High-rigidity substrate coating carrier plate

Abstract

The utility model discloses a high-rigidity substrate coating carrier plate which comprises a metal wire, a rectangular frame and a buffer spring plate, the rectangular frame is composed of two groups of C-shaped steel non-conveying edges and stainless steel conveying edges, and the C-shaped steel non-conveying edges and the stainless steel conveying edges are arranged in parallel. The metal wire tensioning structure comprises a tensioning fixing base, a compression spring, a sliding rod, a fixing tensioning block, a metal wire pressing plate, a fastening screw and a metal wire guide wheel, and the buffering spring plates are arranged at the connecting positions of the two ends of the stainless steel conveying edge and the C-shaped steel non-conveying edge. The rigidity of the integrally-formed conveying edge is easier to guarantee by adopting splicing of two materials, the non-conveying edge frame is made of C-shaped steel and is matched with a double-spring tensioning structure, so that the tensioning degree of a metal wire is greatly improved, the frame strength is improved, the flatness is high, the conveying speed is improved, the conveying abrasion is small, the service life is prolonged, the productivity is greatly improved, and the production cost is reduced. The production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of coating carrier plates, in particular to a high-rigidity substrate coating carrier plate. Background Art

[0002] In PECVD, PVD and other photovoltaic, semiconductor, and vacuum coating equipment, a carrier plate is required as a carrier for substrates such as silicon wafers, to transfer the silicon wafers into the coating equipment cavity and transfer them in multiple cavities.

[0003] The frame of the existing substrate coating carrier plate is made of aluminum, and the four corners are stainless steel blocks. The splicing of the two materials has a high risk of deformation and distortion due to different thermal expansion coefficients. In addition, the aluminum frame material itself has insufficient rigidity, resulting in large overall deformation, poor flatness at high temperatures in the cavity, easy pitting and wear at the bottom after multiple transfers, low service life, insufficient tension of the metal wire, slow carrier plate transfer speed, and inability to improve production capacity.

[0004] The current carrier plate has insufficient strength, which is prone to damage the silicon wafers during the transfer process, and the transfer speed is slow, reducing production efficiency. At the same time, the metal wire tensioning structure is simple, resulting in insufficient tension of the metal wire. At the same time, insufficient strength of the frame will cause the frame to deform more when tightening the metal wire, and it is more likely to damage the silicon wafers during the transfer process.

[0005] In order to solve the problem of frame deformation of the substrate carrier plate, a metal wire tensioning structure is designed to increase the tension strength of the metal wire. Summary of the Utility Model

[0006] In view of the above problems, the utility model provides a high-rigidity substrate coating carrier plate that uses the splicing of two materials and is provided with a metal wire tensioning structure.

[0007] To solve the above technical problems, the technical solution adopted by the utility model is: a high-rigidity substrate coating carrier plate, which includes a rectangular frame composed of metal wires, two groups of parallel C-shaped steel non-transfer sides, and two groups of parallel stainless steel transfer sides, and a buffer spring plate. One end of the metal wire is fixedly pressed on the C-shaped steel non-transfer side, and the other end is installed on the other C-shaped steel non-transfer side through a metal wire tensioning structure. The metal wire tensioning structure includes a tensioning fixed seat, a compression spring, a sliding rod, a fixed tensioning block, a metal wire pressing plate, a fastening screw, and a metal wire guide wheel. The tensioning fixed seat is installed inside the C-shaped steel non-transfer side. The compression spring is sleeved on the sliding rod, and at the same time, the sliding rod is installed on the tensioning fixed seat. The metal wire passes through the notch on the C-shaped steel non-transfer side and the tensioning fixed seat, is placed on the fixed tensioning block along the metal wire guide wheel, and then the metal wire is pressed by tightening the fastening screw on the metal wire pressing plate. The buffer spring plate is arranged at the connection between the two ends of the stainless steel transfer side and the C-shaped steel non-transfer side.

[0008] Further, the stainless-steel conveying edge is made of integrally formed stainless steel above SUS316H, and the C-shaped steel non-conveying edge is made of conventional frame steel above SUS316.

[0009] Further, there are two sets of the compression springs and the sliding rods, which are symmetrically arranged on both sides of the wire.

[0010] Further, one end of the compression spring abuts against the tensioning fixed seat, and the other end abuts against the fixed tensioning block.

[0011] Further, the fixed tensioning block is slidably connected to the sliding rod.

[0012] As can be seen from the above description of the structure of the present utility model, compared with the prior art, the present utility model has the following advantages:

[0013] 1. The present utility model cancels the connecting blocks around the carrier board frame, adopts the splicing of two materials, and the rigidity of the integrally formed conveying edge is easier to ensure. The non-conveying edge frame is a C-shaped steel, which is adapted to the double-spring tensioning structure, greatly improving the tension degree of the wire, enhancing the frame strength, having high flatness, improving the conveying speed, reducing the conveying wear, increasing the service life, greatly improving the production capacity, and reducing the production cost.

[0014] 2. A buffer spring plate is added at the connection of both ends of the stainless-steel conveying edge of the carrier board, so that the buffer during the transition of the carrier board between cavities reduces the shaking of the carrier board and reduces the chip breakage rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0016] Figure 1 is the front axonometric view of the present utility model;

[0017] Figure 2 is the back axonometric view of the present utility model;

[0018] Figure 3 is the schematic diagram of the wire tensioning structure of the present utility model;

[0019] Figure 4 is the cross-sectional view of the C-shaped steel non-conveying edge of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0021] Embodiment

[0022] Reference Figures 1-4 , a high-rigidity substrate coating carrier plate, comprising a rectangular frame formed by a metal wire 1, two groups of parallel C-shaped steel non-conveying edges 2 and two groups of parallel stainless steel conveying edges 3, and a buffer spring plate 4. One end of the metal wire 1 is fixedly pressed on the C-shaped steel non-conveying edge, and the other end is installed on the other C-shaped steel non-conveying edge through a metal wire tensioning structure 5. The metal wire tensioning structure 5 includes a tensioning fixed seat 51, a compression spring 52, a sliding rod 53, a fixed tensioning block 54, a metal wire pressing plate 55, a fastening screw 56, and a metal wire guide wheel 57. The tensioning fixed seat 51 is installed inside the C-shaped steel non-conveying edge 2. The compression spring 52 is sleeved on the sliding rod 53, and at the same time, the sliding rod 53 is inserted into the tensioning fixed seat 51. The metal wire 1 passes through the notches on the C-shaped steel non-conveying edge 2 and the tensioning fixed seat 51, is placed on the fixed tensioning block 54 along the metal wire guide wheel 57, and then the metal wire 1 is pressed tightly by locking the fastening screw 56 on the metal wire pressing plate 55. The buffer spring plate 4 is arranged at the connection between the two ends of the stainless steel conveying edge 3 and the C-shaped steel non-conveying edge 2.

[0023] The stainless steel conveying edge 3 is made of integrally formed stainless steel above SUS316H, and the C-shaped steel non-conveying edge 2 is made of conventional frame steel above SUS316. The inside of the C-shaped steel itself is hollow, with high formability, which is convenient for installing the metal wire tensioning structure and the metal wire pressing structure.

[0024] There are two groups of the compression spring 52 and the sliding rod 53, symmetrically arranged on both sides of the metal wire 1. One end of the compression spring 52 abuts against the tensioning fixed seat 51, and the other end abuts against the fixed tensioning block 54. The fixed tensioning block 54 is slidably connected to the sliding rod 53. When the metal wire 1 is pulled forward, it drives the fixed tensioning block 54 to move forward, so that the compression spring 52 is compressed, generating a reaction tension to make the metal wire 1 tightened. Adding double springs greatly improves the tension degree of the metal wire.

[0025] This utility model cancels the connecting blocks around the carrier plate frame, adopts the splicing of two materials, and it is easier to ensure the rigidity of the integrally formed conveying edge. The non-conveying edge frame is C-shaped steel, which is adapted to the double-spring tensioning structure, greatly improving the tension degree of the metal wire, enhancing the frame strength, having a high flatness, improving the conveying speed, reducing the conveying wear, increasing the service life, greatly improving the production capacity, and reducing the production cost; adding buffer spring plates at the connections of the two ends of the stainless steel conveying edge of the carrier plate to buffer when the carrier plate transitions between cavities, reducing the shaking of the carrier plate and lowering the fragment rate.

[0026] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A high-rigidity substrate coating carrier, characterized in that: It includes a rectangular frame and a buffer spring plate composed of metal wire, two groups of parallel C-shaped steel non-transmission edges and two groups of parallel stainless steel transmission edges. One end of the metal wire is fixed and pressed on the C-shaped steel non-transmission edge, and the other end is installed on the other C-shaped steel non-transmission edge through a metal wire tensioning structure. The metal wire tensioning structure includes a tensioning fixed seat, a compression spring, a sliding rod, a fixed tensioning block, a metal wire pressure plate, a fastening screw, and a metal wire guide wheel. The tensioning fixed seat is installed inside the C-shaped steel non-transmission edge, the compression spring is sleeved on the sliding rod, and the sliding rod is installed on the tensioning fixed seat at the same time. The metal wire passes through the notches on the C-shaped steel non-transmission edge and the tensioning fixed seat, is placed on the fixed tensioning block along the metal wire guide wheel, and then is tightened by locking the fastening screws on the metal wire pressure plate. The buffer spring plate is arranged at the connection between the two ends of the stainless steel transmission edge and the C-shaped steel non-transmission edge.

2. The high rigidity substrate coating carrier according to claim 1, characterized in that: The stainless steel transmission side is made of one-piece stainless steel of SUS316H or higher, and the C-shaped steel non-transmission side is made of conventional frame steel of SUS316 or higher.

3. The high rigidity substrate coating carrier according to claim 1, characterized in that: The compression springs and sliding rods are provided in two groups and are symmetrically arranged on both sides of the metal wire.

4. The high rigidity substrate coating carrier according to claim 1, characterized in that: One end of the compression spring abuts against the tensioning fixing seat, and the other end abuts against the fixed tensioning block.

5. The high rigidity substrate coating carrier according to claim 1, characterized in that: The fixed tensioning block is slidably connected to the sliding rod.

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