Control wafer assembly and physical vapor deposition equipment

Abstract

The utility model provides a control wafer assembly and physical vapor deposition equipment. The control wafer assembly comprises a control wafer body and a control wafer, the shielding disc is located above the control wafer body, at least one working window is formed in the shielding disc, and the control wafer body below the working window is exposed out of the working window; the connecting rod is coupled with the control wafer body and the shielding disc; the control piece body is rotatably connected with the shielding disc through the connecting rod. After one test is finished, the control wafer body is rotatably connected with the shielding disc, so that the working window is aligned with an uncoated area on the control wafer body by rotating the control wafer body or the shielding disc, and the next round of PVD test is continued. By using the control wafer assembly of the embodiment, film coating and monitoring are carried out on the local area of the control wafer body only through the discrete working windows every time film coating is carried out, film coating does not need to be carried out on the whole control wafer body, and the single-wafer utilization rate of the control wafer body can be improved through running fit between the control wafer body and the shielding disc.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a control chip component and a physical vapor deposition device. Background Art

[0002] In the field of semiconductor wafer manufacturing, physical vapor deposition (PVD) is an industrial manufacturing process and a type of coating technology. It is a technology that mainly uses physical methods to heat or stimulate the material process to deposit thin films, namely vacuum coating (evaporation), which is mostly used in the manufacturing process of semiconductor devices.

[0003] In the related art, the concept of control film is introduced in the PVD process. The control film is relative to the mass production film, which is especially used to simulate the PVD process. Specifically, a film equivalent to the production formula is deposited on the control film at regular intervals, and the relevant parameters of the control film are monitored by a measuring machine, generally including particles, stress, reflectivity, thickness, sheet resistance, etc. Based on the relevant parameters, the relevant parameters in the PVD process are tested, such as the deposition rate of the PVD equipment, the deposition film thickness and other parameters.

[0004] At present, the control chip monitoring method in the industry generally adopts the multi-point method for monitoring. Specifically, during the deposition process, multiple discrete positions on the control chip are selected to monitor parameters such as film thickness, which can shorten the measurement time and roughly estimate the thickness uniformity. However, for the control chip itself, most of the deposited area is wasted. Although it can be cleaned and reused later, the utilization rate of a single chip is not high, which invisibly increases the equipment cost.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0006] In view of the problems in the prior art, the purpose of the present invention is to provide a control plate assembly and a physical vapor deposition device, which overcomes the technical problems of low control plate utilization and high cost in the related art.

[0007] The present disclosure provides a control sheet assembly, which includes:

[0008] Control film body;

[0009] A shielding plate located above the control plate body, on which at least one working window is provided, wherein the working window exposes the control plate body below;

[0010] A connecting rod coupling the control plate body and the shielding plate;

[0011] The control piece body and the shielding disc are rotatably connected through the connecting rod.

[0012] In some embodiments, a plurality of the working windows arranged circumferentially are provided in the shielding disc.

[0013] In some embodiments, among the plurality of the working windows, there is a working window having a deviation distance from the center point of the shielding disc.

[0014] In some embodiments, the deviation distance is 10 mm to 50 mm.

[0015] In some embodiments, a through hole is formed in the shielding disc, and the through hole forms the working window.

[0016] In some embodiments, the distance between the shielding disc and the control piece body is 5 mm to 50 mm.

[0017] In some embodiments, the connecting rod and the control piece body are bonded or connected through a snap structure.

[0018] In some embodiments, the connecting rod includes:

[0019] A first rod and a second rod that are rotatably connected and are respectively connected to the shielding disc and the control piece body.

[0020] In some embodiments, the first rod is provided with a hollow structure, the second rod is provided with a rotating shaft that cooperates with the hollow structure, and the rotating shaft rotatably extends into the hollow structure.

[0021] In some embodiments, the shielding disc is provided with an edge shielding portion, and along the radial direction of the control piece body, the edge shielding portion abuts against the control piece body.

[0022] In some embodiments, the shielding disc is provided with a plurality of the edge shielding portions arranged circumferentially, or the edge shielding portion is an edge flanging.

[0023] The embodiments of the present disclosure further provide a physical vapor deposition device, which includes:

[0024] A rotation positioner for carrying the control piece assembly of any of the above embodiments;

[0025] A pressing device, which is installed on the rotation positioner and is used to extend to press the shielding disc.

[0026] In some embodiments, the rotation positioner is a stepping rotation mechanism.

[0027] In some embodiments, the pressing device includes:

[0028] A fixedly installed linear actuator and a pressing structure installed on and above the rotary positioner.

[0029] The wafer control component and the physical vapor deposition equipment according to the embodiments of the present disclosure have the following advantages:

[0030] In the embodiment of the present disclosure, a shielding disk is arranged above the wafer control body and is rotatably connected through a connecting rod. Then, during the PVD test, coating is performed on the wafer control body through the working window. After one test is completed, since the wafer control body and the shielding disk are rotatably connected, before the next test, by rotating the wafer control body or the shielding disk, the working window can be aligned with the uncoated area on the wafer control body, and the next round of PVD test can be continued. When using the wafer control component of this embodiment, during each coating, coating and monitoring are only performed on a local area of the wafer control body through discrete working windows, without coating the entire wafer control body. Moreover, through the rotational cooperation between the wafer control body and the shielding disk, the single-wafer utilization rate of the wafer control body can be improved, and the equipment cost can be reduced. Description of the Drawings

[0031] Other features, objects, and advantages of the present utility model will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0032] Figure 1 A perspective view showing the wafer control component provided by the embodiment of the present disclosure;

[0033] Figure 2 Show Figure 1 A side view of the shown wafer control component;

[0034] Figure 3 Show Figure 1 A top view of the shown wafer control component;

[0035] Figure 4 Show Figure 1 A sectional view of the shown wafer control component;

[0036] Figure 5 Show Figure 1 A sectional view of another embodiment of the shown wafer control component;

[0037] Figure 6 A front view showing the rotary positioner in the physical vapor deposition equipment provided by the embodiment of the present disclosure. Detailed Embodiments

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this utility model will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0039] As used in this application and the claims, unless the context clearly dictates otherwise, the words "a," "an," "one," and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been expressly identified, and these steps and elements do not constitute an exclusive listing. A method or device may also include other steps or elements.

[0040] In the description of this application, it should be understood that the orientation terms such as "front, rear, top, bottom, left, right," "lateral, vertical, perpendicular, horizontal," and "top, bottom," etc., generally refer to the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the scope of protection of this application; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0041] For ease of description, spatial relative terms such as "above," "over," "on the upper surface," "above," etc., can be used here to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures for the device. For example, if the device in the figure is inverted, the device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientation of "above" and "below." The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations will be made for the spatial relative descriptions used here.

[0042] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is merely for the convenience of distinguishing the corresponding components. Without additional declaration, these terms have no special meaning, and thus should not be construed as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used, but also through the meanings implied by each term.

[0043] It should be understood that when a component is referred to as "on another component", "connected to another component", "coupled to another component", or "in contact with another component", it can be directly on, connected to, or coupled to, or in contact with that other component, or there may be an intervening component. In contrast, when a component is referred to as "directly on another component", "directly connected to", "directly coupled to", or "directly in contact with" another component, there is no intervening component.

[0044] In addition, the drawings are only schematic illustrations of the present utility model and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

[0045] Figure 1 A perspective view showing the control piece assembly provided by the embodiment of the present disclosure Figure 2 is Figure 1 a side view of the shown control piece assembly, as Figure 1 and 2 shown, the control piece assembly includes:

[0046] A control piece body 1;

[0047] A shielding disk 2 located above the control piece body 1, on which there is provided at least one working window 2a ( Figure 2 not shown in the figure);

[0048] A connecting rod 3 coupling the control piece body 1 and the shielding disk 2;

[0049] The control piece body 1 and the shielding disk 2 are rotatably connected by the connecting rod 3.

[0050] When using the control wafer component of the present disclosure, during PVD testing, coating is performed on the control wafer body 1 through the working window 2a. After one test is completed, since the control wafer body 1 and the shielding disk 2 are rotatably connected, before the next test, by rotating the control wafer body 1 or the shielding disk 2, the working window 2a can be aligned with the uncoated area on the control wafer body 1, and the next round of PVD testing can be continued.

[0051] When using the control wafer component of this embodiment, during each coating, coating and monitoring are only performed on a partial area of the control wafer body 1 through the discrete working window 2a, without coating the entire control wafer body 1. Moreover, through the rotational cooperation between the control wafer body 1 and the shielding disk 2, the single-wafer utilization rate of the control wafer body 1 can be improved, and the equipment cost can be reduced.

[0052] In one implementation, through holes are formed in the shielding disk 2, and the through holes form the working window 2a. In this way, during the PVD process, coating is sputtered onto the control wafer body through the through holes. The shape of the through holes in this embodiment is not limited and can be a round hole, a square hole, or other shaped windows.

[0053] As Figure 3 shown, a plurality of working windows 2a are provided in the shielding disk 2, so that coating monitoring can be performed at multiple discrete positions during a single test. In one embodiment, these working windows 2a include a plurality of working windows arranged circumferentially, such as uniformly or non-uniformly arranged.

[0054] In an alternative embodiment, as Figure 3 shown, among the plurality of working windows 2a, there is a working window 2a1 having a deviation distance l from the center point O of the shielding disk 2. In this design, the working window 2a1 is arranged deviating from the center point O of the shielding disk 2. Then, when the control wafer body 1 (as Figure 2 shown) rotates relative to the shielding disk 2, this working window 2a1 can be rotated to an adjacent uncoated area for use in the next round of testing. In this way, in a circular area centered at the center point O of the shielding disk 2 and with the deviation distance l as the radius, more testable areas can be obtained to achieve multiple rounds of testing.

[0055] By arranging the working windows along the circumference of the shielding disk 2 and deviating from the center point O of the shielding disk 2, coating monitoring can be performed on different types of areas on the control wafer body 1, such as the edge area and the center area, thereby improving the comprehensiveness and accuracy of the final test results.

[0056] In one embodiment, the above deviation distance l is 10 mm to 50 mm. Within this distance range, the coating area is neither too far nor too close to the center point O of the shielding disk 2, so that multiple rounds of testing can be performed on the central area near the center of the control wafer body 1.

[0057] In the embodiment of the present disclosure, as Figure 2 shown, the distance H between the shielding disc 2 and the control piece body 1 is 5 mm to 50 mm. The distance between the shielding disc 2 and the control piece body 1 should not be too large or too small. Within this range, it is possible to avoid the size of the working window 2a (as Figure 1 shown) from becoming a factor affecting the coating test results and ensure the accuracy of the coating test results.

[0058] In the embodiment of the present disclosure, as Figure 2 shown, the connecting rod 3 and the control piece body 1 are bonded or connected by a snap structure, which can reduce the damage to the control piece body 1. Taking bonding as an example, the bottom end of the connecting rod 3 is bonded to the surface of the control piece body 1 using a solvable glue. In this way, after the current control piece body 1 has been tested and used, it can be conveniently removed and replaced with the next control piece body.

[0059] Exemplarily, the connection method of the snap structure is that a first snap joint is bonded to the surface of the control piece body 1, and a second snap joint that cooperates with the first snap joint is provided at the bottom end of the connecting rod 3. The first snap joint and the second snap joint are snap-connected to realize the installation of the control piece body 1 and the connecting rod 3.

[0060] As a realization method, as Figure 4 shown, the connecting rod 3 includes a first rod section 31 and a second rod section 32 that are rotatably connected. The first rod section 31 and the second rod section 32 are respectively connected to the shielding disc 2 and the control piece body 1. Exemplarily, the first rod section 31 is connected to the control piece body 1 and the second rod section 32 is connected to the shielding disc 2, or the first rod section 31 is connected to the shielding disc 2 and the second rod is connected to the control piece body 1.

[0061] Among the first rod section 31 and the second rod section 32, one is the driving rod. Through the rotational connection, when the driving rod rotates, the other rod section remains stationary to realize the movement of the working window.

[0062] In one embodiment, the first rod section 31 is provided with a hollow structure, and the second rod section 32 is provided with a rotating shaft 321 that cooperates with the hollow structure. The rotating shaft 321 rotatably extends into the hollow structure.

[0063] In this way, the rotating shaft 321 can rotate within the hollow structure to realize the rotational connection between the shielding disc 2 and the control piece body 1.

[0064] In the embodiment of the present disclosure, among the first rod section 31 and the second rod section 32, the corresponding rod section connected to the shielding disc 2 and the shielding disc 2 may be fixedly connected, such as an integral structure, bolt connection, or snap connection, etc., which is not limited herein.

[0065] In the embodiment of the present disclosure, both the shielding plate 2 and the connecting rod 3 are made of high temperature resistant materials, which will not cause pollution to the control piece body 1.

[0066] In another embodiment of the present disclosure, Figure 5 As shown, the shielding plate 4 is provided with an edge shielding portion 41 , and along the radial direction of the control piece body 10 , the edge shielding portion 41 abuts against the control piece body 10 .

[0067] The edge shielding portion 41 is used to prevent the shielding plate 4 and the control sheet body 10 from relative displacement, thereby ensuring that the shielding plate 4 and the control sheet body 10 remain stable during the PVD process.

[0068] In one embodiment, the shielding plate 4 is provided with a plurality of edge shielding portions 41 arranged circumferentially, and these edge shielding portions 41 are dispersedly arranged circumferentially. In this case, the edge shielding portion 41 can be a separate part relative to the shielding plate 4, and is additionally installed on the edge of the shielding plate 4.

[0069] In an optional manner, the edge shielding portion 41 is an edge outer turn-up. In this case, the edge shielding portion 41 may be an annular structure, or may be a partial outer turn-up of the shielding plate 4 .

[0070] The present disclosure also provides a physical vapor deposition device, such as Figure 6 As shown, the physical vapor deposition equipment may include:

[0071] A rotary positioner 51, which is used to carry the control piece assembly 50 of any of the above embodiments;

[0072] The pressing device 52 is installed with the rotation positioner 51 and is used to extend to press the blocking plate 501.

[0073] In this embodiment, the rotary positioner 51 is a rotary mechanism of the PVD device, which can directly provide a rotation driving source for the control film body 502. At this time, the control film body 502 serves as an active component. When the control film body 502 is placed on the wafer stage in the PVD device and clamped by the clamp 53, the pressing device 52 is controlled to press the shielding disk 501 downward, and the shielding disk 501 cannot rotate. At this time, by controlling the rotary positioner 51 to drive the wafer stage to rotate, the control film body 502 can be driven to rotate, and the control film can be reused multiple times.

[0074] In a corresponding embodiment, the rotary positioner 51 is located at the front film inlet of the PVD device. The rotary positioner 51 selects a stepping rotation mechanism, such as a stepping motor, to achieve stepping rotation.

[0075] In the embodiment of the present disclosure, the pressing device 52 includes:

[0076] A fixedly installed linear actuator 521 and a pressing structure 522 installed on and located above the rotary positioner 51. The linear actuator 521 is configured to drive the pressing structure 522 to move up and down.

[0077] As Figure 6 shown, the linear actuator 521 provides a driving force to drive the pressing structure 522 to move up and down. During use, when it is necessary to rotate the control piece body 502, the linear actuator 521 is controlled to drive the pressing structure 522 to descend until it abuts against the shielding disc 501 to the pressing position. When the adjustment is completed, the linear actuator 521 is controlled to drive the pressing structure 522 to move in the reverse direction to release the pressing, and then the control piece assembly is transferred into the PVD process chamber.

[0078] In one embodiment, the linear actuator 521 is a lifting rod, and its specific implementation manner can be belt drive, gear rack, ball screw, and linear motor. The pressing device 52 is integrated into the rotary positioner of the physical vapor deposition equipment and is controlled to extend to press the shielding disc 501 and is also controlled to reset in the reverse direction.

[0079] Figure 6 Only the rotary positioner in the physical vapor deposition equipment is shown. For other structures of the physical vapor deposition equipment, reference can be made to the related technologies well-known to those skilled in the art, and details are not described herein again.

[0080] The above content is a further detailed description of the present invention in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, which should all be regarded as belonging to the protection scope of the present invention.

Claims

1. A control sheet assembly, characterized in that: include: Control film body; A shielding plate located above the control plate body, on which at least one working window is provided, wherein the working window exposes the control plate body below; A connecting rod coupling the control plate body and the shielding plate; The control plate body and the shielding plate are rotatably connected via the connecting rod.

2. The control piece assembly according to claim 1, characterized in that: A plurality of the working windows arranged along the circumferential direction are provided in the shielding disk.

3. The control piece assembly according to claim 2, characterized in that: The plurality of operating windows include an operating window having an offset distance from a center point of the shielding disk.

4. The control piece assembly according to claim 3, characterized in that: The deviation distance is 10 mm to 50 mm.

5. The control piece assembly according to claim 1, characterized in that: A through hole is formed in the shielding plate, and the through hole forms the working window.

6. The control piece assembly according to claim 1, characterized in that: The distance between the shielding plate and the control plate body is 5 mm to 50 mm.

7. The control piece assembly according to claim 1, characterized in that: The connecting rod and the control piece body are connected by bonding or by a snap-fit ​​structure.

8. The control piece assembly according to claim 1, characterized in that: The connecting rod comprises: The first section rod and the second section rod, which are rotatably connected, are respectively connected to the shielding plate and the control sheet body.

9. The control piece assembly according to claim 8, characterized in that: The first section of the rod is provided with a hollow structure, and the second section of the rod is provided with a rotating shaft matched with the hollow structure, and the rotating shaft is rotatably extended into the hollow structure.

10. The control piece assembly according to claim 1, characterized in that: The shielding plate is provided with an edge shielding portion, and along the radial direction of the control piece body, the edge shielding portion abuts against the control piece body.

11. The control piece assembly according to claim 10, characterized in that: The shielding plate is provided with a plurality of edge shielding portions arranged along the circumferential direction, or the edge shielding portion is an edge outer flange.

12. A physical vapor deposition device, characterized in that: include: A rotary positioner, used for carrying the control piece assembly according to any one of claims 1 to 11; A pressing device is installed with the rotary positioner and is used to extend to press the baffle plate.

13. The physical vapor deposition device according to claim 12, characterized in that: The rotary positioner is a stepping rotary mechanism.

14. The physical vapor deposition apparatus according to claim 12, characterized in that: The pressing device comprises: A fixedly mounted linear drive and a pressing structure mounted with the linear drive and located above the rotary positioner.

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