Electronic device

Abstract

The utility model discloses an electronic device. The electronic equipment comprises a first circuit board and a second circuit board, wherein a height difference exists between the first circuit board and the second circuit board; one end of the flexible circuit board is connected with the first circuit board, the other end of the flexible circuit board is connected with the second circuit board, the flexible circuit board comprises a bending area, and the bending area is opposite to the edges of the first circuit board and the second circuit board; the pressing piece is arranged on the side, away from the first circuit board, of the flexible circuit board, the pressing piece comprises a hollowed-out part, and the hollowed-out part is opposite to the bending area.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In the related art, some electronic devices in electronic devices cannot be directly soldered on the circuit board, and need to be connected to the circuit board through FPC (Flexible Printed Circuit) transfer. The conventional way to connect FPC to the circuit board is to snap-fit ​​the BTB (Board to Board) connector. When the BTB is snapped, a BTB fixing bracket is usually required to fix the FPC and BTB.

[0003] Existing BTB fixing brackets generally adopt a full pressing form. For scenarios where the height difference of the FPC bending area is relatively large, the FPC bending area will be arched relatively high after the FPC and BTB are buckled together. When the BTB fixing bracket is assembled and pressed to reinforce the BTB, the fixing bracket will scrape the FPC bending area back and forth, causing damage to the FPC. Utility Model Content

[0004] The embodiment of the present application provides an electronic device that can solve the problem in the prior art that the FPC is easily scratched during the assembly process of the fixing parts, resulting in damage to the FPC.

[0005] An embodiment of the present application provides an electronic device, including: a first circuit board and a second circuit board, wherein there is a height difference between the first circuit board and the second circuit board; a flexible circuit board, wherein one end of the flexible circuit board is connected to the first circuit board, and the other end is connected to the second circuit board, and the flexible circuit board includes a bending area, and the bending area is opposite to the edges of the first circuit board and the second circuit board; and a pressing piece, wherein the pressing piece is arranged on a side of the flexible circuit board away from the first circuit board, and the pressing piece includes a hollow portion, and the hollow portion is opposite to the bending area.

[0006] Thus, in the electronic device provided in the embodiment of the present application, the electronic device includes a first circuit board, a second circuit board, a flexible circuit board and a pressing piece, the two ends of the flexible circuit board are respectively connected to the first circuit board and the second circuit board with a height difference, the flexible circuit board includes a bending area opposite to the edges of the first circuit board and the second circuit board, the pressing piece is arranged on the side of the flexible circuit board away from the first circuit board to press and fix the flexible circuit board, and the pressing piece includes a hollow portion opposite to the bending area to accommodate at least a portion of the bent flexible circuit board.

[0007] Therefore, in the embodiments of the present application, by providing a hollowed-out portion on the fixing member opposite to the bending area, during the assembly process of the fixing member, the hollowed-out portion provides a receiving space for the flexible circuit board of at least a part of the bending area. The flexible circuit board of the part of the bending area can be received in the hollowed-out portion to reduce the extrusion and scraping of the fixing member on the flexible circuit board, improve the reliability of the flexible circuit board, and through the hollowed-out portion, the relative position of the flexible circuit board and the pressing member can be visually observed during the assembly process to reduce the collision risk between the pressing member and the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0009] Figure 1 Structural schematic diagram of a pressing member of an electronic device according to some embodiments of the present application;

[0010] Figure 2 Partial structural schematic diagram of an electronic device according to some embodiments of the present application;

[0011] Figure 3 Structural schematic diagram of a pressing member of an electronic device according to other embodiments of the present application;

[0012] Figure 4 Partial structural schematic diagram of an electronic device according to other embodiments of the present application.

[0013] Explanation of the reference numerals in the drawings:

[0014] 100, electronic device;

[0015] 110, first circuit board; 111, connector;

[0016] 130, flexible circuit board; 131, bending area;

[0017] 140, pressing member; 141, first limiting portion; 142, second limiting portion; 143, hollowed-out portion; 1411, first segment; 1412, second segment; 1421, third segment; 1422, fourth segment;

[0018] 151, protruding portion; 152, protective film layer; 153, buffer layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0020] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims indicates at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0021] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "middle", "rear", "left", "right", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present application.

[0022] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0023] Please refer to Figure 1 and Figure 2 , Figure 1 which are schematic structural diagrams of the pressing member of the electronic device according to some embodiments of the present application; Figure 2 which are partial structural diagrams of the electronic device according to some embodiments of the present application.

[0024] Such as Figure 1 and Figure 2As shown in the figure, an embodiment of the present application provides an electronic device 100, which includes a first circuit board 110, a second circuit board (not shown in the figure), a flexible circuit board 130, and a pressing member 140. There is a height difference between the first circuit board 110 and the second circuit board; one end of the flexible circuit board 130 is connected to the first circuit board 110, and the other end is connected to the second circuit board. The flexible circuit board 130 includes a bending area 131, and the bending area 131 is opposite to the edges of the first circuit board 110 and the second circuit board; the pressing member 140 is disposed on the side of the flexible circuit board 130 away from the first circuit board 110, and the pressing member 140 includes a hollowed-out portion 143, and the hollowed-out portion 143 is opposite to the bending area 131.

[0025] In the electronic device 100 provided by the embodiment of the present application, the electronic device 100 includes a first circuit board 110, a second circuit board, a flexible circuit board 130, and a pressing member 140. The two ends of the flexible circuit board 130 are respectively connected to the first circuit board 110 and the second circuit board with a height difference. The flexible circuit board 130 includes a bending area 131 opposite to the edges of the first circuit board 110 and the second circuit board. The pressing member 140 is disposed on the side of the flexible circuit board 130 away from the first circuit board 110 to press and fix the flexible circuit board 130. The pressing member 140 includes a hollowed-out portion 143 opposite to the bending area 131 to accommodate at least a part of the flexible circuit board 130 in the bending area. Therefore, in the embodiment of the present application, by providing the hollowed-out portion 143 opposite to the bending area 131 on the fixing member, during the assembly process of the fixing member, the hollowed-out portion 143 provides a accommodation space for the flexible circuit board 130 of at least a part of the bending area 131, and the flexible circuit board 130 of a part of the bending area 131 can be accommodated in the hollowed-out portion 143 to reduce the extrusion and rubbing of the fixing member on the flexible circuit board 130, improve the reliability of the flexible circuit board 130, and through the hollowed-out portion 143, the relative position of the flexible circuit board 130 and the pressing member 140 can be visually observed during the assembly process to reduce the collision risk between the pressing member 140 and the flexible circuit board 130.

[0026] In this embodiment, the first circuit board 110 can be disposed inside the electronic device 100, and the first circuit board 110 can be fixedly connected to the middle frame of the electronic device 100 to ensure the structural stability of the first circuit board 110 inside the electronic device 100. Electronic devices such as speakers can be disposed on the first circuit board 110 to enable the electronic device 100 to have corresponding functions. The same applies to the second circuit board. Exemplarily, the first circuit board 110 and the second circuit board are respectively the main board and the secondary board of the electronic device 100.

[0027] The flexible circuit board 130 and the first circuit board 110 are connected by a BTB, and the fixing member is pressed at the BTB connection of the two to improve the connection reliability between the flexible circuit board 130 and the first circuit board 110.

[0028] Exemplarily, a female socket of the BTB connector 111 is provided on the flexible circuit board 130, and a male socket of the BTB connector 111 is provided on the first circuit board 110. The first circuit board 110 and the flexible circuit board 130 are snap-connected by plugging the BTB female socket and the BTB male socket, realizing the electrical connection between the flexible circuit board 130 and the first circuit board 110.

[0029] The bending area 131 faces the edges of the first circuit board 110 and the second circuit board. Then, the bending area 131 of the flexible circuit board 130 is located between the edges of the first circuit board 110 and the second circuit board and extends along the height difference direction of the first circuit board 110 and the second circuit board.

[0030] The flexible circuit board 130 is connected to the first circuit board 110. The pressing member 140 is arranged on the side of the flexible circuit board 130 away from the first circuit board 110 to press and fix the flexible circuit board 130 and improve the connection reliability between the flexible circuit board 130 and the first circuit board 110. The pressing member 140 includes a hollow portion 143 opposite to the bending area 131. "Opposite" means that at least part of the projection of the bending area 131 on the pressing member 140 is located within the hollow portion 143. In this way, when the pressing member 140 presses the flexible circuit board 130 and causes the flexible circuit board 130 in the bending area 131 to deform and bulge, it can be accommodated within the hollow portion 143, reducing the risk of extrusion and abrasion of the pressing member 140 on the bending area 131 of the flexible circuit board 130.

[0031] The hollow portion 143 is a through hole provided in the pressing member 140. The specific shape and size of the hollow portion 143 can be designed by oneself. Exemplarily, the hollow portion 143 is circular or rectangular, etc.

[0032] Optionally, the edge of the hollow portion 143 is designed with rounded corners to reduce the risk of the pressing member 140 scratching the flexible circuit board 130.

[0033] Optionally, a groove with an opening facing the bending area 131 can also be provided at the position of the hollow portion 143 of the pressing member 140. During the assembly process of the pressing member 140, the deformed and bulged flexible circuit board 130 can be accommodated within the groove. The buffer of the groove can reduce the extrusion force between the pressing member 140 and the flexible circuit board 130. After the assembly of the pressing member 140 is completed, the bottom of the groove can play a role in shaping the flexible circuit board 130.

[0034] Optionally, the flexible circuit board 130 is located between the first circuit board 110, the second circuit board and the pressing member 140, and the pressing member 140 is used to fix the flexible circuit board 130 on the first circuit board 110 and the second circuit board.

[0035] In some embodiments, such as Figure 1 andFigure 2 As shown, in the width direction of the flexible circuit board 130, the size of the bending area 131 is smaller than that of the hollowed-out part 143.

[0036] In these embodiments, in the width direction of the flexible circuit board 130, the size of the bending area 131 is smaller than that of the hollowed-out part 143, so that the hollowed-out area can fully accommodate the bending bulge of the bending area 131 extending in the width direction of the flexible circuit board 130.

[0037] The flexible circuit board 130 includes a plurality of wires extending along its length direction and arranged at intervals along its width direction. When the flexible circuit board 130 is squeezed by the pressing member 140, the flexible circuit board 130 is more likely to generate a bulge extending along its width direction. In the width direction of the flexible circuit board 130, the size of the hollowed-out part 143 of the pressing member 140 is larger than that of the bending area 131, so that the bulge of the bending area 131 can be fully accommodated in the hollowed-out part 143.

[0038] As Figure 1 shown, the width direction of the flexible circuit board 130 is the X direction in the figure.

[0039] In some embodiments, as Figure 1 and Figure 2 shown, the orthographic projection of the bending area 131 on the pressing member 140 is located within the hollowed-out part 143.

[0040] In these embodiments, the orthographic projection of the bending area 131 on the pressing member 140 is located within the hollowed-out part 143, so that the flexible circuit board 130 of the bending area 131 can be fully accommodated in the hollowed-out part 143.

[0041] The area of the hollowed-out part 143 of the pressing member 140 is larger than the area of the bending area 131, so that the bending area 131 can be located within the hollowed-out part 143 of the pressing member 140, so that during the assembly process of the pressing member 140, the bending bulge of the bending area 131 can be fully accommodated in the hollowed-out part 143.

[0042] Optionally, the shapes of the hollowed-out part 143 and the bending area 131 match each other, so that when the hollowed-out part 143 can fully accommodate the bending area 131, the size of the hollowed-out part 143 can also be reduced, and the structural strength of the pressing member 140 can be improved. Exemplarily, both the bending area 131 and the hollowed-out part 143 are rectangular.

[0043] In some embodiments, as Figure 1 and Figure 2As shown, the pressing member 140 further includes a first limiting portion 141 and a second limiting portion 142 with a height difference. The first limiting portion 141 faces the first circuit board 110. One end of the flexible circuit board 130 is pressed between the first limiting portion 141 and the first circuit board 110, and the other end of the flexible circuit board 130 is pressed by the second limiting portion 142. The hollow portion 143 is located between the first limiting portion 141 and the second limiting portion 142.

[0044] In these embodiments, the pressing member 140 further includes a first limiting portion 141 and a second limiting portion 142 with a height difference. The first limiting portion 141 faces the first circuit board 110. One end of the flexible circuit board 130 is pressed between the first limiting portion 141 and the first circuit board 110, and the other end of the flexible circuit board 130 is pressed by the second limiting portion 142. Thus, the pressing member 140 can stably fix the flexible circuit board 130 through the first limiting portion 141 and the second limiting portion 142. The hollow portion 143 is located between the first limiting portion 141 and the second limiting portion 142. The hollow portion 143 can accommodate the bending area 131 of the flexible circuit board 130 located between the first circuit board 110 and the second circuit board, so as to reduce the scraping and extrusion of the bending area 131 of the flexible circuit board 130 during the assembly process of the pressing member 140.

[0045] Specifically, there is a height difference between the first circuit board 110 and the second circuit board in their thickness directions, and the first circuit board 110 and the second circuit board are spaced apart in their length directions. The bending area 131 is provided between the two ends of the first circuit board 110 and the second circuit board that are close to each other in their length directions.

[0046] Correspondingly, the flexible circuit board 130 includes a first end and a second end respectively disposed at both ends of the bending area 131. The first end is connected to the first circuit board 110, the second end is connected to the second circuit board, and there is a height difference between the first end and the second end.

[0047] Correspondingly, there is also a height difference between the first limiting portion 141 and the second limiting portion 142 in the thickness direction of the first circuit board 110, and the first limiting portion 141 and the second limiting portion 142 are spaced apart in the length direction of the first circuit board 110. The first end of the flexible circuit board 130 is located between the first limiting portion 141 and the first circuit board 110, and the second end is pressed against the second circuit board. The flexible circuit board 130 is fixed more stably through the first limiting portion 141 and the second limiting portion 142. The hollow portion 143 is located between the first limiting portion 141 and the second limiting portion 142, and the hollow portion 143 corresponds to the bending area 131.

[0048] Optionally, the first limiting portion 141 and the second limiting portion 142 are integrally formed to reduce the splicing seam on the pressing member 140 and improve the structural strength of the pressing member 140; or the first limiting portion 141 and the second limiting portion 142 are separately prepared and connected to each other to facilitate the selection of a suitable pressing member 140 according to the sizes of the first circuit board 110 and the second circuit board.

[0049] Optionally, the flexible circuit board 130 is BTB-connected to the first circuit board, and the first limiting portion 141 is pressed on the BTB connection portion to enhance the connection reliability between the flexible circuit board 130 and the first circuit board 110.

[0050] In some embodiments, as Figure 1 and Figure 2 shown, a convex portion 151 is provided on one side of the first limiting portion 141 and the second limiting portion 142 close to the hollow portion 143.

[0051] In these embodiments, a convex portion 151 is provided on one side of the first limiting portion 141 and the second limiting portion 142 close to the hollow portion 143. The first limiting portion 141 and the second limiting portion 142 are in contact with the flexible circuit board 130 through the convex portion 151 to increase the contact area between the first limiting portion 141 and the second limiting portion 142 and the flexible circuit board 130 and improve the pressing effect of the pressing member 140 on the flexible circuit board 130.

[0052] Optionally, the contact surface between the convex portion 151 and the flexible circuit board 130 is an arc surface to reduce the risk of the pressing member 140 scratching the flexible circuit board 130.

[0053] Optionally, the convex portion 151 and the first limiting portion 141 are integrally formed to improve the structural strength of the first limiting portion 141; the convex portion 151 and the second limiting portion 142 are integrally formed to improve the structural strength of the second limiting portion 142.

[0054] In some embodiments, as Figure 1 and Figure 2 shown, the first circuit board 110 is provided with a connector 111. The flexible circuit board 130 is connected to the first circuit board 110 through the connector 111. The first limiting portion 141 includes a first segment 1411 and a second segment 1412 connected to each other. The second segment 1412 is disposed between the first segment 1411 and the hollow portion 143. The first segment 1411 is pressed on the connector 111, and the second segment 1412 is pressed on the flexible circuit board 130.

[0055] In these embodiments, the first circuit board 110 is provided with a connector 111, and the flexible circuit board 130 is electrically connected to the first circuit board 110 through the connector 111. The first limiting portion 141 includes a first segment 1411 and a second segment 1412 that are connected to each other. The first segment 1411 is pressed against the connector 111 to enhance the connection strength between the flexible circuit board 130 and the first circuit board 110. The second segment 1412 is disposed between the first segment 1411 and the hollow portion 143, and the second segment 1412 is pressed against the flexible circuit board 130 to improve the problem that the flexible circuit board 130 is separated from the first circuit board 110 when the flexible circuit board 130 bulges due to the assembly of the pressing member 140.

[0056] The connector 111 includes a reinforcing steel sheet and a plug-in member that are respectively disposed on both sides of the flexible circuit board 130 in the thickness direction. The plug-in member is connected to the first circuit board 110, and the reinforcing steel sheet is disposed on the side of the flexible circuit board 130 facing the pressing member 140, and the pressing member 140 abuts against the reinforcing steel sheet. During the assembly of the pressing member 140, the place where the flexible circuit board 130 is in contact with the reinforcing steel sheet is folded and arched, and the flexible circuit board 130 and the reinforcing steel sheet are squeezed against each other, which easily causes problems such as damage to the circuit of the flexible circuit board 130 or separation between the reinforcing steel sheet and the flexible circuit board 130.

[0057] Therefore, a second segment 1412 that presses against the flexible circuit board 130 is disposed between the first segment 1411 of the first limiting portion 141 and the hollow portion 143, and the deformation of the flexible circuit board 130 is relieved by the second segment 1412.

[0058] Optionally, the protruding portion of the first limiting portion 141 is disposed on the second segment 1412.

[0059] In some embodiments, as Figure 1 and Figure 2 shown, the second limiting portion 142 includes a third segment 1421 and a fourth segment 1422 that are connected to each other. The third segment 1421 is located between the fourth segment 1422 and the hollow portion 143. The third segment 1421 abuts against the flexible circuit board 130, and the fourth segment 1422 is spaced apart from the flexible circuit board 130.

[0060] In these embodiments, the second limiting portion 142 includes a third segment 1421 that abuts against the flexible circuit board 130 to enhance the fixing effect of the second limiting portion 142 on the flexible circuit board 130. The second limiting portion 142 further includes a fourth segment 1422 that is spaced apart from the flexible circuit board 130 to reduce the contact area between the pressing member 140 and the flexible circuit board 130 and reduce the frictional pulling force on the flexible circuit board 130 during the assembly of the pressing member 140.

[0061] Optionally, the pressing member 140 may be thinned at the fourth segment 1422, or a groove may be provided at the fourth segment 1422 of the pressing member 140, so that the fourth segment 1422 and the flexible circuit board 130 are spaced apart.

[0062] Optionally, through holes are provided at the fourth segment 1422 to visually check the mating condition of the pressing member 140 and the flexible circuit board 130.

[0063] Optionally, the protruding portion of the second limiting portion 142 is provided at the third segment 1421.

[0064] Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic structural diagram of the pressing member of the electronic device according to some other embodiments of the present application; Figure 4 which is a schematic partial structural diagram of the electronic device according to some other embodiments of the present application.

[0065] In some embodiments, as Figure 3 and Figure 4 shown, a protective film layer 152 is coated on the edges of the first limiting portion 141 and the second limiting portion 142 close to the hollow portion 143, and the friction coefficient of the protective film layer 152 is less than 0.1.

[0066] In these embodiments, a protective film layer 152 is coated on the edges of the first limiting portion 141 and the second limiting portion 142 close to the hollow portion 143, and the friction coefficient of the protective film layer 152 is less than 0.1. Through the protective film layer 152 with a smaller friction coefficient, the frictional force between the pressing member 140 and the flexible circuit board 130 is reduced, so as to alleviate the problem that the flexible circuit board 130 is deformed due to the frictional force pulling during the assembly process of the pressing member 140.

[0067] The friction coefficient refers to the ratio of the frictional force between two surfaces to the vertical force acting on one of the surfaces. It is related to the surface roughness and has nothing to do with the size of the contact area.

[0068] Optionally, the protective film layer 152 is provided on the surface of the pressing member 140 or the flexible circuit board 130 in the form of adhesion, coating or application. Exemplarily, the protective film layer 152 may be polytetrafluoroethylene or a smooth steel sheet, etc.

[0069] Optionally, protective film layers 152 are provided on both the pressing member 140 and the flexible circuit board 130, and the contact between the pressing member 140 and the flexible circuit board 130 is replaced by the contact between the two protective film layers 152, so as to further alleviate the problem that the flexible circuit board 130 is deformed due to the frictional force pulling during the assembly process of the pressing member 140.

[0070] Optionally, the protective film layer 152 completely covers both side surfaces of the pressing member 140 or the flexible circuit board 130, reducing the difficulty of setting the protective film layer 152.

[0071] In some embodiments, as Figure 3 and Figure 4 shown, a buffer layer 153 is provided between the protective film layer 152 and the first limiting portion 141 and between the protective film layer 152 and the second limiting portion 142.

[0072] In these embodiments, a buffer layer 153 is provided between the protective film layer 152 and the first limiting portion 141 and between the protective film layer 152 and the second limiting portion 142. The buffer layer 153 can relieve the extrusion force acting on the flexible circuit board 130 during the assembly process of the pressing member 140, so as to reduce the risk of damage to the flexible circuit board 130.

[0073] The buffer layer 153 can be an elastic material or a soft material. Exemplarily, the buffer layer 153 can be a foam layer, a silicone layer, a fabric layer, etc. During the assembly process of the fixing member, the buffer layer 153 can buffer the extrusion force of the pressing member 140 acting on the flexible circuit board 130.

[0074] Optionally, the buffer layer 153 can be connected to the outer surface of the first limiting portion 141 or the second limiting portion 142 to ensure that during the assembly process of the pressing member 140 and after the pressing assembly is completed, the first limiting portion 141 or the second limiting portion 142 is in contact with the flexible circuit board 130 through the buffer layer 153, so as to improve the reliability of the buffer layer 153; or the buffer layer 153 can be connected to the outer surface of the flexible circuit board 130 facing the pressing member 140. Relatively speaking, the outer surface of the flexible circuit board 130 is a flat surface, while the surface of the pressing member 140 is a curved surface, and the combination difficulty of the buffer layer 153 and the flexible circuit board 130 is lower; or the buffer layer 153 is respectively provided on the flexible circuit board 130 and the first limiting portion 141 or the second limiting portion 142 to improve the buffering effect of the buffer layer 153.

[0075] Optionally, the buffer layer 153 can be provided on the pressing member 140 or the flexible circuit board 130 in the form of bonding, clamping or injection molding.

[0076] Optionally, the buffer layer 153 completely covers the side surface where the flexible circuit board 130 contacts the first limiting portion 141 or the second limiting portion 142, so as to improve the buffering effect of the buffer layer 153.

[0077] In some other embodiments, as Figure 3 and Figure 4 shown, the buffer layer 153 is bonded to the pressing member 140.

[0078] In these embodiments, the buffer layer 153 is bonded to the pressing member 140 to improve the connection reliability between the buffer layer 153 and the pressing member 140.

[0079] Optionally, a thermal conductive adhesive layer is provided between the buffer layer and the pressing member. The buffer layer 153 is a thermal conductive foam. Through the combination of the thermal conductive adhesive layer, the thermal conductive foam, and the metal pressing member 140, the pressing member 140 and the buffer layer 153 can quickly conduct the heat of the flexible circuit board 130 or the first circuit board 110.

[0080] The electronic devices in the embodiments of the present application include, but are not limited to, devices with circuit board components such as mobile phones, personal digital assistants (PDAs), tablet computers, laptop computers, televisions, and driving recorders.

[0081] As described above, only the specific embodiments of the present application are provided. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, modules, and units can refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: a first circuit board and a second circuit board, wherein a height difference exists between the first circuit board and the second circuit board; A flexible circuit board, one end of which is connected to the first circuit board, and the other end of which is connected to the second circuit board, wherein the flexible circuit board comprises a bending area, and the bending area is opposite to the edges of the first circuit board and the second circuit board; A pressing piece, wherein the pressing piece is arranged on a side of the flexible circuit board away from the first circuit board, and the pressing piece comprises a hollow portion, and the hollow portion is opposite to the bending area.

2. The electronic device according to claim 1, characterized in that: In the width direction of the flexible circuit board, the size of the bending area is smaller than the size of the hollow portion.

3. The electronic device according to claim 2, characterized in that: The orthographic projection of the bending area on the pressing piece is located within the hollow portion.

4. The electronic device according to claim 1, characterized in that: The pressing part also includes a first limiting portion and a second limiting portion with a height difference, the first limiting portion is opposite to the first circuit board, one end of the flexible circuit board is pressed between the first limiting portion and the first circuit board, the other end of the flexible circuit board is pressed by the second limiting portion, and the hollow portion is located between the first limiting portion and the second limiting portion.

5. The electronic device according to claim 4, characterized in that: A protrusion is disposed on one side of the first limiting portion and the second limiting portion close to the hollow portion.

6. The electronic device according to claim 4, characterized in that: The edges of the first limiting portion and the second limiting portion close to the hollow portion are covered with a protective film layer, and the friction coefficient of the protective film layer is less than 0.

1.

7. The electronic device according to claim 6, characterized in that: A buffer layer is disposed between the protective film layer and the first limiting portion and between the protective film layer and the second limiting portion.

8. The electronic device according to claim 4, characterized in that: The first circuit board is provided with a connector, and the flexible circuit board is connected to the first circuit board via the connector. The first limiting portion includes a first segment and a second segment connected to each other, the second segment is arranged between the first segment and the hollow portion, the first segment is pressed onto the connector, and the second segment is pressed onto the flexible circuit board.

9. The electronic device according to claim 4, characterized in that: The second limiting portion includes a third segment and a fourth segment connected to each other, the third segment is located between the fourth segment and the hollow portion, the third segment abuts against the flexible circuit board, and the fourth segment is spaced apart from the flexible circuit board.

10. The electronic device according to claim 7, characterized in that: The buffer layer is bonded to the pressing piece.

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