Refrigerating cook machine with jacketed pan body

Abstract

The pot body is placed on a base, a temperature control assembly and a heat dissipation assembly which are attached up and down are arranged in the base, the temperature control assembly comprises a heat conduction block, a semiconductor chilling plate is attached to the lower surface of the heat conduction block, and a hollow first cavity is formed in the bottom of the pot body. A first cavity is formed between the inner wall and the outer wall of the pot body, a hollow second cavity is formed between the inner wall and the outer wall of the pot body, the first cavity is communicated with the second cavity, liquid heat-conducting media are arranged in the first cavity and the second cavity, and when the pot body is placed on the base, the bottom wall of the first cavity is attached to the upper surface of the heat-conducting block. According to the utility model, through the liquid heat-conducting medium in the first chamber and the second chamber, the contact area between the heat-conducting block and the pot body is increased, the temperature control effect of the semiconductor chilling plate on the pot body is fully exerted, and the temperature control requirements during long-time use and high-intensity work are met; and the liquid heat-conducting medium after cold accumulation continuously cooks the pan body, so that the use occasion of the cook machine is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of kitchen appliances, and particularly relates to a refrigerating chef machine with a sandwich pot body. Background Art

[0002] A chef machine is a kitchen appliance mainly used to help chefs or housewives complete various tasks such as mixing, stirring, kneading dough, beating eggs, and whipping cream during the cooking process. The chef machine is designed to simplify these tasks that usually require a lot of manual labor, improve efficiency and reduce fatigue. To meet the requirements of the stirring function, the chef machine is usually equipped with a powerful motor that can handle a large amount of ingredients, especially tasks that require greater force such as kneading dough and beating eggs; at the same time, most chef machines have adjustable speed settings that allow users to adjust the stirring speed as needed; and in order for the chef machine to withstand long-term use and high-intensity work, metal materials are generally selected to make the pot body.

[0003] Therefore, when the chef machine is continuously used, the ingredients generate heat due to friction with the pot body while being mixed and stirred, and the ingredients themselves, especially the flour fermentation, also generate heat. These heats will cause the temperature of the ingredients to rise, resulting in excessive fermentation and souring of the ingredients, directly affecting the production effect of the ingredients. And when in scenarios with a relatively low ambient temperature such as in winter, the metal pot body will cause the temperature of the ingredients in the pot to be too low, resulting in difficulty in fermenting the ingredients, which will also affect the production effect of the ingredients.

[0004] CN202220263324.4 discloses a chef machine with a cooling function, including a material barrel and a base. The material barrel is placed on the base. A hollow fixed seat is arranged at the outer bottom of the material barrel. The fixed seat is detachably and fixedly connected with a heat conducting block. The side of the refrigerating sheet facing away from the heat conducting block is the heating side, and the refrigerating side is closely attached to the heat conducting block. It further includes a heat dissipation mechanism. The heat dissipation mechanism includes a water tank, a heat sink and a fan. A cooling flow channel is arranged in the heat sink. The cooling flow channel is provided with a first water inlet and a first water outlet. The base is detachably and fixedly connected with the heat sink. The heat sink is closely attached to the heating side. In this technical solution, the refrigerating sheet is closely attached to the heat conducting block and cools the material barrel through the heat conducting block. Since the contact area between the heat conducting block and the bottom of the material barrel is limited, the temperature control effect of the refrigerating sheet on the material barrel is restricted, and it cannot meet the temperature control requirements during the long-term use and high-intensity work of the chef machine. Content of the Utility Model

[0005] The purpose of the present utility model is to provide a refrigerated chef machine with a sandwich pot body, so as to solve the problem in the prior art that the refrigeration sheet is closely attached to the heat conduction block and the heat conduction block is used to cool the material barrel. Since the contact area between the heat conduction block and the bottom of the material barrel is limited, the temperature control effect of the refrigeration sheet on the material barrel is restricted, and the temperature control requirements during the long-term use and high-intensity operation of the chef machine cannot be met, so as to overcome the deficiencies of the prior art.

[0006] The present utility model provides a refrigerated chef machine with a sandwich pot body through the following technical solutions, including a pot body and a base. The pot body is placed on the base. A temperature control component and a heat dissipation component are arranged in the base and are attached to each other up and down. The temperature control component includes a heat conduction block. A semiconductor refrigeration sheet is attached to the lower surface of the heat conduction block. The circumference of the semiconductor refrigeration sheet is coated with heat preservation cotton. The heat dissipation component is attached to the lower surface of the semiconductor refrigeration sheet. A hollow first chamber is arranged at the bottom of the pot body, and a hollow second chamber is arranged between the inner wall and the outer wall of the pot body. The first chamber and the second chamber are communicated with each other. A liquid heat conduction medium is arranged in the first chamber and the second chamber. When the pot body is placed on the base, the bottom wall of the first chamber is attached to the upper surface of the heat conduction block. The liquid heat conduction medium in the first chamber and the second chamber conducts heat transfer between the pot body and the temperature control component to cool or heat the food materials in the pot body.

[0007] Further, a through hole is arranged between the first chamber and the second chamber to enable the first chamber and the second chamber to communicate with each other.

[0008] Further, a liquid injection port that can be opened or closed is also arranged on the bottom wall of the first chamber.

[0009] Further, the heat dissipation component includes a cooling water tank and a heat dissipation water tank. The cooling water tank is attached to the lower surface of the semiconductor refrigeration sheet.

[0010] Further, the cooling water tank is provided with a first water inlet and a first water outlet, the heat dissipation water tank is provided with a second water inlet and a second water outlet, a first water pipe is connected between the first water inlet and the second water outlet, and a second water pipe is connected between the second water inlet and the first water outlet.

[0011] Further, a water pump is also arranged on the first water pipe.

[0012] Further, a fan is arranged below the heat dissipation water tank, and an air inlet is arranged on the base wall below the fan.

[0013] Further, a temperature measuring element is arranged in the heat conduction block.

[0014] The utility model has the following beneficial effects: through the liquid heat-conducting medium in the first chamber and the second chamber, the contact area between the heat-conducting block and the pot body is increased, the temperature control effect of the semiconductor refrigeration sheet on the pot body is fully exerted, the temperature control requirements during the long-term use and high-intensity work of the cooking machine are met. In addition, before use, the pot body is frozen separately, and the heat-conducting liquid medium after cold storage can continuously cool the pot body, further increasing the application scenarios of the cooking machine. Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the whole machine of a refrigerated cooking machine with a sandwich pot body according to the utility model.

[0016] Figure 2 It is a vertical cross-sectional view of the pot body and the base of a refrigerated cooking machine with a sandwich pot body according to the utility model.

[0017] Figure 3 is Figure 2 an enlarged schematic view of part A in

[0018] Figure 4 It is a schematic structural diagram of the heat dissipation component of a refrigerated cooking machine with a sandwich pot body according to the utility model.

[0019] Among them, Figures 1 to 4 the corresponding relationship between the reference numerals and the component names in

[0020] 1 Pot body, 2 Base, 3 Heat-conducting block, 4 Semiconductor refrigeration sheet, 5 First chamber, 6 Second chamber, 7 Liquid injection port, 8 Cooling water tank, 9 Heat dissipation water tank, 10 First water inlet, 11 First water outlet, 12 Second water inlet, 13 Second water outlet, 14 First water pipe, 15 Second water pipe, 16 Water pump, 17 Fan, 18 Air inlet, 19 Temperature measuring element, 20 Heat preservation cotton, 21 Through hole. Detailed Embodiments

[0021] Next, the technical solutions of the present application will be clearly and completely described in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments.

[0022] Generally, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents the selected embodiments of the present application.

[0023] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0024] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0025] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0026] Next, refer to Figures 1-4 Describe a refrigerated chef machine with a sandwich pot body according to some embodiments of the present application.

[0027] The present utility model provides a refrigerated chef machine with a sandwich pot body through the following technical solutions, including a pot body 1 and a base 2. During use, the pot body 1 is placed on the base 2, and the stirring blade on the head of the chef machine extends into the pot body 1 and rotates to mix and stir the ingredients in the pot body 1.

[0028] A temperature control component is provided in the base 2, including a heat conduction block 3. The lower surface of the heat conduction block 3 is attached with a semiconductor refrigeration sheet 4, and the circumference of the semiconductor refrigeration sheet 4 is covered with a heat insulation cotton 20.

[0029] Meanwhile, a hollow first chamber 5 is provided at the bottom of the pot body 1, and a hollow second chamber 6 is provided between the inner wall and the outer wall of the pot body 1. The first chamber 5 and the second chamber 6 are connected through a through hole 21 provided therebetween, and a liquid heat-conducting medium is provided in the first chamber 5 and the second chamber 6. When the pot body 1 is placed on the base 2, the bottom wall of the first chamber 5 adheres to the upper surface of the heat-conducting block 3. The semiconductor refrigeration sheet 4, the heat-conducting block 3, the liquid heat-conducting medium in the first chamber 5 and the second chamber 6 and the pot body 1 form a continuous heat transfer channel, and the semiconductor refrigeration sheet 4 can be switched through a circuit to achieve refrigeration or heating on the same side. Therefore, when it is necessary to cool the ingredients in the pot body 1, the semiconductor refrigeration sheet 4 adheres to one side of the heat-conducting block 3 for refrigeration, and through the heat transfer and exchange between the semiconductor refrigeration sheet 4, the heat-conducting block 3, the liquid heat-conducting medium in the first chamber 5 and the second chamber 6 and the pot body 1, the heat generated during the processing of the ingredients in the pot body 1 is absorbed, so that the ingredients are maintained at an appropriate temperature; when it is necessary to heat the ingredients in the pot body 1, the semiconductor refrigeration sheet 4 adheres to one side of the heat-conducting block 3 for heating, and similarly through the heat transfer and exchange between the semiconductor refrigeration sheet 4, the heat-conducting block 5, the liquid heat-conducting medium in the first chamber 5 and the second chamber 6 and the pot body 1, the heat generated by the semiconductor refrigeration sheet 4 is transferred to the ingredients in the pot body 1, so that the ingredients are maintained at an appropriate temperature.

[0030] The so-called appropriate temperature mainly refers to that when using a chef machine to mix and stir ingredients, especially when stirring flour for making pasta, bread, and cakes, the flour is prone to over-fermentation and souring when stirred at a relatively high temperature for a long time, while it is difficult to ferment when stirred at a relatively low temperature, including that the added butter is not easily dispersed at a relatively low temperature. Therefore, when the ingredients are stirred and mixed in the chef machine at a temperature close to or slightly higher than room temperature, better production effects can be obtained.

[0031] In addition, before using the chef machine, the pot body 1 can be separately frozen to store cold in the liquid heat-conducting medium in the first chamber 5 and the second chamber 6. In this way, a stronger pot body cooling effect than that of the semiconductor refrigeration sheet 4 can be obtained in a short time, which is especially suitable for stirring and mixing some temperature-sensitive ingredients.

[0032] Specifically, the liquid heat-conducting medium can be water, coolant or cold storage agent, which is selected according to the usage occasion and environment of the chef machine. Since a liquid injection port 7 that can be opened or closed is provided at the bottom wall of the first chamber 5, it is convenient to replace or increase or decrease the liquid heat-conducting medium in the first chamber 5 and the second chamber 6.

[0033] In the technical solution of this embodiment, a heat dissipation component is further provided in the base 2, including a cooling water tank 8 and a heat dissipation water tank 9, and the cooling water tank 8 adheres to the lower surface of the semiconductor refrigeration sheet 4.

[0034] Specifically, the cooling water tank 8 is provided with a first water inlet 10 and a first water outlet 11, the heat dissipation water tank 9 is provided with a second water inlet 12 and a second water outlet 13, a first water pipe 14 is connected between the first water inlet 10 and the second water outlet 13, a second water pipe 15 is connected between the second water inlet 12 and the first water outlet 11, and a water pump 16 is further provided on the first water pipe 14. A fan 17 is provided below the heat dissipation water tank 9, and an air inlet 18 is provided on the wall of the base 2 below the fan 17.

[0035] When the semiconductor refrigeration sheet 4 is attached to one side of the heat conduction block 3 for refrigeration, the lower surface of the semiconductor refrigeration sheet 4 will generate heat. The water in the cooling water tank 8 and the heat dissipation water tank 9 circulates along the first water pipe 14 and the second water pipe 15 under the drive of the water pump 16. The water in the cooling water tank 8 absorbs the heat of the semiconductor refrigeration sheet 4 and then flows to the heat dissipation water tank 9. The fan 17 sucks external air from the air inlet 18 and blows it towards the heat dissipation water tank 9 to dissipate the heat in the water of the heat dissipation water tank 9. The cooled water then flows back to the cooling water tank 8 to cool the semiconductor refrigeration sheet 4.

[0036] Similarly, when the semiconductor refrigeration sheet 4 is attached to one side of the heat conduction block 3 for heating, the lower surface of the semiconductor refrigeration sheet 4 will refrigerate, and the cooling water tank 8 and the heat dissipation water tank 9 cooperate to moderately warm the semiconductor refrigeration sheet 4 to prevent the lower surface of the semiconductor refrigeration sheet 4 from being too cold and causing icing.

[0037] A temperature measuring element 19 is provided in the heat conduction block 3 and is electrically connected to the temperature control system of the cooking machine to control and adjust the temperature control component.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A refrigerated chef machine with a sandwich pot, comprising a pot body and a base, wherein the pot body is placed on the base, characterized in that: The base is provided with a temperature control component and a heat dissipation component attached up and down, the temperature control component includes a heat conductive block, a semiconductor refrigeration sheet is attached to the lower surface of the heat conductive block, the semiconductor refrigeration sheet is circumferentially covered with thermal insulation cotton, the heat dissipation component is attached to the lower surface of the semiconductor refrigeration sheet, the bottom of the pot body is provided with a hollow first chamber, a hollow second chamber is provided between the inner wall and the outer wall of the pot body, the first chamber and the second chamber are connected, and liquid heat conductive medium is contained in the first chamber and the second chamber. When the pot body is placed on the base, the bottom wall of the first chamber is attached to the upper surface of the heat conductive block, and the liquid heat conductive medium in the first chamber and the second chamber transfers heat between the pot body and the temperature control component to cool or heat the food in the pot body.

2. The refrigerated chef machine with a sandwich pot according to claim 1, characterized in that: A through hole is provided between the first chamber and the second chamber so that the first chamber and the second chamber are in communication.

3. The refrigerated chef machine with a sandwich pot according to claim 2, characterized in that: The bottom wall of the first chamber is also provided with a liquid injection port which can be opened or closed.

4. The refrigerated chef machine with a sandwich pot according to claim 3, characterized in that: The heat dissipation component comprises a cooling water tank and a heat dissipation water tank, and the cooling water tank is attached to the lower surface of the semiconductor refrigeration sheet.

5. The refrigerated chef machine with a sandwich pot according to claim 4, characterized in that: The cooling water tank is provided with a first water inlet and a first water outlet, the heat dissipation water tank is provided with a second water inlet and a second water outlet, a first water pipe is connected between the first water inlet and the second water outlet, and a second water pipe is connected between the second water inlet and the first water outlet.

6. The refrigerated chef machine with a sandwich pot according to claim 5, characterized in that: The first water pipe is also provided with a water pump.

7. The refrigerated chef machine with a sandwich pot according to claim 6, characterized in that: A fan is arranged below the heat dissipation water tank, and an air inlet is arranged on the base wall below the fan.

8. A refrigerated chef machine with a sandwich pot according to any one of claims 1 to 7, characterized in that: A temperature measuring element is arranged in the heat conducting block.

Images