Cooking equipment
By burying the temperature sensing parts on the outer side wall of the pot body and setting up data transmission equipment, the existing pot body temperature measurement methods are solved, and the functions of measuring the pot body are more accurate and the function of freely moving the pot body are achieved.
Patent Information
- Application Number
- CN202421370139.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The existing pot body temperature measurement method is heat conduction and temperature measurement, resulting in poor thermal conductivity, delayed temperature measurement and large errors, which affects the control of temperature during cooking.
By burying a temperature sensing member on the outer wall of the pot body, and setting a data transmitter on the side of the pot body, and setting a data receiving member on the side of the support component, the purpose of the data receiving member receiving member receiving the internal temperature data of the pot body is achieved.
It realizes more accurately measuring the internal temperature of the pot body and can move the pot body freely without affecting the reception of temperature measurement data, improving the temperature control accuracy during cooking.
Smart Images

Figure CN222997717U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of food processing, and particularly to a cooking device. Background Art
[0002] Intelligent cooking devices can keep people away from the harm of kitchen fumes and enable them to enjoy delicious food easily. They are widely used in families, canteens, etc. During the cooking process, an intelligent cooking device needs to use a temperature measurement structure to transmit the temperature data of the pot body to the controller in real time, so that the controller can adjust the heating power of the heating part according to the temperature of the pot body.
[0003] Currently, most pot body temperature measurement methods are realized by installing a temperature measurement probe under the pot body. That is, when using the pot body for cooking, the pot body is placed on the temperature measurement probe, and then the pot temperature is measured through heat conduction. This setting method has the following problems: the thermal conductivity for measuring the bottom of the pot body is poor. That is, there is a long delay in the pot temperature measured by the temperature measurement probe through heat conduction, resulting in a very large deviation in the measured temperature value. Moreover, the measurement is carried out with the pot body separating the food above the pot body, resulting in temperature measurement lag and large errors, affecting the control of the temperature during the cooking process. Utility Model Content
[0004] The embodiments of this application provide a cooking device that can measure the temperature inside the pot body more accurately, and can move the pot body freely without affecting the reception of temperature measurement data.
[0005] The embodiments of this application provide a cooking device, including:
[0006] A support assembly;
[0007] A pot body detachably arranged on the support assembly;
[0008] A temperature measurement assembly arranged outside the pot body. The temperature measurement assembly includes a temperature sensing element and a data transmitting element. At least part of the temperature sensor is embedded in the side wall of the pot body, and the data transmitting element is electrically connected to the temperature sensing element;
[0009] A data receiving element arranged on the support assembly, and the data receiving element is configured to be electrically connected or communicatively connected to the data transmitting element.
[0010] In a feasible implementation manner, a receiving groove is formed on the outer side wall of the pot body, and the receiving groove is used for placing the temperature sensing element.
[0011] In a feasible implementation manner, the temperature sensing element includes a temperature measurement probe. At least part of the temperature measurement probe is located in the receiving groove, and the first end of the temperature measurement probe is in contact with the pot body.
[0012] In a feasible implementation, the data transmitting element includes an output terminal, and the output terminal is electrically connected to the second end of the temperature measuring probe through a connecting lead;
[0013] The data receiving component comprises a receiving terminal, and the receiving terminal is used for adapting and coupling with the output terminal to collect the temperature signal of the temperature measuring probe.
[0014] In a feasible implementation, the data transmitting element includes a transmitting module, and the transmitting module is electrically connected to the second end of the temperature measuring probe through a connecting lead;
[0015] The data receiving component includes a receiving module, and the receiving module is configured to receive the signal sent by the transmitting module to collect the temperature signal of the temperature measuring probe.
[0016] In a feasible implementation, the temperature measurement component further includes a power supply, and the power supply is electrically connected to the temperature measurement probe and the transmitting module respectively.
[0017] In a feasible implementation, the accommodating groove is in a strip shape;
[0018] The temperature measuring component includes a mounting seat, and a strip groove adapted to the accommodating groove is constructed on the side of the mounting seat facing the pot body. The strip groove and the accommodating groove are used to form a clamping position. At least part of the temperature measuring probe is located in the clamping position, and the remaining part is located in the mounting seat in a bent shape.
[0019] In a feasible implementation, the cooking device further includes a handle, one end of the handle is fixedly connected to the mounting base, and a side of the mounting base facing away from the handle is fixedly connected to the pot body.
[0020] In a feasible implementation, the cooking device also includes a holding portion, the holding portion is configured with an installation groove, the installation groove is used to install the temperature sensor and the data transmitter, and the holding portion is fixedly connected to the pot body to abut the temperature sensor against the accommodating groove.
[0021] In a feasible implementation, at least one temperature measuring component is disposed on the outside of the pot body, and the supporting component is provided with at least one data receiving component corresponding one-to-one to the temperature measuring component.
[0022] The cooking device provided by the embodiment of the present application buries a temperature sensing component on the outer side wall of the pot body to measure the temperature inside the pot body more accurately. Moreover, by setting a data transmitting component on the side of the pot body and a data receiving component on the side of the support component, the data receiving component can receive the temperature data inside the pot body through the physical connection or wireless transmission between the data receiving component and the data transmitting component. This kind of setting can not only measure the temperature inside the pot body more accurately, but also move the pot body freely without affecting the reception of the temperature measurement data. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings required for use in the description of the embodiments or the related art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0024] Figure 1 is a schematic structural diagram of the temperature measurement component and the pot body in the cooking device provided by the embodiment of the present application;
[0025] Figure 2 is an exploded structural diagram of the temperature measurement component and the pot body provided by the embodiment of the present application;
[0026] Figure 3 is Figure 2 an enlarged structural diagram of the temperature measurement component at position A in
[0027] REFERENCE MARKS:
[0028] 100, pot body;
[0029] 200, temperature measurement component; 210, temperature sensing component; 211, temperature measurement probe; 2111, first end; 220, data transmitting component; 230, mounting seat;
[0030] 300, handle. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0031] The following will further describe in detail the embodiments of the present application with reference to the drawings and embodiments. The following embodiments are used to illustrate the present application, but cannot be used to limit the scope of the present application.
[0032] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0033] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0034] In the embodiments of the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0035] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0036] The cooking device provided by the embodiment of the present application can be an automatic stir-fry machine or a clay pot machine, or other machines that can automatically cook, and no specific limitation is made here. In this example, the support component of the cooking device can be understood as the device main body, including a support frame for supporting the pot body, and a controller arranged on the support frame for controlling automatic cooking. The specific structure can be understood with reference to the related art.
[0037] Since the existing temperature measurement structure used in, for example, an automatic stir-fry machine is arranged on the support component, when the pot body is placed on the support component, the temperature measurement structure can measure the pot temperature through heat conduction. This method not only causes temperature measurement lag, but also has a large temperature error in the measurement, which is not conducive to the controller's control of the temperature during cooking and affects the taste of the cooked food.
[0038] Based on the above existing problems, the embodiment of the present application provides a cooking device. Figure 1 It is a schematic structural diagram of the temperature measurement component and the pot body in the cooking device provided by the embodiment of the present application; Figure 2 It is a disassembled structural diagram of the temperature measurement component and the pot body provided by the embodiment of the present application. As shown in Figure 1 and Figure 2 shown, the cooking device can include a support component (not shown in the figure), a pot body 100, a temperature measurement component 200, and a data receiving component (not shown in the figure).
[0039] The pot body 100 is detachably arranged on the support component; the temperature measurement component 200 is arranged outside the pot body 100. The temperature measurement component 200 includes a temperature sensing element 210 and a data transmitting element 220. At least part of the temperature sensor is embedded in the side wall of the pot body 100, and the data transmitting element 220 is electrically connected to the temperature sensing element 210; the data receiving component is arranged on the support component and is configured to be electrically connected or communicatively connected to the data transmitting element 220.
[0040] It can be understood that in this example, the cooking device is taken as an automatic stir-fry machine for illustration. As the device main body, one or more pot bodies 100 can be placed on the support component. If multiple pot bodies 100 are placed, it is convenient to control multiple pot bodies 100 to process the same or different ingredients at the same time. After one of the pot bodies 100 is stir-fried, the pot body 100 can be removed from the support component manually or by a robotic arm, so as to pour the food in the pot body 100 into a serving container and facilitate cleaning of the pot body 100. Based on this, the pot body 100 in this example needs to be detachably arranged from the support component to facilitate the above-mentioned operation of the pot body 100 detaching from the support component.
[0041] In this example, the temperature measuring component 200 is arranged on the side of the pot body 100. In particular, the temperature sensing element 210 in the temperature measuring component 200 is at least partially embedded in the side wall of the pot body 100, that is, the part of the temperature sensing element 210 that mainly senses temperature (such as the end) is buried in the side wall of the pot body 100 to measure the temperature of the pot more accurately. To facilitate burying the temperature sensing element 210 into the side wall of the pot body 100 without affecting the overall firmness of the pot body 100, a groove with a depth of 1 mm can be pre-opened on the outer side wall of the pot body 100 so that the part of the temperature sensing element 210 that mainly senses temperature is located in the groove. Of course, the depth of the groove is not limited to 1 mm and can be set according to the actual thickness of the pot body 100, and can also be set to 0.5 mm, 0.7 mm, 1.2 mm, etc.
[0042] It should be noted that to measure the temperature in the pot body 100 more accurately, the temperature sensing element 210 can be arranged at a position lower on the side wall of the pot body 100. For example, it can be the intersection position of the side wall of the pot body 100 and the bottom of the pot body 100, but there is no specific limitation.
[0043] Similarly, to facilitate the separation of the pot body 100 from the support component and to be able to transmit the temperature data obtained by the temperature sensing element 210 to the controller (the controller is usually arranged on the support component side) in a timely manner, a data transmitter 220 electrically connected to the temperature sensing element 210 is arranged on the side of the pot body 100, and a data receiver is arranged on the support component side. The data receiver can be physically connected to the data transmitter 220 when the pot body 100 is placed on the support component, so as to receive the temperature data of the temperature sensing element 210. Of course, the data receiver can also receive the temperature data sent by the data transmitter 220 through a wireless transmission method.
[0044] In this application, by burying the temperature sensing element 210 in the outer side wall of the pot body 100, the temperature inside the pot body 100 can be measured more accurately. Moreover, by arranging the data transmitter 220 on the side of the pot body 100 and the data receiver on the support component side, through the physical connection or wireless transmission between the data receiver and the data transmitter 220, the purpose of the data receiver receiving the temperature data inside the pot body 100 is realized. This kind of setting can not only measure the temperature inside the pot body 100 more accurately, but also move the pot body 100 freely without affecting the reception of the temperature measurement data.
[0045] Next, the specific structure of the cooking device provided by the embodiment of the present application will be introduced in detail in combination with the attached Figure 1 - attached Figure 3 Drawings.
[0046] In some embodiments, a receiving groove (not shown in the figure) is formed on the outer side wall of the pot body 100, and the receiving groove is used to place the temperature sensing element 210.
[0047] Specifically, one or more accommodation grooves may be formed on the outer sidewall of the pot body 100 to correspondingly place one or more temperature sensing elements 210. The depth of the accommodation groove may be 0.8 mm, 1 mm, 1.2 mm, etc., which is not limited herein. In addition, the shape of the accommodation groove may be dot-shaped to facilitate the end of the temperature sensing element 210 (the temperature measurement probe 211 described below) to extend into the accommodation groove. Alternatively, the shape of the accommodation groove may be set as strip-shaped. The strip-shaped accommodation groove can enable more parts of the temperature sensing element 210 to be buried in the sidewall of the pot body 100, which is more conducive to measuring the accurate temperature inside the pot body 100 and can facilitate the reasonable arrangement of the space of the temperature measurement assembly 200 to reduce the volume of the temperature measurement assembly 200.
[0048] As Figure 3 shown, in some embodiments, the temperature sensing element 210 includes a temperature measurement probe 211. At least a part of the temperature measurement probe 211 is located in the accommodation groove, and the first end 2111 of the temperature measurement probe 211 is in contact with the pot body 100.
[0049] Specifically, the temperature measurement probe 211 may adopt a thermocouple or a resistance temperature detector type temperature measurement probe 211. The physical property change of its temperature detection can be transmitted to the data transmitting element 220 through the connection lead, so as to be received by the data receiving element and sent to the controller, so that the controller can obtain the temperature inside the pot body 100 to adjust the output power of the heating element.
[0050] In addition, only the first end 2111 of the temperature measurement probe 211 may be placed in the accommodation groove and in contact with the sidewall of the pot body 100, or more parts including the first end 2111 of the temperature measurement probe 211 may be placed in the accommodation groove, and it is ensured that the first end 2111 is in contact with the pot body 100. The form of the temperature measurement probe 211 arranged in the accommodation groove is not limited herein.
[0051] The physical connection manner between the data transmitting element 220 and the data receiving element may be, as Figure 2 shown, in some embodiments, the data transmitting element 220 includes an output terminal, and the output terminal is electrically connected to the second end of the temperature measurement probe 211 through a connection lead; the data receiving element includes a receiving terminal, and the receiving terminal is used to be adaptively coupled to the output terminal to collect the temperature signal of the temperature measurement probe 211.
[0052] It can be understood that an output terminal connected to the second end of the temperature measurement probe 211 is arranged on the side of the pot body 100. Correspondingly, a receiving terminal corresponding to the output terminal is arranged on the side of the support assembly. When the pot body 100 is placed on the support assembly, the output terminal is coupled to the receiving terminal, so that the controller can receive the temperature data of the pot body 100 measured by the temperature measurement probe 211 through the receiving terminal and the output terminal.
[0053] Of course, in this example, the settings of the receiving terminal and the output terminal are not only used for the transmission of temperature data, but also can position and support the pot body 100 when the pot body 100 is placed on the supporting component.
[0054] It should be noted that in this example, a plurality of output terminals can be arranged at intervals along the circumferential direction of the pot body 100, and each output terminal is connected to one or more temperature measuring probes 211. Similarly, a plurality of receiving terminals corresponding to the output terminals one by one are arranged on the supporting component. For example, two opposite output terminals can be arranged on the pot body 100, and two receiving terminals are arranged on the supporting component; it can also be that three data terminals are arranged on the pot body 100 in a uniformly distributed manner, and three receiving terminals are arranged on the supporting component.
[0055] It should be noted that the contact positions of the plurality of temperature measuring probes 211 connected to different output terminals with the pot body 100 can be made different, so as to facilitate receiving the temperatures of different parts of the pot body 100, thereby providing a reference basis for the controller to adjust the output power of the heating element.
[0056] The wireless transmission mode between the data transmitting member 220 and the data receiving member can be that, in some embodiments, the data transmitting member 220 includes a transmitting module, and the transmitting module is electrically connected to the second end of the temperature measuring probe 211 through a connection lead; the data receiving member includes a receiving module, and the receiving module is configured to receive the signal emitted by the transmitting module to collect the temperature signal of the temperature measuring probe 211.
[0057] It can be understood that the transmitting module can be electrically connected to the second end of the temperature measuring probe 211 through a connection lead, and the receiving module can also be connected to the controller through a connection lead, but there is no physical connection between the transmitting module and the receiving module. The communication connection between the transmitting module and the receiving module can be that when the distance between the transmitting module and the receiving module is within a preset range, they are automatically connected, or when the pot body 100 is placed on the supporting component, the communication connection between the transmitting module and the receiving module is triggered. The receiving module can transmit the received temperature data to the controller, so that the controller can obtain the temperature inside the pot body 100.
[0058] In some embodiments, the temperature measuring assembly 200 further includes a power supply member (not shown in the figure), and the power supply member is electrically connected to the temperature measuring probe 211 and the transmitting module respectively.
[0059] Specifically, the power supply member can be a storage battery or a common battery, and the battery is connected to the transmitting module to provide electrical energy. The battery can be charged regularly or replaced to ensure its power. Of course, a wireless charging seat can also be arranged on the supporting component to charge the battery on the side of the pot body 100 to ensure its power.
[0060] In some embodiments, the receiving groove is strip-shaped; the temperature measuring assembly 200 includes a mounting base 230. On one side of the mounting base 230 facing the pot body 100, a strip-shaped groove adapted to the receiving groove is formed. The strip-shaped groove and the receiving groove are used to form a clamping position, and at least part of the temperature measuring probe 211 is located in the clamping position, and the remaining part is bent and located in the mounting base 230.
[0061] It can be understood that the strip-shaped receiving groove can be opened along the height direction of the pot body 100. The strip-shaped groove opened on one side of the mounting base 230 facing the pot body 100 can form a channel with the receiving groove. This channel is used to place the temperature measuring probe 211 and can abut the temperature measuring probe 211 against the side wall of the pot body 100, so that the first end 2111 of the temperature measuring probe 211 remains in contact with the pot body 100, facilitating accurate measurement of the temperature inside the pot body 100.
[0062] In addition, a part of the temperature measuring probe 211 away from the first end 2111 can be bent, as Figure 3 shown. This setting method can reasonably arrange the temperature measuring probe 211 with a longer size in the mounting base 230, facilitating reduction of the size of the mounting base 230 and thus reducing the size of the entire pot body 100.
[0063] In some embodiments, the cooking device further includes a handle 300. One end of the handle 300 is fixedly connected to the mounting base 230, and the side of the mounting base 230 away from the handle 300 is fixedly connected to the pot body 100.
[0064] It can be understood that the setting of the handle 300 facilitates the pot body 100 to be separated from the support assembly, facilitating operations such as pouring out food or cleaning the pot body 100. The handle 300 can be provided on the mounting base 230, that is, the mounting base 230 is arranged between the pot body 100 and the handle 300. This setting can use an ordinary handle 300 and is also more conducive to assembly.
[0065] Of course, in addition to the above method of installing the handle 300, in some embodiments, the cooking device may further include a holding part. The holding part is configured with a mounting groove for mounting the temperature sensing element 210 and the data transmitting element 220. The holding part is fixedly connected to the pot body 100 to abut the temperature sensing element 210 in the receiving groove.
[0066] Specifically, in this embodiment, an installation groove is formed on one side of the holding part (handle) close to the pot body 100, so as to facilitate the support and installation of the temperature sensing element 210 and the data transmitting element 220. This setting can eliminate the need for an additional mounting base 230 for installing the temperature sensing element 210 and the data transmitting element 220. Through the fixed connection between the holding part and the pot body 100, the temperature sensing element 210 can be abutted against the accommodating groove to measure the internal temperature of the pot body 100, without affecting the use of the holding part (handle), reducing the use of components and saving costs.
[0067] In some embodiments, at least one temperature measuring assembly 200 is provided on the outer side of the pot body 100, and the support assembly is provided with at least one data receiving element corresponding to the temperature measuring assembly 200 one by one.
[0068] Specifically, two temperature measuring assemblies 200 can be provided on the outer side of the pot body 100 along the circumferential direction of the pot body 100, and the two temperature measuring assemblies 200 can be arranged oppositely. Correspondingly, two data receiving elements corresponding to the temperature measuring assemblies 200 are provided on the support assembly. If these two data receiving elements are used as receiving terminals, they can effectively support the pot body 100. Of course, three temperature measuring assemblies 200 can also be provided at equal intervals on the outer side of the pot body 100 along the circumferential direction of the pot body 100. Correspondingly, three data receiving elements corresponding to the temperature measuring assemblies 200 are provided on the support assembly. Of course, only one temperature measuring assembly 200 can also be provided on the outer side of the pot body 100. The number of temperature measuring assemblies 200 provided on the outer side of the pot body 100 is not limited herein.
[0069] Finally, it should be noted that the above embodiments are only used to illustrate the present application, rather than to limit the present application. Although the present application has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should all be covered by the scope of the claims of the present application.
Claims
1. A cooking device, characterized in that: include: Support components; A pot body (100) is detachably arranged on the support assembly; A temperature measuring component (200) is arranged outside the pot body (100), the temperature measuring component (200) comprising a temperature sensing component (210) and a data transmitting component (220), at least a portion of the temperature sensing component (210) is embedded in a side wall of the pot body (100), and the data transmitting component (220) is electrically connected to the temperature sensing component (210); A data receiving component, arranged on the supporting assembly, the data receiving component being configured to be electrically connected or communicatively connected to the data transmitting component (220); The outer side wall of the pot body (100) is configured with a receiving groove, and the receiving groove is used to place the temperature sensing component (210); The temperature sensing component (210) comprises a temperature measuring probe (211), at least a portion of the temperature measuring probe (211) is located in the accommodating groove, and a first end (2111) of the temperature measuring probe (211) is in contact with the pot body (100); The data transmitting element (220) comprises a transmitting module, and the transmitting module is electrically connected to the second end of the temperature measuring probe (211) via a connecting lead; The data receiving component comprises a receiving module, and the receiving module is configured to receive the signal sent by the transmitting module to collect the temperature signal of the temperature measuring probe (211).
2. The cooking device according to claim 1, characterized in that: The data transmitting element (220) comprises an output terminal, and the output terminal is electrically connected to the second end of the temperature measuring probe (211) via a connecting lead; The data receiving component comprises a receiving terminal, and the receiving terminal is used to be adaptively coupled with the output terminal to collect the temperature signal of the temperature measuring probe (211).
3. The cooking device according to claim 1, characterized in that: The temperature measurement component (200) further comprises a power supply, which is electrically connected to the temperature measurement probe (211) and the transmitting module respectively.
4. The cooking device according to any one of claims 1 to 3, characterized in that: The accommodating groove is in a strip shape; The temperature measuring assembly (200) comprises a mounting seat (230), and a strip-shaped groove adapted to the receiving groove is configured on a side of the mounting seat (230) facing the pot body (100), the strip-shaped groove and the receiving groove are used to form a clamping position, at least a portion of the temperature measuring probe (211) is located at the clamping position, and the remaining portion is located in the mounting seat (230) in a bent shape.
5. The cooking device according to claim 4, characterized in that: The cooking device further comprises a handle (300), one end of the handle (300) being fixedly connected to the mounting seat (230), and a side of the mounting seat (230) facing away from the handle (300) being fixedly connected to the pot body (100).
6. The cooking device according to any one of claims 1 to 3, characterized in that: The cooking device also includes a gripping portion, the gripping portion being configured with an installation groove, the installation groove being used to install the temperature sensing component (210) and the data transmitting component (220), the gripping portion being fixedly connected to the pot body (100) so as to abut the temperature sensing component (210) against the accommodating groove.
7. The cooking device according to any one of claims 1 to 3, characterized in that: At least one temperature measuring component (200) is arranged outside the pot body (100), and the support component is provided with at least one data receiving component corresponding one-to-one to the temperature measuring component (200).