Novel mainboard with high integration

Abstract

The utility model relates to the technical field of mainboards, in particular to a novel mainboard with high integration. The mainboard comprises a mainboard body, and a fan base A, a fan base B, an antenna base, a camera base, an LVDS base, a stepping motor base and an infrared base A are installed on the surface of the mainboard body. An MIPI screen base, a temperature sensor base, a fan base C, an HDMI base and an infrared base B are installed on the back face of the main board body. The antenna base, the camera base, the LVDS base, the stepping motor base, the infrared base A, the MIPI screen base, the temperature sensor base, the HDMI base and the infrared base B are integrated on the main board body, so that 90% of peripheral connection requirements of mechanical automation can be met, and meanwhile, all the elements are installed on the surface and the back face of the main board body, so that the mechanical automation degree is improved. Therefore, the high integration level of the main board body can be achieved, the utilization rate of the board is increased, and the problems that the area of the main board body is increased and the applicability is reduced due to multi-element installation are effectively solved.

Description

Technical Field

[0001] This application relates to the technical field of mainboards, and particularly to a new type of mainboard with high integration. Background Art

[0002] With the progress of technology, the degree of mechanical automation is getting higher and higher. Mechanical automation technology is one of the core technologies in the modern industrial field. It realizes the automation and intelligence of the mechanical manufacturing process by integrating advanced electronic technology, information technology and intelligent technology. The development and application of this technology have greatly improved production efficiency, reduced labor costs, and at the same time improved the quality and stability of products;

[0003] Relatively speaking, automated equipment often involves the access of various peripherals, such as sensors, actuators, display screens, etc. The computer mainboard needs to provide rich interface resources to meet the connection requirements of different peripherals. At the same time, the integration of the mainboard needs to be considered, and the space layout needs to be optimized to increase the utilization rate of the board material;

[0004] In view of this, the present utility model provides a new type of mainboard with high integration. Summary of the Utility Model

[0005] In view of the above deficiencies of the prior art, the purpose of this application is to provide a new type of mainboard with high integration, aiming to provide a computer mainboard with rich interfaces and high integration for the connection requirements of some equipment required for mechanical automation.

[0006] One technical solution adopted by this application to solve the technical problem is as follows:

[0007] A new type of mainboard with high integration, including a mainboard body, on the surface of which a fan socket A, a fan socket B, an antenna socket, a camera socket, an LVDS socket, a stepper motor socket and an infrared socket A are installed;

[0008] On the back of the mainboard body, a MIPI screen socket, a temperature sensor socket, a fan socket C, an HDMI socket and an infrared socket B are installed.

[0009] In a possible implementation manner, the fan socket A, the fan socket B, the antenna socket and the camera socket are located on the left edge of the surface of the mainboard body and are arranged in sequence from bottom to top.

[0010] In a possible implementation manner, the LVDS socket, the stepper motor socket and the infrared socket A are located on the upper edge of the surface of the mainboard body and are arranged in sequence from left to right.

[0011] In a possible implementation manner, the MIPI screen socket is located on the upper edge of the back of the mainboard body.

[0012] In a possible implementation, the temperature sensor socket and the fan socket C are located at the right edge of the back side of the main board body, and are arranged in sequence from top to bottom.

[0013] In a possible implementation, the HDMI socket and the infrared socket B are located at the lower edge of the back side of the main board body, and are arranged in sequence from right to left.

[0014] In a possible implementation, a button socket A, a limit plate socket, a power socket, a power-on button, and a speaker socket A are further installed on the surface of the main board body.

[0015] In a possible implementation, the button socket A is located between the stepper motor socket and the infrared socket A, the limit plate socket is located on the right side of the infrared socket A, and the power socket, the power-on button, and the speaker socket A are located at the right edge of the surface of the main board body, and are arranged in sequence from top to bottom.

[0016] In a possible implementation, a speaker socket B, a button socket B, a reset button, a headphone socket, a USB socket A, and a USB socket B are further installed on the back side of the main board body.

[0017] In a possible implementation, the speaker socket B is located at the left edge of the back side of the main board body, the button socket B is located on the left side of the MIPI screen socket, the headphone socket is located on the right side of the HDMI socket, the USB socket A and the USB socket B are located between the HDMI socket and the infrared socket B, and are arranged in sequence from right to left, and the reset button is located between the headphone socket and the fan socket C.

[0018] Compared with the prior art, the beneficial effects of the present application are as follows:

[0019] 1. Through the integration of the antenna socket, the camera socket, the LVDS socket, the stepper motor socket, the infrared socket A, the MIPI screen socket, the temperature sensor socket, the HDMI socket, and the infrared socket B on the main board body, the present utility model can meet 90% of the peripheral connection requirements of mechanical automation.

[0020] 2. Secondly, through the settings of the fan socket A, the fan socket B, and the fan socket C, it can be connected to multiple peripheral fans for operation to achieve rapid heat dissipation. At the same time, through the temperature sensor socket installed on the main board, the temperature of the device can be monitored in real time to prevent overheating damage, thereby improving the reliability and safety of the device.

[0021] 3. In addition, through the installation of each component on the front and back surfaces of the main board body, high integration of the main board body can be achieved, so as to increase the utilization rate of the board material, effectively reduce the increase in the area of the main board body caused by the installation of multiple components, and reduce the problem of applicability. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a front view structural schematic diagram of a novel main board with high integration provided by this embodiment;

[0024] Figure 2 It is a side view structural schematic diagram of a novel main board with high integration provided by this embodiment;

[0025] Figure 3 It is a rear view structural schematic diagram of a novel main board with high integration provided by this embodiment.

[0026] In the figure: 1. Fan seat A; 2. Fan seat B; 3. Antenna seat; 4. Camera seat; 5. LVDS seat; 6. Stepper motor seat; 7. Button seat A; 8. Infrared seat A; 9. Limiting plate seat; 10. Power supply seat; 11. Power-on button; 12. Speaker seat A; 13. Speaker seat B; 14. Button seat B; 15. MIPI screen seat; 16. Temperature sensor seat; 17. Fan seat C; 18. Reset button; 19. Headphone seat; 20. HDMI seat; 21. USB seat A; 22. USB seat B; 23. Infrared seat B; 24. Main board body. Specific embodiments

[0027] The following will describe the embodiments of the present application in detail. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0028] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0029] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0030] In addition, the technical features involved in different embodiments of the present utility model described above can be combined with each other as long as they do not conflict with each other.

[0031] The present utility model provides a new main board with high integration as shown in Figures 1 - 3 to meet the connection requirements of equipment for mechanical automation, and provides a computer main board with rich interfaces and high integration. Its main structure includes a main board body 24. On the surface of the main board body 24, a fan seat A1, a fan seat B2, an antenna seat 3, a camera seat 4, an LVDS seat 5, a stepper motor seat 6, and an infrared seat A8 are installed. The fan seat A1, the fan seat B2, the antenna seat 3, and the camera seat 4 are located at the left edge of the surface of the main board body 24 and are arranged in sequence from bottom to top. The antenna seat 3 is mainly used for the transceiver of wireless network signals, enabling it to achieve wireless network connection. The LVDS seat 5, the stepper motor seat 6, and the infrared seat A8 are located at the upper edge of the surface of the main board body 24 and are arranged in sequence from left to right;

[0032] Specifically, the LVDS socket 5 is mainly used for transmitting video signals and is usually applied to computer monitors and other devices that require high-definition video transmission. This type of connector has characteristics such as high-speed transmission, low power consumption, and good electromagnetic compatibility, and can meet the high requirements of modern electronic devices for data transmission efficiency and stability. The stepper motor socket 6 is a component used to connect the stepper motor, which can ensure that the stepper motor can accurately respond to the input electrical pulse signal and achieve precise position control. For example, when used in an automated robotic arm, it can achieve the precise operation of the robotic arm.

[0033] On the back of the main board body 24, there are an MIPI screen socket 15, a temperature sensor socket 16, a fan socket C17, an HDMI socket 20, and an infrared socket B23. The MIPI screen socket 15 is located at the upper side edge of the back of the main board body 24. The temperature sensor socket 16 and the fan socket C17 are located at the right side edge of the back of the main board body 24 and are arranged in sequence from top to bottom. The HDMI socket 20 and the infrared socket B23 are located at the lower side edge of the back of the main board body 24 and are arranged in sequence from right to left.

[0034] Specifically, the MIPI screen socket 15 is a high-bandwidth and low-power interface for mobile devices and is widely used for connecting the display screens of mobile devices such as tablets. It can support the connection of single or multiple cameras and provide flexible scalability. The infrared socket A8 and the infrared socket B23 are five-pin sockets used to connect infrared transmission devices. The advantage of the infrared interface is that it is very convenient. Using its own special connection protocol, the data transmission speed can reach 4 Mbps. Moreover, within the effective area, multiple devices can dynamically join and leave the connection, allowing multiple users to dynamically establish or terminate the connection and achieve "resume interrupted transfer", and it has good security functions.

[0035] Furthermore, on the surface of the main board body 24, there are also a button socket A7, a limit plate socket 9, a power socket 10, a power-on button 11, and a speaker socket A12. The button socket A7 is located between the stepper motor socket 6 and the infrared socket A8. The limit plate socket 9 is located on the right side of the infrared socket A8. The power socket 10, the power-on button 11, and the speaker socket A12 are located at the right side edge of the surface of the main board body 24 and are arranged in sequence from top to bottom. On the back of the main board body 24, there are also a speaker socket B13, a button socket B14, a reset button 18, a headphone socket 19, a USB socket A21, and a USB socket B22. The speaker socket B13 is located at the left side edge of the back of the main board body 24. The button socket B14 is located on the left side of the MIPI screen socket 15. The headphone socket 19 is located on the right side of the HDMI socket 20. The USB socket A21 and the USB socket B22 are located between the HDMI socket 20 and the infrared socket B23 and are arranged in sequence from right to left. The reset button 18 is located between the headphone socket 19 and the fan socket C17.

[0036] The above components are basically common installation components of an existing computer motherboard, such as speaker socket A12, speaker socket B13, USB socket A21, and USB socket B22, etc. Speaker socket A12 and speaker socket B13 are used to connect speakers to output sound signals, which can transmit information about the system status and prompt the user about the operating status of the computer by emitting different sounds. For example, a short "beep" sound when starting up indicates that the system has started normally, while continuous long beeps may indicate a memory fault or other hardware problems. This design enables users to understand the basic operating conditions of the computer through hearing, especially when there is no visual interface or screen, and this sound prompt becomes particularly important, not only improving the maintainability of the computer but also enabling users to more intuitively understand the operating status of the computer; and there is no need to elaborate on USB socket A21 and USB socket B22 anymore. It is a general serial bus standard used to connect the computer to various external devices.

[0037] In summary, through the installation of the above various components on the front and back surfaces of the motherboard main body 24, the high integration of each component is achieved, meeting the needs of most intelligent automated mechanical equipment in the market. At the same time, through the application on the front and back surfaces of the motherboard main body 24, the space layout of the motherboard main body 24 is effectively optimized, increasing the utilization rate of the board material.

[0038] Obviously, the above embodiments are only examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A new type of highly integrated motherboard, comprising a motherboard body (24), characterized in that: The surface of the mainboard body (24) is equipped with a fan seat A (1), a fan seat B (2), an antenna seat (3), a camera seat (4), an LVDS seat (5), a stepping motor seat (6) and an infrared seat A (8); A MIPI screen seat (15), a temperature sensor seat (16), a fan seat C (17), an HDMI seat (20) and an infrared seat B (23) are installed on the back of the main board body (24).

2. The highly integrated new motherboard according to claim 1, characterized in that: The fan seat A (1), the fan seat B (2), the antenna seat (3) and the camera seat (4) are located on the left edge of the surface of the main board body (24) and are arranged in sequence from bottom to top.

3. The highly integrated new motherboard according to claim 2, characterized in that: The LVDS seat (5), the stepping motor seat (6) and the infrared seat A (8) are located on the upper edge of the surface of the main board body (24) and are arranged in sequence from left to right.

4. The new type of highly integrated motherboard according to claim 3, characterized in that: The MIPI screen seat (15) is located at the upper edge of the back side of the main board body (24).

5. The new type of highly integrated motherboard according to claim 4, characterized in that: The temperature sensor seat (16) and the fan seat C (17) are located at the right edge of the back side of the main board body (24), and are arranged in sequence from top to bottom.

6. The new type of highly integrated motherboard according to claim 5, characterized in that: The HDMI socket (20) and the infrared socket B (23) are located at the lower edge of the back side of the main board body (24), and are arranged in sequence from right to left.

7. The new type of highly integrated motherboard according to claim 6, characterized in that: The surface of the mainboard body (24) is also equipped with a button seat A (7), a limit plate seat (9), a power seat (10), a power button (11) and a speaker seat A (12).

8. The new type of highly integrated motherboard according to claim 7, characterized in that: The button seat A (7) is located between the stepping motor seat (6) and the infrared seat A (8), the limit plate seat (9) is located on the right side of the infrared seat A (8), and the power seat (10), the power button (11) and the speaker seat A (12) are located on the right edge of the surface of the main board body (24), and are arranged in sequence from top to bottom.

9. The new type of highly integrated motherboard according to claim 8, characterized in that: The back of the main board body (24) is also equipped with a speaker seat B (13), a button seat B (14), a reset button (18), an earphone seat (19), a USB seat A (21) and a USB seat B (22).

10. The new type of highly integrated motherboard according to claim 9, characterized in that: The speaker socket B (13) is located at the left edge of the back side of the main board body (24), the button socket B (14) is located on the left side of the MIPI screen socket (15), the headphone socket (19) is located on the right side of the HDMI socket (20), the USB socket A (21) and the USB socket B (22) are located between the HDMI socket (20) and the infrared socket B (23), and are arranged in sequence from right to left, and the reset button (18) is located between the headphone socket (19) and the fan socket C (17).

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