Cutting device for high-precision circuit board processing

Abstract

The utility model is applicable to the field of cutting devices, and provides a cutting device for high-precision circuit board processing, which comprises a base, two mounting racks are symmetrically and fixedly mounted at the upper end of the base, each mounting rack consists of a mounting plate and a supporting plate, each supporting plate is fixedly mounted at the upper end of the corresponding mounting plate, and an adjusting structure is mounted on each supporting plate. The adjusting structure is composed of a screw rod and a handle. By arranging the mounting frame, the fixed roller, the movable roller and the cleaning structure, the circuit board can be cleaned before being cut by the laser cutting assembly, so that sundries attached to the circuit board are effectively cleaned away, and the situation that the sundries attached to the circuit board affect cutting of the circuit board by the laser cutting assembly is avoided; according to the circuit board cleaning device, the adjusting structure and the moving plate are arranged, meanwhile, the cleaning structure and the moving roller are installed on the moving plate, the distance between the moving roller and the fixed roller can be adjusted according to the thickness of a circuit board, the height of the cleaning structure can be adjusted, and therefore the cleaning structure can clean circuit boards with different thicknesses.

Description

Technical Field

[0001] The utility model belongs to the field of cutting devices, and particularly relates to a cutting device for processing high-precision circuit boards. Background Art

[0002] A high-precision circuit board is a substrate of electronic components with high precision, multi-layer structure and complex circuit connections, and is widely used in fields such as communication, medical treatment, aviation, and military. During the production of high-precision circuit boards, laser cutting equipment is often required for cutting.

[0003] During the production of circuit boards, some sundries are likely to adhere to them. In the existing patent application with the application number CN202222542147.6, a laser cutting device for circuit boards does not have a structure for cleaning the circuit boards. Therefore, the sundries on the circuit boards may cause the laser beam to fail to accurately focus on the target cutting line, or the sundries themselves are melted by the laser beam and adhered to the cutting surface, resulting in a rough and uneven cutting surface, even burrs, reducing the cutting quality. At the same time, the sundries may block the transmission path of the laser beam, causing the laser beam to deviate from the preset cutting path, thereby reducing the cutting accuracy. Therefore, it needs to be improved. Content of the Utility Model

[0004] An embodiment of the utility model provides a cutting device for processing high-precision circuit boards, aiming to solve the problem that the existing laser cutting device does not have a structure for cleaning the circuit boards. Therefore, the sundries on the circuit boards may cause the laser beam to fail to accurately focus on the target cutting line, or the sundries themselves are melted by the laser beam and adhered to the cutting surface, resulting in a rough and uneven cutting surface, even burrs, reducing the cutting quality. At the same time, the sundries may block the transmission path of the laser beam, causing the laser beam to deviate from the preset cutting path, thereby reducing the cutting accuracy.

[0005] An embodiment of the utility model provides a cutting device for processing high-precision circuit boards, including a base. Two mounting frames are symmetrically and fixedly installed at the upper end of the base. The mounting frame is composed of a mounting plate and a support plate. The support plate is fixedly installed at the upper end of the mounting plate. An adjusting structure is installed on the support plate. The adjusting structure is composed of a screw rod and a handle. The handle is fixedly installed at the upper end of the screw rod. A moving plate is installed in the support plate and on the screw rod. Two fixed rollers are rotatably installed on the two support plates of the two mounting frames. Two moving rollers are rotatably installed on the two moving plates. A cleaning structure is fixedly installed between the two moving rollers at the inner ends of the two moving plates. The cleaning structure is composed of a base rod and a rubber scraping plate. The rubber scraping plate is fixedly installed at the lower end of the base rod.

[0006] Further, a moving gantry is installed on the base, a moving support is installed on the moving gantry, and a laser cutting assembly is fixedly installed on the moving support.

[0007] Further, the mounting plate on the mounting frame is fixedly installed at the upper end of the base. An installation groove is formed in the support plate. Two first holes are symmetrically formed in the support plate below the installation groove. A through hole is formed in the upper end of the support plate, and the through hole communicates with the installation groove.

[0008] Further, the screw rod on the adjusting structure is rotatably installed in the installation groove and the through hole formed in the support plate, and the handle is located above the support plate.

[0009] Further, the moving plate is movably installed in the installation groove formed in the support plate.

[0010] Further, two second holes are symmetrically formed in the moving plate, the second holes penetrate the moving plate from left to right, a threaded hole is formed in the moving plate between the two second holes, the threaded hole penetrates the moving plate from top to bottom, and the moving plate is installed on the screw rod through the threaded hole.

[0011] Further, the fixed roller is rotatably installed on the two first holes, and the moving roller is rotatably installed on the two second holes.

[0012] Further, the base rod on the cleaning structure is fixedly connected to the moving plate.

[0013] Compared with the prior art, the utility model can clean the circuit board before it is cut by the laser cutting assembly by arranging the mounting frame, the fixed roller, the moving roller and the cleaning structure, so as to effectively clean the sundries attached thereto, and further avoid the sundries attached to the circuit board from affecting the cutting of the circuit board by the laser cutting assembly; by arranging the adjusting structure and the moving plate, and installing the cleaning structure and the moving roller on the moving plate at the same time, the distance between the moving roller and the fixed roller can be adjusted according to the thickness of the circuit board, and the height of the cleaning structure can also be adjusted, so that the cleaning structure can clean circuit boards of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 is a schematic diagram of the mounting frame and the fixed roller of the utility model;

[0016] Figure 3 is a schematic diagram of the moving plate, the moving roller and the adjusting structure of the utility model;

[0017] Figure 4It is a schematic structural diagram of the cleaning structure of the present utility model.

[0018] Among them, 1. Base; 2. Mounting frame; 3. Adjusting structure; 4. Moving plate; 5. Fixed roller; 6. Moving roller; 7. Cleaning structure; 8. Moving gantry; 9. Moving bracket; 10. Laser cutting assembly; 11. Mounting plate; 12. Support plate; 13. Mounting groove; 14. First hole; 15. Through hole; 16. Screw; 17. Handle; 18. Rubber squeegee; 19. Screw hole; 20. Second hole; 21. Base rod. Detailed implementation manners

[0019] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0021] When used herein, it should also be understood that the terms "including / comprising" or "having" etc. specify the presence of the stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the related listed items.

[0022] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a cutting device for processing high-precision circuit boards includes a base 1, a moving gantry 8 is installed on the base 1, a moving bracket 9 is installed on the moving gantry 8, and a laser cutting assembly 10 is fixedly installed on the moving bracket 9.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4As shown in the figure, two mounting brackets 2 are symmetrically and fixedly installed at the upper end of the base 1. The mounting bracket 2 is composed of a mounting plate 11 and a support plate 12. The support plate 12 is fixedly installed at the upper end of the mounting plate 11. The mounting plate 11 on the mounting bracket 2 is fixedly installed at the upper end of the base 1. An installation groove 13 is provided on the support plate 12. Two first holes 14 are symmetrically provided on the support plate 12 and below the installation groove 13. A through hole 15 is provided at the upper end of the support plate 12, and the through hole 15 communicates with the installation groove 13. Two fixing rollers 5 are rotatably installed on the two support plates 12 of the two mounting brackets 2. Two moving rollers 6 are rotatably installed on the two moving plates 4. The fixing roller 5 is rotatably installed on the two first holes 14. The moving roller 6 is rotatably installed on the two second holes 20. A cleaning structure 7 is fixedly installed between the two moving rollers 6 at the inner ends of the two moving plates 4. The cleaning structure 7 is composed of a base rod 21 and a rubber scraper 18. The rubber scraper 18 is fixedly installed at the lower end of the base rod 21. The base rod 21 on the cleaning structure 7 is fixedly connected to the moving plate 4. By providing the mounting bracket 2, the fixing roller 5, the moving roller 6 and the cleaning structure 7, the circuit board can be cleaned before being cut by the laser cutting assembly 10, so as to effectively clean the sundries attached thereto, and further avoid the sundries attached to the circuit board from affecting the laser cutting assembly 10 to cut the circuit board.

[0024] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown in the figure, an adjusting structure 3 is installed on the support plate 12. The adjusting structure 3 is composed of a screw rod 16 and a handle 17. The handle 17 is fixedly installed at the upper end of the screw rod 16. The screw rod 16 on the adjusting structure 3 is rotatably installed in the installation groove 13 and the through hole 15 provided on the support plate 12. The handle 17 is located above the support plate 12. A moving plate 4 is installed on the screw rod 16 inside the support plate 12. The moving plate 4 is movably installed in the installation groove 13 provided on the support plate 12. Two second holes 20 are symmetrically provided on the moving plate 4, and the second holes 20 penetrate the moving plate 4 left and right. A threaded hole 19 is provided between the two second holes 20 on the moving plate 4, and the threaded hole 19 penetrates the moving plate 4 up and down. The moving plate 4 is installed on the screw rod 16 through the threaded hole 19. By providing the adjusting structure 3 and the moving plate 4, and at the same time installing the cleaning structure 7 and the moving roller 6 on the moving plate 4, the distance between the moving roller 6 and the fixing roller 5 can be adjusted according to the thickness of the circuit board, and the height of the cleaning structure 7 can also be adjusted, so that the cleaning structure 7 can clean circuit boards of different thicknesses.

[0025] It should be noted that the present utility model is a cutting device for processing high-precision circuit boards. When cutting and processing a circuit board, the circuit board to be cut can first be passed through between the fixed roller 5 and the moving roller 6, and then the circuit board can be placed on the upper end of the base 1. When the circuit board passes through between the fixed roller 5 and the moving roller 6, the fixed roller 5 and the moving roller 6 will rotate due to friction with the circuit board. At the same time, the upper end of the circuit board will come into contact and friction with the rubber scraper 18 on the cleaning structure 7. Thus, as the circuit board moves, the rubber scraper 18 will scrape off the sundries attached to the upper end of the circuit board. When the circuit board completely passes through between the fixed roller 5 and the moving roller 6, it can be placed on the upper end of the base 1, and then the moving gantry 8, the moving support 9, and the laser cutting assembly 10 can be started to cut the circuit board; when it is necessary to adjust the distance between the fixed roller 5 and the moving roller 6 according to the thickness of the circuit board to be cleaned and cut, the adjusting structure 3 can be rotated. As the adjusting structure 3 rotates, the moving plate 4 will move on the screw 16, and the moving roller 6 and the cleaning structure 7 will move together with the moving plate 4. When the moving plate 4 moves upward, the moving roller 6 will move away from the fixed roller 5, and the height of the cleaning structure 7 will increase. At this time, a circuit board with a thicker thickness can pass through between the moving roller 6 and the fixed roller 5, so that the cleaning structure 7 can clean a thicker circuit board.

[0026] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

[0027] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered that the scope described in this specification is covered.

[0028] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent shall be subject to the appended claims.

Claims

1. A cutting device for high-precision circuit board processing, comprising a base, characterized in that: Two mounting frames are symmetrically fixedly installed on the upper end of the base, and the mounting frame consists of a mounting plate and a supporting plate, and the supporting plate is fixedly installed on the upper end of the mounting plate, and an adjusting structure is installed on the supporting plate, and the adjusting structure consists of a screw and a handle, and the handle is fixedly installed on the upper end of the screw, and a movable plate is installed in the supporting plate and on the screw, two fixed rollers are rotatably installed on the two supporting plates on the two mounting frames, and two movable rollers are rotatably installed on the two movable plates, and a cleaning structure is fixedly installed at the inner ends of the two movable plates and between the two movable rollers, and the cleaning structure consists of a base rod and a rubber scraper, and the rubber scraper is fixedly installed on the lower end of the base rod.

2. The cutting device for high-precision circuit board processing according to claim 1, characterized in that: A mobile gantry is installed on the base, a mobile bracket is installed on the mobile gantry, and a laser cutting component is fixedly installed on the mobile bracket.

3. The cutting device for high-precision circuit board processing according to claim 2, characterized in that: The mounting plate on the mounting frame is fixedly mounted on the upper end of the base, a mounting groove is provided on the support plate, two No. 1 holes are symmetrically provided on the support plate and below the mounting groove, a through hole is provided on the upper end of the support plate, and the through hole is connected to the mounting groove.

4. The cutting device for high-precision circuit board processing as claimed in claim 3, characterized in that: The screw rod on the adjusting structure is rotatably mounted in the mounting groove and the through hole provided on the supporting plate, and the handle is located above the supporting plate.

5. The cutting device for high-precision circuit board processing according to claim 4, characterized in that: The movable plate is movably installed in a mounting groove provided on the supporting plate.

6. The cutting device for high-precision circuit board processing according to claim 5, characterized in that: The movable plate is symmetrically provided with two No. 2 holes, the No. 2 holes penetrate the movable plate from left to right, and the movable plate is provided with a screw hole between the two No. 2 holes, the screw hole penetrates the movable plate from top to bottom, and the movable plate is mounted on the screw rod through the screw hole.

7. The cutting device for high-precision circuit board processing according to claim 6, characterized in that: The fixed roller is rotatably mounted on the two No. 1 holes, and the movable roller is rotatably mounted on the two No. 2 holes.

8. The cutting device for high-precision circuit board processing according to claim 7, characterized in that: The base rod on the cleaning structure is fixedly connected to the movable plate.

Images