuring the purity and adhesion of the film.

[0033] In order to enable the loading mechanism to move in the coating equipment, the guide mechanism 220 includes a group of rollers 222 arranged in the loading chamber 200 and the process chamber 210, wherein the group of rollers 222 includes a plurality of rollers 222 and a driving motor 223 respectively arranged on one side of the loading chamber 200 and the process chamber 210, and the plurality of rollers 222 are connected to each other through a belt 1 224, and one of the rollers 222 is connected to the output end of the driving motor 223 through a belt 2 225.

[0034] In order to achieve film coating, film coating mechanisms are disposed on both sides of the process chamber 210 .

[0035] A cylinder is also provided on one side of the process chamber 210, an end cover 230 is hinged on the upper part of the process chamber 210, a pull rod is hinged on one side of the end cover 230, one end of the pull rod is hingedly connected to a push plate, wherein the piston rod of the cylinder is fixedly connected to the push plate to drive the push rod to move linearly. The cylinder pushes the push plate to move linearly, and the push plate pulls the pull rod, so that the pull rod opens the end cover 230.

[0036] All devices (parts without specific structure) selected in this application are universal standard parts or parts known to those skilled in the art, and their structures and principles can be known by those skilled in the art through technical manuals or conventional experimental methods. In addition, the software programs involved in this application are all prior art, and this application does not involve any improvement to the software programs.

[0037] In the description of the embodiments of the present utility model, unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model may be understood according to specific circumstances.

[0038] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0039] In several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some communication interfaces. The indirect coupling or communication connection of the devices or units may be in an electrical, mechanical, or other form.

[0040] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0041] In addition, in each embodiment of the present utility model, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0042] Based on the above-mentioned ideal embodiments of the present utility model as an inspiration, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present utility model. The technical scope of the present utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer loading mechanism, characterized in that: include: A carrying plate and a carrying frame arranged on the carrying plate, wherein: The carrying frame encloses a carrying cavity, and the height of the carrying cavity corresponds to the thickness of a plurality of silicon wafers, so as to facilitate stacking the silicon wafers in the carrying cavity; The cross section of the carrying frame is L-shaped. The carrying frame is located at the corner of the silicon wafer; A cover plate is also provided above the bearing cavity, wherein: The size of the cover plate is larger than the size of the bearing cavity.

2. A coating device using the loading mechanism as claimed in claim 1, characterized in that: It comprises a loading chamber and a process chamber which are interconnected, wherein a guide mechanism is arranged in each of the loading chamber and the process chamber, wherein: The guide mechanism is adapted to transport the loading mechanism from the loading chamber to the process chamber.

3. A coating device as claimed in claim 2, characterized in that: The bottom of the loading chamber and the process chamber are both connected to a vacuum pump, wherein: The vacuum pump is adapted to evacuate the gas in the loading chamber and the process chamber.

4. A coating device as claimed in claim 2, characterized in that: The guide mechanism includes a roller group arranged in the loading chamber and the process chamber, wherein: The roller group includes a plurality of rollers and drive motors respectively arranged on one side of the loading chamber and the process chamber. The plurality of rollers are connected to each other through a belt 1 transmission, and one of the rollers is connected to the output end of the drive motor through a belt 2 transmission.

5. A coating device as claimed in claim 2, characterized in that: Coating mechanisms are arranged on both sides of the process chamber.

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