Integrated piezoelectric pump

Abstract

The utility model relates to an integrated piezoelectric pump, which belongs to the technical field of piezoelectric pumps, solves the problem of insufficient integration level and compatibility in the prior art, and comprises a pump body, the pump body comprises a top radiating plate, a runner plate, a resonant plate, an outer frame with an embedded vibrator and an electrode plate which are assembled from top to bottom; the valve body is mounted below the pump body and comprises a first fixing layer, an elastic film layer and a second fixing layer which are assembled from top to bottom, a side wall part for fixedly mounting the first fixing layer, the elastic film layer and the second fixing layer, and a bottom base plate which is fixed to the bottom surface of the side wall part and serves as a bottom plate of the valve body; wherein the bottom substrate is used as a bottom plate of the integrated piezoelectric pump and is used for supplying power to piezoelectric elements of the pump body and controlling the piezoelectric elements of the pump body; and a conductive through hole is formed in the side wall part, and is used as a path for supplying power to the piezoelectric element of the pump body by the bottom substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of piezoelectric pumps, and particularly relates to an integrated piezoelectric pump. Background Art

[0002] In recent years, small wearable devices, portable medical devices, instruments, meters, detection devices, etc. have been increasingly widely used due to their portability and small size. Piezoelectric pumps are usually used as the driving and controlling core components in these devices. Such small and precision applications require piezoelectric pumps to have a small external dimension, precise control, and high reliability.

[0003] However, conventional piezoelectric pumps usually only include a pump body and require external separate control valves, drive circuits and other components. Their connections also require separate connecting pipelines and cables, resulting in a relatively large space occupation when the piezoelectric pump is integrally applied. Moreover, the external components and connectors are vulnerable to interference and disconnection and other faults, and the assembly process is complex and the production efficiency is low.

[0004] Therefore, there is a need in the art for a piezoelectric pump that can achieve high integration, overall lightness, high reliability, good compatibility, easy assembly to various devices, and convenient mass production. Summary of the Utility Model

[0005] In order to solve the above problems, the utility model provides an integrated piezoelectric pump. By laminating and integrating a pump body, a valve body and a control circuit, a miniaturized, highly integrated and precisely controlled piezoelectric pump device is obtained.

[0006] According to an embodiment of the utility model, an integrated piezoelectric pump is provided, including:

[0007] A pump body, which includes, assembled from top to bottom: a top heat dissipation plate, a flow channel plate, a resonance plate, an outer frame with an embedded oscillator, and an electrode plate; and

[0008] A valve body installed below the pump body, which includes: a first fixing layer, an elastic film layer and a second fixing layer assembled from top to bottom, side wall parts for fixedly installing the first fixing layer, the elastic film layer and the second fixing layer, and a bottom substrate fixed to the bottom surface of the side wall parts and serving as the bottom plate of the valve body;

[0009] Wherein, the bottom substrate serves as the bottom plate of the integrated piezoelectric pump, and supplies power to and controls the piezoelectric elements of the pump body;

[0010] And wherein, at least two separated conductive through holes are formed in the side wall parts, and both ends of the conductive through holes are electrically connected to the electrode plate and the bottom substrate respectively, serving as a path for the bottom substrate to supply power to the piezoelectric elements of the pump body.

[0011] Optionally, the oscillator includes a diaphragm and a piezoelectric element. The diaphragm has a reinforcing portion at the center and a support frame surrounding the reinforcing portion. The piezoelectric element is fixed to the lower surface of the reinforcing portion. The electrode plate has a cantilever extending inward, and the cantilever contacts the lower surface of the piezoelectric element.

[0012] Optionally, the flow channel plate has a circular central through hole at the center position and flow channels connecting the central through hole to the outside. The resonance plate has a central hole, which is communicated with the central through hole of the flow channel plate and is coaxially arranged. The aperture of the central through hole ranges from 4.5 mm to 6.0 mm, the aperture of the central hole of the resonance plate ranges from 0.5 mm to 1.2 mm, and the width of the flow channel ranges from 0.6 mm to 1.0 mm.

[0013] Optionally, the support frame of the diaphragm is an octagonal structure, including four side beams and four diagonal bracing beams that are alternately connected to form an octagon, and inner beams extending inward from the side beams to connect to the outer edge of the reinforcing portion. The width of each side beam is narrower than that of the diagonal bracing beam. The diagonal bracing beam extends outward beyond the outer edge of the side beam at the connection with the side beam to form a mounting protrusion. A plurality of separated internal voids are formed between the reinforcing portion and the support frame of the diaphragm.

[0014] Optionally, the outer frame has a square opening in the middle and a mounting groove is formed on the inner side facing the square opening. The mounting groove matches the mounting protrusion of the diagonal bracing beam. After the diaphragm is fitted and assembled with the outer frame, a plurality of corner gaps are formed between the diagonal bracing beam of the diaphragm and the inner wall of the square opening of the outer frame, and a plurality of side gaps are formed between the side beam of the diaphragm and the inner wall of the square opening of the outer frame.

[0015] Optionally, the pump body and the valve body are assembled together by fixing the bottom surface of the electrode plate of the pump body to the top surface of the side wall portion of the valve body.

[0016] Optionally, the surrounding frame of the electrode plate of the pump body includes a surrounding frame part one and a surrounding frame part two separated by an insulating strip. The cantilever extends inward from the surrounding frame part two, and the surrounding frame part one is electrically connected to the outer frame above it. The upper ends of two conductive through holes in the side wall portion of the valve body are respectively electrically connected to the surrounding frame part one and the surrounding frame part two, and the lower ends of the two conductive through holes are electrically connected to the power supply unit of the bottom substrate.

[0017] Optionally, the first fixing layer of the valve body includes normally closed holes. The elastic film layer includes film transmission holes, and the position of the film transmission holes is offset from the position of the normally closed holes. The normally closed holes of the first fixing layer and the film transmission holes of the elastic film layer together form a normally closed valve.

[0018] Optionally, the first fixing layer of the valve body includes a first avoidance opening; the corresponding part of the elastic film layer to the first avoidance opening is solid; the side wall portion has a boss extending inward from one side, and a boss transmission hole extending downward from its upper surface is formed in the boss, and the side wall portion forms a side wall outlet communicating laterally from the boss transmission hole to the outside of the side wall portion on the side wall where the boss is provided, and the position of the boss transmission hole corresponds to the first avoidance opening; wherein, the first avoidance opening, the corresponding part of the elastic film layer to the first avoidance opening, and the boss transmission hole together constitute a normally open valve.

[0019] Optionally, a power supply unit and a control unit are provided on the bottom substrate, and the power supply unit corresponds to and is electrically connected to the conductive through holes in the side wall portion.

[0020] Compared with the prior art, an integrated piezoelectric pump provided by an embodiment of the present invention has at least the following advantages:

[0021] 1. Adopting an integrated design of microelectronics and micromachinery, integrating the power supply unit and the control unit on the bottom substrate, and the internal structure is also reasonably distributed, reducing the volume of the traditional piezoelectric pump body and greatly reducing the overall mechanical and electronic overall solution area and volume.

[0022] 2. The side wall serves as a three-dimensional circuit path to drive the pump, and there are multiple I / O ports that can supply power to the pump and communicate after receiving signals. Integrating the circuit path in the side wall not only reduces the volume and has high space utilization rate, but also reduces external interference and improves the stability and reliability of the system.

[0023] 3. The oscillator, outer frame, and resonance plate, which are respectively independent components, are structurally designed, and can be assembled by one-time bonding, which not only simplifies the processing technology and improves the processing efficiency, but also further reduces the overall volume of the piezoelectric micropump and improves the device integration degree under the condition of meeting the performance of the vibration element.

[0024] 4. Through the structure composed of substantially straight lines of the support frame of the vibration plate, when manufacturing the vibration plate with fiber-reinforced composite material, the high elastic modulus and low density characteristics of the fiber-reinforced composite material can be fully utilized to achieve a relatively high resonance frequency on a very thin material, making the pump body thinner, and the enhanced modulus in the fiber direction of the fiber-reinforced composite material can be fully utilized to provide better vibration performance and durability. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. By referring to the drawings, the features and advantages of the present invention can be more clearly understood. The drawings are schematic and should not be construed as imposing any limitations on the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a schematic view of the appearance of the pump body of an integrated piezoelectric pump according to the first embodiment of the present invention.

[0027] Figure 2 It is an exploded view of the pump body of the integrated piezoelectric pump according to the first embodiment of the present invention.

[0028] Figure 3 It is a schematic view of the vibration plate of the vibrator of the integrated piezoelectric pump according to the first embodiment of the present invention.

[0029] Figure 4 It is a schematic view of the combination of the vibrator and the outer frame fitting of the integrated piezoelectric pump according to the first embodiment of the present invention.

[0030] Figure 5 It is an exploded view of the valve body of the integrated piezoelectric pump according to the first embodiment of the present invention.

[0031] Figure 6 It is a schematic view of the side wall portion of the valve body of the integrated piezoelectric pump according to the first embodiment of the present invention.

[0032] Figure 7 It is an exploded view of an integrated piezoelectric pump according to the second embodiment of the present invention.

[0033] Explanation of reference numerals:

[0034] 100 Pump body;

[0035] 110 Top heat dissipation plate;

[0036] 120 Flow channel plate;

[0037] 122 Central through hole;

[0038] 124 Flow channel;

[0039] 130 Resonant plate;

[0040] 132 Central hole;

[0041] 134 Avoidance groove;

[0042] 140 Vibrator;

[0043] 150 Vibration plate;

[0044] 152 Reinforcing part;

[0045] 154 Support frame;

[0046] 155 Side beam;

[0047] 156 Diagonal brace beam;

[0048] 157 Mounting convex part;

[0049] 158 Inner beam;

[0050] 160 Piezoelectric element;

[0051] 170 Outer frame;

[0052] 172 Square opening;

[0053] 177 Mounting groove;

[0054] 180 Internal hollowing;

[0055] 182 Corner gap;

[0056] 184 Side gap;

[0057] 190 Electrode plate;

[0058] 192 Enclosing frame;

[0059] 194 Cantilever;

[0060] 195 Insulating strip;

[0061] 196 Part of the enclosing frame;

[0062] 198 Another part of the enclosing frame;

[0063] 200 Valve body;

[0064] 210 First fixing layer;

[0065] 212 Normally closed hole;

[0066] 214 First avoiding opening;

[0067] 220 Elastic film layer;

[0068] 222 Film transmission hole;

[0069] 230 Second fixing layer;

[0070] 232 Transmission opening;

[0071] 234 Second avoiding opening;

[0072] 240 Side wall part;

[0073] 241 Side wall outlet;

[0074] 242 First step wall;

[0075] 244 Second step wall;

[0076] 246 Third step wall;

[0077] 248 Boss;

[0078] 249 Boss transfer hole;

[0079] 250 Conductive through hole;

[0080] 300 Bottom substrate;

[0081] 310 Substrate hole;

[0082] 320 Control unit;

[0083] 350 Power supply unit;

[0084] 1100 Pump body;

[0085] 1110 Top heat dissipation plate;

[0086] 1120 Flow channel plate;

[0087] 1130 Resonant plate;

[0088] 1170 Outer frame;

[0089] 1190 Electrode plate;

[0090] 1200 Valve body;

[0091] 1240 Side wall part;

[0092] 1300 Bottom substrate. Detailed implementation mode

[0093] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation modes. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0094] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below.

[0095] The following provides a detailed description of an integrated piezoelectric pump according to an embodiment of the present invention with reference to the accompanying drawings.

[0096] Example 1

[0097] As Figures 1 to 6 shown, an integrated piezoelectric pump provided according to an embodiment of the present invention includes: a pump body 100 and a valve body 200; wherein the bottom substrate 300 of the valve body 200 serves as the bottom plate of the integrated piezoelectric pump to supply power to and control the pump body 100. Among them, the thickness of the pump body 100 ranges from 0.8 mm to 2.0 mm, and the thickness of the valve body 200 ranges from 1.0 mm to 2.0 mm, so that the thickness of the integrated piezoelectric pump ranges from 1.8 mm to 4.0 mm. The pump body 100 and the valve body 200 may have the same outer peripheral shape and size, so that the assembled integrated piezoelectric pump has a uniform and consistent outer shape, which is convenient for transportation and storage, and suitable for integration into a variety of actual application products.

[0098] The following refers to Figures 2 to 4 , and provides a detailed description of the pump body 100 of the integrated piezoelectric pump of this embodiment.

[0099] As Figure 2 shown, the pump body 100 of this embodiment includes, from top to bottom in sequence: a top heat dissipation plate 110, a flow channel plate 120, a resonance plate 130, an outer frame 170 of an embedded oscillator 140, and an electrode plate 190. Among them, the flow channel plate 120 has a central through hole 122 and a flow channel 124 communicating with the central through hole 122; the resonance plate 130 has a central hole 132, and the central hole 132 communicates with the central through hole 122 of the flow channel plate 120; the electrode plate 190 has a surrounding frame 192 and a cantilever 194 extending inward from the surrounding frame 192; the oscillator 140 includes: a vibration plate 150, having a central reinforcement portion 152 and a support frame 154 surrounding it; a piezoelectric element 160 is fixed to the lower surface of the reinforcement portion 152. The above-mentioned multi-layer elements included in the pump body 100 have the same outer peripheral dimensions and shapes, and form a consistent outer shape of the pump body 100 after assembly. Optionally, the flow channel plate 120, the resonance plate 130, and the outer frame 170 of the embedded oscillator 140 can be assembled together by bonding.

[0100] In this embodiment, the top heat dissipation plate 110 is located at the top of the pump body 100 and cooperates with the lower flow channel plate 120 to form a channel for fluid to enter. The top heat dissipation plate 110 can be made of copper, aluminum alloy or carbon fiber composite material to have good heat conduction and heat dissipation capabilities. Or optionally, in other embodiments, according to needs, the top heat dissipation plate 110 can also be made of ceramic material.

[0101] As Figure 2As shown, in this embodiment, the flow channel plate 120 located below the top heat dissipation plate 110 has a central through hole 122 that penetrates the flow channel plate 120 at the central position, and a groove-type structure provided on the surface of the flow channel plate 120 to form a flow channel 124. The flow channel 124 connects the central through hole 122 with the outside of the side of the flow channel plate 120, enabling the fluid to flow in from the outside of the side. In this embodiment, the central through hole 122 is circular, and the four flow channels 124 are evenly distributed around the central through hole 122 and extend to the four corners of the flow channel plate 120 in a straight line manner. The width of the diversion groove 24 can be set in the range of 0.6 mm to 1.0 mm as required. The flow channel plate 120 can be made of stainless steel material or carbon composite material.

[0102] Reference Figure 2 , in this embodiment, the resonance plate 130 located below the flow channel plate 120 may have a through central hole 132, and the central hole 132 communicates with the central through hole 122 of the flow channel plate 120. Optionally, the central hole 132 of the resonance plate 130 is coaxial with the central through hole 122 of the flow channel plate 120, and the aperture of the central hole 132 of the resonance plate 130 is smaller than the aperture of the central through hole 122 of the flow channel plate 120, so as to ensure that the backflow of the fluid from the inside to the outside of the pump body 100 is small enough when the integrated piezoelectric pump works, forming a one-way transportation of the fluid into the pump body 100. For example but not limited to this, the aperture of the central through hole 122 of the flow channel plate 120 can be set in the range of 4.5 mm to 6.0 mm, and it needs to be calculated and optimized according to different required resonance frequencies. The aperture of the central hole 132 of the resonance plate 130 can be set in the range of 0.5 mm to 1.2 mm. Optionally, the resonance plate 130 can also be hollowed out with an avoidance groove 134 around the central hole 132, and the position of the avoidance groove 134 corresponds to the vibration part of the support frame 154 of the oscillator 140, so as to avoid the vibration part of the support frame 154 with undulating vibration when the oscillator 140 vibrates, reduce the impact and collision between components, avoid component failure caused by vibration, and improve the overall durability of the integrated piezoelectric pump.

[0103] Such as Figures 2 to 4As shown, in this embodiment, below the resonance plate 130 is a combination of an oscillator 140 and an outer frame 170. The space between the resonance plate 130 and the oscillator 140 below forms a resonance cavity. The space below the oscillator 140 forms a pump cavity. The oscillator 140 includes a vibration plate 150 and a piezoelectric unit 160 fixed to the middle of the vibration plate 150. The oscillator 140 has a structure without side walls and is assembled to the separately manufactured outer frame 170 by fitting the vibration plate 150 with the outer frame 170. During assembly, when fitting the vibration plate 150 with the outer frame 170, an adhesive method can also be used simultaneously to make their combination more firm and be able to withstand vibration for a longer time without loosening. The outer frame 170 has a square opening 172 in the middle and forms a mounting groove 177 on the inner side facing the square opening 172 for mounting the vibration plate 150. The vibration plate 150 can be integrally formed, for example, by cutting on a carbon composite material sheet. The outer frame 170 can be made of materials such as stainless steel and carbon fiber composite materials.

[0104] As Figure 3 , Figure 4As shown, the diaphragm 150 includes a circular reinforcing portion 152 at the center and a support frame 154 surrounding the reinforcing portion 152. The piezoelectric element 160 can be fixed to the reinforcing portion 152 by adhesion or welding. In this embodiment, the support frame 154 is a structure of multiple beams, generally forming an octagonal structure surrounding the reinforcing portion 152. Specifically, the support frame 154 includes four side beams 155 and four diagonal bracing beams 156 that are alternately connected to form the octagonal structure. The four side beams 155 are narrower than the four diagonal bracing beams 156, thus providing a larger elastic deformation range. The four diagonal bracing beams 156 serve to connect and fix the side beams 155. Optionally, the support frame 154 further includes inner beams 158 that extend inward from the side beams 155 to the reinforcing portion 152. By connecting with the reinforcing portion 152 through the inner beams 158, better vibration performance can be provided. Optionally, the structure of the diaphragm 150 can be such that four inwardly radially extending inner beams 158 are evenly spaced around the central circular reinforcing portion 152. Four side beams 155 of equal length are respectively provided at the outer ends of the four inner beams 158. The four side beams 155 are arranged such that adjacent side beams 155 are perpendicular to each other. Adjacent side beams 155 are connected by diagonal bracing beams 156, and the diagonal bracing beams 156 extend beyond the outer edge of the side beams 155 to form mounting protrusions 157. The mounting protrusions 157 are matched with the mounting grooves 177 of the outer frame 170 to be fitted together during installation. This design enables the diaphragm 150 to be achieved by etching or laser processing with only a material of appropriate thickness (such as 0.25 mm to 0.3 mm) through different steps or hollowing processes in a single layer of material. At the same time, the wider side beams 155 and diagonal bracing beams 156 structure of this embodiment enables the entire diaphragm 150 to have good overall flatness and is not easily deformed locally, thereby causing a decrease in the pump yield. Optionally, the diagonal bracing beam 156 extends from the connection with the side beam 155 to form a mounting protrusion 157 with an oblique angle, which is matched with the mounting groove 177 of the same oblique angle shape of the outer frame 170. This shape makes the fitting of the oscillator 140 and the outer frame 170 more stable and not easily loosened.

[0105] As Figure 4As shown, after the vibration plate 150 is assembled with the outer frame 170, the side beams 155 are respectively parallel to the sides of the square opening 172 of the outer frame 170; the diagonal support beams 156 respectively obliquely cut the four corners of the square opening 172 of the outer frame 170, thereby forming corner gaps 182 at the four corners. The diagonal support beams 156 can play a role in adjusting the vibration frequency of the straight beams. The closer the diagonal support beams 156 are to the reinforcement part 152, the higher the vibration frequency of the reinforcement part 152 during operation; the farther the diagonal support beams 156 are from the reinforcement part 152, the lower the vibration frequency of the reinforcement part 152 during operation. Thus, the vibration frequency of the vibrator 140 can be adjusted so that its vibration frequency is higher than 20KHz and it operates in the ultrasonic frequency band, but the frequency is not too high. An overly high frequency, for example, exceeding 30KHz, will cause a decrease in flow rate, an increase in the heat generation of the pump body, and is prone to fatigue failure.

[0106] A plurality of internally hollowed 180 regions are formed between the support frame 154 and the reinforcement part 152 of the vibration plate 150. The support frame 154 can be set such that the width from the outer side of one of the side beams 155 to the outer side of the other side beam 155 parallel to it is slightly narrower than the corresponding width of the square opening 172 of the outer frame 170, thereby forming an elongated side gap 184 between the side beam 155 and the inner side of the outer frame 170. As Figure 4As shown, after the vibration plate 150 is assembled with the outer frame 170, corner gaps 182 located at the four corners and side gaps 184 located between the side beams 155 and the outer frame 170 are formed between the support frame 154 of the vibration plate 150 and the outer frame 170. Thus, in the combination of the assembled oscillator 140 and the outer frame 170, there are a plurality of internally hollowed-out portions 180, corner gaps 182, and side gaps 184 spaced apart from each other, enabling fluid to flow quickly through the hollowed-out portions and gap spaces during operation, thereby reducing flow resistance. The thickness of the outer frame 170 should be greater than or equal to the thickness of the oscillator 140 formed by stacking the vibration plate 150 and the piezoelectric element 160. Optionally, the thickness dimension range of the outer frame 170 can be between 0.35 mm and 0.5 mm, while the thickness dimension range of the oscillator 140 can be between 0.35 mm and 0.45 mm. Such a dimension setting can ensure sufficient vibration space while also ensuring that the overall size of the integrated piezoelectric pump meets the requirements of various ultra-thin applications. Through the vibration plate 150 with the above structure, excellent vibration performance can be provided for the pump body 100 of the integrated piezoelectric pump, and this structure enables the vibration plate 150 to be integrally cut and processed on a single-piece material, facilitating manufacturing, saving raw materials, and reducing manufacturing costs. By the method of fitting and assembling the vibration plate 150 with the outer frame 170, it is beneficial to improve the tolerance of manufacturing errors of the vibration plate 150, facilitate assembly, and also has excellent adaptability. It can be applied to different pump bodies and pump devices by assembling the vibration plate 150 to outer frames with different external shapes, and thus is applicable to a variety of different application products. The vibration plate 150 can use fiber-reinforced composite materials. The oscillator 140 can make full use of the enhanced modulus in the fiber direction of the fiber-reinforced composite material through the above-mentioned generally straight strip-shaped support frame 154, providing better vibration performance and durability. After the vibration plate 150 and the outer frame 170 are made of different materials, they can be fitted, bonded, or keyed together, which is beneficial to meeting the requirements of an ultra-thin and low-heat-generating oscillator structure while also enabling the outer frame 170 to meet the scribing requirements of a scribing machine. For example, the vibration plate 150 can be made of stainless steel or carbon fiber composite materials, and the outer frame 170 can be made of glass fiber or carbon fiber composite materials, ceramics, stainless steel, etc. The glass fiber and ceramic materials used can undergo a metallization process.

[0107] As Figure 2As shown, the electrode plate 190 located below the oscillator 140 has a surrounding frame 192 and cantilevers 194 extending inward from the surrounding frame 192. The surrounding frame 192 may include two insulating strips 195 and two parts separated by the insulating strips 195, namely the first part 196 of the surrounding frame and the second part 198 of the surrounding frame, where the cantilevers 194 extend inward from the second part 198 of the surrounding frame. The electrode plate 190 is made of a conductive metal material, and the electrical connection between the first part 196 of the surrounding frame and the second part 198 of the surrounding frame is cut off by the insulating strips 195 to insulate them from each other. When the pump body 100 is working, the cantilevers 194 of the electrode plate 190 supply power to the side of the piezoelectric element 160 facing away from the reinforcing part 152. The first part 196 of the surrounding frame is connected to the vibration plate 150 through conductive adhesive. Since the vibration plate 150 is a good conductor, power is supplied to the side of the piezoelectric element 160 facing the reinforcing part 152 through the first part 196 of the surrounding frame, the conductive adhesive, and the vibration plate 150. Thus, power is supplied to the two electrode surfaces of the piezoelectric element 160 with low impedance, reducing power loss.

[0108] The fixing method of the electrode plate 190 and the outer frame 170 of the oscillator 140 is that the cantilevers 194 of the electrode plate 190 and the oscillator 140 are connected by tin soldering or silver paste high-temperature curing. The first part 196 of the surrounding frame of the electrode plate 190 is bonded or keyed to the outer frame 170 through conductive adhesive, and the second part 198 of the surrounding frame is bonded or keyed to the outer frame 170 through insulating adhesive.

[0109] Optionally, in the assembled pump body 100, the central through hole 122 of the flow channel plate 120, the central hole 132 of the resonance plate 130, the reinforcing part 152 of the vibration plate 150, and the piezoelectric element 160 are coaxial, so as to cooperate to provide excellent fluid flow performance and oscillation effect.

[0110] The working process of the pump body 100 in this embodiment will be described in detail below. When the pump body 100 of the embodiment of the present invention is performing pumping work, the piezoelectric element 160 of the oscillator 140 is energized to generate a radial expansion and contraction movement, driving the oscillator 140 to vibrate to achieve fluid pumping.

[0111] Specifically, when the pump body 100 is in the first working state, the oscillator 140 is not powered, and the piezoelectric element 160 is in a flat and undeformed state.

[0112] When the pump body 100 is in the second working state, during the vibration of the oscillator 140, when the piezoelectric element 160 expands, it drives the reinforcing part 152 of the oscillator 140 to concave downward, causing the vibration cavity above the reinforcing part 152 to expand; at the same time, the support frame 154 bends upward to form a high-pressure area above it; at this time, a low pressure is generated in the expanded vibration cavity space above the reinforcing part 152; so that the fluid enters the expanded vibration cavity from the outside of the pump body 100 through the flow channel 124 and the central through hole 122 of the flow channel plate 120, and then through the central hole 132 of the resonance plate 130; realizing fluid inhalation.

[0113] The pump body 100 is in the third working state. During the vibration of the vibrator 140, when the piezoelectric element 160 contracts, it drives the reinforcing portion 152 of the vibrator 140 to bulge upward, causing the vibration cavity above the reinforcing portion 152 to be squeezed and narrowed, thereby generating a high-pressure area; at the same time, the area of the support frame 154 sinks downward to form a low-pressure area above it; at this time, since the central position above the reinforcing portion 152 is a high-pressure area with a large flow resistance and the surrounding is a low-pressure area with a small flow resistance, the fluid flows from the high-pressure area at the central position to the low-pressure areas around it, and part of the fluid flows downward through the hollow part of the support frame 154 from the low-pressure areas around it; furthermore, due to the size settings of the central hole 132 and the central through hole 122, only a very small amount of fluid is discharged from the vibration cavity to the outside of the pump body 100 through the central hole 132, the central through hole 122, and the flow channel 124. This makes the amount of fluid flowing out when the piezoelectric element 160 vibrates upward much less than the amount of fluid inhaled when the piezoelectric element 160 vibrates downward, realizing the one-way flow of the fluid. When the pressure inside the pump body 100 increases and reaches a certain pressure value, when the piezoelectric element 160 vibrates downward, the amount of fluid flowing back from the pump cavity below the vibrator 140 to the vibration cavity above the vibrator 140 through the multiple hollow and gap structures formed by the vibrator 140 is approximately equal to the amount of fluid flowing from the vibration cavity into the pump cavity through the multiple hollow and gap structures formed by the vibrator 140 when the piezoelectric element 160 vibrates upward, reaching a dynamic balance. At this time, the integrated piezoelectric pump reaches the zero-flow back-pressure state, and the fluid in it only oscillates and does not form a one-way flow.

[0114] The following refers to Figure 5 and Figure 6 to describe in detail the valve body 200 of the integrated piezoelectric pump in this embodiment.

[0115] As Figure 5As shown, the valve body 200 of this embodiment includes: a first fixing layer 210 assembled in sequence from top to bottom; an elastic film layer 220; a second fixing layer 230; a side wall portion 240 for fixedly installing the above-mentioned first fixing layer 210, elastic film layer 220 and second fixing layer 230; and a bottom substrate 300 fixed to the bottom surface of the side wall portion 240 and serving as a bottom plate; wherein, the bottom substrate 300 includes a power supply unit 350 and a control unit 320; and the elastic film layer 220 and the second fixing layer 230 have the same size, and the length and width of the first fixing layer 210 are greater than the length and width of the elastic film layer 220 and the second fixing layer 230. The side wall portion 240 and the bottom substrate 300 included in the valve body 200 have the same outer peripheral dimensions and shapes, and form a consistent outer shape of the valve body 200 after assembly. In addition, the pump body 100 and the valve body 200 may have the same outer peripheral shape and dimensions, so that the assembled integrated piezoelectric pump has a uniform and consistent outer shape. The thickness of the side wall portion 240 is greater than the total thickness of the first fixing layer 210, the elastic film layer 220 and the second fixing layer 230 to form a space in the valve body 200 for accommodating chips and devices on the bottom substrate 300, accommodating the deformation of the elastic film layer 220, and providing fluid circulation. The first fixing layer 210, the elastic film layer 220, the second fixing layer 230 and the side wall portion 240 of the valve body 200 together form a normally closed valve and a normally open valve.

[0116] Reference Figure 5 , a normally closed hole 212 and a first avoidance opening 214 are formed on the first fixing layer 210, and the size of the first avoidance opening 214 is larger than the size of the normally closed hole 212. The first avoidance opening 214 is used to provide an avoidance space for accommodating the upward deformation of the elastic film layer 220 when the elastic film layer 220 deforms upward.

[0117] As Figure 5As shown, below the first fixing layer 210 is an elastic film layer 220. The elastic film layer 220 is made of a material with good elasticity. A film transmission hole 222 is formed on the elastic film layer 220, and the film transmission hole 222 corresponds to the normally closed hole 212 of the first fixing layer 210. The film transmission hole 222 can be set as a plurality of independent sector-shaped small holes, which enclose a circular area. The central part of the circular area is a solid part and corresponds to the normally closed hole 212 of the first fixing layer 210. This setting enables the normally closed hole 212 to be blocked by the solid circular area when the elastic film layer 220 is in a flat state or an upward deformation state; when the elastic film layer 220 is in a downward deformation state, the solid circular area of the elastic film layer 220 deforms downward to open the normally closed hole 212, and the normally closed hole 212 communicates with the film transmission hole 222. In this embodiment, the elastic film layer 220 is integrally made of a single piece of elastic film material. In other embodiments, two elastic film pieces can also be respectively arranged at positions corresponding to the normally closed hole 212 and the first avoidance opening 214.

[0118] As Figure 5 shown, below the elastic film layer 220 is a second fixing layer 230. A transmission opening 232 corresponding to the film transmission hole 222 of the elastic film layer 220 and a second avoidance opening 234 corresponding to the first avoidance opening 214 of the first fixing layer 210 are formed on the second fixing layer 230. The transmission opening 232 can be circular, and its size is larger than the circular area enclosed by the film transmission hole 222, for providing an avoidance space for its downward deformation when the elastic film layer 220 deforms downward, and at the same time providing a fluid communication path from the normally closed hole 212 through the film transmission hole 222 and the transmission opening 232 of the downwardly deformed elastic film layer 220. The size of the second avoidance opening 234 can be the same as the size of the first avoidance opening 214 of the first fixing layer 210, and the position of the second avoidance opening 234 corresponds to the position of the first avoidance opening 214 of the first fixing layer 210, for providing an avoidance space for its downward deformation when the elastic film layer 220 deforms downward.

[0119] Reference Figure 5 and Figure 6, in this embodiment, the side wall portion 240 of the valve body 200 is a multi-step structure surrounded by four side walls with a hollow opening, so as to facilitate the installation of the first fixing layer 210, the elastic film layer 220 and the second fixing layer 230. The multi-step structure includes, from top to bottom, a first step wall 242 forming a first opening size, a second step wall 244 forming a second opening size, and a third step wall 246 forming a third opening size. The third step wall 246 further includes a boss 248 extending inward from one side, and a boss transmission hole 249 formed in the boss 248 and extending downward from the upper surface of the boss 248, and the thickness of the boss 248 is lower than the thickness of the third step wall 246. Optionally, the boss transmission hole 249 may extend downward from the upper surface of the boss 248 and penetrate through the boss 248. A side wall outlet 241 communicating with the outside of the side wall portion 240 is formed on the side wall of the side wall portion 240 where the boss 248 is provided. One end of the side wall outlet 241 communicates with the outside of the side wall, and the other end communicates with the transmission hole 249 in the boss 248. In the figure, it is shown that the side wall outlet 241 is located at the bottom of the side wall portion 240. It should be understood that the side wall outlet 241 can be provided at other suitable positions of the side wall portion as required. The first opening size of the first step wall 242 matches the first fixing layer 210, and the second opening size of the second step wall 244 matches the elastic film layer 220 and the second fixing layer 230. When assembling the first fixing layer 210, the elastic film layer 220 and the second fixing layer 230 to the side wall portion 240, the first fixing layer 210 is received in the first opening surrounded by the first step wall 242 and supported by the top surface of the second step wall 244, and the elastic film layer 220 and the second fixing layer 230 are received in the second opening surrounded by the second step wall 244 and supported by the top surface of the third step wall 246. The boss transmission hole 249 of the boss 248 corresponds to the position of the second avoidance opening 234. Thus, the boss 248 of the side wall portion 240 can cooperate with the elastic film layer 220 and the first fixing layer 210 and the second fixing layer 230. When the elastic film layer 220 is in a downward deformation state, the boss transmission hole 249 of the boss 248 is blocked; when the elastic film layer 220 is in a flat state or an upward deformation state, the boss transmission hole 249 is communicated with the space inside the valve body 200. The side wall portion 240 of the valve body 200 is made of an insulating material.

[0120] After assembly, the normally closed hole 212 of the first fixing layer 210 and the film transmission hole 222 of the elastic film layer 220 partially form a normally closed valve together. When the elastic film layer 220 is in an undeformed flat state, the normally closed hole 212 is closed and the passage is closed; while the first avoidance opening 214 of the first fixing layer 210, the elastic film layer 220 and the boss transmission hole 249 of the boss 248 form a normally open valve together. When the elastic film layer 220 is in an undeformed flat state, the passage from the inside of the valve body 200 through the boss transmission hole 249 is opened.

[0121] In addition, continuing to refer to Figure 6 , two separated through-holes penetrating up and down can be formed in the side wall portion 240. The through-holes are filled with a conductive material to form conductive vias 250. Through the conductive vias 250, the power supply unit 350 of the bottom substrate 300 is electrically connected to the electrode plate 190 of the pump body 100, so as to supply power to the piezoelectric element 160 of the pump body 100 and control its vibration action. The two conductive vias 250 are respectively connected to and electrically connected to the first frame portion 196 and the second frame portion 198 of the electrode plate 190, and then are respectively electrically connected to the frame body 170 and the cantilever 194, so as to supply power to the piezoelectric element 160 of the oscillator 140 and avoid short-circuit conditions. The arrangement of the through-conductive vias 250 of the valve body 200 penetrating up and down can effectively reduce the number of components, realize a compact, efficient and reliable power supply and control method, reduce the structural size, and enable the integrated piezoelectric pump to be applicable to more application scenarios. The conductive material can be, for example but not limited to, copper material, silver material, etc.

[0122] As Figure 5 shown, in this embodiment, the valve body 200 uses the bottom substrate 300 as its bottom plate. The bottom substrate 300 has the same external shape and size as the side wall portion 240, and the bottom substrate 300 is fixedly connected to the lower part of the side wall portion 240. The bottom substrate 300 is provided with: a power supply unit 350, which corresponds to and is electrically connected to the conductive vias 250 in the side wall portion 240; a substrate hole 310, which is arranged at the center of the bottom substrate 300 and is used for allowing fluid to enter and exit the valve body 200 without additional connecting pipes. The bottom substrate 300 also includes a chip serving as a control unit 320, a driving device, and input and output ports for electrically connecting and communicating with the outside. The components arranged on the bottom substrate 300 can avoid the positions of the substrate hole 310 and the boss 248 of the side wall portion 240 to facilitate assembly. The bottom substrate 300 is made by laminating a circuit layer and an insulating layer.

[0123] The working process of the valve body 200 in this embodiment will be described in detail below.

[0124] According to the embodiment of the present invention, the valve body 200 is in the first working state. When the internal and external pressures are the same, the elastic film layer 220 is in a flat and undeformed state, and the normally closed one-way valve is closed, that is, the normally closed hole 212 of the first fixing layer 210 is blocked by the elastic film layer 220; the normally open one-way valve is open, that is, the gap between the upper part of the boss transmission hole 249 and the flat elastic film layer 220 is not blocked, allowing fluid to flow through.

[0125] According to the embodiment of the present utility model, the valve body 200 is in the second working state. When the pump body 100 above the valve body 200 is working, the pressure above the valve body 200 is higher than the pressure inside the valve body 200. The elastic film layer 220 deforms downward, and the normally closed one-way valve opens, that is, the downward-deformed elastic film layer 220 allows the normally closed hole 212 of the first fixing layer 210 to be opened, so that the normally closed hole 212 communicates with the inside of the valve body 200 through the film transmission hole 222 of the elastic film layer 220. The fluid enters the inside of the valve body 200 from above through the normally closed hole 212 and the film transmission hole 222, and flows out from the substrate hole 310 of the bottom substrate 300. At the same time, the normally open one-way valve closes, that is, the downward-deformed elastic film layer 220 blocks the boss transmission hole 249 on the boss 248, and the fluid cannot flow through here.

[0126] According to the embodiment of the present utility model, the valve body 200 is in the third working state. When the pump body 100 stops working, the pressure inside the valve body 200 is higher than the pressure above the valve body 200. The elastic film layer 220 deforms upward, and the normally closed one-way valve closes, that is, the upward-deformed elastic film layer 220 blocks the normally closed hole 212 of the first fixing layer 210, and the fluid cannot flow through here. At the same time, the normally open one-way valve opens, that is, the upward-deformed elastic film layer 220 allows the boss transmission hole 249 on the boss 248 to be opened. The fluid enters the inside of the valve body 200 from below through the substrate hole 310 at the center of the bottom substrate 300, passes through the boss transmission hole 249, and then is discharged out of the valve body 200 through the side wall outlet 241.

[0127] The following describes the assembly and fixation method of the pump body 100 and the valve body 200. The pump body 100 and the valve body 200 are assembled by fixing the bottom surface of the electrode plate 190 at the bottom of the pump body 100 to the top surface of the side wall portion 240 of the valve body 200. The bottom surface of the electrode plate 190 at the bottom of the pump body 100 and the top surface of the side wall portion 240 of the valve body 200 can be bonded by an insulating flexible adhesive. When bonding, the flexible adhesive avoids the conductors of the conductive through holes 250 in the side wall portion 240 of the valve body 200, and the conductors of the conductive through holes 250 are respectively in contact with and electrically connected to the frame part one 196 and the frame part two 198 of the electrode plate 190, so as to realize the power supply and control of the piezoelectric element 160 in the pump body 100 from the bottom substrate 300. The power supply circuit from the bottom substrate 300 to the piezoelectric element 160 in the pump body 100 is as follows: from a power supply unit 350 of the bottom substrate 300, through a conductive through hole 250 in the side wall portion 240, the frame part one 196 of the electrode plate 190 electrically connected to the conductive through hole 250, the outer frame 170 above the frame part one 196, and the diaphragm 150 fitted with the outer frame 170, and then electrically connected to the upper surface of the piezoelectric element 160; from another power supply unit 350 of the bottom substrate 300, through another conductive through hole 250 in the side wall portion 240, the frame part two 198 of the electrode plate 190 electrically connected to the conductive through hole 250, and the cantilever 194 extending from the frame part two 198, and then electrically connected to the lower surface of the piezoelectric element 160. Thus, a power supply circuit for the piezoelectric element 160 is formed. By forming a power supply path in the side wall portion 240 of the valve body 200, the oscillator 140 of the pump body 100 does not require laterally outwardly extending electrical connection terminals and corresponding connection cables, and the appearance is more concise, which is more conducive to application in small and micro downstream products.

[0128] In addition, between the pump body 100 and the valve body 200 and between their respective layer plates, microstructures can be fabricated on the wafer and then bonded by eutectic bonding or resin bonding, which can achieve rapid bonding of materials at a relatively low temperature, help protect the integrity of the device, avoid damage to the device caused by high temperature, provide a higher yield, better consistency, and is more convenient for rapid mass production.

[0129] According to the valve body 200 provided by this embodiment, an integrated design of microelectronics and micromechanics is adopted, the power supply unit and the control unit are integrated on the bottom substrate, the internal structure is reasonably distributed, the volume of the piezoelectric pump body is reduced, and the overall mechanical and electronic overall solution area and volume are greatly reduced; the control unit, that is, the chip, is integrated on the bottom substrate, which greatly reduces the downstream application development cycle and improves the space benefit of downstream users; by arranging a circuit path in the side wall portion to supply power and communicate with the pump body 100, no external connection cable is required, which not only reduces the volume and has high space utilization rate, but also reduces external interference and improves the stability and reliability of the system.

[0130] Embodiment 2

[0131] Figure 7 is an exploded view of an integrated piezoelectric pump provided according to another embodiment of the present utility model.

[0132] As Figure 7 shown, an integrated piezoelectric pump provided according to another embodiment of the present utility model includes a pump body 1100 with a circular outer periphery and a valve body 1200. The pump body 1100 successively includes from top to bottom: a top heat dissipation plate 1110, a flow channel plate 1120, a resonance plate 1130, a frame 1170 for embedding an oscillator 140, and an electrode plate 1190. The above-mentioned multiple layers of components included in the pump body 1100 have consistent outer peripheral dimensions and a circular outer peripheral shape, and form a pump body 1100 with a circular outer periphery after assembly. Among them, although the outer peripheral shape of the multiple layers of components is circular, its internal structure is the same as that of the pump body 100 in the above first embodiment, and will not be elaborated here. Since the square opening structure in the middle of the frame 1170 is the same as the square opening in the middle of the frame 170 in the above first embodiment, the oscillator 140 composed of the vibration plate 150 and the piezoelectric element 160 in the first embodiment can be matched therein.

[0133] The valve body 1200 of this embodiment includes: a first fixing layer 210 assembled successively from top to bottom; an elastic film layer 220; a second fixing layer 230; a side wall portion 1240 for fixedly installing the above-mentioned first fixing layer 210, elastic film layer 220, and second fixing layer 230; and a bottom substrate 1300 fixed to the bottom surface of the side wall portion 1240 and serving as a bottom plate. The side wall portion 1240 and the bottom substrate 1300 included in the valve body 1200 have consistent outer peripheral dimensions and a circular outer peripheral shape, and form a valve body 1200 with a circular outer periphery after assembly, and are matched with the above-mentioned pump body 1100. Among them, although the outer peripheral shapes of the side wall portion 1240 and the bottom substrate 1300 of the valve body 1200 are circular, its internal structure is the same as that of the pump body 100 in the above first embodiment, and the structures of the first fixing layer, elastic film layer, and second fixing layer installed in the side wall portion 1240 are the same as those in the first embodiment, and will not be elaborated here.

[0134] All the above optional technical solutions can be combined arbitrarily to form optional embodiments of the present application, which will not be elaborated one by one here.

[0135] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present utility model.

[0136] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model.

Claims

1. An integrated piezoelectric pump, characterized in that: include: The pump body includes, assembled from top to bottom: a top heat sink, a flow channel plate, a resonance plate, an outer frame with an embedded vibrator, and an electrode plate; as well as A valve body installed below the pump body, the valve body comprising: a first fixing layer, an elastic film layer, and a second fixing layer assembled from top to bottom, a side wall portion for fixing and installing the first fixing layer, the elastic film layer, and the second fixing layer, and a bottom base plate fixed to the bottom surface of the side wall portion and serving as a bottom plate of the valve body; Wherein, the bottom substrate serves as the bottom plate of the integrated piezoelectric pump to supply power to and control the piezoelectric element of the pump body; At least two separated conductive through holes are formed in the side wall portion, and two ends of the conductive through holes are electrically connected to the electrode plate and the bottom substrate respectively, serving as a path for the bottom substrate to supply power to the piezoelectric element of the pump body.

2. The integrated piezoelectric pump according to claim 1, characterized in that: in, The vibrator comprises a vibration plate and a piezoelectric element, wherein the vibration plate has a central reinforcement portion and a support frame surrounding the reinforcement portion, and the piezoelectric element is fixed to the lower surface of the reinforcement portion; The electrode plate has a cantilever extending inwardly, and the cantilever contacts the lower surface of the piezoelectric element.

3. The integrated piezoelectric pump according to claim 2, characterized in that: The flow channel plate has a circular central through hole at the center, and a flow channel connecting the central through hole with the outside; The resonance plate has a central hole, which is connected to the central through hole of the flow channel plate and is coaxially arranged; The diameter of the central through hole is in the range of 4.5 mm to 6.0 mm, the diameter of the central hole of the resonance plate is in the range of 0.5 mm to 1.2 mm, and the width of the flow channel is in the range of 0.6 mm to 1.0 mm.

4. The integrated piezoelectric pump according to claim 2, characterized in that: The support frame of the vibration plate is an octagonal structure, including four side beams and four diagonal support beams alternately connected to each other to form an octagon, and an inner beam extending inwardly from the side beams and connected to the outer edge of the reinforcement part; Wherein, the width of each side beam is narrower than the width of the diagonal bracing beam; Wherein, the diagonal bracing beam extends outwardly beyond the outer edge of the side beam at the connection with the side beam to form a mounting protrusion; Wherein, a plurality of separated internal hollows are formed between the reinforcement portion of the vibration plate and the support frame.

5. The integrated piezoelectric pump according to claim 4, characterized in that: The outer frame has a square opening in the middle, and a mounting groove is formed on the inner side facing the square opening, and the mounting groove matches the mounting protrusion of the diagonal bracing beam; After the vibration plate is assembled with the outer frame, a plurality of corner gaps are formed between the diagonal support beam of the vibration plate and the inner wall of the square opening of the outer frame, and a plurality of side gaps are formed between the side beam of the vibration plate and the inner wall of the square opening of the outer frame.

6. The integrated piezoelectric pump according to any one of claims 1 to 5, characterized in that: The pump body and the valve body are assembled together by fixing a bottom surface of an electrode plate of the pump body to a top surface of a side wall portion of the valve body.

7. The integrated piezoelectric pump according to claim 6, characterized in that: The surrounding frame of the electrode plate of the pump body comprises a first frame portion and a second frame portion separated by an insulating strip, wherein the cantilever extends inwardly from the second frame portion, and the first frame portion is electrically connected to the outer frame above it; The upper ends of the two conductive through holes in the side wall of the valve body are electrically connected to the first and second enclosure frames respectively, and the lower ends of the two conductive through holes are electrically connected to the power supply unit of the bottom substrate.

8. The integrated piezoelectric pump according to any one of claims 1 to 5, characterized in that: The first fixed layer of the valve body includes a normally closed hole; The elastic film layer comprises a film transmission hole, and the position of the film transmission hole deviates from the position of the normally closed hole; Wherein, the normally closed hole of the first fixed layer and the film transmission hole of the elastic film layer together constitute a normally closed valve.

9. The integrated piezoelectric pump according to claim 8, characterized in that: The first fixed layer of the valve body includes a first avoidance opening; The elastic film layer is solid at a portion corresponding to the first avoidance opening; The side wall portion has a boss extending inward from one side, a boss transmission hole extending downward from the upper surface thereof is formed in the boss, and a side wall outlet is formed on the side wall where the boss is provided, which is connected from the boss transmission hole to the outside of the side wall portion, and the position of the boss transmission hole corresponds to the first avoidance opening; The first avoidance opening, the portion of the elastic film layer corresponding to the first avoidance opening, and the boss transmission hole together constitute a normally open valve.

10. The integrated piezoelectric pump according to any one of claims 1 to 5, characterized in that: A power supply unit and a control unit are arranged on the bottom substrate, and the power supply unit corresponds to and is electrically connected to the conductive through hole in the side wall portion.

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