Substrate slice cleaning and drying device

Abstract

The utility model discloses a substrate slice cleaning and drying device, which relates to the technical field of semiconductor substrate material manufacturing and comprises a moving plate, a driver, a spraying assembly and a drying assembly. A fixing assembly is arranged on the movable plate; the driver is connected with the moving plate; the spraying assembly is arranged on the cleaning station; the drying assembly is arranged on the drying station. The moving plate is driven to move through the driver, then the substrate slice fixed by the fixing assembly on the moving plate can move between the cleaning station and the drying station, the substrate slice can quickly reach the drying station to be dried after being cleaned at the cleaning station, and the cleaning and drying efficiency is greatly improved. Moreover, the cleaning assembly and the drying assembly perform synchronous operation on the first face and the second face of the substrate slice, face changing operation is not needed, and the operation efficiency of cleaning and drying is further improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor substrate material manufacturing, and particularly to a cleaning and drying device for substrate wafers. Background Art

[0002] Indium phosphide is a compound of phosphorus and indium. As a semiconductor material, indium phosphide has excellent properties. Semiconductor devices manufactured using indium phosphide substrates have characteristics such as a high saturated electron drift velocity, a suitable emission wavelength for low-loss optical fiber communication, strong radiation resistance, good thermal conductivity, high photoelectric conversion efficiency, and a relatively wide bandgap. Therefore, indium phosphide substrates can be widely used in the manufacture of optical module devices, sensor devices, high-end radio frequency devices, etc.

[0003] In the manufacture of indium phosphide substrate materials, the polished indium phosphide substrate wafers need to be cleaned and then dried. In the prior art, cleaning and drying are often two independent processes. Therefore, the cleaned indium phosphide substrates need to go through processes of blanking - transfer - reloading before they can be dried, which severely restricts production efficiency. For this reason, there is an urgent need to provide a new solution to solve the above problems. Summary of the Utility Model

[0004] In view of this, the purpose of this application is to provide a cleaning and drying device for substrate wafers to solve the technical problem of low efficiency in the cleaning and drying operations of existing indium phosphide substrates.

[0005] To achieve the above technical purpose, this application provides a cleaning and drying device for substrate wafers, including a moving plate, a driver, a spraying component, and a drying component;

[0006] A fixing component is provided on the moving plate;

[0007] The fixing component is used to fix the substrate wafer;

[0008] The driver is connected to the moving plate and is used to drive the moving plate to move, so that the fixing component moves between the cleaning station and the drying station;

[0009] The spraying component is arranged at the cleaning station and is used to spray and clean the first side and the second side of the substrate wafer;

[0010] The drying component is arranged at the drying station and is used to spray and clean the first side and the second side of the substrate wafer.

[0011] Further, the driver is used to drive the moving plate to move along a first horizontal straight line direction;

[0012] The spraying component and the drying component are arranged along the first horizontal straight line direction.

[0013] Further, the fixing component includes at least one fixture;

[0014] The fixture is used to fix the substrate wafer obliquely.

[0015] Further, the fixing component includes two fixtures;

[0016] The two fixtures are spaced apart along a second horizontal line direction perpendicular to the first horizontal line direction, and are symmetrically arranged with respect to a preset plane perpendicular to the second horizontal line direction.

[0017] Further, the spraying component includes a first spray pipe and a second spray pipe;

[0018] The first spray pipe is vertically arranged above the moving plate, and its central axis coincides with the preset plane;

[0019] A plurality of first cleaning spray holes for spraying and cleaning the first surface of the substrate wafer located on the fixture are provided on the first spray pipe;

[0020] The second spray pipe is connected to the first spray pipe, and is provided with a plurality of second cleaning spray holes for spraying and cleaning the second surface of the substrate wafer located on the fixture.

[0021] Further, the second spray pipe is perpendicularly connected to the end of the first spray pipe away from the moving plate, and is distributed in a T shape with the first spray pipe;

[0022] The first cleaning spray holes are arranged on the outer peripheral wall of the first spray pipe;

[0023] The second cleaning spray holes are arranged at the bottom of the second spray pipe.

[0024] Further, the spraying component further includes a spray bracket;

[0025] The spray bracket is connected to the second spray pipe;

[0026] The spray bracket includes two third spray pipes;

[0027] The two third spray pipes are symmetrically arranged with respect to the first spray pipe, and are respectively connected and fixed to the second spray pipe;

[0028] A plurality of third spray holes for spraying and cleaning the second surface of the substrate wafer on the fixture are arranged on one side surface of the two third spray pipes.

[0029] Further, the drying component includes a first drying pipe and a second drying pipe;

[0030] The first drying pipe is vertically arranged above the moving plate, and its central axis coincides with the preset plane;

[0031] A plurality of first drying spray holes for blowing and drying the first surface of the substrate wafer located on the jig are provided on the first drying pipe;

[0032] The second drying pipe is connected to the first drying pipe and is provided with a plurality of second drying spray holes for blowing and drying the second surface of the substrate wafer located on the jig.

[0033] Further, the second drying pipe is perpendicularly connected to one end of the first drying pipe away from the moving plate and is distributed in a T shape with the first drying pipe;

[0034] The first drying spray holes are arranged on the outer peripheral wall of the first drying pipe;

[0035] The second drying spray holes are arranged at the bottom of the second drying pipe.

[0036] Further, the drying assembly also includes a drying bracket;

[0037] The drying bracket is connected to the second drying pipe;

[0038] The drying bracket includes two third drying pipes;

[0039] The two third drying pipes are symmetrically arranged with respect to the first drying pipe and are respectively connected and fixed to the second drying pipe;

[0040] A plurality of third spray holes for blowing and drying the second surface of the substrate wafer located on the jig are arranged on one side surface of the two third drying pipes.

[0041] As can be seen from the above technical solutions, in the substrate wafer cleaning and drying device designed in the present application, the driver drives the movement of the moving plate, so that the substrate wafer fixed by the fixing component on the moving plate can move between the cleaning station and the drying station. After the substrate wafer completes the cleaning operation at the cleaning station, it can quickly reach the drying station for drying, greatly improving the cleaning and drying efficiency. Moreover, the cleaning component and the drying component perform synchronous operations on the first surface and the second surface of the substrate wafer, without the need for surface-changing operations, further improving the operation efficiency of cleaning and drying. Description of the Drawings

[0042] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0043] Figure 1 A perspective view of a wafer cleaning and drying device provided in the present application;

[0044] Figure 2 A perspective view of a spraying assembly of a wafer cleaning and drying device provided in the present application;

[0045] Figure 3 A perspective view of a drying assembly of a wafer cleaning and drying device provided in the present application;

[0046] Figure 4 A schematic diagram of the cooperation structure between a fixture and a wafer in a wafer cleaning and drying device provided in the present application;

[0047] In the figure: 1, moving plate; 2, driver; 3, fixture; 31, card slot; 32, connecting part; 33, supporting part; 41, first spray pipe; 411, first cleaning spray hole; 42, second spray pipe; 421, second cleaning spray hole; 43, third spray pipe; 431, third cleaning spray hole; 44, first cleaning pipe joint; 45, second cleaning pipe joint; 51, first drying pipe; 511, first drying spray hole; 52, second drying pipe; 521, second drying spray hole; 53, third drying pipe; 531, third drying spray hole; 54, first drying pipe joint; 55, second drying pipe joint; 6, wafer. Detailed implementation manners

[0048] The following will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the drawings. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the embodiments of the present application.

[0049] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0050] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0051] The embodiments of the present application disclose a cleaning and drying device for a wafer substrate 6.

[0052] Please refer to Figure 1 and Figure 2 , an embodiment of a cleaning and drying device for a wafer substrate 6 provided in the embodiments of the present application includes:

[0053] A moving plate 1, a driver 2, a spraying assembly, and a drying assembly.

[0054] A fixing assembly is provided on the moving plate 1, and the fixing assembly is used to fix the wafer substrate 6.

[0055] The driver 2 is connected to the moving plate 1 and is used to drive the moving plate 1 to move so that the fixing assembly moves between the cleaning station and the drying station.

[0056] The spraying assembly is arranged at the cleaning station and is used to spray and clean the first surface and the second surface of the wafer substrate 6; the drying assembly is arranged at the drying station and is used to spray and clean the first surface and the second surface of the wafer substrate 6.

[0057] The cleaning and drying device for the substrate wafer 6 designed in this application drives the movement of the moving plate 1 through the driver 2, so that the substrate wafer 6 fixed by the fixing component on the moving plate 1 can move between the cleaning station and the drying station. After the substrate wafer 6 completes the cleaning operation at the cleaning station, it can quickly reach the drying station for drying, greatly improving the cleaning and drying efficiency. Moreover, the cleaning component and the drying component perform synchronous operations on the first surface and the second surface of the substrate wafer 6, eliminating the need for surface-changing operations and further improving the operation efficiency of cleaning and drying.

[0058] The above is the first embodiment of a cleaning and drying device for a substrate wafer 6 provided by this application. The following is the second embodiment of a cleaning and drying device for a substrate wafer 6 provided by this application. For details, please refer to Figures 1 to 4 。

[0059] Based on the solution of the above first embodiment:

[0060] Further, as Figure 1 shown, the driver 2 is designed to drive the moving plate 1 to move along the first horizontal straight line direction; the spraying component and the drying component are arranged along the first horizontal straight line direction. It can be understood that the driver 2 is a linear displacement driver 2, specifically it can be a linear slide (such as a screw slide); of course, the driver 2 can also be an electric push rod or a telescopic cylinder, and there is no specific limitation.

[0061] Further, as Figure 1 shown, the fixing component includes at least one fixture 3. The fixture 3 is used to fix the substrate wafer 6 obliquely. By using the fixture 3 to fix the substrate wafer 6 obliquely, a certain cleaning / drying angle is formed on both the first surface and the second surface of the substrate wafer 6, which is more conducive to cleaning and drying. The inclination angle of the substrate wafer 6 in this application can be 45° or other angles, which can make a certain spraying and cleaning angle on both the first surface and the second surface to ensure sufficient cleaning or drying.

[0062] Further, as Figure 1 shown, in order to better improve the efficiency, the fixing component is designed to include two fixtures 3.

[0063] The two fixtures 3 are spaced apart along the second horizontal straight line direction perpendicular to the first horizontal straight line direction and are symmetrically arranged with respect to a preset plane perpendicular to the second horizontal straight line direction to achieve double-station cleaning / drying.

[0064] Further, as Figure 2 shown, for the design of the spraying component, it includes a first spray pipe 41 and a second spray pipe 42.

[0065] The first spray pipe 41 is vertically arranged above the moving plate 1, and its central axis coincides with the preset plane;

[0066] A plurality of first cleaning spray holes 411 for spray cleaning the first surface of the substrate wafer 6 located on the jig 3 are provided on the first spray pipe 41; the second spray pipe 42 is connected to the first spray pipe 41 and is provided with a plurality of second cleaning spray holes 421 for spray cleaning the second surface of the substrate wafer 6 located on the jig 3. The width of the gap space between the substrate wafers 6 provided on the two symmetrically arranged jigs 3 should be greater than the width of the first spray pipe 41 to ensure that the moving plate 1 will not be interfered by the first spray pipe 41 when moving.

[0067] Further, as Figure 2 shown, the second spray pipe 42 is perpendicularly connected to one end of the first spray pipe 41 away from the moving plate 1 and is distributed in a T shape with the first spray pipe 41; the length of the second spray pipe 42 can cover the entire moving plate 1 in the first horizontal straight line direction, or at least can cover the two symmetrically arranged jigs 3 of the fixing component, ensuring that the substrate wafers 6 on the two jigs 3 can be spray cleaned simultaneously.

[0068] The first cleaning spray holes 411 are provided on the outer peripheral wall of the first spray pipe 41 and are evenly distributed; the second cleaning spray holes 421 are provided at the bottom of the second spray pipe 42 and are evenly distributed.

[0069] Further, as Figure 2 shown, the first spray pipe 41 and the second spray pipe 42 are conductively connected, and a first cleaning pipe joint 44 is provided on the second spray pipe 42 for connecting to the cleaning liquid supply source; in this way, the two spray pipes share one joint, reducing the number of joints. Of course, the first cleaning pipe joint 44 can also be provided on the first spray pipe 41 without limitation.

[0070] Further, as Figure 2 shown, in order to fix the first spray pipe 41 and the second spray pipe 42, the spray assembly further includes a spray support.

[0071] The spray support is connected to the second spray pipe 42. The spray support includes two third spray pipes 43; the two third spray pipes 43 are symmetrically arranged with respect to the first spray pipe 41 and are respectively connected and fixed to the second spray pipe 42; a plurality of third cleaning spray holes 431 for spray cleaning the second surface of the substrate wafer 6 on the jig 3 are provided on one side surface of the two third spray pipes 43. Using the two third spray pipes 43 to form the spray support not only satisfies the support and fixing function but also can spray clean the substrate wafer 6, further improving the cleaning effect; second cleaning pipe joints 45 can be respectively provided on the third spray pipes 43 for connecting and conducting the cleaning liquid supply source.

[0072] Further, as Figure 3 shown, for the design of the drying component, it includes a first drying pipe 51 and a second drying pipe 52.

[0073] The first drying pipe 51 is vertically arranged above the moving plate 1, and its central axis coincides with the preset plane; a plurality of first drying spray holes 511 for blowing and drying the first surface of the substrate sheet 6 located on the jig 3 are provided on the first drying pipe 51; the second drying pipe 52 is connected to the first drying pipe 51, and a plurality of second drying spray holes 521 for blowing and drying the second surface of the substrate sheet 6 located on the jig 3 are provided. The width of the gap space between the substrate sheets 6 arranged on the two symmetrically arranged jigs 3 should be greater than the width of the first drying pipe 51 to ensure that the moving plate 1 will not be interfered by the first drying pipe 51 when moving.

[0074] Furthermore, as Figure 3 shown, the second drying pipe 52 is perpendicularly connected to the end of the first drying pipe 51 away from the moving plate 1, and is distributed in a T shape with the first drying pipe 51; the length of the second drying pipe 52 can cover the entire moving plate 1 in the first horizontal linear direction, or at least can cover the two symmetrically arranged jigs 3 of the fixing component, ensuring that the substrate sheets 6 on the two jigs 3 can be blown and dried simultaneously.

[0075] The first drying spray holes 511 are arranged on the outer peripheral wall of the first drying pipe 51 and are evenly distributed; the second drying spray holes 521 are arranged at the bottom of the second drying pipe 52 and are evenly distributed.

[0076] Furthermore, as Figure 3 shown, the first drying pipe 51 and the second drying pipe 52 are conductively connected, and a first drying pipe joint 54 is arranged on the second drying pipe 52 for connecting to the blowing gas supply source; in this way, the two drying pipes share one joint, reducing the number of joints. Of course, the first drying pipe joint 54 can also be arranged on the first drying pipe 51, without limitation.

[0077] Furthermore, as Figure 3 shown, in order to be able to fix the first drying pipe 51 and the second drying pipe 52, the drying assembly further includes a drying bracket; the drying bracket is connected to the second drying pipe 52; the drying bracket includes two third drying pipes 53; the two third drying pipes 53 are symmetrically arranged with respect to the first drying pipe 51 and are respectively connected and fixed to the second drying pipe 52; a plurality of third drying spray holes 531 for blowing and drying the second surface of the substrate sheet 6 on the jig 3 are provided on one side surface of the two third drying pipes 53. Using the two third drying pipes 53 to form a drying bracket not only satisfies the support and fixation function, but also can blow and dry the substrate sheet 6, further improving the drying effect; second drying pipe joints 55 can be respectively arranged on the third drying pipes 53 for connecting and conducting the blowing gas supply source.

[0078] As Figure 1As shown, to further improve efficiency, the number of fixing components designed in this application can be two, and they are arranged at intervals along the first horizontal straight line direction. Correspondingly, both the spraying component and the drying component are designed to be two.

[0079] Furthermore, as Figure 4 shown, in order to be able to fix the substrate film 6, the jig 3 is provided with a slot 31 for the substrate film 6 to be inserted and is inclined.

[0080] Furthermore, as Figure 4 shown, there are two slots 31 on the jig 3, and they are arranged at intervals; the design of the spaced double slots 31 can play a better role in fixing the substrate film 6.

[0081] Furthermore, as Figure 4 shown, in terms of the structural design of the jig 3, it includes a connecting part 32 and a supporting part 33.

[0082] The connecting part 32 is fixedly connected to the moving plate 1, and there are two supporting parts 33, which are arranged at intervals on the connecting part 32; taking the design of two slots 31 as an example, then each supporting part 33 is respectively provided with a slot 31.

[0083] Furthermore, as Figure 4 shown, the connecting part 32 is a U-shaped plate structure; while meeting certain strength requirements, it saves manufacturing materials.

[0084] The supporting part 33 is a convex block structure, which is integrally formed with the connecting part 32, reducing the assembly process and making production more convenient.

[0085] The jig 3, the moving plate 1, the first spray pipe 41, the second spray pipe 42, the third spray pipe 43, the first drying pipe 51, the second drying pipe 52, the third drying pipe 53 and each pipe joint in this application can be prepared from PEEK material without limitation.

[0086] Working principle (taking two fixing components and four jigs 3 as an example):

[0087] 1. Manually install four substrate films 6 onto the four jigs 3 on the moving plate 1;

[0088] 2. The driver 2 drives the moving plate 1 to reciprocate in the cleaning station, thereby driving the jig 3 and the substrate film 6 to reciprocate;

[0089] 3. Connect the first cleaning pipe joint 44 and the second cleaning pipe joint 45, so that the first spray pipe 41, the second spray pipe 42 and the third spray pipe 43 spray the cleaning liquid to spray and clean the first side and the second side of the substrate film 6;

[0090] 4. The driver 2 drives the moving plate 1 to reciprocate in the drying station, thereby driving the jig 3 and the substrate wafer 6 to reciprocate.

[0091] 5. Connect the first drying pipe joint 54 and the second drying pipe joint 55, so that the first drying pipe 51, the second drying pipe 52 and the third drying pipe 53 eject gas to blow-dry the first side and the second side of the substrate wafer 6.

[0092] The above has introduced in detail a cleaning and drying device for a substrate wafer 6 provided by the present application. For those of ordinary skill in the art, according to the idea of the embodiments of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A substrate sheet cleaning and drying device, characterized in that: It comprises a moving plate (1), a driver (2), a spraying component and a drying component; The movable plate (1) is provided with a fixing component; The fixing assembly is used to fix the substrate sheet (6); The driver (2) is connected to the movable plate (1) and is used to drive the movable plate (1) to move so that the fixed component moves between the cleaning station and the drying station; The spray assembly is arranged on the cleaning station and is used to spray and clean the first surface and the second surface of the substrate sheet (6); The drying component is arranged on the drying station and is used for spray cleaning the first surface and the second surface of the substrate sheet (6).

2. A substrate sheet cleaning and drying device according to claim 1, characterized in that: The driver (2) is used to drive the movable plate (1) to move along a first horizontal straight line direction; The spraying component and the drying component are arranged along the first horizontal straight line direction.

3. A substrate sheet cleaning and drying device according to claim 2, characterized in that: The fixing assembly comprises at least one fixture (3); The jig (3) is used to fix the substrate sheet (6) in an inclined manner.

4. A substrate sheet cleaning and drying device according to claim 2, characterized in that: The fixing assembly comprises two fixtures (3); The two jigs (3) are spaced apart along a second horizontal straight line direction perpendicular to the first horizontal straight line direction, and are symmetrically arranged relative to a preset plane perpendicular to the second horizontal straight line direction.

5. A substrate sheet cleaning and drying device according to claim 4, characterized in that: The spray assembly comprises a first spray pipe (41) and a second spray pipe (42); The first spray pipe (41) is vertically arranged above the movable plate (1), and its central axis coincides with the preset surface; The first spray pipe (41) is provided with a plurality of first cleaning spray holes (411) for spraying and cleaning the first surface of the substrate sheet (6) located on the fixture (3); The second spray pipe (42) is connected to the first spray pipe (41) and is provided with a plurality of second cleaning spray holes (421) for spraying and cleaning the second surface of the substrate sheet (6) located on the fixture (3).

6. A substrate sheet cleaning and drying device according to claim 5, characterized in that: The second spray pipe (42) is vertically connected to an end of the first spray pipe (41) away from the movable plate (1), and is arranged in a T-shape with the first spray pipe (41); The first cleaning spray hole (411) is arranged on the outer peripheral wall of the first spray pipe (41); The second cleaning spray hole (421) is arranged at the bottom of the second spray pipe (42).

7. A substrate sheet cleaning and drying device according to claim 6, characterized in that: The spray assembly also includes a spray bracket; The spray bracket is connected to the second spray pipe (42); The spray bracket comprises two third spray pipes (43); The two third spray pipes (43) are symmetrically arranged relative to the first spray pipe (41), and are respectively connected and fixed to the second spray pipe (42); A plurality of third cleaning spray holes (431) for spray cleaning the second surface of the substrate sheet (6) on the fixture (3) are provided on one side surface of the two third spray pipes (43).

8. The substrate sheet cleaning and drying device according to claim 4, characterized in that: The drying component comprises a first drying tube (51) and a second drying tube (52); The first drying tube (51) is vertically arranged above the movable plate (1), and its central axis coincides with the preset surface; The first drying tube (51) is provided with a plurality of first drying spray holes (511) for spray drying the first surface of the substrate sheet (6) located on the jig (3); The second drying tube (52) is connected to the first drying tube (51) and is provided with a plurality of second drying spray holes (521) for spray drying the second surface of the substrate sheet (6) located on the jig (3).

9. A substrate sheet cleaning and drying device according to claim 8, characterized in that: The second drying tube (52) is vertically connected to an end of the first drying tube (51) away from the movable plate (1), and is arranged in a T-shape with the first drying tube (51); The first drying spray hole (511) is arranged on the outer peripheral wall of the first drying tube (51); The second drying spray hole (521) is arranged at the bottom of the second drying tube (52).

10. The substrate sheet cleaning and drying device according to claim 9, characterized in that: The drying components all include a drying bracket; The drying support is connected to the second drying tube (52); The drying support comprises two third drying tubes (53); The two third drying tubes (53) are symmetrically arranged relative to the first drying tube (51), and are respectively connected and fixed to the second drying tube (52); A plurality of third drying spray holes (531) for spray drying the second surface of the substrate sheet (6) on the jig (3) are provided on one side surface of the two third drying tubes (53).

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