Garbage power plant hearth flame image recognition device

Abstract

The utility model discloses a hearth flame image recognition device for a garbage power plant, which belongs to the technical field of flame recognition equipment and comprises an image recognizer body, a heat dissipation device arranged on the image recognizer body, a heat insulation shell arranged outside the heat dissipation device and an air guide device used for dissipating heat of the heat dissipation device. According to the utility model, the first semiconductor chilling plate is adopted to cool the image recognizer body, so that the image recognizer has the advantage of small volume, can generate low temperature of dozens of degrees below zero, can cool the image recognition device body, and improves the working stability of the device.

Description

Technical Field

[0001] The utility model relates to a furnace flame image recognition device for a waste power plant, belonging to the field of flame recognition equipment. Background Art

[0002] With the acceleration of the urbanization process and the continuous growth of the population, waste treatment has become an increasingly serious problem. Waste incineration power generation, as a way of resource utilization and harmless treatment, has been widely used globally. However, the flame stability during the waste incineration process directly affects the incineration efficiency, pollutant emissions, and the safe operation of equipment.

[0003] Currently, waste incineration power plants generally use flame image recognition devices to monitor the combustion conditions in the furnace.

[0004] Because the temperature in the incineration furnace is relatively high, high requirements are put forward for the cooling of the flame image recognition device. Currently, the commonly used water-cooling method has problems such as the coolant not being able to maintain a low temperature and the heat dissipation capacity not meeting the requirements. Moreover, the water-cooling has the problem that the contact area is limited by the pipeline, resulting in a limited contact area. In addition, the cooling capacity of the water-cooling device is positively correlated with the pipeline flow rate. When the pipeline diameter is increased to increase the flow rate and enhance the heat dissipation capacity, the overall volume will increase. The increase in volume leads to an increase in the external contact area, resulting in an increase in the received heat and reducing the effect of increasing the water-cooling pipeline flow rate. Content of the Utility Model

[0005] Aiming at the problems existing in the above-mentioned prior art, the utility model provides a furnace flame image recognition device for a waste power plant, which can quickly generate a low temperature of dozens of degrees below zero under the condition of a small volume, cool the image recognition device body, and improve the working stability of the device.

[0006] In order to achieve the above purpose, the furnace flame image recognition device for a waste power plant includes an image recognition device body, and also includes:

[0007] A heat dissipation device, including a plurality of first semiconductor refrigeration chips arranged on the side wall of the image recognition device body with the refrigerating surface facing the inside of the image recognition device body;

[0008] A heat insulation housing, arranged outside the image recognition device body and the first heat dissipation device, and a first air outlet is arranged at one end located in the furnace;

[0009] A wind guiding device, including an air inlet pipe communicated with the heat insulation housing and an air inlet fan arranged in the air inlet pipe.

[0010] Preferably, the heat dissipation device further includes:

[0011] The mounting plate is arranged on the outer side wall of the image recognizer body. The first semiconductor refrigeration chip is arranged on the mounting plate. Both ends of the mounting plate are provided with inclined plates, and threads are arranged on the inclined plates.

[0012] The fastening sleeve is matched with the threads on the mounting plate.

[0013] Preferably, heat dissipation fins are arranged on the heat generating surface of the first semiconductor refrigeration chip.

[0014] Preferably, the air guiding device further includes:

[0015] The second semiconductor refrigeration chip is arranged on the side wall of the air inlet pipe, and its refrigerating surface faces the inside of the air inlet pipe.

[0016] Preferably, a second air outlet is arranged on the side wall of the air inlet pipe on the lower air outlet side of the air inlet fan, and a wind guiding plate covering the second semiconductor refrigeration chip is arranged on the second air outlet.

[0017] Preferably, a baffle is arranged near the shooting side of the image recognizer body at the first air outlet.

[0018] Preferably, the mounting plate is a multi-layer heat insulation plate body.

[0019] Compared with the prior art, the beneficial effects of the present utility model are:

[0020] 1. By arranging the first semiconductor refrigeration chip to cool the image recognizer body, with a small volume, it can use a large contact area and quickly generated low temperature to cool the inside of the image recognizer body, and maintain the normal operation of the image recognizer body.

[0021] 2. The air guiding device can blow out the heat generated by the heat generating surface of the first semiconductor refrigeration chip from the first air outlet to maintain the normal operation of the first semiconductor refrigeration chip.

[0022] 3. By using the second semiconductor refrigeration chip to cool the heat generating surface of the first semiconductor refrigeration chip, the heat dissipation effect can be improved, the temperature difference between the cold and hot surfaces of the first semiconductor refrigeration chip can be maintained, the working stability can be improved, and a part of the airflow generated by the air inlet fan is discharged from the second air outlet to cool the heat generating surface of the second semiconductor refrigeration chip, so as to maintain the normal operation of the second semiconductor refrigeration chip. Brief Description of the Drawings

[0023] Figure 1 is the structural schematic diagram of the present utility model Figure 1 ;

[0024] Figure 2 is the structural schematic diagram of the upper cover plate of the present utility model Figure 2 ;

[0025] Figure 3Schematic diagram of the internal structure of the present utility model;

[0026] Figure 4 Schematic diagram of the structure of the heat dissipation device of the present utility model.

[0027] In the figure: 1. Image recognition device body, 2. Heat dissipation device, 2-1. First semiconductor refrigeration sheet, 2-2. Mounting plate, 2-3. Tightening sleeve, 2-4. Heat dissipation fins, 3. Heat insulation housing, 3-1. First air outlet, 3-2. Baffle, 4. Air guiding device, 4-1. Air inlet pipe, 4-2. Air inlet fan, 4-3. Second semiconductor refrigeration sheet, 4-4. Second air outlet, 4-5. Air guiding plate. Specific embodiments

[0028] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] Embodiment 1, as Figures 1 to 4 shown, the garbage power plant furnace flame image recognition device provided by the embodiment of the present utility model includes an image recognition device body 1 for furnace flame recognition. An insulating housing 3 for heat insulation is arranged outside the image recognition device body 1. A part of the insulating housing 3 is installed inside the furnace and the other part is located outside the furnace. A heat dissipation device 2 is arranged on the outer side wall of the image recognition device body 1. The heat dissipation device 2 includes a plurality of first semiconductor refrigeration sheets 2-1 arranged on the outer wall of the image recognition device body 1. The refrigerating surface of the first semiconductor refrigeration sheet 2-1 faces the inside of the image recognition device body 1 to cool it and maintain the normal working temperature of the image recognition device body 1 inside the furnace. An air guiding device 4 is also arranged inside the insulating housing 3. The air guiding device 4 includes an air inlet pipe 4-1 communicated with the insulating housing 3 and an air inlet fan 4-2 arranged in the air inlet pipe 4-1. A plurality of first air outlets 3-1 are arranged at one end of the insulating housing 3 located inside the furnace. The fan 4-2 blows external cold air into the insulating housing 3, passes through the heating surface of the first semiconductor refrigeration sheet 2-1, takes away the heat, and the hot air is discharged from the first air outlet 3-1 to maintain the normal operation of the first semiconductor refrigeration sheet 2-1.

[0030] Embodiment 2: As Figure 3As shown, in order to facilitate the installation of the first semiconductor refrigeration chip 2-1, an installation plate 2-2 is further provided on the outer wall of the image recognition device body 1. The first semiconductor refrigeration chip 2-1 is arranged on the installation plate 2-2. Tilted plates are provided at both ends of the installation plate 2-2. Threads are provided on the tilted plates, and a fastening sleeve 2-3 that mates with the threads is also provided. By tightening and squeezing the installation plate 2-2 with the fastening sleeve 2-3, while facilitating the installation, the first semiconductor refrigeration chip 2-1 is made to contact the image recognition device body 1 more closely, improving the heat conduction efficiency. Moreover, the installation plate 2-2 is made of a multi-layer heat insulation plate body, which can effectively isolate both sides of the first semiconductor refrigeration chip 2-1 and maintain the normal operation of the first semiconductor refrigeration chip 2-1.

[0031] Furthermore, in order to improve the heat dissipation efficiency of the heating surface of the first semiconductor refrigeration chip 2-1, as Figure 4 shown, heat dissipation fins 2-4 are provided on the heating surface of the first semiconductor refrigeration chip 2-1.

[0032] Embodiment 3: As Figure 3 shown, in order to improve the heat dissipation efficiency of the heating surface of the first semiconductor refrigeration chip 2-1 and maintain the normal operation of the first semiconductor refrigeration chip 2-1, a plurality of second semiconductor refrigeration chips 4-3 are provided on the side wall of the air inlet pipe 4-1 to cool the air in the air inlet pipe 4-1, thereby improving the cooling effect on the heating surface of the first semiconductor refrigeration chip 2-1.

[0033] Furthermore, in order to maintain the normal operation of the second semiconductor refrigeration chip 4-3 and cool the heating surface of the second semiconductor refrigeration chip 4-3, Figure 3 shown, a plurality of second exhaust ports 4-4 are provided on the air inlet pipe 4-1 at the lower air outlet of the air inlet fan 4-2. Part of the air driven by the air inlet fan 4-2 is discharged from the second exhaust ports 4-4 and blows over the heating surface of the second semiconductor refrigeration chip 4-3 to achieve the cooling of its heating surface and maintain the normal operation of the second semiconductor refrigeration chip 4-3. Moreover, a wind guide plate 4-5 is provided on the surface of the second semiconductor refrigeration chip 4-3 to direct the discharged air flow in the opposite direction of the air inlet of the air inlet fan 4-2, reducing the intake of hot air by the air inlet fan 4-2.

[0034] In order to reduce the influence of hot air on the shooting of the image recognition device body 1, a baffle 3-2 is provided on one side of the first exhaust port 3-1 close to the shooting end of the image recognition device body 1 to block the hot air discharged from the first exhaust port 3-1 from flowing in other directions and reduce the interference with the shooting of the image recognition device body 1.

[0035] Working process: The intake fan 4-2 in the intake air duct 4-1 blows external cold air into the heat insulation housing 3. The air in the intake air duct 4-1 is further cooled by the second semiconductor heat sink 4-3. After the cold air enters the heat insulation housing 3, it passes through the heating surface of the first semiconductor refrigeration sheet 2-1, taking away the heat, and the hot air is discharged from the first air outlet 3-1.

[0036] The refrigerating surface of the first semiconductor refrigeration sheet 2-1 cools the image recognition device body 1 to maintain the normal operation of the image recognition device body 1.

[0037] In summary, by setting the first semiconductor refrigeration sheet 2-1 to cool the image recognition device body 1, in the case of a small volume, it can use a large contact area and the rapidly generated low temperature to cool the inside of the image recognition device body 1 and maintain the normal operation of the image recognition device body 1; the air guiding device 4 can blow out the heat generated by the heating surface of the first semiconductor refrigeration sheet 2-1 from the first air outlet 3-1 to maintain the normal operation of the first semiconductor refrigeration sheet 2-1; using the second semiconductor refrigeration sheet 4-3 to cool the heating surface of the first semiconductor refrigeration sheet 2-1 can improve the heat dissipation effect, maintain the temperature difference between the cold and hot surfaces of the first semiconductor refrigeration sheet 2-1, improve the working stability, and a part of the air flow generated by the intake fan 4-2 is discharged from the second air outlet 4-4 to cool the heating surface of the second semiconductor refrigeration sheet 4-3, thus maintaining the normal operation of the second semiconductor refrigeration sheet 4-3.

[0038] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit and basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0039] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A flame image recognition device for a furnace of a garbage power plant, comprising an image recognition device body (1), characterized in that: Also includes: A heat dissipation device (2) comprising a plurality of first semiconductor cooling sheets (2-1) arranged on the side wall of the image recognizer body (1) and with the cooling surface facing the interior of the image recognizer body (1); A heat-insulating shell (3) is arranged outside the image recognition device body (1) and the first heat dissipation device (2), and a first air outlet (3-1) is arranged at one end located in the furnace; The air guide device (4) comprises an air inlet pipe (4-1) connected to the heat-insulating shell (3) and an air inlet fan (4-2) arranged in the air inlet pipe (4-1).

2. The device for recognizing flame images in a furnace of a garbage power plant according to claim 1, characterized in that: The heat dissipation device (2) further comprises: A mounting plate (2-2) is arranged on the outer side wall of the image recognition device body (1); the first semiconductor cooling plate (2-1) is arranged on the mounting plate (2-2); inclined plates are arranged at both ends of the mounting plate (2-2); and threads are arranged on the inclined plates; The fastening sleeve (2-3) cooperates with the threads on the mounting plate (2-2).

3. The device for recognizing flame images in a furnace of a garbage power plant according to claim 1, characterized in that: The heat-generating surface of the first semiconductor refrigeration sheet (2-1) is provided with heat-dissipating fins (2-4).

4. The device for recognizing flame images in a furnace of a garbage power plant according to claim 3, characterized in that: The air guide device (4) further comprises: The second semiconductor refrigeration sheet (4-3) is arranged on the side wall of the air inlet pipe (4-1), and its refrigeration surface faces the inside of the air inlet pipe (4-1).

5. The device for recognizing flame images in a furnace of a garbage power plant according to claim 4, characterized in that: A second air outlet (4-4) is provided on the side wall of the air inlet pipe (4-1) at the lower air outlet side of the air inlet fan (4-2), and an air guide plate (4-5) covering the second semiconductor refrigeration sheet (4-3) is provided on the second air outlet (4-4).

6. The device for recognizing flame images in a furnace of a garbage power plant according to claim 1, characterized in that: A baffle (3-2) is provided on the first air outlet (3-1) close to the shooting side of the image recognition device body (1).

7. The device for recognizing flame images in a furnace of a garbage power plant according to claim 2, characterized in that: The mounting plate (2-2) is a multi-layer heat insulation plate body.

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