Silicon wafer conveying device

Abstract

The utility model belongs to the technical field of silicon wafer conveying equipment, and discloses a silicon wafer conveying device which comprises a frame body, a working table, a tensioning mechanism, a belt, a bearing piece and a driving assembly. In the transportation process, a silicon wafer is firstly placed on the bearing piece, then the driving assembly drives the bearing piece to move in the length direction of the guide groove so that the silicon wafer can be conveyed to the downstream station from the upstream station, meanwhile, the bearing piece drives the belt to move synchronously, and the belt seals the guide groove under the action of the tensioning mechanism. Through the arrangement, the belt can move along with the bearing piece all the time and seal the guide groove, so that fragments can be prevented from falling into a working part below the workbench through the guide groove, and normal work of the conveying device can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer transportation equipment, in particular to a silicon wafer conveying device. Background Art

[0002] During the preparation process of silicon wafers, a conveying device is usually used to convey the silicon wafers from the upstream station to the downstream station. The existing conveying device generally includes a workbench and a conveying mechanism. The conveying mechanism is arranged under the workbench, and a guide groove is arranged on the workbench. The carrier of the conveying mechanism passes through the guide groove and extends to the workbench. The carrier is used to carry the silicon wafer.

[0003] However, silicon wafers are fragile materials and are easily broken during production or transportation, forming fragments, debris, etc. Therefore, when the existing conveying device conveys silicon wafers, the fragments easily fall into the conveying mechanism under the workbench through the guide groove, causing the conveying mechanism to get stuck and fail to work normally.

[0004] Therefore, the above problems need to be solved urgently. Utility Model Content

[0005] The utility model aims to provide a silicon wafer conveying device to solve the problem that the chips easily fall into the conveying mechanism below the workbench through the guide groove, thereby causing the conveying mechanism to be stuck and unable to work normally.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A silicon wafer conveying device, comprising:

[0008] Frame;

[0009] A work surface is arranged on the frame, and a guide groove is arranged on the work surface;

[0010] A carrier, disposed on the work surface, and used for carrying a silicon wafer;

[0011] A driving assembly is disposed below the work surface and is drivingly connected to the bearing member through the guide groove to drive the bearing member to reciprocate along the length direction of the guide groove;

[0012] The belt and the tensioning mechanism are both arranged below the work surface. The tensioning mechanism is used to tension the belt so that the belt seals the guide groove. The belt is fixedly connected to the bearing member and moves synchronously.

[0013] Preferably, the belt is wound around the frame through two pulleys, the two pulleys are respectively located at two ends of the guide groove, and the belt has a sealing portion that reciprocates in the guide groove.

[0014] Preferably, the tensioning mechanism includes:

[0015] At least one tensioning pulley, which is arranged on the frame body, and each tensioning pulley is configured to adjust the tension of the belt so that the sealing part is in a flat state.

[0016] One of the tensioning pulleys is pivotally connected to the frame body through a mounting member, and the tensioning pulley acts on one side of the belt below the workbench surface by its own gravity.

[0017] Preferably, two of the belt pulleys, the belt and the carrier member form a set of conveying components. There are multiple sets of the conveying components, and the multiple sets of conveying components are arranged in a first direction, and the first direction is perpendicular to the length direction of the guide groove, and the number of the guide grooves corresponds to the number of the conveying components.

[0018] Preferably, the silicon wafer conveying device further includes a synchronization component arranged between the driving component and the multiple carrier members, and the synchronization component is configured to synchronously transmit the driving force provided by the driving component to the multiple carrier members to drive the multiple carrier members to move synchronously.

[0019] Preferably, the driving component includes:

[0020] A servo motor, which is arranged on the frame body;

[0021] A driving wheel, which is coaxially arranged on the output shaft of the servo motor;

[0022] A driven wheel, which is arranged on the frame body, and the driven wheel and the driving wheel are arranged along the length direction of the guide groove;

[0023] A transmission belt, which is wound around the driving wheel and the driven wheel, and the synchronization component is in transmission connection with the transmission belt.

[0024] Preferably, the synchronization component includes:

[0025] A guide rail, which is arranged on the frame body along the length direction of the guide groove;

[0026] A slider, which is in sliding fit with the guide rail;

[0027] A connecting member, and the slider and the transmission belt are connected by the connecting member;

[0028] An adapter, and the carrier member is connected to the connecting member through the adapter, and the number of the adapters corresponds to the number of the carrier members.

[0029] Preferably, two sets of the conveying components form a transportation mechanism, and one transportation mechanism is used to transport one silicon wafer.

[0030] Preferably, two of the carriers in the same transport mechanism can be lifted and lowered synchronously.

[0031] Preferably, both of the adapters in the same transport mechanism include a moving part connected to the carrier, and the two moving parts are connected by a synchronizing part;

[0032] The transport mechanism includes a power part arranged on the connecting part, and the power part is configured to drive the synchronizing part to move.

[0033] Advantages of the present utility model:

[0034] The belt of the wafer conveying device provided by the present utility model can always follow the movement of the carrier and seal the guide groove, so as to avoid debris falling into the working parts under the workbench through the guide groove, and further ensure the normal operation of the conveying device. Description of the drawings

[0035] Figure 1 is a schematic structural diagram of the wafer conveying device provided by the present utility model;

[0036] Figure 2 is a schematic structural diagram of the conveying assembly provided by the present utility model;

[0037] Figure 3 is a schematic structural diagram of the transport mechanism, the drive assembly and the synchronization assembly provided by the present utility model;

[0038] Figure 4 is Figure 1 an enlarged view of part A in

[0039] Figure 5 is Figure 3 an enlarged view of part B in

[0040] In the figure:

[0041] 1, frame; 11, workbench surface; 12, guide groove;

[0042] 3, transport mechanism; 30, conveying assembly; 31, pulley; 32, belt; 321, sealing part; 33, carrier; 34, tensioning wheel; 35, mounting part;

[0043] 4, drive assembly; 41, servo motor; 42, driving wheel; 43, driven wheel; 44, transmission belt;

[0044] 5, synchronization assembly; 51, guide rail; 52, slider; 53, connecting part; 54, adapter; 541, moving part; 542, synchronizing part; 55, power part. Detailed implementation manners

[0045] Before explaining any embodiments of the present application in detail, it should be understood that the present application is not limited to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0046] In the present application, the terms "comprising", "including", "having" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising that element.

[0047] In the present application, the term "and / or" describes an associative relationship between associated objects, indicating that three relationships may exist. For example, a centrifugal vortex magnetic pump and / or a centrifugal vortex magnetic pump may represent: the sole existence of a centrifugal vortex magnetic pump, the simultaneous existence of a centrifugal vortex magnetic pump and a centrifugal vortex magnetic pump, and the sole existence of a centrifugal vortex magnetic pump. Additionally, in the present application, the character " / " generally indicates that the associated objects before and after are in an "and / or" relationship.

[0048] In the present application, the terms "connected", "joined", "coupled", "mounted" may be direct connection, joining, coupling or mounting, or may be indirect connection, joining, coupling or mounting. For example, direct connection means that two parts or components are connected together without the need for an intermediate member, and indirect connection means that two parts or components are respectively connected to at least one intermediate member, and these two parts or components are connected through the intermediate member. In addition, "connected" and "coupled" are not limited to physical or mechanical connection or coupling, and may include electrical connection or coupling.

[0049] In the present application, those of ordinary skill in the art will understand that relative terms used in combination with a quantity or condition (such as "about", "approximately", "substantially", etc.) are intended to include the stated value and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances caused by manufacturing, assembly, use, etc. associated with a particular value. Such terms should also be considered to disclose a range defined by the absolute values of two endpoints. Relative terms may refer to plus or minus a certain percentage (such as 1%, 5%, 10% or more) of the indicated value. A numerical value without a relative term should also be disclosed as a specific value with a tolerance. In addition, when expressing a relative angular positional relationship (such as substantially parallel, substantially perpendicular), "substantially" may refer to plus or minus a certain number of degrees (such as 1 degree, 5 degrees, 10 degrees or more) based on the indicated angle.

[0050] In this application, it will be understood by those skilled in the art that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0051] In the present application, the terms "upper", "lower", "left", "right", "front", "back" and other directional words are described based on the orientation and positional relationship shown in the accompanying drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element. It should also be understood that directional words such as upper side, lower side, left side, right side, front side, back side, etc. not only represent the positive orientation, but can also be understood as the lateral orientation. For example, the bottom can include directly below, lower left, lower right, lower front, and lower back, etc.

[0052] See also Figures 1 to 5 The present embodiment provides a silicon wafer conveying device, which includes a frame 1, a work surface 11, a belt 32, a tensioning mechanism, a carrier 33 and a driving assembly 4. The work surface 11 is arranged on the frame 1, and a guide groove 12 is arranged on the work surface 11. The carrier 33 is arranged on the upper surface of the work surface 11, and the carrier 33 is used to carry silicon wafers. The driving assembly 4 is arranged under the work surface 11, and is connected to the carrier 33 through the guide groove 12 to drive the carrier 33 to reciprocate along the length direction of the guide groove 12. The belt 32 and the tensioning mechanism are both arranged under the work surface 11, and the tensioning mechanism is used to tension the belt so that the belt 32 seals the guide groove 12, and the belt 32 is fixedly connected to the carrier 33 and moves synchronously.

[0053] During the transportation process, the silicon wafer is first placed on the carrier 33, and then the driving assembly 4 drives the carrier 33 to move along the length direction of the guide groove 12 to transport the silicon wafer from the upstream station to the downstream station. At the same time, the carrier 33 drives the belt 32 to move synchronously, and the belt 32 seals the guide groove 12 under the action of the tensioning mechanism. In this way, the belt 32 can always follow the movement of the carrier 33 and seal the guide groove 12, so as to avoid debris from falling into the working parts under the workbench through the guide groove 12, thereby ensuring the normal operation of the conveying device.

[0054] To make the belt 32 fit more securely with the guide groove 12, the belt 32 is wound around the frame 1 through two pulleys 31. The two pulleys 31 are respectively located at both ends of the guide groove 12. The belt 32 has a sealing portion 321 that reciprocates within the guide groove 12. With such an arrangement, the belt 32 seals the guide groove 12 through the sealing portion 321 filled in the guide groove 12. When the sealing portion 321 and the carrier 33 move synchronously, the guide groove 12 can guide the sealing portion 321, thereby preventing the sealing portion 321 from disengaging from the guide groove 12. Of course, in other embodiments, the belt 32 can also be abutted against the back surface of the workbench 11 to cover the guide groove 12.

[0055] Generally speaking, the tension of the belt 32 will gradually decrease after long-term use, and the belt 32 cannot seal the guide groove 12 well after long-term use. In this embodiment, the tension of the belt 32 can be adjusted through a tensioning mechanism, thereby extending the service life of the wafer conveying device.

[0056] Specifically, the tensioning mechanism includes at least one tensioning pulley 34. Each tensioning pulley 34 is disposed on the frame 1, and each tensioning pulley 34 is configured to adjust the tension of the belt 32 so that the sealing portion 321 is in a straight state.

[0057] Further, one of the tensioning pulleys 34 is pivotally connected to the frame 1 through a mounting member 35. The tensioning pulley 34 acts on one side of the belt 32 below the workbench 11 by its own gravity, so as to adapt to the magnitude of the tension applied to the lower side of the belt 32 during the tension adjustment of the belt 32. That is, the tension applied to the lower side of the belt 32 by the gravity of the tensioning pulley 34 can always straighten the sealing portion 321 of the belt 32. In this embodiment, two tensioning pulleys 34 are provided. Of course, in other embodiments, the number of tensioning pulleys 34 can also be three, four or more. This embodiment does not make specific requirements and limitations on this.

[0058] To improve the transportation efficiency of the wafer conveying device, in this embodiment, two pulleys 31, a belt 32 and a carrier 33 form a set of conveying components 30. Multiple sets of conveying components 30 are arranged in a first direction, and the first direction is perpendicular to the length direction of the guide groove 12. The number of guide grooves 12 is set corresponding to the number of conveying components 30. It can be understood that multiple sets of conveying components 30 can transport multiple wafers simultaneously, thus helping to improve the transportation efficiency of the wafer conveying device. It can also be understood that two or more of the multiple conveying components 30 can cooperate with each other to transport large-sized wafers, thus helping to improve the applicability of the wafer conveying device.

[0059] It should be noted that when two or more conveying components 30 convey the same silicon wafer, the conveying speeds of the two or more conveying components 30 need to be kept consistent to ensure that the silicon wafer does not fall. For this purpose, in this embodiment, the silicon wafer conveying device further includes a synchronization component 5 disposed between the driving component 4 and the plurality of carrier members 33. The synchronization component 5 is configured to synchronously transmit the driving force provided by the driving component 4 to the plurality of carrier members 33 to drive the plurality of carrier members 33 to move synchronously.

[0060] It should be noted that in other embodiments, a plurality of driving components 4 are provided corresponding to the plurality of conveying components 30, and the plurality of driving components 4 synchronously drive the plurality of conveying components 30 to move, which can also make the conveying speeds of the plurality of conveying components 30 consistent, and will not be elaborated here.

[0061] In this embodiment, the driving component 4 includes a servo motor 41, a driving wheel 42, a driven wheel 43, and a transmission belt 44. The servo motor 41 is disposed on the frame 1. The driving wheel 42 is coaxially disposed on the output shaft of the servo motor 41. The driven wheel 43 is disposed on the frame 1, and the driven wheel 43 and the driving wheel 42 are arranged along the length direction of the guide groove 12. The transmission belt 44 is wound around the driving wheel 42 and the driven wheel 43, and the synchronization component 5 is in transmission connection with the transmission belt 44. It can be understood that the servo motor 41 has the advantages of high precision, high speed, high stability, etc., which helps to improve the reliability and stability of the silicon wafer conveying device.

[0062] In this embodiment, the synchronization component 5 includes a guide rail 51, a slider 52, a connecting member 53, and an adapter 54. The guide rail 51 is disposed on the frame 1 along the length direction of the guide groove 12. The slider 52 is slidably engaged with the guide rail 51. The slider 52 and the transmission belt 44 are connected by the connecting member 53. The carrier member 33 and the adapter 54 are connected to the connecting member 53 through the adapter 54, and the number of the adapters 54 is set corresponding to the number of the carrier members 33. It can be understood that the plurality of carrier members 33 are all connected to the connecting member 53 through their corresponding adapters 54. When the driving component 4 drives the connecting member 53 to move, the plurality of carrier members 33 can be synchronously driven to move, so that the conveying speeds of the plurality of conveying components 30 can be ensured to be consistent. It can also be understood that the structure composed of the guide rail 51 and the slider 52 can guide the connecting member 53, which helps to improve the smoothness of the movement of the connecting member 53.

[0063] It should be noted that in this embodiment, there are four conveying components 30. Among them, two groups of conveying components 30 form a transportation mechanism 3, and one transportation mechanism 3 is used to transport one silicon wafer. With such a setting, the silicon wafer conveying device can convey two silicon wafers simultaneously, with high efficiency. It is worth noting that usually, the height of the carrier 33 needs to be adjusted before conveying to prevent the silicon wafer from interfering with the workbench surface 11 during the conveying process. For this purpose, the two carriers 33 in the same transportation mechanism 3 can be lifted and lowered synchronously to synchronously adjust the heights of the two carriers 33.

[0064] Specifically, the two adapter parts 54 in the same transportation mechanism 3 both include a moving part 541 connected to the carrier 33, and the two moving parts 541 are connected by a synchronizing part 542. The transportation mechanism 3 includes a power part 55 arranged on the connecting part 53, and the power part 55 is configured to drive the synchronizing part 542 to move. It can be understood that when the power part 55 drives the synchronizing part 542 to move, the synchronizing part 542 can drive the two moving parts 541 to move together, so as to realize synchronous driving of the two carriers 33. It should be noted that the moving part 541 can be any one of the existing linear driving mechanisms in the prior art, such as an electric cylinder, a pneumatic cylinder, a linear module, etc. This embodiment does not make specific requirements and limitations on this.

[0065] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A silicon wafer conveying device, characterized in that: include: Frame (1); A work surface (11) is arranged on the frame (1), and a guide groove (12) is arranged on the work surface (11); A carrier (33) is arranged on the working table (11), and the carrier (33) is used to carry a silicon wafer; A driving assembly (4) is arranged below the work surface (11) and is drivingly connected to the bearing member (33) through the guide groove (12) so as to drive the bearing member (33) to reciprocate along the length direction of the guide groove (12); The belt (32) and the tensioning mechanism are both arranged below the work surface (11); the tensioning mechanism is used to tension the belt so that the belt (32) seals the guide groove (12); the belt (32) is fixedly connected to the carrier (33) and moves synchronously.

2. A silicon wafer conveying device according to claim 1, characterized in that: The belt (32) is wound around the frame (1) via two pulleys (31), the two pulleys (31) are respectively located at two ends of the guide groove (12), and the belt (32) has a sealing portion (321) that reciprocates in the guide groove (12).

3. A silicon wafer conveying device according to claim 2, characterized in that: The tensioning mechanism comprises: at least one tensioning wheel (34) disposed on the frame (1), each of the tensioning wheels (34) being configured to adjust the tension of the belt (32) so that the sealing portion (321) is in a straight state; One of the tensioning wheels (34) is pivotally connected to the frame (1) via a mounting member (35), and the tensioning wheel (34) acts on the side of the belt (32) located below the work surface (11) through its own weight.

4. The silicon wafer conveying device according to claim 2, characterized in that: The two pulleys (31), the belt (32) and the carrier (33) form a group of conveying components (30), and the conveying components (30) are provided in multiple groups. The multiple groups of conveying components (30) are arranged along a first direction, and the first direction is perpendicular to the length direction of the guide groove (12). The number of the guide grooves (12) is set corresponding to the number of the conveying components (30).

5. The silicon wafer conveying device according to claim 4, characterized in that: The silicon wafer conveying device further comprises a synchronization component (5) arranged between the driving component (4) and the plurality of the carriers (33), wherein the synchronization component (5) is configured to synchronously transmit the driving force provided by the driving component (4) to the plurality of the carriers (33) to drive the plurality of the carriers (33) to move synchronously.

6. The silicon wafer conveying device according to claim 5, characterized in that: The driving assembly (4) comprises: A servo motor (41) is arranged on the frame (1); A driving wheel (42) is coaxially arranged on the output shaft of the servo motor (41); A driven wheel (43) is arranged on the frame (1), and the driven wheel (43) and the driving wheel (42) are arranged along the length direction of the guide groove (12); A transmission belt (44) is wound around the driving wheel (42) and the driven wheel (43), and the synchronous component (5) is transmission-connected to the transmission belt (44).

7. The silicon wafer conveying device according to claim 6, characterized in that: The synchronization component (5) comprises: A guide rail (51) is arranged on the frame (1) along the length direction of the guide groove (12); A slider (52) slidingly cooperates with the guide rail (51); A connecting member (53), wherein the slider (52) and the transmission belt (44) are connected via the connecting member (53); An adapter (54), the bearing member (33) is connected to the connecting member (53) via the adapter (54), and the number of the adapters (54) is set corresponding to the number of the bearing members (33).

8. The silicon wafer conveying device according to claim 7, characterized in that: Two groups of the conveying components (30) form a transport mechanism (3), and one transport mechanism (3) is used to transport one silicon wafer.

9. The silicon wafer conveying device according to claim 8, characterized in that: The two bearing members (33) in the same transport mechanism (3) can be raised and lowered synchronously.

10. The silicon wafer conveying device according to claim 9, characterized in that: The two adapters (54) in the same transport mechanism (3) both include a moving part (541) connected to the carrier (33), and the two moving parts (541) are connected via a synchronizing part (542); The transport mechanism (3) comprises a power part (55) arranged on the connecting member (53), and the power part (55) is configured to drive the synchronization part (542) to move.

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