Cleaning device for die bonder

Abstract

The utility model discloses a cleaning device for a die bonder. The cleaning device comprises an air blowing pipe, a regulating valve, a bracket and an air pump, the air blowing pipe comprises a main pipe, a functional pipe and a hose, the main pipe is connected between the functional pipe and the hose, the free end of the functional pipe is an air blowing opening, and the air blowing opening points to and is close to the to-be-taken wafer and the suction nozzle; the hose is mounted at the second end of the main pipe; the regulating valve is mounted on the hose and is used for controlling the air flow; the bracket is used for mounting the air blowing pipe and the adjusting valve; an air outlet of the air pump is connected with the hose and used for providing an airflow source. According to the utility model, clean airflow can be blown to the wafer to be taken and the suction nozzle, so that silicon chips or other foreign matters are prevented from being adhered to the suction nozzle or the wafer, the normal proceeding of a die bonding process is ensured, the phenomenon that the wafer is crushed is avoided, and the stability of chip packaging quality is ensured.

Description

Technical Field

[0001] The utility model relates to a cleaning device for the chip soldering process, specifically a cleaning device for a die bonder. Background Art

[0002] Semiconductor packaging is a process of processing wafers into independent chip products according to product models and functional requirements. Among them, die bonding is a key link in packaging. Die bonding is a process of attaching the independent wafers obtained by scribing the wafer to the designated areas of the corresponding substrate holders to form a thermal path or an electrical path, providing conditions for subsequent wire bonding.

[0003] In the die bonding process during chip packaging, the problem of wafer crushing often occurs. Most of the reasons for wafer crushing are that foreign objects adhere to the suction nozzles for picking up wafers, and the wafers are crushed when the suction nozzles pick up other wafers.

[0004] After the wafer is scribed and cut, there will be foreign object residues, such as foreign foreign objects or silicon chips, etc. Once the silicon debris adheres to the suction nozzles for picking up wafers during die bonding, it will cause batch abnormalities. Therefore, it is necessary to keep the wafer surface clean during die bonding.

[0005] Therefore, it is urgent to solve the problem of foreign object residues on the wafer surface. Summary of the Utility Model

[0006] In order to solve the above technical problems, the utility model provides a cleaning device for a die bonder.

[0007] The technical solution adopted by the utility model is as follows:

[0008] 1. A cleaning device for a die bonder, characterized by comprising

[0009] A blowpipe, which includes a main pipe, a functional pipe, and a flexible pipe. The main pipe is located between the functional pipe and the flexible pipe. The free end of the functional pipe is a blowing port, and the blowing port points to and is close to the wafers to be picked up and the suction nozzles in the die bonder to blow out air currents to the wafers to be picked up;

[0010] A bracket, which is used to install the blowpipe and the die bonder;

[0011] An air pump, which is connected to the flexible pipe and is used to provide a source of air current; and

[0012] A regulating valve, which is installed on the flexible pipe and is used to control the magnitude of the air current.

[0013] Further, a first mounting hole is provided at the first end of the bracket for connecting the bracket to the frame of the die bonder. A first connecting member is provided at a position close to the second end of the bracket, and the first connecting member is used for connecting the main pipe. A second connecting member is further provided on the bracket. The second connecting member is provided with a second mounting hole, and the second mounting hole is used for mounting the regulating valve.

[0014] Further, the second connecting member is fixedly connected to one side of the bracket, and the regulating valve is connected and fixed to the second connecting member through a bolt structure.

[0015] Further, the main pipe is welded to the first connecting member.

[0016] Further, the main pipe is movably connected to the first connecting member. The first connecting member is provided as a guide sleeve through which the main pipe can pass. The guide sleeve is provided with a second mounting hole, and a fastening bolt is installed in the second mounting hole. The main pipe is fixed to the guide sleeve through the fastening bolt.

[0017] Further, the cleaning device is further provided with a first power device for controlling the horizontal movement of the blowing pipe. The first power device is connected to the main pipe. The first connecting member is provided as a guide sleeve, and the main pipe is slidably and cooperatively connected to the guide sleeve. The first power device controls the horizontal movement of the main pipe.

[0018] Further, the functional pipe is arranged deviating from the central axis of the main pipe, and the functional pipe is fixedly connected to the main pipe.

[0019] Further, the functional pipe is provided with a structure that can be bent relative to the main pipe. The functional pipe is connected to the main pipe through a bellows, and a second power device capable of controlling the bending angle of the functional pipe is installed on the main pipe.

[0020] Further, the die bonder includes a frame, a nozzle, a thimble, and a wafer fixing seat, and the cleaning device is installed on the frame.

[0021] Further, two sets of the cleaning devices are provided and are symmetrically arranged in the horizontal direction with respect to the wafer fixing seat.

[0022] The beneficial effects of the present utility model are as follows: 1) A cleaning device is provided to blow a cleaning air flow to the wafer to be picked and the nozzle, so as to prevent silicon debris or other foreign matters from adhering to the nozzle or the wafer, ensure the normal progress of the die bonding process, and avoid the phenomenon of crushing the wafer;

[0023] 2) A first power device is provided to control the movement of the blowing pipe, and the distance between the blowing port and the nozzle and the wafer to be picked can be adjusted according to the working conditions at the operation site, so that it can blow air to the nozzle and the wafer to be picked, enhancing its applicability;

[0024] 3) Set up the second power device, and connect the main pipe and the functional pipe using a bourdon tube, which can conveniently adjust the blowing angle of the blowing port, further improving the cleaning range and operational flexibility of the cleaning device;

[0025] The present utility model ensures the stability of the chip packaging quality. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the first embodiment of a cleaning device for a die bonder according to the present utility model;

[0027] Figure 2 It is a schematic structural diagram of the second embodiment of a cleaning device for a die bonder according to the present utility model;

[0028] Figure 3 It is a schematic structural diagram of the third embodiment of a cleaning device for a die bonder according to the present utility model;

[0029] Figure 4 It is a schematic structural diagram of the fourth embodiment of a cleaning device for a die bonder based on the first embodiment according to the present utility model;

[0030] Figure 5 It is a schematic structural diagram of the fifth embodiment of a cleaning device for a die bonder based on the second embodiment according to the present utility model;

[0031] Figure 6 It is a schematic structural diagram of the sixth embodiment of a cleaning device for a die bonder based on the third embodiment according to the present utility model;

[0032] Figure 7 It is a schematic structural diagram of a die bonder described in the seventh embodiment of the present utility model;

[0033] Figure 8 It is a schematic structural diagram of the working principle of a die bonder described in the seventh embodiment of the present utility model.

[0034] In the figure, 1 - blowing pipe, 11 - main pipe, 12 - functional pipe, 121 - blowing port, 13 - hose, 14 - bourdon tube, 2 - regulating valve, 3 - bracket, 31 - first mounting hole, 32 - first connecting piece, 33 - second connecting piece, 34 - second mounting hole, 341 - bolt structure, 35 - third mounting hole, 351 - fastening bolt, 4 - air pump, 5 - first power device, 6 - second power device;

[0035] A - frame, B - suction nozzle, C - ejector pin, D - wafer fixing seat, E - cleaning device, F - wafer, F1 - wafer to be picked. Detailed Description of the Embodiments Embodiment 1

[0036] The present utility model provides a feasible embodiment. As Figure 1 shown, a cleaning device for a die bonder includes a blowing pipe 1, a regulating valve 2, a bracket 3 and an air pump 4.

[0037] The blowing pipe 1 includes a main pipe 11, a functional pipe 12 and a hose 13. The main pipe 11 is located between the functional pipe 12 and the hose 13. The first end of the main pipe 11 is connected to the functional pipe 12, and the second end of the main pipe 11 is connected to the hose 13. The functional pipe 12 is arranged at a certain angle deviating from the central axis of the main pipe 11, and the functional pipe 12 is fixedly connected to the main pipe 13 to present an L-shaped structure. The distal end of the functional pipe 12 is a blowing port 121, and the blowing port 121 is used to blow out an air flow into the wafer F1 to be picked up in the die bonder. The blowing port 121 points to and is close to the wafer F1 to be picked up and the suction nozzle B above the wafer F1. The air pump 4 is connected to the hose 13 to provide the source of the air flow, and a regulating valve 2 is installed on the hose 13, which can be used to control the magnitude of the air flow rate.

[0038] The bracket 3 is used to install the blowing pipe 1, the regulating valve 2 and the die bonder. The bracket 3 is in a plate-like structure. The first end thereof is provided with a first mounting hole 31 for connecting the bracket 3 to the die bonder. A first connecting member 32 is arranged at a position of the bracket 3 close to the second end, and the first connecting member 32 is used to connect the main pipe 11; a second connecting member 33 is further arranged on the bracket 3, and the second connecting member 33 is provided with a second mounting hole 34, and the second mounting hole 34 is used to install the regulating valve 2.

[0039] The second connecting member 33 is fixedly connected to one side of the bracket 3, and the regulating valve 2 is connected and fixed to the second connecting member 33 through a bolt structure 341.

[0040] The main pipe 11 is fixedly connected to the first connecting member 32 by welding. By adopting this connection method, the connection between the main pipe 11 and the bracket 3 can be made more firm. Embodiment Two

[0041] The present utility model provides a feasible embodiment. As Figure 2 shown, it also includes a blowing pipe 1, a regulating valve 2, a bracket 3 and an air pump 4 as in Embodiment One. In addition, the main pipe 11 and the first connecting member 32 are movably connected. The first connecting member 32 is set as a guide sleeve through which the main pipe 11 can pass. The guide sleeve is provided with a third mounting hole 35, and a fastening bolt 351 is installed in the third mounting hole 35. The main pipe 11 is fixed to the guide sleeve through the fastening bolt. By adopting this connection method, the position or distance of the blowing port 121 relative to the suction nozzle can be conveniently adjusted manually, and the operation is flexible and convenient. Embodiment Three

[0042] The present utility model provides a feasible embodiment, as Figure 3 shown. Similar to the first embodiment, it also includes a blowing pipe 1, a regulating valve 2, a bracket 3 and an air pump 4. In addition, the cleaning device E is further provided with a first power device 5 for controlling the horizontal movement of the blowing pipe 1. The first power device 5 is connected to the main pipe 11. The first connecting member 32 is set as a guide sleeve. The main pipe 11 is slidably fitted and installed with the guide sleeve. The first power device 5 is a micro servo electric cylinder. The cylinder body of the micro servo electric cylinder is hinged to the bracket 3, and the output shaft of the micro servo electric cylinder is hinged to the main pipe 11 to control the horizontal movement of the main pipe 11. The setting of the first power device 5 further improves the convenience, controllability and accuracy of the position adjustment of the blowing port 121. Embodiment Four

[0043] Based on the above first embodiment, the present utility model provides Embodiment Four, as Figure 4 shown. In addition to having the same components as the first embodiment, the functional pipe 12 is set to be a bendable structure and is connected to the main pipe 11 through a bellows 14 to achieve its bending function. A second power device 6 for controlling the bending angle of the functional pipe 12 is installed on the main pipe 11.

[0044] The second power device 6 is a micro servo electric cylinder. The cylinder body of the micro servo electric cylinder is hinged to the main pipe 11, and the output shaft of the micro servo electric cylinder is hinged to the functional pipe 12 to control the adjustment of the deviation angle of the functional pipe 12.

[0045] The setting of the second power device 6 can further adjust the positional relationship between the blowing port 121 and the suction nozzle, and further provide guarantee for the cleaning of foreign matters during the wafer bonding process when picking up the wafer. Embodiment Five

[0046] Based on the above second embodiment, the present utility model provides Embodiment Five, as Figure 5 shown. In addition to having the same components as the second embodiment, the functional pipe 12 is set to be a bendable structure and is connected to the main pipe 11 through a bellows 14 to achieve its bending function. A second power device 6 for controlling the bending angle of the functional pipe 12 is installed on the main pipe 11.

[0047] The second power device 6 is a micro servo electric cylinder. The cylinder body of the micro servo electric cylinder is hinged to the main pipe 11, and the output shaft of the micro servo electric cylinder is hinged to the functional pipe 12 to control the adjustment of the deviation angle of the functional pipe 12.

[0048] The setting of the second power device 6 can further adjust the positional relationship between the air blowing port 121 and the suction nozzle, and further ensure that foreign matters can be cleaned up during the wafer bonding process when picking up the wafer. Embodiment Six

[0049] Based on the above Embodiment Three, the present utility model provides Embodiment Six, as Figure 6 shown. In addition to having the same components as Embodiment Three, the functional tube 12 is arranged in a bendable structure and is connected to the main tube 11 through a spring tube 14 to realize its bending function. A second power device 6 capable of controlling the bending angle of the functional tube 12 is installed on the main tube 11.

[0050] The second power device 6 is a micro servo electric cylinder. The cylinder body of the micro servo electric cylinder is hinged to the main tube 11, and the output shaft of the micro servo electric cylinder is hinged to the functional tube 12 to control the adjustment of the deviation angle of the functional tube 12.

[0051] The setting of the second power device 6 can further adjust the positional relationship between the air blowing port 121 and the suction nozzle, and further ensure that foreign matters can be cleaned up during the wafer bonding process when picking up the wafer. Embodiment Seven

[0052] As Figures 7-8 shown, the present utility model provides a cleaning device E for cleaning a die bonder. The die bonder is used to pick up the cut wafers and mount them on the designated areas of the substrate holder. The die bonder includes a frame A, a suction nozzle assembly, a thimble C, and a wafer fixing seat D. The cleaning device E is installed on the frame A.

[0053] Two groups of the cleaning devices E are provided and are symmetrically arranged with respect to the wafer fixing seat D.

[0054] The working process of the present utility model is as follows:

[0055] Place the cut wafer F on the wafer fixing seat D. The wafer located directly above the thimble C is the wafer to be picked up F1;

[0056] Manually or by using the first power device 5, adjust the position of the air blowing tube 1 so that the air blowing port 121 approaches the thimble C horizontally, and make the air blowing port 121 of the air blowing tube 1 point to the position of the wafer to be picked up F1 directly above the thimble C;

[0057] 2) Use the camera for positioning to move the suction nozzle B directly above the wafer to be picked up F1. At this time, the centers of the suction nozzle B, the wafer to be picked up F1, and the thimble C are located on the same vertical line;

[0058] 3) Turn on the air pump 4 and the regulating valve 2, and the air flow blows out from the air blowing port 121 towards the wafer F1 to be picked up;

[0059] 4) Move the suction nozzle B downward to approach the wafer F1 to be picked up. At this time, while the air flow blows towards the wafer F1 to be picked up, it also blows towards the suction nozzle B, blowing off the foreign matters remaining on the suction nozzle B and the wafer F1 to be picked up and the foreign matters around them;

[0060] 5) Turn on the ejector pin C and the suction nozzle B simultaneously, so that the ejector pin C jacks up the wafer F1 to be picked up upwards, and at the same time the suction nozzle B picks up the wafer F1 to be picked up and moves upwards, and transfers and places it in the designated area of the substrate holder, completing one die bonding operation;

[0061] 6) The wafer fixing seat D moves, moving the next wafer F1 to be picked up to directly above the ejector pin C, and the suction nozzle B resets, repeating steps 2)-5) to sequentially complete the die bonding process for all the wafers on the wafer.

[0062] In the above step 2), the second power device 6 can also be used to adjust the direction of the air blowing port 121 to achieve precise air blowing operation.

Claims

1. A cleaning device for a crystal bonding machine, characterized in that: include The air blowing pipe comprises a main pipe, a functional pipe and a soft pipe, wherein the main pipe is located between the functional pipe and the soft pipe; the free end of the functional pipe is an air blowing port, and the air blowing port is directed to and close to the wafer to be taken out and the suction nozzle in the die bonder so as to blow air to the wafer to be taken out; A bracket, used for mounting the air blowing pipe and the die bonding machine; an air pump connected to the hose and used to provide an air flow source; and A regulating valve is installed on the hose and is used to control the size of the air flow.

2. A cleaning device for a crystal bonding machine according to claim 1, characterized in that: A first mounting hole is provided at the first end of the bracket for connecting the bracket to the frame of the crystal bonding machine, and a first connecting piece is provided near the second end of the bracket, and the first connecting piece is used to connect the main pipe; a second connecting piece is also provided on the bracket, and the second connecting piece is provided with a second mounting hole, and the second mounting hole is used to install the regulating valve.

3. A cleaning device for a crystal bonding machine according to claim 2, characterized in that: The second connecting member is fixedly connected to one side of the bracket, and the regulating valve is connected and fixed to the second connecting member via a bolt structure.

4. The cleaning device for a crystal bonding machine according to claim 2, characterized in that: The main pipe is welded to the first connecting piece.

5. The cleaning device for a crystal bonding machine according to claim 2, characterized in that: The main pipe is movably connected to the first connecting member, the first connecting member is configured as a guide sleeve through which the main pipe can pass, the guide sleeve is provided with a second mounting hole, a fastening bolt is installed in the second mounting hole, and the main pipe is fixed to the guide sleeve by the fastening bolt.

6. The cleaning device for a crystal bonding machine according to claim 2, characterized in that: The cleaning device is also provided with a first power device for controlling the horizontal movement of the air blowing pipe, the first power device is connected to the main pipe, the first connecting member is set as a guide sleeve, the main pipe is slidably connected with the guide sleeve, and the first power device controls the horizontal movement of the main pipe.

7. A cleaning device for a die bonder according to any one of claims 1 to 6, characterized in that: The functional pipe is arranged offset from the central axis of the main pipe, and the functional pipe is fixedly connected to the main pipe.

8. A cleaning device for a die bonder according to any one of claims 1 to 6, characterized in that: The functional tube is configured as a structure capable of bending relative to the main tube, the functional tube is connected to the main tube via a spring tube, and a second power device capable of controlling the offset angle of the functional tube is installed on the main tube.

9. The cleaning device for a crystal bonding machine according to claim 1, characterized in that: The crystal bonding machine comprises a frame, a suction nozzle, a thimble and a wafer fixing seat, and the cleaning device is installed on the frame.

10. The cleaning device for a crystal bonding machine according to claim 9, characterized in that: The cleaning devices are arranged in two groups, which are symmetrically arranged in the horizontal direction relative to the wafer fixing seat.

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