Coating equipment

Abstract

The utility model relates to coating equipment which comprises a graphite boat, a shielding assembly and a moving assembly, the graphite boat comprises a plurality of boat pieces, the boat pieces are parallel to one another and arranged at intervals, each boat piece is provided with a plurality of hollowed-out grooves, the shielding assembly comprises a cover plate and a plurality of partition plates, and the partition plates are parallel to one another, arranged at intervals and connected with the cover plate; the moving assembly is used for driving the cover plate and the graphite boat to move relatively, so that the cover plate can drive the multiple partition plates to move to cover the front faces of the multiple boat pieces and can drive the multiple partition plates to move to cover the back faces of the multiple boat pieces. According to the coating equipment, double-sided coating of the silicon wafer can be achieved without transferring the silicon wafer, the coating efficiency is improved, meanwhile, the risk that the silicon wafer is broken is reduced, the contact area of the special gas flow and the surface of the silicon wafer can be increased through the hollowed-out groove of the boat piece, the thin film deposition rate is increased, the passivation effect is improved, and therefore the coating quality is improved.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell manufacturing, and particularly to a coating device. Background Art

[0002] The solar photovoltaic industry has developed rapidly and its scale has been continuously growing. In order to achieve a larger market share, manufacturers in each supporting link are striving to pursue and improve the conversion efficiency and reduce the production cost.

[0003] In the production process of silicon wafer coating, a graphite boat is generally used as a carrier device to realize the coating process of a batch of silicon wafers.

[0004] However, in the related art, the processes of coating the front and back sides of the silicon wafer are carried out separately. After coating one side of the silicon wafer, it is necessary to use a flower basket to transfer it to another device for coating the other side of the silicon wafer. This coating process takes a long time and requires a large amount of manpower, material resources and financial resources, and the time cost is relatively high. Moreover, the coating quality under this coating method is not good. For example, during the transfer of the silicon wafer, the risk of silicon wafer breakage will increase; during the coating process, the contact area between the special gas flow rate and the surface of the silicon wafer decreases, slowing down the film deposition efficiency and affecting the passivation effect. Summary of the Invention

[0005] Based on this, a coating device is provided to solve the technical problem of how to improve the coating efficiency while improving the coating quality.

[0006] The present application provides a coating device, including:

[0007] A graphite boat, the graphite boat includes a plurality of boat plates, the plurality of boat plates are parallel and spaced from each other, and the boat plates are provided with a plurality of hollow grooves for loading silicon wafers, so that the front and back sides of the silicon wafers are respectively exposed on both sides of the boat plates;

[0008] A shielding assembly, the shielding assembly includes a cover plate and a plurality of partition plates, the plurality of partition plates are parallel and spaced from each other, and are all connected to the cover plate;

[0009] A moving assembly, the moving assembly is used to drive the cover plate to move relative to the graphite boat, so that the cover plate can drive the plurality of partition plates to move to cover the front sides of the plurality of boat plates, and can drive the plurality of partition plates to move to cover the back sides of the plurality of boat plates.

[0010] In one embodiment, a plurality of clamping points located at the edges of the hollow grooves are provided on the boat plates, and the clamping points are used to position the silicon wafers in the hollow grooves.

[0011] In one embodiment, the hollow groove is rectangular, having a top edge and a bottom edge opposite to each other up and down, and two side edges located between the top edge and the bottom edge. The clamping points on the boat piece are located on the bottom edge and the two side edges.

[0012] In one embodiment, the boat piece is provided with a stepped groove corresponding to at least one side edge of the hollow groove, so as to form a retaining wall on the side close to the back surface of the boat piece. The stepped groove is used to receive the edge of the silicon wafer, so that the edge of the silicon wafer abuts against the retaining wall.

[0013] In one embodiment, limiting protrusions are provided on the partition board and / or the front surface of the boat piece. When the partition board covers the front surface of the boat piece, the limiting protrusions are clamped between the front surface of the boat piece and the partition board, so that the partition board is kept at a distance from the silicon wafer located in the hollow groove.

[0014] In one embodiment, the limiting protrusion is annular. When the partition board covers the front surface of the boat piece, the limiting protrusion surrounds the four sides of the hollow groove and forms a closed cavity between the boat piece and the partition board. The closed cavity is used to shield the side of the silicon wafer located in the hollow groove facing the partition board.

[0015] In one embodiment, the cover plate is detachably connected to a plurality of the partition boards, and the plurality of partition boards are all perpendicular to the cover plate.

[0016] In one embodiment, the moving assembly includes a translation mechanism and a lifting mechanism. The translation mechanism is used to drive the cover plate to move horizontally relative to the graphite boat, and the lifting mechanism is used to drive the cover plate or the graphite boat to move up and down, so that the cover plate drives a plurality of partition boards to be inserted into or withdrawn from the spaces between the boat pieces.

[0017] In one embodiment, the translation mechanism includes a first roller, a second roller and a belt. The belt is connected between the first roller and the second roller and is used to drive the cover plate to move horizontally; and / or, the lifting mechanism includes a worm drive assembly and a robotic arm. The worm drive assembly is connected to the robotic arm and is used to drive the robotic arm to move up and down. The robotic arm has a hook, and the cover plate has a buckle groove for cooperating with the hook.

[0018] In one embodiment, the ratio of the hollow area of the hollow groove to the area of the boat piece is greater than or equal to 90%.

[0019] The coating equipment of the present application includes a graphite boat, a shielding component, and a moving component. The boat slices of the graphite boat are provided with hollow grooves to load silicon wafers, so that the front and back sides of the silicon wafers are respectively exposed on both sides of the boat slices. The shielding component includes a cover plate and a plurality of partition plates arranged in parallel at intervals. The moving component is used to drive the cover plate to move relative to the graphite boat, so that the partition plates can shield the front side of the silicon wafers loaded on the graphite boat and the back side of the silicon wafers, so that after one side of the silicon wafer is coated, it is not necessary to use a flower basket to transfer to another equipment to coat the other side of the silicon wafer, improving the coating efficiency. Thus, the boat slices adopt hollow grooves to load silicon wafers, so that the positions of the silicon wafers corresponding to the hollow grooves do not contact the graphite boat, increasing the contact area between the special gas flow and the surface of the silicon wafers, thereby increasing the film deposition rate, and the film color at the center position of the silicon wafer is more uniform, improving the passivation effect. In this way, the recombination of minority carriers can be reduced, the carrier lifetime can be increased, and the coating quality can be improved accordingly. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 FIG. 9 is a three-dimensional structural schematic diagram of the graphite boat of the coating equipment according to an embodiment of the present application.

[0022] Figure 2 FIG. 13 is a front view schematic diagram of the boat slice of the graphite boat of the coating equipment according to an embodiment of the present application.

[0023] Figure 3 FIG. 17 is a structural schematic diagram when the shielding component of the coating equipment according to an embodiment of the present application shields the back side of the graphite boat.

[0024] Figure 4 FIG. 21 is a structural schematic diagram when the shielding component of the coating equipment according to an embodiment of the present application shields the front side of the graphite boat.

[0025] Figure 5 FIG. 25 is a structural schematic diagram when the moving component moves the shielding component to shield the back side of the boat slice in the coating equipment according to an embodiment of the present application.

[0026] Figure 6 FIG. 29 is a structural schematic diagram when the moving component of the coating equipment according to an embodiment of the present application pulls out the partition plate of the shielding component from the interval between the boat slices.

[0027] Figure 7In the coating device according to an embodiment of the present application, the following is a schematic structural view when the partition of the shielding component is moved by the translation component of the moving component to be aligned with the front surface of the corresponding boat

[0028] Figure 8 In the coating device according to an embodiment of the present application, the following is a schematic structural view when the moving component moves the shielding component to shield the front surface of the boat

[0029] Explanation of reference numerals:

[0030] 10. Graphite boat; 10a. Silicon wafer; 11. Boat; 12. Hollow groove; 13. Card point; 14. Step groove; 14a. Baffle wall; 20. Shielding component; 21. Cover plate; 21a. Buckling groove; 22. Partition; 23. Limit protrusion; 23a. Closed cavity; 30. Moving component; 31. Translation mechanism; 311. First roller; 312. Second roller; 313. Belt; 32. Lifting mechanism; 321. Worm drive assembly; 322. Robot arm; 322a. Hook. Detailed implementation manners

[0031] To make the above objects, features, and advantages of the present application more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0033] The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions are for illustrative purposes only and do not represent the only implementation manner.

[0034] It should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present application.

[0035] In an embodiment of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] Combined with Figures 1 to 5 As shown, an embodiment of the present application provides a coating device, including a graphite boat 10, a shielding component 20, and a moving component 30. The graphite boat 10 includes a plurality of boat plates 11, and the plurality of boat plates 11 are parallel to each other and arranged at intervals. The boat plates 11 are provided with a plurality of hollow slots 12, and the hollow slots 12 are used to load silicon wafers 10a so that the front and back surfaces of the silicon wafers 10a are respectively exposed on both sides of the boat plates 11. The shielding component 20 includes a cover plate 21 and a plurality of partition plates 22, and the plurality of partition plates 22 are parallel to each other and arranged at intervals, and are all connected to the cover plate 21. The moving component 30 is used to drive the cover plate 21 to move relative to the graphite boat 10, so that the cover plate 21 can drive the plurality of partition plates 22 to move to cover the front surfaces of the plurality of boat plates 11, and can drive the plurality of partition plates 22 to move to cover the back surfaces of the plurality of boat plates 11.

[0037] In this embodiment, the boat plates 11 of the graphite boat 10 are provided with hollow slots 12 to load the silicon wafers 10a, so that the front and back surfaces of the silicon wafers 10a are respectively exposed on both sides of the boat plates 11. During coating, the positions of the silicon wafers 10a corresponding to the hollow slots 12 will not contact the graphite boat 10, increasing the area of contact between the special gas flow and the surface of the silicon wafers 10a, thereby increasing the film deposition rate. The film color at the central position of the silicon wafers 10a is more uniform, reducing the refractive index and improving the passivation effect. In this way, the recombination of minority carriers can be reduced, the carrier lifetime can be increased, and the coating quality can be improved.

[0038] Since the moving component 30 drives the cover plate 21 to move relative to the graphite boat 10, the cover plate 21 can drive the plurality of partition plates 22 to move to cover the front surfaces of the plurality of boat plates 11, and can drive the plurality of partition plates 22 to move to cover the back surfaces of the plurality of boat plates 11. Thus, when the front surface of the silicon wafer 10a needs to be coated, the back surface of the silicon wafer 10a can be shielded by using the partition plates 22 to cover the back surface of the boat plate 11; after the front surface coating is completed, the moving component 30 can be used to drive the cover plate 21 to move relative to the graphite boat 10, so that the partition plates 22 cover the front surface of the boat plate 11 to shield the front surface of the silicon wafer 10a, in order to coat the back surface of the silicon wafer 10a. Since in this process, there is no need to use a traditional technique to transfer the silicon wafer 10a to another device by a carrier basket to coat the other side of the silicon wafer 10a after coating one side of the silicon wafer 10a, the coating efficiency can be improved.

[0039] It should be noted that the coating process usually includes a heating step. In the related art, the time for coating the back of the silicon wafer 10a is about fifteen minutes, and the cumulative time from the heating process to the end of cooling is more than forty-five minutes; the time for coating the front of the silicon wafer 10a is about eleven minutes, and the time from heating to the process to the next cooling cycle is more than fifty minutes. When the coating equipment of the present application is used for coating, since the shielding component 20 can be used to shield the front of the silicon wafer 10a, the shielding component 20 can also be used to shield the back of the silicon wafer 10a. When the coating equipment of the present application is used for coating, after completing the coating of one side, it is only necessary to move the cover plate 21 so that the cover plate 21 shields the coated side, and the uncoated side of the silicon wafer 10a can be coated. In this way, during the coating process, the heat retained by the previous step of coating can be used in the process of coating another layer of film. Therefore, when the coating equipment of the present application is used for coating, the high-temperature process time can be shortened, and the flow rate of special gas can also be saved.

[0040] The portion of the surface of the silicon wafer 10a exposed to the boat 11 is the coating area, therefore, the larger the area of ​​the portion of the silicon wafer 10a exposed to the boat 11, the larger the area of ​​the coating area, and the higher the photoelectric conversion efficiency. In some embodiments, the hollow area of ​​the hollow groove 12 accounts for greater than or equal to 90% of the area of ​​the boat 11, so as to increase the hollow area of ​​the hollow groove 12 as much as possible while maintaining the overall volume of the boat 11 to ensure the coating area of ​​the silicon wafer 10a.

[0041] In some embodiments, the coating equipment includes a quartz furnace tube and a push boat system. When coating, the furnace door of the quartz furnace tube is opened, and the graphite boat 10 loaded with the silicon wafer 10a is sent into the quartz furnace tube by the push boat system. Special gases such as silane and ammonia are input into the quartz furnace tube, so that the special gases react with the silicon wafer 10a disposed in the hollow groove 12 to form a silicon nitride film.

[0042] There is no limitation on the number of boats 11 of the graphite boat 10 and the number of hollow slots 12 on each boat 11. For example, in some embodiments, the graphite boat 10 includes 25 boats 11, and each boat 11 is provided with 7 hollow slots 12. Each hollow slot 12 can carry one silicon wafer 10a, so one graphite boat 10 can carry 175 silicon wafers 10a.

[0043] The size of the silicon wafer 10a of the graphite boat 10 and the size of the hollow groove 12 can be set according to actual needs. Figure 1As shown, taking the case where the boat plates 11 of the graphite boat 10 are vertically placed as an example, a rectangular coordinate system X - Y - Z is established. The dimension of the graphite boat 10 in the X direction is the length, the dimension in the Y direction is the width, and the dimension in the Z direction is the height. In some embodiments, the length of the graphite boat 10 is 1395 mm, the width is 362 mm, and the height is 195 mm. The dimension of the boat plate 11 in the length direction defines the length of the graphite boat 10, the distance between the opposite surfaces of the two outermost boat plates 11 defines the width of the graphite boat 10, and the dimension of the boat plate 11 in the height direction defines the height of the graphite boat 10. Understandably, the size of the hollow groove 12 is just enough to place the silicon wafer 10a for producing solar cells. In some embodiments, the length of the hollow groove 12 is 150 mm, the depth is 15 mm, and the height is 150 mm.

[0044] Combined with Figure 3 and Figure 4 As shown, a plurality of clamping points 13 are provided on the boat plate 11 at the edge of the hollow groove 12. The clamping points 13 are used to position the silicon wafer 10a in the hollow groove 12. In this embodiment, by using the clamping points 13 to position the silicon wafer 10a, the silicon wafer 10a can be prevented from falling off the hollow groove 12. When placing the silicon wafer 10a, the edge of the silicon wafer 10a can be first inserted between the clamping point 13 and the side wall of the hollow groove 12, and then the silicon wafer 10a is moved into the hollow groove 12. Finally, the silicon wafer 10a is completely loaded into the hollow groove 12 and stably positioned in the hollow groove 12 under the limitation of the clamping points 13.

[0045] For the sake of easy understanding, the position of the clamping point 13 will be described below in combination with the shape of the hollow groove 12. However, the clamping point 13 is not limited thereto, as long as the clamping point 13 can position the silicon wafer 10a in the hollow groove 12.

[0046] The hollow groove 12 is rectangular. The hollow groove 12 has a top edge and a bottom edge that are opposite to each other up and down, and two side edges located between the top edge and the bottom edge. Understandably, the top edge and the bottom edge of the hollow groove 12 respectively refer to when using the coating equipment for coating, the silicon wafers 10a loaded in the hollow groove 12 are vertically placed. That is to say, at this time, a plurality of boat plates 11 of the graphite boat 10 are all vertically arranged. In this way, when loading the silicon wafers 10a into the hollow grooves 12 on the boat plates 11, these silicon wafers 10a are all vertically placed. The upper edge of the hollow groove 12 is the top edge, and the lower edge of the hollow groove 12 is the bottom edge. Correspondingly, the edges on both sides of the hollow groove 12 are the side edges.

[0047] The clamping points 13 on the boat piece 11 are located on the bottom edge and the two side edges. In this way, when the silicon wafer 10a is placed, one side edge of the silicon wafer 10a can be inserted between the clamping points 13 on the two side edges and the side wall of the hollow groove 12, and then the silicon wafer 10a is moved towards the bottom edge of the hollow groove 12. Finally, the edge of the silicon wafer 10a corresponding to the bottom edge is clamped between the clamping points 13 on the bottom edge and the side wall of the hollow groove 12, so that the silicon wafer 10a can be restricted from falling off the hollow groove 12 by the clamping points 13 on the bottom edge and the clamping points 13 on the two side edges.

[0048] Continuing to combine Figure 3 and Figure 4 As shown, at least one side edge of the boat piece 11 corresponding to the hollow groove 12 is provided with a step groove 14 to form a retaining wall 14a on the side close to the back surface of the boat piece 11. The step groove 14 is used to receive the edge of the silicon wafer 10a so that the edge of the silicon wafer 10a abuts against the retaining wall 14a. Through this structural arrangement, the retaining wall 14a formed by the step groove 14 can be used to limit the edge of the silicon wafer 10a, which is beneficial to improving the stability of the silicon wafer 10a in the hollow groove 12.

[0049] Regarding the placement and positioning methods of the silicon wafer 10a in the hollow groove 12, no limitations are made here. As long as the silicon wafer 10a is placed in the hollow groove 12 and the front and back surfaces of the silicon wafer 10a are respectively exposed from both sides of the boat piece 11 to meet the requirements of coating. In some embodiments, the silicon wafer 10a can also be positioned in the hollow groove 12 by positioning bars corresponding to the front and back surfaces of the silicon wafer 10a respectively. When installing the silicon wafer 10a, the silicon wafer 10a can be first placed in the hollow groove 12, and then the positioning bars are respectively abutted against the edge positions of the front and back surfaces of the silicon wafer 10a corresponding to the hollow groove 12. The positioning bars can be fixed to the edge of the hollow groove 12 by means of clamping or plugging, etc. In this way, the positioning of the silicon wafer 10a can be achieved by using the positioning bars to prevent the silicon wafer 10a from falling off the hollow groove 12.

[0050] In some embodiments, the partition plate 22 is provided with a limiting protrusion 23. When the partition plate 22 covers the front surface of the boat piece 11, the limiting protrusion 23 is clamped between the front surface of the boat piece 11 and the partition plate 22, so that the partition plate 22 is spaced from the silicon wafer 10a located in the hollow groove 12. In this way, it can be ensured that the partition plate 22 does not contact the silicon wafer 10a in the hollow groove 12. Thus, when the moving assembly 30 drives the cover plate 21 to move relative to the graphite boat 10 so that the cover plate 21 drives a plurality of partition plates 22 to move, the partition plate 22 will not rub against the silicon wafer 10a, thereby reducing the probability of the silicon wafer 10a being worn.

[0051] It should be noted that the limiting protrusion 23 can also be arranged on the front surface of the boat piece 11. In this way, when the partition plate 22 contacts the front surface of the boat piece 11, the limiting protrusion 23 can also be clamped between the front surface of the boat piece 11 and the partition plate 22, so as to achieve the effect of keeping the partition plate 22 and the silicon wafer 10a in the hollow groove 12 at a distance, preventing the partition plate 22 from contacting the silicon wafer 10a and generating friction with the silicon wafer 10a during the movement of the partition plate 22.

[0052] Furthermore, in combination with Figure 4As shown, the limiting protrusion 23 is annular. When the partition plate 22 covers the front surface of the boat piece 11, the limiting protrusion 23 surrounds the periphery of the hollow groove 12 and forms a closed cavity 23a between the boat piece 11 and the partition plate 22. The closed cavity 23a is used to shield the surface of the silicon wafer 10a located in the hollow groove 12 facing the partition plate 22. Specifically, since the limiting protrusion 23 is annular, when the partition plate 22 covers the front surface of the boat piece 11, the front surface of the boat piece 11 abuts against the annular limiting protrusion 23, so that the space surrounded by the limiting protrusion 23 will form a closed cavity 23a between the boat piece 11 and the partition plate 22. It can be understood that since the limiting protrusion 23 surrounds the periphery of the hollow groove 12, the closed cavity 23a communicates with the hollow groove 12, and then the closed cavity 23a can be used to shield the surface of the silicon wafer 10a located in the hollow groove 12 facing the partition plate 22. The advantage of this structural design is that when coating the surface of the silicon wafer 10a in the hollow groove 12 facing away from the partition plate 22, the closed cavity 23a shields the surface of the silicon wafer 10a facing the partition plate 22, thus preventing the coating material from entering the surface of the silicon wafer 10a facing the partition plate 22 from the surface of the silicon wafer 10a facing away from the partition plate 22, and then realizing that the coating of the two sides of the silicon wafer 10a does not interfere with each other. In some embodiments, the cover plate 21 is detachably connected to a plurality of partition plates 22, and the plurality of partition plates 22 are all perpendicular to the cover plate 21. Since the cover plate 21 and the partition plate 22 are detachably connected, the installation position of the partition plate 22 relative to the cover plate 21 can be adjusted according to actual needs, so that the cover plate 21 can drive the partition plate 22 to cover the front surface of the boat piece 11 or drive the partition plate 22 to cover the back surface of the boat piece 11 under the drive of the moving assembly 30. It should be noted here that for the graphite boat 10, the installation positions of the plurality of boat pieces 11 can be fixed. For example, the plurality of boat pieces 11 are arranged at equal intervals with a preset distance. In this way, the intervals between the partition plates 22 are the same as the intervals between the boat pieces 11, so that the installation position of the partition plate 22 relative to the cover plate 21 can be fixed without adjustment. For graphite boats 10 of different specifications, the boat pieces 11 may be arranged at equal intervals with other preset distances. At this time, the detachable connection between the partition plate 22 and the cover plate 21 can be used to install the partition plate 22 relative to the cover plate 21 at a suitable position, so that the cover plate 21 can drive the partition plate 22 to cover the front surface of the boat piece 11 or cover the back surface of the boat piece 11 under the movement of the moving assembly 30. Therefore, the detachable connection between the partition plate 22 and the cover plate 21 is beneficial to improving the adaptability of the shielding assembly 20, so that the shielding assembly 20 can meet the shielding requirements of the silicon wafers 10a loaded in different specifications of graphite boats 10, thereby further reducing the coating cost.

[0053] In this embodiment, the detachable connection manner between the partition plate 22 and the cover plate 21 includes, but is not limited to, snap connection or plug connection.

[0054] Combined with Figure 5And Figure 6 As shown in Figure 6 , the moving component 30 includes a translation mechanism 31 and a lifting mechanism 32. The translation mechanism 31 is used to drive the cover plate 21 to move horizontally relative to the graphite boat 10, and the lifting mechanism 32 is used to drive the cover plate 21 or the graphite boat 10 to move up and down, so that the cover plate 21 drives a plurality of partition plates 22 to be inserted into or withdrawn from the spaces between the boat plates 11. Both the translation mechanism 31 and the lifting mechanism 32 can be implemented by a PLC (programmable logic controller) to achieve automatic control, which is beneficial to realizing the automatic coating of the coating equipment.

[0055] The translation mechanism 31 includes a first roller 311, a second roller 312 and a belt 313. The belt 313 is connected between the first roller 311 and the second roller 312 and is used to drive the cover plate 21 to move horizontally. In this embodiment, the belt 313 is used to drive the cover plate 21 to move horizontally, so that a plurality of partition plates 22 on the cover plate 21 move horizontally together, so that the partition plates 22 can be abutted against the front surface of the boat plate 11 or the back surface of the boat plate 11. In this way, the partition plate 22 can be used to shield the front surface of the silicon wafer 10a loaded in the hollow groove 12 of the boat plate 11 to meet the need of coating the back surface of the silicon wafer 10a. After the coating is completed, the partition plate 22 can be used to shield the back surface of the silicon wafer 10a to meet the need of coating the front surface of the silicon wafer 10a. This structure has simple control and can realize double-sided coating of the silicon wafer 10a without transferring the silicon wafer 10a, improving the coating efficiency. The power source for driving the belt 313 can come from a motor (not shown in the figure) connected to the first roller 311 or the second roller 312. By driving the corresponding first roller 311 or the second roller 312 to rotate with the motor, the movement of the belt 313 can be realized.

[0056] The lifting mechanism 32 includes a worm drive assembly 321 and a robotic arm 322. The worm drive assembly 321 is connected to the robotic arm 322 and is used to drive the robotic arm 322 to move up and down. The robotic arm 322 has a hook 322a, and the cover plate 21 has a buckle groove 21a for cooperating with the hook 322a. In this way, the robotic arm 322 can easily cooperate with the buckle groove 21a by using its hook 322a to pick up the cover plate 21; and when the robotic arm 322 drives the cover plate 21 to move, the cover plate 21 is not easily detached from the robotic arm 322.

[0057] It should be noted that the lifting mechanism 32 can be connected to the belt 313, so that the belt 313 can drive the lifting mechanism 32 to move horizontally. In this way, the belt 313 and the lifting mechanism 32 can be used to realize horizontal movement and lifting movement, so that the shielding assembly 20 can move horizontally and can also be lifted, so as to cover the front surface of the boat piece 11 and can also be moved to cover the back surface of the boat piece 11. In some embodiments, the lifting mechanism 32 may not be connected to the translation mechanism 31. For example, the lifting mechanism 32 is used to drive the graphite boat 10 to move up and down. In this way, the relative movement between the graphite boat 10 and the shielding assembly 20 in the vertical direction can also be realized. The structures of the lifting mechanism 32 and the translation mechanism 31 are not limited herein.

[0058] As shown in Figure 5 When coating the front surface of the silicon wafer 10a, the moving assembly 30 can be used to move the cover plate 21, so that the plurality of partition plates 22 on the cover plate 21 respectively cover the back surface of the boat piece 11 loaded with the silicon wafer 10a, so as to prevent the back surface of the silicon wafer 10a from being interfered during the coating process of the front surface of the silicon wafer 10a. As shown in Figure 6 and Figure 7 After the coating of the front surface of the silicon wafer 10a is completed, the lifting mechanism 32 is used to drive the cover plate 21 and the graphite boat 10 to move relative to each other in the vertical direction, and the plurality of partition plates 22 are lifted out of the gaps between the boat pieces 11 of the graphite boat 10. Then, the translation mechanism 31 is used to drive the cover plate 21 to move horizontally, so that the cover plate 21 drives the plurality of partition plates 22 to move horizontally to a position substantially aligned with the front surface of the boat piece 11. Preferably, there is a certain gap between the partition plate 22 and the front surface of the boat piece 11 to prevent scratching between the two during the downward movement of the partition plate 22 relative to the boat piece 11. Such scratching includes, but is not limited to, scratching between the limiting protrusion 23 provided on the partition plate 22 and the clamping point 13 provided on the boat piece 11. As shown in Figure 8 When the partition plate 22 is moved to be substantially aligned with the front surface of the boat piece 11, the lifting mechanism 32 is used to drive the cover plate 21 and the graphite boat 10 to move relative to each other in the vertical direction, so that the plurality of partition plates 22 respectively cover the front surface of the boat piece 11. If the closed cavity 23a has not been formed between the limiting protrusion 23 of the partition plate 22 and the boat piece 11 at this time, the translation mechanism 31 can be used to drive the cover plate 21 to move horizontally again to finely adjust the horizontal relative position between the partition plate 22 and the boat piece 11, so that the limiting protrusion 23 is clamped between the partition plate 22 and the boat piece 11 to form a closed cavity 23a to shield the front surface of the silicon wafer 10a. Thus, when coating the back surface of the silicon wafer 10a loaded in the hollow groove 12 of the boat piece 11, the front surface of the silicon wafer 10a will not be interfered.

[0059] In some embodiments, the clamping point 13 is completely located within the hollow groove 12, that is, the clamping point 13 does not protrude from the front surface of the boat 11. Subsequently, when the partition 22 and the boat 11 move relative to each other in the vertical direction, the clamping point 13 will not scrape other components. Therefore, after the front surfaces of the partition 22 and the boat 11 are aligned, the two can be driven to move relative to each other in the vertical direction. In this application, the alignment of the front surfaces of the partition 22 and the boat 11 means that the distance between them is the thickness of the limiting protrusion 23. That is to say, in this case, when the front surfaces of the partition 22 and the boat 11 face each other, the limiting protrusion 23 is clamped between the partition 22 and the boat 11 to form a closed cavity 23a.

[0060] The setting position of the clamping point 13 and the setting position of the limiting protrusion 23 are not limited herein. Correspondingly, the process of the moving assembly 30 driving the cover plate 21 to drive a plurality of partitions 22 to cover the front or back surface of the boat 11 is not limited herein.

[0061] It should be noted that, in some embodiments, the front surface of the silicon wafer 10a can be coated first, and then the back surface of the silicon wafer 10a can be coated. Or the back surface of the silicon wafer 10a can be coated first, and then the front surface of the silicon wafer 10a can be coated.

[0062] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combinations of these technical features do not conflict, they should be considered to be within the scope described in this specification.

[0063] The above embodiments only represent several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be construed as a limitation on the patent scope of this application. It should be pointed out that for those of ordinary skill in the art, without departing from the inventive concept of this application, several deformations and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application should be subject to the appended claims.

Claims

1. A coating device, characterized in that: include: A graphite boat (10), the graphite boat (10) comprising a plurality of boat plates (11), the plurality of boat plates (11) being arranged parallel to each other and spaced apart, the boat plates (11) being provided with a plurality of hollow grooves (12), the hollow grooves (12) being used to load silicon wafers (10a), so that the front side and the back side of the silicon wafer (10a) are respectively exposed on two sides of the boat plate (11); A shielding assembly (20), the shielding assembly (20) comprising a cover plate (21) and a plurality of partition plates (22), the plurality of partition plates (22) being arranged parallel to each other and spaced apart, and all connected to the cover plate (21); A moving component (30) is used to drive the cover plate (21) and the graphite boat (10) to move relative to each other, so that the cover plate (21) can drive the plurality of baffles (22) to move to cover the front side of the plurality of boat sheets (11), and can drive the plurality of baffles (22) to move to cover the back side of the plurality of boat sheets (11).

2. The coating device according to claim 1, characterized in that: The boat (11) is provided with a plurality of clamping points (13) located at the edge of the hollow groove (12), and the clamping points (13) are used to position the silicon wafer (10a) in the hollow groove (12).

3. The coating device according to claim 2, characterized in that: The hollow groove (12) is rectangular, having a top edge and a bottom edge that are opposite to each other, and two side edges located between the top edge and the bottom edge, and the clamping point (13) on the boat piece (11) is located on the bottom edge and the two side edges.

4. The coating device according to claim 1, characterized in that: A step groove (14) is provided on at least one side edge of the boat sheet (11) corresponding to the hollow groove (12) to form a retaining wall (14a) on the side close to the back side of the boat sheet (11); the step groove (14) is used to accommodate the edge of the silicon sheet (10a) so that the edge of the silicon sheet (10a) abuts against the retaining wall (14a).

5. The coating device according to claim 4, characterized in that: A limiting protrusion (23) is provided on the partition (22) and / or on the front surface of the boat sheet (11); when the partition (22) covers the front surface of the boat sheet (11), the limiting protrusion (23) is sandwiched between the front surface of the boat sheet (11) and the partition (22), so that the partition (22) and the silicon sheet (10a) located in the hollow groove (12) are spaced apart.

6. The coating device according to claim 5, characterized in that: The limiting protrusion (23) is ring-shaped. When the partition (22) covers the front side of the boat sheet (11), the limiting protrusion (23) surrounds the four sides of the hollow groove (12) and forms a closed cavity (23a) between the boat sheet (11) and the partition (22). The closed cavity (23a) is used to shield the side of the silicon wafer (10a) located in the hollow groove (12) facing the partition (22).

7. The coating device according to claim 1, characterized in that: The cover plate (21) is detachably connected to the plurality of partition plates (22), and the plurality of partition plates (22) are all perpendicular to the cover plate (21).

8. The coating device according to claim 1, characterized in that: The moving assembly (30) comprises a translation mechanism (31) and a lifting mechanism (32), wherein the translation mechanism (31) is used to drive the cover plate (21) to move horizontally relative to the graphite boat (10), and the lifting mechanism (32) is used to drive the cover plate (21) or the graphite boat (10) to move up and down, so that the cover plate (21) drives a plurality of partitions (22) to be inserted into the intervals of the boat sheet (11) or to be lifted out from the intervals of the boat sheet (11).

9. The coating device according to claim 8, characterized in that: The translation mechanism (31) comprises a first roller (311), a second roller (312) and a belt (313); the belt (313) is connected between the first roller (311) and the second roller (312) and is used to drive the cover plate (21) to move horizontally; And / or, the lifting mechanism (32) comprises a worm gear transmission assembly (321) and a mechanical arm (322), the worm gear transmission assembly (321) being connected to the mechanical arm (322) and used to drive the mechanical arm (322) to move up and down, the mechanical arm (322) having a hook (322a), and the cover plate (21) having a buckle groove (21a) for cooperating with the hook (322a).

10. The coating device according to claim 1, characterized in that: The hollow area of ​​the hollow groove (12) accounts for more than or equal to 90% of the area of ​​the boat sheet (11).

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