Electrodeposition device capable of providing uniform magnetic field

Abstract

The utility model discloses an electro-deposition device capable of providing a uniform magnetic field. The electro-deposition device comprises an electro-deposition tank body, a magnet sleeve frame and a cathode base, electro-deposition liquid is contained in the electro-deposition tank body, an anode wire fixing cover used for fixing an anode wire is arranged at an upper opening of the electro-deposition tank body, and the anode wire penetrates into the electro-deposition liquid in the electro-deposition tank body; an electro-deposition source sheet is arranged on the cathode base, and a lower opening of the electro-deposition tank body is formed in the electro-deposition source sheet; a circular skirt hem is arranged on the outer wall of the bottom of the electro-deposition tank body, the magnet sleeve frame sleeves the outer side of the electro-deposition tank body and is positioned on the circular skirt hem, a plurality of magnetic columns are arranged on the magnet sleeve frame, and the electro-deposition tank body is fixed on the cathode base through the magnetic attraction force between the magnetic columns and the cathode base. According to the utility model, the magnetic field providing and the electro-deposition tank body sealing are combined into one through the magnet sleeve frame; therefore, the electro-deposition tank body, the electro-deposition source sheet and the cathode base are combined into a whole, the electro-deposition device is greatly simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of isotope radiation sources, and particularly relates to an electroplating device capable of providing a uniform magnetic field. Background Art

[0002] The α instrument calibration source is prepared with α radioactive nuclides. In order to ensure that the α particle energy is basically not attenuated in the source and reduce self-absorption, the active layer must be very thin. The domestic α instrument calibration sources mainly include 241 Am, 238 Pu, and 244 Cm, etc. According to the classification of GB18871-2002, most of the α nuclides belong to the extremely toxic group. After the α nuclides enter the human body, the tissues will be continuously irradiated. The parts where radiation will induce cell death, mutation and malignant mutation are in the cell nucleus, and deoxyribonucleic acid is the main target. Ionization and excitation mainly damage cells by acting on DNA molecules, resulting in various health hazards until the radioactive nuclide decays completely or is completely excreted from the body.

[0003] Parker, Kitov and others developed a new method for preparing radiation sources and targets for nuclear physics experiments in weakly polar organic solvents in the 1960s. They used organic solvents such as isopropanol and electroplating solutions of inorganic acids containing trace radioactive substances for electroplating to prepare sources. The electroplating is carried out at a high DC voltage and a low current density. The radioactive nuclides are deposited on the cathode in the form of hydroxides or other compounds. This method is called molecular electroplating and is widely used in the preparation of α instrument calibration sources. The advantages of the molecular electroplating method are: (1) wide application range, more than 60% of the elements in the periodic table can be electroplated on the metal negative film by this method; (2) the deposited film is thin and uniform; (3) the cathode negative film can be made of metals such as aluminum without worrying about being corroded by the electroplating solution.

[0004] The China Institute of Atomic Energy filed a patent application for an invention named "Deposition device for preparing a high-resolution α radiation source by magnetohydrodynamic electroplating method", with the application number 201710284564.6; this application discloses that a permanent magnet is arranged outside the deposition tank body, the anode wire extends from the top of the deposition tank body into the deposition solution, the bottom of the deposition tank body is sealed by a threaded bottom cover, a central hole is opened in the threaded bottom cover, a cathode lead-out gasket and a cathode deposition source sheet are sequentially arranged from bottom to top inside the threaded bottom cover at the bottom of the deposition tank body, a cathode lead-out wire is connected to the bottom of the cathode lead-out gasket, and the cathode lead-out wire is led out from the hole in the threaded bottom cover and connected to the negative pole of the power supply.

[0005] This deposition device has the following problems:

[0006] (1) It is inconvenient to operate with a permanent magnet arranged outside the deposition tank body, and the installation efficiency is low.

[0007] (2) The magnetic field intensity of the permanent magnet arranged outside the deposition tank cannot change in a gradient manner, and the magnetic field distribution is uneven, reducing the effect of the magnetic field on deposition.

[0008] (3) The deposition tank and the bottom cover are sealed by threads, resulting in low disassembly and assembly efficiency.

[0009] (4) The deposition source sheet contacts the cathode lead-out gasket, and then the cathode lead-out gasket is connected to a wire and placed on the electroplating tank bracket; there are many connection points in this process, which easily leads to poor contact, and the electro-deposition device has a complex structure, resulting in low production efficiency. Summary of the Utility Model

[0010] Aiming at the deficiencies in the prior art, the present utility model provides an electro-deposition device with a uniform magnetic field distribution and a magnetic field intensity that can be changed in a gradient manner, which is convenient to set up and has high working efficiency.

[0011] The present utility model discloses an electro-deposition device capable of providing a uniform magnetic field, including: an anode wire fixing cover, an electro-deposition tank, a magnet sleeve frame, and a cathode base;

[0012] The electro-deposition tank is filled with an electro-deposition solution. An anode wire fixing cover for fixing the anode wire is provided at the upper opening of the electro-deposition tank, and the anode wire extends into the electro-deposition solution in the electro-deposition tank;

[0013] An electro-deposition source sheet is provided on the cathode base, and the lower opening of the electro-deposition tank is placed on the electro-deposition source sheet so that the electro-deposition solution filled in the electro-deposition tank contacts the electro-deposition source sheet;

[0014] A circular skirt is provided on the outer wall of the bottom of the electro-deposition tank. The magnet sleeve frame is sleeved outside the electro-deposition tank and is located on the circular skirt. A plurality of magnetic columns are provided on the magnet sleeve frame. Through the magnetic attraction force of the magnetic columns and the cathode base, the electro-deposition tank is fixed on the cathode base to achieve close contact between the electro-deposition tank, the electro-deposition source sheet, and the cathode base.

[0015] As a further improvement of the present utility model, a rubber gasket is provided at the lower opening of the electro-deposition tank. The rubber gasket is fixed to the bottom of the electro-deposition tank by glue. The diameter of the rubber gasket is the same as the diameter of the electro-deposition source sheet. An opening is provided in the middle of the rubber gasket, and the electro-deposition solution contacts the surface of the electro-deposition source sheet through the opening.

[0016] As a further improvement of the present utility model, the top of the cathode base is provided with a stepped first groove, second groove and third groove. The groove diameter of the first groove is smaller than that of the second groove, and the groove diameter of the second groove is smaller than that of the third groove. The lower first groove is used to accommodate the electroplating source wafer, the middle second groove is used to accommodate the circular skirt, and the upper third groove is used to accommodate the magnet sleeve holder. Preferably, the diameter of the first groove is equal to the diameter of the electroplating source wafer, and the electroplating source wafer is placed in the first groove; the diameter of the second groove is equal to the outer diameter of the circular skirt, and the second groove plays a role in limiting and fixing the electroplating tank body; the diameter of the third groove is equal to the outer diameter of the magnet sleeve holder, and the third groove plays a role in limiting and fixing the magnet sleeve holder. A conductive column is provided on the cathode base, and the conductive column is connected to the negative pole of the DC regulated power supply.

[0017] As a further improvement of the present utility model, the anode wire fixing cover includes a cover body and a fixing part. The cover body covers the upper opening of the electroplating tank body, and the fixing part is fixed on the cover body (preferably, the fixing part and the cover body are of a coaxial integral structure). An anode wire hole for the anode wire to pass through is provided on the axis of the cover body and the fixing part, and a fixing hole for fixing the anode wire is provided on the side of the fixing part. Further, the anode wire hole is a vertical hole, and the fixing hole is a horizontal screw hole perpendicular to and communicating with the anode wire hole. The anode wire is fixed in the anode wire hole by a screw.

[0018] As a further improvement of the present utility model, the anode wire is a platinum wire, and its shape is a spiral shape. It is placed in the electroplating tank body and parallel to the cathode (electroplating source wafer).

[0019] As a further improvement of the present utility model, the upper opening of the electroplating tank body is a 45-degree inclined plane.

[0020] As a further improvement of the present utility model, a first hole for the electroplating tank body to pass through is provided at the center of the magnet sleeve holder. A plurality of second holes for accommodating magnetic columns are annularly and evenly distributed outside the first hole, and a third hole smaller than the diameter of the magnetic column is provided on the bottom plate of the second hole.

[0021] As a further improvement of the present utility model, the electroplating tank body and the magnet sleeve holder are made of polytetrafluoroethylene material, and the cathode base is made of stainless steel material.

[0022] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] The present utility model innovatively designs a magnet sleeve holder, which combines the provision of magnetic field and the sealing of the electroplating tank body into one; furthermore, it realizes the integration of the electroplating tank body, the electroplating source wafer and the cathode base, greatly simplifies the electroplating device, and the above design can significantly improve the energy resolution and production efficiency of the α radiation source. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 FIG. is a schematic structural view of an electrodeposition device capable of providing a uniform magnetic field disclosed by the present utility model;

[0025] Figure 2 is Figure 1 a schematic structural view of the anode wire fixing cover in;

[0026] Figure 3 is Figure 1 a sectional view and a top view of the electrodeposition cell body in;

[0027] Figure 4 is Figure 1 a sectional view and a top view of the magnet sleeve bracket in;

[0028] Figure 5 is Figure 1 a sectional view and a top view of the cathode base in.

[0029] In the figure:

[0030] 1 - Anode wire fixing cover; 11 - Cover body; 12 - Fixing part; 13 - Anode wire hole; 14 - Fixing hole;

[0031] 2 - Electrodeposition cell body; 21 - Upper opening; 22 - Lower opening; 23 - Rubber gasket; 24 - Circular skirt; 25 - Electrodeposition source sheet;

[0032] 3 - Magnet sleeve bracket; 31 - First hole; 32 - Second hole; 33 - Magnetic column; 34 - Third hole;

[0033] 4 - Cathode base; 41 - First groove; 42 - Second groove; 43 - Third groove; 44 - Conductive column. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the scope of protection of the present utility model.

[0035] The present utility model will be further described in detail below with reference to the accompanying drawings:

[0036] As Figures 1 to 5As shown in the figure, the present utility model provides an electroplating device capable of providing a uniform magnetic field, including: an anode wire fixing cover 1, an electroplating tank body 2, a magnet sleeve frame 3, and a cathode base 4; wherein, an anode wire fixing cover 1 for fixing the anode wire is provided at the upper opening of the electroplating tank body 2, the magnet sleeve frame 3 is sleeved on the electroplating tank body 2, and the electroplating tank body 2 is fixed on the cathode base 4 by the magnetic attraction force between the magnetic columns on the magnet sleeve frame 3 and the cathode base 4, so that the electroplating solution contained in the electroplating tank body 2 contacts the electroplating source sheet 25 provided on the cathode base 4 to complete electroplating.

[0037] Specifically:

[0038] Further referring to Figure 2 , the anode wire fixing cover 1 of the present utility model includes a cover body 11 and a fixing part 12. The cover body 11 covers the upper opening 21 of the electroplating tank body 2, and the fixing part 12 is fixed on the cover body 11. Preferably, the fixing part 12 and the cover body 11 are of a coaxial integrated structure; an anode wire hole 13 for the anode wire (not shown in the figure) to pass through is provided on the axis of the cover body 11 and the fixing part 12, and the anode wire extends into the electroplating solution in the electroplating tank body; a fixing hole 14 for fixing the anode wire is provided on the side of the fixing part 12; further, the anode wire hole 13 is a vertical hole, and the fixing hole 14 is a horizontal screw hole perpendicular to and communicating with the anode wire hole, and the anode wire is fixed in the anode wire hole by a screw. Further, the anode wire is a platinum wire, and its shape is a coil shape, which is placed in the electroplating tank body 2 and parallel to the cathode (electroplating source sheet 25).

[0039] Further referring to Figure 3 , the electroplating tank body 2 of the present utility model is of a cylindrical structure, with an upper opening 21 and a lower opening 22 provided at its upper and lower ends respectively. The upper opening 21 of the electroplating tank body 2 is a 45-degree inclined plane, which is convenient for pouring the electroplating solution out of the tank body 2 without the electroplating solution being easily spilled. A rubber gasket 23 is provided at the lower opening 22 of the electroplating tank body 2. The rubber gasket 23 is fixed to the bottom of the electroplating tank body 2 by glue. The diameter of the rubber gasket 23 is the same as the diameter of the electroplating source sheet 25. There is an opening in the middle of the rubber gasket 23, and the electroplating solution contacts the surface of the electroplating source sheet 25 through the opening of the rubber gasket 23. A circular skirt 24 is provided on the outer wall of the bottom of the electroplating tank body 2, and the circular skirt 24 is used to support the magnet sleeve frame 3.

[0040] Further referring to Figure 4, the magnet sleeve 3 of the present utility model is sleeved outside the electroplating tank body 2 and located on the circular skirt 24; a plurality of magnetic columns 33 are provided on the magnet sleeve 3, and the electroplating tank body 2 is fixed on the cathode base 4 by the magnetic attraction force between the magnetic columns 33 and the cathode base 4, so as to realize the close contact between the electroplating tank body 2, the rubber gasket 23, the electroplating source sheet 25 and the cathode base 4. Specifically, a first hole 31 for the electroplating tank body 2 to pass through is provided in the center of the magnet sleeve 3, and a plurality of second holes 32 for accommodating the magnetic columns 33 are evenly distributed in a ring outside the first hole 31. As Figure 4 shown, the magnet sleeve 3 has a total of 9 openings. The large hole in the middle (the first hole 31) is completely penetrated. During use, the electroplating tank body 2 passes through this hole; 8 small holes (the second holes 32) are symmetrically distributed around the large hole, and each small hole can place a strong magnetic column (33), and the number of magnetic columns used can be changed according to requirements. The second hole 32 is not a completely penetrated hole, and a third hole 34 smaller than the diameter of the magnetic column 33 is provided on the bottom plate of the second hole 32, which ensures a strong attraction force between the magnet sleeve 3 and the cathode base 4. The first function of the magnet sleeve 3 is to provide a magnetic field with a gradient change and uniform distribution around the electroplating tank; the second function is to have a strong attraction force with the cathode base, ensuring the close contact between the rubber gasket 23 and the electroplating source sheet 25 at the bottom of the tank and preventing the deposition liquid from leaking.

[0041] Further referring to Figure 4 , on the top of the cathode base 4 of the present utility model, there are provided a stepped first groove 41, a second groove 42 and a third groove 43. The groove diameter of the first groove 41 is smaller than that of the second groove 42, and the groove diameter of the second groove 42 is smaller than that of the third groove 43; the lower first groove 41 is used to accommodate the electroplating source sheet 25, the middle second groove 42 is used to accommodate the circular skirt 24, and the upper third groove 43 is used to accommodate the magnet sleeve 3; preferably: the diameter of the first groove 41 is equal to the diameter of the electroplating source sheet 25, and the electroplating source sheet 25 is placed in the first groove 41; the diameter of the second groove 42 is equal to the outer diameter of the circular skirt 24, and the second groove 42 plays a role in limiting and fixing the electroplating tank body 2; the diameter of the third groove 43 is equal to the outer diameter of the magnet sleeve 3, and the third groove 43 plays a role in limiting and fixing the magnet sleeve 3; a conductive column 44 is also provided on the cathode base 4, and the conductive column 44 is connected to the negative pole of the DC regulated power supply; further, the materials of the electroplating tank body 2 and the magnet sleeve 3 are made of polytetrafluoroethylene material, and the material of the cathode base 4 is made of stainless steel material.

[0042] The specific assembly and use method of the present utility model is as follows:

[0043] Place the electroplating source sheet 25 in the first groove 41 of the cathode base 4, and vertically place the electroplating cell 2 with a rubber gasket 23 pasted at the lower opening 22 on the electroplating source sheet 25. The rubber gasket 23 is also wholly or partly received in the first groove 41, and the circular skirt 24 of the electroplating cell 2 is placed in the second groove 42 of the cathode base 4. Pass the first hole 31 in the middle of the magnet sleeve 3 through the electroplating cell 2 from top to bottom and support it on the circular skirt 24. The magnet sleeve 3 is placed in the third groove 43 of the cathode base 4. Place magnetic posts 33 in a plurality of second holes 32 evenly distributed in a ring on the outer circle of the magnet sleeve 3. Press the electroplating cell 2 tightly on the cathode base 4 by the magnetic attraction force between the magnetic posts 33 and the cathode base 4, so as to realize the close contact between the electroplating source sheet 25 and the rubber gasket 23.

[0044] Add electroplating solution into the electroplating cell 2, fix the anode wire on the anode wire fixing cover 1, and cover the anode wire fixing cover 1 on the electroplating cell 2 so that the anode wire extends into the electroplating solution in the electroplating cell 2. Connect the conductive column 44 of the cathode base 4 to the negative pole of the DC regulated power supply. Turn on the power supply, and the electroplating reaction starts.

[0045] The advantages of the present utility model are as follows:

[0046] The present utility model innovatively designs a magnet sleeve, which combines the provision of magnetic field and the sealing of the electroplating cell into one; thereby realizing the integration of the electroplating cell, the electroplating source sheet and the cathode base, greatly simplifying the electroplating device. The above design can significantly improve the energy resolution and production efficiency of the α radiation source.

[0047] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An electrodeposition device capable of providing a uniform magnetic field, characterized in that: include: Anode wire fixing cover, electrodeposition tank body, magnet sleeve and cathode base; The electrodeposition tank contains an electrodeposition liquid, and an anode wire fixing cover for fixing an anode wire is provided at the upper opening of the electrodeposition tank. The anode wire penetrates into the electrodeposition liquid in the electrodeposition tank. The cathode base is provided with an electrodeposition source sheet, and the lower opening of the electrodeposition tank body is placed on the electrodeposition source sheet; A circular skirt is provided on the outer wall of the bottom of the electrodeposition tank body, the magnet sleeve is sleeved on the outside of the electrodeposition tank body and is located on the circular skirt, and a plurality of magnetic columns are provided on the magnet sleeve. The electrodeposition tank body is fixed on the cathode base through the magnetic attraction between the magnetic columns and the cathode base.

2. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1, characterized in that: A rubber gasket is provided at the lower opening of the electrodeposition tank body, and the rubber gasket is fixed to the bottom of the electrodeposition tank body by glue. The diameter of the rubber gasket is the same as the diameter of the electrodeposition source sheet. A hole is opened in the middle of the rubber gasket, and the electrodeposition liquid contacts the surface of the electrodeposition source sheet through the hole.

3. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1 or 2, characterized in that: The top of the cathode base is provided with a first groove, a second groove and a third groove in a stepped manner, the groove diameter of the first groove is smaller than the groove diameter of the second groove, and the groove diameter of the second groove is smaller than the groove diameter of the third groove; the first groove at the bottom is used to accommodate the electrodeposition source sheet, the second groove in the middle is used to accommodate the circular skirt, and the third groove at the top is used to accommodate the magnet sleeve; a conductive column is provided on the cathode base, and the conductive column is connected to the negative pole of the DC regulated power supply.

4. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1, characterized in that: The anode wire fixing cover includes a cover body and a fixing part, wherein the cover body is covered on the upper opening of the electrodeposition tank body, the fixing part is fixed on the cover body, an anode wire hole for the anode wire to pass through is provided on the axis of the cover body and the fixing part, and a fixing hole for fixing the anode wire is provided on the side of the fixing part.

5. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1 or 4, characterized in that: The anode wire is a platinum wire in the shape of a coil, which is placed in the electrodeposition tank and parallel to the cathode.

6. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1, characterized in that: The upper opening of the electrodeposition tank body is inclined at 45 degrees.

7. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1, characterized in that: The center of the magnet sleeve is provided with a first hole through which the power supply deposition tank passes, the outer side of the first hole is evenly distributed in an annular manner with a plurality of second holes for accommodating magnetic columns, and the bottom plate of the second hole is provided with a third hole smaller than the diameter of the magnetic column.

8. The electrodeposition device capable of providing a uniform magnetic field as claimed in claim 1, characterized in that: The electrodeposition tank body and the magnet housing are made of polytetrafluoroethylene, and the cathode base is made of stainless steel.

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