Feeding device for copper deposition treatment of circuit board

Abstract

The utility model discloses a feeding device for copper deposition processing of a circuit board, which comprises a positioning base plate, two groups of vertical plates are symmetrically and fixedly connected to the top of the positioning base plate, and the positioning base plate, the vertical plates, a conveying device body, a [-shaped frame, a translation assembly, a mounting frame and a guide assembly are matched for use. The distance between the two groups of guide assemblies can be adjusted through the translation assembly, so that circuit boards with different sizes can be guided, each circuit board can be conveyed forwards at the same position, and the feeding consistency of the circuit boards is guaranteed; by means of the clamping assembly, the centralized circuit board on the conveying device body can be clamped and positioned, in the copper deposition treatment process of the circuit board, accurate positioning of the position of the circuit board is crucial to guarantee of the copper deposition quality, and the clamping assembly can guarantee that the position of the circuit board in copper deposition equipment is accurate through the accurate clamping and positioning functions; therefore, the precision and the reliability of copper deposition are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, and particularly relates to a feeding device for electroless copper plating treatment of circuit boards. Background Art

[0002] In the rapid development of the electronics manufacturing industry, as a basic component of electronic devices, the quality and performance of circuit boards directly affect the stability and reliability of the final products. Electroless copper plating treatment of circuit boards, as one of the key links in the circuit board manufacturing process, is of great significance for improving the electrical conductivity, corrosion resistance and reliability of circuit boards.

[0003] In the existing technology of electroless copper plating treatment of circuit boards, the transportation process of circuit boards often faces a significant challenge: in the existing circuit board transportation system, there is often a lack of a special positioning mechanism to accurately control the position of circuit boards on the conveyor belt, which leads to the easy occurrence of offset, rotation or stacking of circuit boards during transportation, making the positions of each circuit board different when reaching the electroless copper plating treatment unit. Therefore, we need to propose a feeding device for electroless copper plating treatment of circuit boards. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a feeding device for electroless copper plating treatment of circuit boards, aiming to solve the problem that in the existing technology, there is often a lack of a special positioning mechanism to accurately control the position of circuit boards on the conveyor belt, which leads to the easy occurrence of offset, rotation or stacking of circuit boards during transportation, making the positions of each circuit board different when reaching the electroless copper plating treatment unit.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A feeding device for electroless copper plating treatment of circuit boards includes a positioning base plate. Two groups of vertical plates are symmetrically and fixedly connected to the top of the positioning base plate. A conveying device body is installed on the opposite sides of the two groups of vertical plates. A U-shaped frame is fixedly installed on the top of the positioning base plate. A translation component is arranged on the inner wall of the U-shaped frame. Two moving ends of the translation component are respectively connected with mounting frames. Guide components for positioning the circuit boards are respectively arranged at the bottoms of the two groups of mounting frames. Two groups of clamping components for positioning the circuit boards are symmetrically arranged on one side of the upper surface of the positioning base plate.

[0007] Preferably, the translation component includes a bidirectional lead screw. The two ends of the bidirectional lead screw are respectively rotatably installed on the inner walls of the two sides of the U-shaped frame. One end of the bidirectional lead screw penetrates through the U-shaped frame and is connected with a driving motor. Two groups of movable blocks are symmetrically threadedly connected to the outer wall of the bidirectional lead screw. The tops of the two groups of mounting frames are respectively fixedly connected to the bottoms of the two groups of movable blocks.

[0008] Preferably, bump blocks are fixedly connected to the tops of the two groups of movable blocks respectively, and sliding rods are fixedly connected to the inner walls of the two sides of the U-shaped frame. The two groups of bump blocks are both movably sleeved on the outer walls of the sliding rods.

[0009] Preferably, the driving motor is fixedly installed on one side wall of the U-shaped frame, and one end of the output shaft of the driving motor is fixedly connected to one end of the bidirectional lead screw.

[0010] Preferably, the guiding assembly includes an L-shaped mounting plate which is fixedly installed at the bottom end of the mounting frame. A plurality of groups of rollers are rotatably installed at equal intervals on the inner top of the L-shaped mounting plate, and the outer walls of the plurality of groups of rollers are in contact with the circuit board.

[0011] Preferably, it further includes a connecting plate. One side of the connecting plate is fixedly connected to one side wall of the L-shaped mounting plate, and the connecting plate is inclined.

[0012] Preferably, the clamping assembly includes a fixing plate which is fixedly installed on the top of the positioning substrate. An electric push rod is fixedly connected to one side wall of the fixing plate, and the telescopic end of the electric push rod penetrates through the fixing plate and is fixedly connected to a clamping plate.

[0013] Preferably, it further includes two groups of guiding rods. The two groups of guiding rods are both slidably inserted into the fixing plate, and one ends of the two groups of guiding rods penetrate through the fixing plate and are fixedly connected to one side of the clamping plate.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] By using the positioning substrate, the vertical plate, the conveying device body, the U-shaped frame, the translation assembly, the mounting frame and the guiding assembly in cooperation, the distance between the two groups of guiding assemblies can be adjusted through the translation assembly, so as to guide circuit boards of different sizes. In this way, each circuit board can be conveyed forward in the same position, ensuring the consistency of circuit board feeding. Through the provided clamping assembly, the circuit board righted on the conveying device body can be clamped and positioned. During the copper deposition process of the circuit board, accurately positioning the position of the circuit board is crucial for ensuring the copper deposition quality. The clamping assembly can ensure the accurate position of the circuit board in the copper deposition equipment through precise clamping and positioning functions, thereby improving the accuracy and reliability of copper deposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural schematic diagram of the present utility model;

[0017] Figure 2 is a structural schematic diagram of the translation assembly and the guiding assembly of the present utility model;

[0018] Figure 3This is a schematic structural diagram of the clamping assembly of the present utility model.

[0019] In the figure: 1, positioning substrate; 2, vertical plate; 3, conveying device body; 4, C-shaped frame; 5, translation assembly; 501, bidirectional lead screw; 502, drive motor; 503, movable block; 6, mounting bracket; 7, guiding assembly; 701, L-shaped mounting plate; 702, rotating roller; 703, connecting plate; 8, clamping assembly; 801, fixing plate; 802, electric push rod; 803, clamping plate; 804, guiding rod; 9, convex block; 10, sliding rod. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1-3 , the present utility model provides a technical solution:

[0022] A feeding device for copper deposition treatment of circuit boards includes a positioning substrate 1. Two groups of vertical plates 2 are symmetrically and fixedly connected to the top of the positioning substrate 1. A conveying device body 3 is installed on the opposite sides of the two groups of vertical plates 2. A C-shaped frame 4 is fixedly installed on the top of the positioning substrate 1. A translation assembly 5 is arranged on the inner wall of the C-shaped frame 4. The two moving ends of the translation assembly 5 are respectively connected with mounting brackets 6. Guiding assemblies 7 for centering the circuit boards are respectively arranged at the bottoms of the two groups of mounting brackets 6. By setting the cooperation of the positioning substrate 1, the vertical plates 2, the conveying device body 3, the C-shaped frame 4, the translation assembly 5, the mounting brackets 6 and the guiding assemblies 7, the distance between the two guiding assemblies 7 can be adjusted through the translation assembly 5, so as to guide circuit boards of different sizes, and each circuit board can be conveyed forward in the same position. Two groups of clamping assemblies 8 for positioning the circuit boards are symmetrically arranged on one side of the upper surface of the positioning substrate 1, and the circuit boards righted on the conveying device body 3 can be clamped and positioned. Subsequently, the clamped circuit boards can be placed in a copper deposition device (not shown in the figure) by a robotic arm (not shown in the figure). During the copper deposition treatment of the circuit boards, accurately positioning the position of the circuit boards is crucial for ensuring the quality of copper deposition. The clamping assembly 8 can ensure the accurate position of the circuit boards in the copper deposition device through precise clamping and positioning functions, thereby improving the accuracy and reliability of copper deposition;

[0023] The translation component 5 includes a bidirectional lead screw 501. The two ends of the bidirectional lead screw 501 are respectively rotatably installed on the inner walls of both sides of the C-shaped frame 4. One end of the bidirectional lead screw 501 penetrates through the C-shaped frame 4 and is connected to a driving motor 502. Two groups of movable blocks 503 are symmetrically threadedly connected to the outer wall of the bidirectional lead screw 501. The two movable blocks 503 serve as the two moving ends of the translation component 5. The tops of the two groups of mounting frames 6 are respectively fixedly connected to the bottoms of the two groups of movable blocks 503;

[0024] By adopting the above case, the output shaft of the driving motor 502 can drive the bidirectional lead screw 501 to rotate forward or backward, thereby driving the two groups of movable blocks 503 to reciprocate along the axial direction of the bidirectional lead screw 501, so as to achieve the effect of adjusting the distance between the two groups of guiding components 7;

[0025] The tops of the two groups of movable blocks 503 are respectively fixedly connected with convex blocks 9. The inner walls of both sides of the C-shaped frame 4 are fixedly connected with sliding rods 10. The two groups of convex blocks 9 are both movably sleeved on the outer walls of the sliding rods 10. By setting the convex blocks 9 and the sliding rods 10 to cooperate, the movable blocks 503 are limited, making their movement more stable;

[0026] The driving motor 502 is fixedly installed on one side wall of the C-shaped frame 4. One end of the output shaft of the driving motor 502 is fixedly connected to one end of the bidirectional lead screw 501. The driving motor 502 is set as a forward and reverse stepping motor;

[0027] The guiding component 7 includes an L-shaped mounting plate 701. The L-shaped mounting plate 701 is fixedly installed at the bottom end of the mounting frame 6. A number of groups of rollers 702 are equidistantly rotatably installed at the inner top of the L-shaped mounting plate 701. The outer walls of the number of groups of rollers 702 are in contact with the circuit board. It also includes a connecting plate 703. One side of the connecting plate 703 is fixedly connected to one side wall of the L-shaped mounting plate 701, and the connecting plate 703 is inclined;

[0028] By adopting the above case, when the circuit board on the conveying device body 3 first contacts the connecting plate 703, it moves towards the space between the two groups of L-shaped mounting plates 701 under the guiding action of the connecting plate 703. Subsequently, the outer wall of the circuit board contacts the number of groups of rollers 702, so as to achieve the effect of positioning the circuit board, enabling each circuit board to be conveyed forward in the same position, ensuring the consistency of circuit board feeding;

[0029] The clamping component 8 includes a fixing plate 801. The fixing plate 801 is fixedly installed on the top of the positioning substrate 1. One side wall of the fixing plate 801 is fixedly connected with an electric push rod 802. One end of the telescopic end of the electric push rod 802 penetrates through the fixing plate 801 and is fixedly connected with a clamping plate 803. The telescopic end of the electric push rod 802 can drive the clamping plate 803 to clamp and position the circuit board;

[0030] It further includes two groups of guide rods 804. Both groups of guide rods 804 are slidably inserted into the inside of the fixing plate 801, and one end of each of the two groups of guide rods 804 penetrates through the fixing plate 801 and is fixedly connected to one side of the clamping plate 803. By providing the guide rods 804, the function of limiting the clamping plate 803 is achieved, making its movement process more stable.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A feeding device for copper plating of a circuit board, comprising a positioning substrate (1), characterized in that: The top of the positioning substrate (1) is symmetrically fixedly connected with two groups of vertical plates (2), and the conveying device body (3) is installed on the opposite side of the two groups of vertical plates (2). The top of the positioning substrate (1) is fixedly installed with a profile frame (4), and a translation component (5) is arranged on the inner wall of the profile frame (4). The two movable ends of the translation component (5) are respectively connected with mounting frames (6), and the bottoms of the two groups of mounting frames (6) are respectively provided with guide components (7) for positioning the circuit board. Two groups of clamping components (8) for positioning the circuit board are symmetrically arranged on one side of the upper surface of the positioning substrate (1).

2. A feeding device for copper plating of a circuit board according to claim 1, characterized in that: The translation assembly (5) includes a bidirectional screw rod (501), the two ends of which are rotatably mounted on the inner walls of the two sides of the shaped frame (4), one end of the bidirectional screw rod (501) passes through the shaped frame (4) and is connected to a driving motor (502), and two groups of movable blocks (503) are symmetrically threaded on the outer wall of the bidirectional screw rod (501), and the tops of the two groups of mounting frames (6) are fixedly connected to the bottoms of the two groups of movable blocks (503) respectively.

3. A feeding device for copper plating of circuit boards according to claim 2, characterized in that: The tops of the two groups of movable blocks (503) are respectively fixedly connected with protrusions (9), and the inner walls on both sides of the shaped frame (4) are fixedly connected with sliding rods (10), and the two groups of protrusions (9) are movably sleeved on the outer walls of the sliding rods (10).

4. A feeding device for copper plating of a circuit board according to claim 3, characterized in that: The driving motor (502) is fixedly mounted on a side wall of the mold frame (4), and one end of the output shaft of the driving motor (502) is fixedly connected to one end of the bidirectional screw rod (501).

5. The feeding device for copper plating of a circuit board according to claim 1, characterized in that: The guide assembly (7) comprises an L-shaped mounting plate (701), the L-shaped mounting plate (701) being fixedly mounted on the bottom end of the mounting frame (6), a plurality of groups of rollers (702) being equidistantly mounted on the inner top of the L-shaped mounting plate (701), the outer walls of the plurality of groups of rollers (702) being in contact with the circuit board.

6. A feeding device for copper plating of a circuit board according to claim 5, characterized in that: It also comprises a connecting plate (703), one side of which is fixedly connected to a side wall of the L-shaped mounting plate (701), and the connecting plate (703) is arranged in an inclined manner.

7. A feeding device for copper plating of circuit boards according to claim 1, characterized in that: The clamping assembly (8) comprises a fixing plate (801), wherein the fixing plate (801) is fixedly mounted on the top of the positioning substrate (1), an electric push rod (802) is fixedly connected to a side wall of one side of the fixing plate (801), and one end of the telescopic end of the electric push rod (802) passes through the fixing plate (801) and is fixedly connected to a clamping plate (803).

8. A feeding device for copper plating of circuit boards according to claim 7, characterized in that: It also includes two groups of guide rods (804), both of which are slidably inserted into the interior of the fixed plate (801), and one end of each of the two groups of guide rods (804) passes through the fixed plate (801) and is fixedly connected to one side of the clamping plate (803).

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