Heat exchange cooling device in circuit board processing process

Abstract

The utility model relates to the technical field of cooling devices, in particular to a heat exchange cooling device in the processing process of a circuit board, which comprises a cooling system and a supporting system, the supporting system supports the circuit board on the surface of the cooling system, the cooling system cools the circuit board, and cooling water firstly exchanges heat with a heat conducting plate. The heat conduction plate is cooled and then exchanges heat with the circuit board, so that the circuit board is prevented from being damaged due to gathering and cold contraction caused by direct contact of supercooled cooling water with the circuit board, the cooling water continuously flows through the cooling pipe and exchanges heat with water in the cavity, the heat conduction plate is kept in a low-temperature state all the time, and the circuit board is mildly cooled. When the cooling water reaches the tail part of the cooling pipe, the temperature of the cooling water is increased, and the heated cooling water is discharged through a water outlet of the cooling pipe and is discharged into an external drainage facility for centralized treatment; the cooling device adopts a water cooling system, so that small particles in the surrounding environment cannot be blown up, the environment is not polluted, the performance of the circuit board cannot be reduced, and the body health of workers cannot be influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling devices, in particular to a heat exchange cooling device in the process of circuit board processing. Background Art

[0002] A circuit board is also called a ceramic circuit board, an alumina ceramic circuit board, a aluminum nitride ceramic circuit board, a printed circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, an ultra-thin circuit board, a printed (copper etching technology) circuit board, etc. The circuit board miniaturizes and visualizes the circuit, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances; the printed circuit board can be divided into three categories according to the number of layers: single-sided board, double-sided board and multi-layer printed circuit board; according to the characteristics, it can be divided into three categories: flexible board (FPC), rigid board (PCB), and flexible-rigid board (FPCB).

[0003] A large amount of heat is generated during the production process of the circuit board and cannot be immediately packaged or put into use. It is necessary to cool its temperature to an appropriate value before the next operation can be carried out. The traditional cooling method uses air cooling. After a large amount of air passes through the circuit board and continues to flow, small particles such as dust and debris around are blown floating in the air, polluting the circuit board and the operating environment, reducing the performance of the circuit board, and affecting the health of workers. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a heat exchange cooling device in the process of circuit board processing, so as to solve the problems in the related technology that small particles such as dust and debris around are blown floating in the air, polluting the circuit board and the operating environment, reducing the performance of the circuit board, and affecting the health of workers.

[0005] To achieve the above object, according to one aspect of the utility model, there is provided a heat exchange cooling device in the process of circuit board processing, including: a cooling system, the cooling system includes a cooling plate, a cooling tube group and a bracket, the cooling tube group is fixed inside the cooling plate by the bracket, when cooling water flows into the cooling tube group, heat exchange can occur with the cooling plate to reduce the temperature of the cooling plate;

[0006] A support system, the support system includes a fixing plate and a bottom plate, there are several fixing plates in total, the fixing plates are fixedly arranged on the upper surface of the bottom plate, and a notch is provided on the inner surface of the fixing plate, the fixing plate and the bottom plate provide support for the circuit board, when the circuit board is inserted into the notch, it is fixed on the surface of the cooling plate and conducts heat exchange with the cooling plate.

[0007] Further, both sides of one surface of the cooling plate are fixedly connected to the side surface of the fixing plate respectively, the cooling plate includes a partition plate, a heat conducting plate and a cavity, the cavity is located at the center of the cooling plate, and the cavity is filled with moisture, and the moisture is isolated from the outside.

[0008] Furthermore, the heat conducting plate is located inside the cooling plate and adjacent to the support system. The isolation plate is located on other outer surfaces of the cooling plate to prevent heat exchange between the moisture in the cavity and the outside world. The heat conducting plate exchanges heat with the moisture in the cavity to reduce its own temperature.

[0009] Furthermore, the cooling tube group includes cooling tubes, a cooling tube water inlet, and a cooling tube water outlet. The front end of the cooling tube is fixedly connected to the cooling tube water inlet, and the rear end is fixedly connected to the cooling tube water outlet. After cooling water flows into the cooling tube, it exchanges heat with the moisture in the cavity to reduce the temperature of the moisture in the cavity.

[0010] Furthermore, the bracket includes a support plate, a groove, and a screw hole. The support plate includes a fixed plate and a movable plate. The upper and lower ends of the fixed plate are respectively fixedly connected to the cooling plate. Grooves are provided on one side surface of the support plate. When the fixed plate and the movable plate are buckled together, the corresponding grooves of the support plate are combined to wrap the cooling tube therein.

[0011] Furthermore, screw holes are provided at the top and bottom of the support plate. The screw holes penetrate through the two buckled support plates, and bolts pass through the screw holes to fix the two buckled support plates together to support the cooling tube.

[0012] Furthermore, a water inlet is fixedly provided on one side of the cooling plate, and a water outlet is provided on the other side. The water inlet is fixedly connected to the cooling tube water inlet, and the water outlet is fixedly connected to the cooling tube water outlet.

[0013] Compared with the prior art, the present utility model has the following beneficial effects: The cooling water first exchanges heat with the heat conducting plate to cool down the heat conducting plate and then exchanges heat with the circuit board, avoiding direct contact between the overcooled cooling water and the circuit board, which may cause the circuit board to contract due to cold accumulation and be damaged. The continuous cooling water flows through the cooling tube and continuously exchanges heat with the moisture in the cavity to keep the heat conducting plate in a low temperature state all the time, gently cooling the circuit board. When the cooling water reaches the tail of the cooling tube, its temperature has risen, and the heated cooling water is discharged through the cooling tube water outlet and discharged into an external drainage facility for centralized treatment; This cooling device adopts a water cooling system, which will not blow up small particles in the surrounding environment, is pollution-free to the environment, will not reduce the performance of the circuit board, and will not affect the physical health of workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the whole of the present utility model;

[0015] Figure 2 is a schematic diagram of the structure of the cooling plate of the present utility model;

[0016] Figure 3 is a schematic cross-sectional view of the structure of the cooling plate of the present utility model;

[0017] Figure 4 Schematic diagram of the cooling tube group structure of the present utility model;

[0018] Figure 5 Schematic diagram of the support plate structure of the present utility model.

[0019] Illustration description:

[0020] 1. Cooling plate; 101. Isolation plate; 102. Heat conduction plate; 103. Cavity;

[0021] 2. Fixed plate;

[0022] 3. Notch;

[0023] 4. Water inlet;

[0024] 5. Water outlet;

[0025] 6. Bottom plate;

[0026] 7. Arc-shaped opening;

[0027] 8. Cooling tube group; 801. Cooling tube; 802. Cooling tube water inlet; 803. Cooling tube water outlet;

[0028] 9. Bracket; 901. Support plate; 902. Groove; 903. Screw hole. Detailed implementation manners

[0029] To further elaborate on the technical means and effects adopted by the present utility model to achieve the predetermined utility model purpose, the following combines the drawings and preferred embodiments to detail the specific implementation manners, structures, features and their effects according to the present utility model as follows.

[0030] Please refer to Figures 1 to 5 , this embodiment provides a heat exchange cooling device during the circuit board processing, including: a cooling system, the cooling system includes a cooling plate 1, a cooling tube group 8 and a bracket 9, the cooling tube group 8 is fixed inside the cooling plate 1 by the bracket 9, when cooling water flows into the cooling tube group 8, heat exchange can occur with the cooling plate 1 to reduce the temperature of the cooling plate 1;

[0031] A support system, the support system includes a fixed plate 2 and a bottom plate 6, there are two fixed plates 2 in total, the fixed plates 2 are fixedly arranged on the upper surface of the bottom plate 6, and a notch 3 is provided on the inner surface of the fixed plate 2, the fixed plate 2 and the bottom plate 6 provide support for the circuit board, when the circuit board is inserted into the notch 3, it is fixed on the surface of the cooling plate 1 and conducts heat exchange with the cooling plate 1 to reduce the temperature of the circuit board.

[0032] On both sides of one surface of the cooling plate 1, they are respectively fixedly connected to the side surface of the fixing plate 2. The cooling plate 1 includes a partition plate 101, a heat conducting plate 102, and a cavity 103. The cavity 103 is located at the center of the cooling plate 1, and the cavity 103 is filled with water. The water is isolated from the outside to prevent the water temperature from rising and reducing the cooling effect of the circuit board. An arc-shaped opening 7 is provided at the top of the cooling plate 1 to facilitate the insertion and extraction of the circuit board.

[0033] The heat conducting plate 102 is located inside the cooling plate 1 and is adjacent to the support system. The heat conducting plate 102 is made of silicone, with a soft surface and a certain strength, which will not scratch the circuit board, nor will the water in the cavity 103 flow out due to being scratched by the circuit board, damaging the cooling device. The partition plate 101 is located on other outer surfaces of the cooling plate 1. The outer surface of the partition plate 101 is made of plastic, and the inside is filled with foam, having heat insulation performance to prevent the water in the cavity 103 from exchanging heat with the outside. The heat conducting plate 102 exchanges heat with the water in the cavity 103 to reduce its own temperature.

[0034] The cooling pipe group 8 includes a cooling pipe 801, a cooling pipe water inlet 802, and a cooling pipe water outlet 803. The front end of the cooling pipe 801 is fixedly connected to the cooling pipe water inlet 802, and the rear end is fixedly connected to the cooling pipe water outlet 803. After cooling water flows into the cooling pipe 801, it exchanges heat with the water in the cavity 103 to reduce the temperature of the water in the cavity 103. The cooling water first reduces the water temperature in the cavity 103, and then reduces the temperature of the circuit board through the heat conducting plate 102 to prevent the circuit board from being damaged due to excessive temperature difference.

[0035] The bracket 9 includes a support plate 901, a groove 902, and a screw hole 903. The support plate 901 includes a fixed plate and a movable plate. The upper and lower ends of the fixed plate are respectively fixedly connected to the cooling plate 1. Grooves 902 are provided on one side surface of the support plate 901. When the fixed plate and the movable plate are buckled together, the corresponding grooves 902 of the support plate 901 are combined to wrap the cooling pipe 801 therein and fix it inside the cooling plate 1.

[0036] Screw holes 903 are provided at the top and bottom of the support plate 901. The screw holes 903 penetrate through the two buckled support plates 901, and bolts pass through the screw holes 903 to fix the two buckled support plates 901 together to support the cooling pipe 801.

[0037] An inlet 4 is fixedly provided on one side of the cooling plate 1, and an outlet 5 is provided on the other side. The inlet 4 is fixedly connected to the cooling pipe water inlet 802, and the outlet 5 is fixedly connected to the cooling pipe water outlet 803. The cooling water enters the cooling pipe 801 from the inlet 4 through the cooling pipe water inlet 802, and the water after heat exchange with the water in the cavity 103 is discharged from the cooling pipe water outlet 803 through the outlet 5.

[0038] Connect an external water pump to the water inlet 4 and the water outlet 5 to an external drainage facility. Turn on the water pump and pump cooling water into the water inlet 4. The cooling water flows from the water inlet 4 through the cooling pipe water inlet 802 into the cooling pipe 801 in the cooling plate 1. After flowing through all the cooling pipes 801, the cooling water flows into the water outlet 5 through the cooling pipe water outlet 803 and is discharged into the external drainage facility. The cooling water flowing through the cooling pipe 801 exchanges heat with the water in the cavity 103, reducing the water temperature in the cavity 103 and thus lowering the temperature of the surface of the heat conducting plate 102. Insert the circuit board to be processed into the slot 3 with the side to be processed facing outwards. The fixing plate 2 supports the circuit board for convenient processing, and the bottom plate 6 supports the bottom of the circuit board. The fixing plate 2 and the bottom plate 6 fix the circuit board on the surface of the cooling plate 1. The heat conducting plate 102 exchanges heat with the circuit board during the processing to reduce the temperature of the circuit board. The cooling water first exchanges heat with the heat conducting plate 102 to cool down the heat conducting plate 102 and then exchanges heat with the circuit board, avoiding direct contact between the overly cold cooling water and the circuit board, which may cause the circuit board to contract due to cold accumulation and be damaged. A continuous stream of cooling water flows through the cooling pipe 801, continuously exchanges heat with the water in the cavity 103, keeps the heat conducting plate 102 in a low-temperature state all the time, and gently cools down the circuit board. When the cooling water reaches the end of the cooling pipe 801, its temperature has risen, and the heated cooling water is discharged through the cooling pipe water outlet 803 and discharged into the external drainage facility for centralized treatment. This cooling device adopts a water cooling system, which can effectively avoid the problems of small particles such as dust and debris floating in the air caused by traditional air cooling, polluting the circuit board and the operating environment, and reducing the performance of the circuit board.

[0039] The above is only a preferred embodiment of the present invention, and it is not intended to limit the present invention in any form. Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to form an equivalent embodiment with equivalent changes within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A heat exchange cooling device in a circuit board processing process, characterized in that: include: A cooling system, the cooling system comprising a cooling plate (1), a cooling pipe group (8) and a bracket (9), the cooling pipe group (8) being fixed inside the cooling plate (1) by the bracket (9), and when cooling water flows into the cooling pipe group (8), heat exchange can occur with the cooling plate (1), thereby reducing the temperature of the cooling plate (1); A support system, the support system comprising a fixing plate (2) and a bottom plate (6), the fixing plate (2) having a total of several pieces, the fixing plate (2) being fixedly arranged on the upper surface of the bottom plate (6), and the inner surface of the fixing plate (2) being provided with a notch (3), the fixing plate (2) and the bottom plate (6) providing support for a circuit board, and when the circuit board is inserted into the notch (3), it is fixed on the surface of the cooling plate (1) and performs heat exchange with the cooling plate (1).

2. A heat exchange cooling device in a circuit board processing process according to claim 1, characterized in that: Both sides of one side of the cooling plate (1) are respectively fixedly connected to the side of the fixing plate (2); the cooling plate (1) comprises an isolation plate (101), a heat conduction plate (102) and a cavity (103); the cavity (103) is located at the center of the cooling plate (1), and the cavity (103) is filled with water, which is isolated from the outside.

3. The heat exchange cooling device in the circuit board processing process according to claim 2, characterized in that: The heat conducting plate (102) is located on the inner side of the cooling plate (1) and is adjacent to the support system. The isolation plate (101) is located on the other outer surface of the cooling plate (1) to prevent moisture in the cavity (103) from exchanging heat with the outside. The heat conducting plate (102) exchanges heat with moisture in the cavity (103) to reduce its own temperature.

4. The heat exchange cooling device in the circuit board processing process according to claim 1, characterized in that: The cooling pipe group (8) comprises a cooling pipe (801), a cooling pipe water inlet (802) and a cooling pipe water outlet (803); the front end of the cooling pipe (801) is fixedly connected to the cooling pipe water inlet (802), and the rear end is fixedly connected to the cooling pipe water outlet (803); after cooling water flows into the cooling pipe (801), heat exchange is performed with the water in the cavity (103), thereby reducing the temperature of the water in the cavity (103).

5. The heat exchange cooling device in the circuit board processing process according to claim 1, characterized in that: The bracket (9) includes a support plate (901), a groove (902) and a screw hole (903); the support plate (901) includes a fixed plate and a movable plate; the upper and lower ends of the fixed plate are respectively fixedly connected to the cooling plate (1); a groove (902) is provided on one side surface of the support plate (901); when the fixed plate and the movable plate are relatively buckled, the grooves (902) corresponding to the support plate (901) are combined to wrap the cooling pipe (801) therein.

6. The heat exchange cooling device in the circuit board processing process according to claim 5, characterized in that: The top and bottom ends of the support plate (901) are both provided with screw holes (903), and the screw holes (903) penetrate through the two buckled support plates (901). Bolts pass through the screw holes (903) to fix the two buckled support plates (901) together, thereby supporting the cooling pipe (801).

7. The heat exchange cooling device in the circuit board processing process according to claim 1, characterized in that: The cooling plate (1) is fixedly provided with a water inlet (4) on one side and a water outlet (5) on the other side; the water inlet (4) is fixedly connected to the cooling pipe water inlet (802), and the water outlet (5) is fixedly connected to the cooling pipe water outlet (803).

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