Semiconductor refrigerator

Abstract

According to the semiconductor refrigerator, a refrigerator body is divided into a storage cavity, a cold end cavity and a hot end cavity, the cold end cavity is located above the hot end cavity, the cold end cavity is communicated with the storage cavity through a ventilation opening, and the hot end cavity is communicated with the outside through an air outlet. The semiconductor chilling plate is arranged between the cold end cavity and the hot end cavity, the cold end of the semiconductor chilling plate is arranged in the cold end cavity, the hot end of the semiconductor chilling plate is arranged in the hot end cavity, the moisture absorption end of the dehumidification assembly is arranged in the cold end cavity, and the drying end of the dehumidification assembly is arranged in the hot end cavity. A capillary pipeline is formed between the moisture absorption end and the drying end of the dehumidification assembly, moisture of the moisture absorption end can be conveyed to the drying end to be evaporated, and water vapor in the cold end cavity and the storage cavity in the refrigerator is actively adsorbed through the dehumidification assembly. The problem that the refrigerating efficiency is reduced due to frosting caused by high humidity is effectively solved while the refrigerating speed of the refrigerator is greatly increased, and the overall energy consumption of the refrigerator is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigerators, in particular to a semiconductor refrigerator. Background Art

[0002] In recent years, semiconductor refrigeration refrigerators have been gradually introduced in the market. The core component is the semiconductor refrigeration module, including the hot end radiator, semiconductor refrigeration sheet and cold end radiator. Among them, the hot end radiator is located outside the box insulation layer, and the side close to the box insulation layer is close to the hot end of the semiconductor refrigeration sheet. A cooling fan is arranged around the radiator, and the fan motor is used to enhance the heat exchange of the radiator; the cold end radiator is arranged inside the box insulation layer, and the other part passes through the box insulation layer and is close to the cold end of the semiconductor refrigeration sheet. There are also cooling fans around it to achieve a cooling effect inside the box.

[0003] Since the semiconductor refrigeration chip is composed of interlaced P and N semiconductor particles, the Peltier effect will cause heat to be absorbed from one junction and transferred to another junction for release. From a macroscopic perspective, heat will be transferred from the cold end of the semiconductor refrigeration chip to the hot end. This makes the semiconductor refrigeration chip have the advantages of small size, no noise, fast response speed, and stepless temperature adjustment.

[0004] However, in actual applications, due to the limitations of semiconductor materials, the energy efficiency of semiconductor refrigerators is relatively low, resulting in greater energy demand compared to compressor refrigeration systems. In addition, frost is prone to form on the cold end during long-term use, which hinders heat conduction, severely reduces refrigeration efficiency and further increases power consumption.

[0005] There is a need to improve upon the existing technology. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide a semiconductor refrigerator with a reasonable structure and capable of actively reducing the humidity inside the refrigerator to increase the refrigeration effect.

[0007] In order to solve the above technical problems, the technical solution adopted by the utility model is: a semiconductor refrigerator, comprising a cabinet, a control panel, a semiconductor refrigeration sheet and a dehumidification component, the control panel is arranged in the cabinet, the control panel is electrically connected to the semiconductor refrigeration sheet, the cabinet is divided into a storage cavity, a cold end cavity and a hot end cavity, the cold end cavity is located above the hot end cavity, the cold end cavity is connected with the storage cavity through a vent, the hot end cavity is connected with the outside through an air outlet, the cold end of the semiconductor refrigeration sheet is arranged in the cold end cavity, the hot end of the semiconductor refrigeration sheet is arranged in the hot end cavity, the moisture absorption end of the dehumidification component is arranged in the cold end cavity, the drying end of the dehumidification component is arranged in the hot end cavity, and a capillary tube is formed between the moisture absorption end and the drying end of the dehumidification component.

[0008] Furthermore, the cold-end cavity is provided with a cold-end fan, which is used to drive the air in the cold-end cavity to pass through the moisture absorption end of the dehumidification component and enter the storage cavity through the vent; the hot-end cavity is provided with a hot-end fan, which is used to drive the hot air in the hot-end cavity to pass through the drying end of the dehumidification component and be discharged to the outside through the air outlet.

[0009] Furthermore, a cold end radiator is provided at the cold end of the semiconductor refrigeration plate, and the moisture absorption end of the dehumidification component is arranged between the cold end radiator and the cold end fan through a bracket.

[0010] Furthermore, a hot end heat sink is provided at the hot end of the semiconductor refrigeration plate.

[0011] Furthermore, the drying end of the dehumidification component is arranged between the hot end radiator and the air outlet of the box through a bracket.

[0012] Furthermore, the dehumidification assembly includes at least two dehumidification sheets, each of the at least two dehumidification sheets is provided with a plurality of through holes, and the through holes between two adjacent dehumidification sheets are arranged in a staggered manner.

[0013] Furthermore, the dehumidification sheet is a flexible porous dehumidification sheet.

[0014] Furthermore, the dehumidification sheet is diatom mud or sponge.

[0015] Furthermore, it also includes a touch screen, which is arranged on the box body and is electrically connected to the control panel.

[0016] Furthermore, the storage cavity is provided with a temperature and humidity sensor, and the temperature and humidity sensor is electrically connected to the control board.

[0017] The beneficial effects of the utility model are as follows: a semiconductor refrigerator is provided, which divides a cabinet into a storage cavity, a cold end cavity and a hot end cavity, wherein the cold end cavity is located above the hot end cavity, the cold end cavity is connected with the storage cavity through a vent, and the hot end cavity is connected with the outside through an air outlet, a semiconductor refrigeration plate is arranged between the cold end cavity and the hot end cavity, so that the cold end of the semiconductor refrigeration plate is arranged in the cold end cavity, and the hot end of the semiconductor refrigeration plate is arranged in the hot end cavity, the moisture absorption end of the dehumidification component is arranged in the cold end cavity, and the drying end of the dehumidification component is arranged in the hot end cavity, a capillary channel is formed between the moisture absorption end and the drying end of the dehumidification component, and the moisture at the moisture absorption end can be transported to the drying end for evaporation, and the water vapor in the cold end cavity and the storage cavity in the refrigerator is actively adsorbed by the dehumidification component, which greatly increases the refrigeration rate of the refrigerator and effectively solves the problem of reduced refrigeration efficiency due to frosting due to high humidity, thereby ensuring the overall energy consumption of the refrigerator. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The specific structure of the utility model is described in detail below with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the internal structure of the semiconductor refrigerator of the present utility model;

[0020] Figure 2 It is a schematic diagram of the top view of the cold end cavity of the semiconductor refrigerator of the utility model;

[0021] Figure 3 This is a front structural schematic diagram of the dehumidification component of the utility model;

[0022] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure of AA;

[0023] 11-storage cavity; 12-cold end cavity; 13-hot end cavity; 14-ventilation port; 15-air outlet;

[0024] 2- semiconductor cooling chip; 21- cold end radiator; 22- cold end fan; 23- hot end radiator; 24- hot end fan;

[0025] 3-dehumidification component; 31-dehumidification sheet; 32-through hole;

[0026] 4- Touch screen;

[0027] 5- Temperature and humidity sensor. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0034] Example

[0035] See also Figures 1 to 4 The present embodiment provides a semiconductor refrigerator, comprising a housing, a control board, a semiconductor refrigeration sheet 2 and a dehumidification component 3, wherein the control board is arranged in the housing, and the control board is electrically connected to the semiconductor refrigeration sheet 2, the housing is divided into a storage cavity 11, a cold end cavity 12 and a hot end cavity 13, the cold end cavity 12 is located above the hot end cavity 13, the cold end cavity 12 is communicated with the storage cavity 11 through a vent 14, and the hot end cavity 13 is communicated with the outside through an air outlet 15, the cold end of the semiconductor refrigeration sheet 2 is arranged in the cold end cavity 12, the hot end of the semiconductor refrigeration sheet 2 is arranged in the hot end cavity 13, the moisture absorption end of the dehumidification component 3 is arranged in the cold end cavity 12, the drying end of the dehumidification component 3 is arranged in the hot end cavity 13, and a capillary is formed between the moisture absorption end and the drying end of the dehumidification component 3.

[0036] In this embodiment, the box body includes an outer shell and three inner shells made of stainless steel. A polyurethane foam insulation layer is filled between the outer shell and the inner shell, and between the inner shells, so as to achieve a good thermal isolation effect. A storage cavity 11, a cold end cavity 12 and a hot end cavity 13 are formed inside the three inner shells respectively. The cold end cavity 12 is connected with the storage cavity 11 through a vent 14, and the hot end cavity 13 is connected with the outside through an air outlet 15 arranged on the box body. The cold end cavity 12 is arranged above the hot end cavity 13, and the semiconductor refrigeration sheet 2 is arranged between the cold end cavity 12 and the hot end cavity 13. The cold end of the semiconductor refrigeration sheet 2 is arranged in the cold end cavity 12, and the hot end of the semiconductor refrigeration sheet 2 is arranged in the hot end cavity 13. When power is turned on for cooling, the semiconductor refrigeration sheet 2 can transfer the heat from the cold end to the hot end through the Peltier effect, thereby achieving cooling of the cold end cavity 12 and the storage cavity 11. By using semiconductor refrigeration chips to cool, there is no need for a compressor, which achieves the goals of energy saving, quietness and reducing the size of the refrigerator. At the same time, it avoids the use of refrigerants such as Freon, reduces the impact on the environment, and meets the needs of modern families for environmentally friendly, efficient and convenient life.

[0037] In order to reduce the humidity in the air in the cold end cavity 12 and the storage cavity 11, so as to avoid frost at the cold end of the semiconductor refrigeration sheet 2 and reduce the refrigeration effect, the refrigerator is also provided with a dehumidification component 3 arranged through the cold end cavity 12 and the hot end cavity 13, and the dehumidification component 3 can absorb moisture in the air. For the convenience of explanation, the part of the dehumidification component 3 located in the cold end cavity 12 is defined as the moisture absorption end, and the part of the dehumidification component 3 located in the hot end cavity is defined as the drying end.

[0038] The moisture absorbing end of the dehumidification component 3 can absorb moisture in the air of the cold end cavity 12 and the storage cavity 11. After absorbing enough moisture, the excess moisture is transported to the drying end of the dehumidification component 3 by gravity and the capillary force of the capillary tube. The hot end of the semiconductor refrigeration sheet 2 can heat the drying end of the dehumidification component 3, and evaporate the moisture at the drying end of the dehumidification component 3 into the atmosphere, thereby reducing the humidity in the cold end cavity 12 and the storage cavity 11, keeping the internal environment of the refrigerator dry, effectively improving the refrigeration efficiency of the refrigerator, and reducing energy consumption.

[0039] In one embodiment, the structure of the refrigerator is improved to ensure the moisture absorption efficiency of the dehumidification component 3. Specifically, the cold end cavity 12 is provided with a cold end fan 22, and the cold end fan 22 is used to drive the air in the cold end cavity 12 to pass through the moisture absorption end of the dehumidification component 3 and enter the storage cavity 11 through the vent 14; the hot end cavity 13 is provided with a hot end fan 24, and the hot end fan 24 is used to drive the hot air in the hot end cavity 13 to pass through the drying end of the dehumidification component 3 and be discharged to the outside through the air outlet 15.

[0040] In this embodiment, a cold end fan 22 is provided in the cold end cavity 12 to increase the air flow speed, and the wind blown out by the cold end fan 22 passes through the moisture absorption end of the dehumidification component 3 and then enters the storage cavity 11 through the vent 14, thereby effectively improving the moisture absorption efficiency.

[0041] Similarly, a hot end fan 24 is provided in the hot end cavity 13 to increase the air flow speed, and the hot air blown out by the hot end fan 24 passes through the drying end of the dehumidification component 3 and is discharged to the outside through the air outlet 15, thereby effectively improving the drying efficiency.

[0042] In one embodiment, the structure of the cold end of the semiconductor refrigeration sheet 2 is improved to ensure the refrigeration efficiency. Specifically, the cold end of the semiconductor refrigeration sheet 2 is provided with a cold end radiator 21, and the moisture absorption end of the dehumidification component 3 is arranged between the cold end radiator 21 and the cold end fan 22 through a bracket.

[0043] In the present embodiment, by setting a cold end radiator 21 at the cold end of the semiconductor refrigeration plate 2, the contact area between the cold end of the semiconductor refrigeration plate 2 and the air can be greatly increased, thereby increasing the refrigeration efficiency. At the same time, in order to ensure the moisture absorption efficiency, the moisture absorption end of the dehumidification component 3 is set between the cold end radiator 21 and the cold end fan 22 through a bracket, and the air that has completed moisture absorption is blown through the cold end radiator 21, which can effectively prevent the moisture in the air from condensing into frost on the cold end radiator 21, thereby ensuring the refrigeration effect.

[0044] To ensure the heat conduction effect, thermal conductive silicone grease is coated between the cold end of the semiconductor refrigeration sheet 2 and the cold end heat sink 21 .

[0045] In one embodiment, the structure of the hot end of the semiconductor cooling plate 2 is improved to ensure the heat dissipation efficiency. Specifically, a hot end heat sink 23 is provided at the hot end of the semiconductor cooling plate 2.

[0046] In this embodiment, by providing a hot end heat sink 23 at the hot end of the semiconductor cooling plate 2, the contact area between the hot end of the semiconductor cooling plate 2 and the air can be greatly increased, thereby increasing the heat dissipation efficiency.

[0047] To ensure the heat conduction effect, thermal grease is coated between the hot end of the semiconductor cooling plate 2 and the hot end heat sink 23 .

[0048] In one embodiment, the position of the drying end of the dehumidification component 3 is improved to ensure the drying effect. Specifically, the drying end of the dehumidification component 3 is arranged between the hot end radiator 23 and the air outlet 15 of the box body through a bracket.

[0049] In this embodiment, the drying end of the dehumidification component 3 is set between the hot end radiator 23 and the air outlet 15 of the box body through a bracket. The wind blown by the hot end fan 24 takes away the heat of the hot end radiator 23 to increase the temperature, so that the heated air passes through the drying end of the dehumidification component 3, which can achieve a better drying effect on the drying end of the dehumidification component 3, and at the same time, the hot air with water vapor can be discharged to the outside of the box body through the air outlet 15 in time.

[0050] In one embodiment, the structure of the dehumidification component 3 is improved to ensure the moisture absorption effect. Specifically, the dehumidification component 3 includes at least two dehumidification sheets 31, each of which is provided with a plurality of through holes 32, and the through holes between two adjacent dehumidification sheets 31 are staggered.

[0051] In the present embodiment, in order to ensure the adsorption effect of water vapor, the dehumidification component 3 includes at least two dehumidification sheets 31. The present embodiment takes two dehumidification sheets 31 as an example for explanation. The two dehumidification sheets 31 are arranged at intervals through a bracket, and an airway is formed between the two dehumidification sheets 31. Each dehumidification sheet 31 is provided with a plurality of through holes 32 arranged at intervals from top to bottom. The through holes 32 of the two dehumidification sheets 31 are arranged alternately. The through holes 32 are preferably long strip through holes. The length direction of the long strip through holes is consistent with the width direction of the dehumidification sheet 31, so that the dehumidification component 3 will not reduce the air volume too much while ensuring the adsorption effect of moisture in the air.

[0052] In one embodiment, the type of the dehumidification sheet 31 is improved to ensure the dehumidification effect. Specifically, the dehumidification sheet 31 is a flexible porous dehumidification sheet.

[0053] In the present embodiment, utilizing the property of the flexible porous dehumidification sheet that it can absorb moisture in the air, the moisture absorption end of the flexible porous dehumidification sheet is set in the cold end cavity 12, and the drying end of the flexible porous dehumidification sheet is set in the hot end cavity 13. The moisture adsorbed by the flexible porous dehumidification sheet in the cold end cavity 12 can be guided to the drying end of the flexible porous dehumidification sheet by gravity and the capillary structure inside the flexible porous dehumidification sheet. The moisture at the drying end of the flexible porous dehumidification sheet is evaporated into the air by heating, thereby achieving dehumidification of the cold end cavity 12 and the storage cavity 11.

[0054] Preferably, the dehumidification sheet 31 is diatom mud or sponge. Both diatom mud and sponge have rich porous structures inside, and capillaries can be formed between the porous structures. Under the action of gravity and the capillaries, moisture can be well guided from the wet end to the dry end.

[0055] In one embodiment, the structure of the refrigerator is improved to facilitate the user to adjust the refrigerator and view information. Specifically, it also includes a touch screen 4, which is arranged on the box body and is electrically connected to the control panel.

[0056] In this embodiment, a touch screen 4 is provided on the outer shell of the refrigerator, and the touch screen 4 is electrically connected to the control panel. The user can check the current working status of the refrigerator through the touch screen 4, and can also set the working mode of the refrigerator through the touch mode 4.

[0057] In one embodiment, the structure of the refrigerator is improved to facilitate obtaining the environmental conditions inside the refrigerator. Specifically, the storage cavity 11 is provided with a temperature and humidity sensor 5, and the temperature and humidity sensor 5 is electrically connected to the control board.

[0058] In this embodiment, the temperature and humidity data in the storage cavity are acquired in real time by the temperature and humidity sensor 5 and displayed on the touch display screen 4 so that the user can view the environmental conditions of the storage cavity 11 of the refrigerator.

[0059] At the same time, the control panel can automatically adjust the cooling and dehumidification process through real-time monitoring of temperature and humidity data to achieve intelligent control.

[0060] Preferably, the temperature and humidity sensor 5 is arranged on the cavity wall away from the ventilation opening, so as to more accurately detect the real environmental conditions of the storage cavity 11 of the refrigerator away from the ventilation opening.

[0061] From the above description, it can be seen that the beneficial effects of the utility model are: a semiconductor refrigerator is provided, which divides the box body into a storage cavity, a cold end cavity and a hot end cavity, wherein the cold end cavity is located above the hot end cavity, the cold end cavity is connected to the storage cavity through a vent, and the hot end cavity is connected to the outside through an air outlet, a semiconductor refrigeration plate is arranged between the cold end cavity and the hot end cavity, so that the cold end of the semiconductor refrigeration plate is arranged in the cold end cavity, and the hot end of the semiconductor refrigeration plate is arranged in the hot end cavity, the moisture absorption end of the dehumidification component is arranged in the cold end cavity, and the drying end of the dehumidification component is arranged in the hot end cavity, a capillary tube is formed between the moisture absorption end and the drying end of the dehumidification component, which can transport moisture from the moisture absorption end to the drying end for evaporation, and the dehumidification component actively absorbs water vapor in the cold end cavity and the storage cavity in the refrigerator, which greatly increases the refrigeration rate of the refrigerator and effectively solves the problem of reduced refrigeration efficiency due to frosting due to high humidity, thereby ensuring the overall energy consumption of the refrigerator.

[0062] It is easy for those skilled in the art to understand that the above-mentioned implementation modes can be freely combined and superimposed without conflict.

[0063] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor refrigerator, comprising a box, a control panel, a semiconductor refrigeration sheet and a dehumidification component, wherein the control panel is arranged in the box, and the control panel is electrically connected to the semiconductor refrigeration sheet, characterized in that: The box body is divided into a storage cavity, a cold end cavity and a hot end cavity. The cold end cavity is located above the hot end cavity. The cold end cavity is connected with the storage cavity through a vent, and the hot end cavity is connected with the outside through an air outlet. The cold end of the semiconductor refrigeration plate is arranged in the cold end cavity, and the hot end of the semiconductor refrigeration plate is arranged in the hot end cavity. The moisture absorption end of the dehumidification component is arranged in the cold end cavity, and the drying end of the dehumidification component is arranged in the hot end cavity. A capillary tube is formed between the moisture absorption end and the drying end of the dehumidification component.

2. The semiconductor refrigerator according to claim 1, characterized in that: The cold-end cavity is provided with a cold-end fan, which is used to drive the air in the cold-end cavity to pass through the moisture absorption end of the dehumidification component and enter the storage cavity through the vent; the hot-end cavity is provided with a hot-end fan, which is used to drive the hot air in the hot-end cavity to pass through the drying end of the dehumidification component and be discharged to the outside through the air outlet.

3. The semiconductor refrigerator according to claim 2, characterized in that: A cold end radiator is provided at the cold end of the semiconductor refrigeration sheet, and the moisture absorption end of the dehumidification component is arranged between the cold end radiator and the cold end fan through a bracket.

4. The semiconductor refrigerator according to claim 2, characterized in that: The hot end of the semiconductor refrigeration plate is provided with a hot end radiator.

5. The semiconductor refrigerator according to claim 4, characterized in that: The drying end of the dehumidification component is arranged between the hot end radiator and the air outlet of the box body through a bracket.

6. The semiconductor refrigerator according to claim 1, characterized in that: The dehumidification assembly comprises at least two dehumidification sheets, each of the at least two dehumidification sheets is provided with a plurality of through holes, and the through holes between two adjacent dehumidification sheets are arranged in a staggered manner.

7. The semiconductor refrigerator according to claim 6, characterized in that: The dehumidification sheet is a flexible porous dehumidification sheet.

8. The semiconductor refrigerator according to claim 6, characterized in that: The dehumidification sheet is diatom mud or sponge.

9. The semiconductor refrigerator according to claim 1, characterized in that: It also includes a touch screen, which is arranged on the box body and is electrically connected to the control panel.

10. The semiconductor refrigerator according to claim 1, characterized in that: The storage cavity is provided with a temperature and humidity sensor, and the temperature and humidity sensor is electrically connected to the control board.

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