Heat dissipation support

Abstract

The utility model provides a heat dissipation support which comprises a bearing plate, a cover plate and a baffle, the cover plate is arranged on the bearing plate, the baffle is in sliding fit with the bearing plate in the first direction, one of the cover plate and the baffle is provided with a groove, the other of the cover plate and the baffle is provided with a positioning protrusion, the positioning protrusion is clamped with the groove, and the baffle is arranged on the bearing plate. The number of the positioning protrusions and / or the grooves is multiple, and the multiple positioning protrusions and / or the multiple grooves are arranged at intervals in the first direction. The baffle is pushed and pulled in the first direction to adjust the length, extending out of the bearing plate, of the baffle in the first direction, and when the baffle is adjusted to the preset position, the baffle is limited by clamping the positioning protrusions into the corresponding grooves; according to the technical scheme, adjusting and positioning of multiple gears of the baffle are achieved, so that the baffle can be subjected to multi-gear adjusting, adjusting is convenient, user operation is facilitated, and the use experience feeling of a user is improved.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation, and more specifically, relates to a heat dissipation bracket. Background Art

[0002] With the rapid development of electronic devices, the types and functions of electronic devices are also increasing, making electronic devices an essential tool for people's work, study, and relaxation. In order to facilitate portability and use, small-sized electronic devices such as laptops or tablets (Pads) are becoming more and more popular among people.

[0003] Since electronic devices such as laptops or tablets are becoming more and more lightweight and thin in volume, and their integration degree is also getting higher and higher, the heat generated by the internal components of the electronic devices is more concentrated and not easily dissipated to the outside of the electronic devices, thus prone to phenomena such as slow operation or even malfunction. Therefore, in order to improve the heat dissipation performance of electronic devices such as laptops or tablets, a heat dissipation bracket is generally additionally used to support and dissipate heat from such electronic devices.

[0004] During the use of the heat dissipation bracket, the supporting plate of the heat dissipation bracket is generally in an inclined state so that users can use electronic devices such as laptops or tablets at a better angle. To prevent the electronic device from slipping, a baffle is generally provided on the lower end side of the supporting plate, and some baffles are also provided with a telescopic adjustable structure to adapt to electronic devices of different sizes. However, generally, the screw and slot method is used to achieve the telescopic adjustable function of the baffle, and the adjustment method is relatively complex and not convenient for users to operate. Summary of the Utility Model

[0005] The purpose of the embodiments of this application is to provide a heat dissipation bracket to solve the technical problem in the prior art that the adjustment method for realizing the telescopic adjustment of the baffle of the heat dissipation bracket is relatively complex and not convenient for users to operate.

[0006] To achieve the above purpose, the technical solution adopted in this application is: providing a heat dissipation bracket, including: a supporting plate, a cover plate, and a baffle. The cover plate is disposed on the supporting plate. The baffle is slidably engaged with the supporting plate along a first direction. One of the cover plate and the baffle has a groove, and the other of the cover plate and the baffle is provided with a positioning protrusion. The positioning protrusion is engaged with the groove. The number of the positioning protrusions and / or the grooves is multiple, and the multiple positioning protrusions and / or the multiple grooves are spaced along the first direction.

[0007] Optionally, the supporting plate has a supporting surface and a mounting surface arranged opposite to each other. The supporting plate is provided with a movable slot penetrating through the supporting surface and the mounting surface. The cover plate is arranged on the supporting surface. The baffle is in sliding contact with the mounting surface. A slider is arranged on the baffle. The slider penetrates through the movable slot and is slidably arranged between the cover plate and the supporting plate in the first direction. The positioning protrusion or the groove is arranged on the slider.

[0008] Optionally, the supporting surface has a limiting slot penetrating through the supporting surface. The cover plate is limited within the limiting slot. The movable slot is communicated with the limiting slot. A part of the slider is slidably arranged on the side surface where the limiting slot is located.

[0009] Optionally, two groups of grooves are arranged on the baffle at intervals in the second direction. Each group of grooves includes a plurality of the grooves. The number of the sliders is two. The positioning protrusions are arranged on each slider. The positioning protrusions on the two sliders are respectively engaged with at least one of the grooves in the two groups of grooves.

[0010] Optionally, the heat dissipation bracket further includes a heat dissipation component, and the heat dissipation component is arranged on the supporting plate.

[0011] Optionally, the heat dissipation component includes a housing, a heat conduction member, a semiconductor refrigeration member, a heat dissipation member, an air supply fan and a heat dissipation fan. The housing is provided with a relatively independent cold air channel and a heat dissipation channel. At least a part of the heat conduction member and the air supply fan are both arranged in the cold air channel. The heat dissipation fan and the heat dissipation member are both arranged in the heat dissipation channel. The semiconductor refrigeration member is connected to the heat conduction member and the heat dissipation member.

[0012] Optionally, the heat dissipation bracket further includes a cooling frame assembly. The cooling frame assembly forms a cooling groove. The heat dissipation component is used for conveying cold air into the cooling groove.

[0013] Optionally, the supporting plate has a supporting surface and a mounting surface arranged opposite to each other. The supporting plate is provided with a ventilation port penetrating through the supporting surface and the mounting surface. The heat dissipation component is arranged on the mounting surface and is correspondingly arranged with the ventilation port. The cooling frame assembly is arranged on the mounting surface. The cooling groove is communicated with the ventilation port.

[0014] Optionally, the cooling frame assembly includes a main frame, a first frame and a second frame. The first frame and the second frame are respectively arranged at both ends of the main frame in the second direction and enclose the cooling groove with the main frame. The first frame and the second frame are both slidably arranged between the main frame and the supporting plate in the second direction.

[0015] Optionally, the heat dissipation bracket further includes a folding bracket, which is connected to the supporting plate and configured to adjust the height and tilt angle of the supporting plate.

[0016] The beneficial effect of the heat dissipation bracket provided by this application is that, compared with the prior art, in this application, a groove is provided on one of the cover plate and the baffle, and a positioning protrusion is provided on the other of the cover plate and the baffle. By pushing and pulling the baffle along the first direction, the length of the baffle extending out of the supporting plate in the first direction is adjusted. When the baffle is adjusted to a preset position, the positioning protrusion is snapped into the corresponding groove to limit the baffle. By arranging a plurality of positioning protrusions and / or a plurality of grooves along the first direction, the adjustment and positioning of multiple gears of the baffle are realized, so that the baffle can be adjusted in multiple gears, the adjustment is convenient, the operation is convenient for the user, and it is beneficial to improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of the three-dimensional structure of the heat dissipation bracket provided by the embodiment of this application Figure 1 ;

[0019] Figure 2 Schematic diagram of the three-dimensional structure of the heat dissipation bracket provided by the embodiment of this application Figure 2 ;

[0020] Figure 3 Exploded structure diagram of the heat dissipation bracket provided by the embodiment of this application;

[0021] Figure 4 Bottom view structure diagram of the cover plate provided by the embodiment of this application;

[0022] Figure 5 Schematic diagram of the three-dimensional structure of the baffle provided by the embodiment of this application;

[0023] Figure 6 Combined state diagram of the baffle, slider and cover plate provided by the embodiment of this application;

[0024] Figure 7 For Figure 6 Enlarged schematic diagram at position A shown;

[0025] Figure 8 Vertical sectional structure diagram of the heat dissipation component provided by the embodiment of this application.

[0026] Among them, the reference numerals in the figures are as follows:

[0027] 10. Supporting plate; 11. Supporting surface; 12. Mounting surface; 13. Ventilation port; 14. Dust-proof net; 15. Limiting groove; 16. Movable groove; 20. Cooling frame assembly; 21. Main frame; 22. First frame; 23. Second frame; 24. Cooling groove; 30. Heat dissipation assembly; 31. Housing; 311. First air inlet; 312. Cold air outlet; 313. Cold air cavity; 314. Second air inlet; 315. Hot air outlet; 316. Heat dissipation cavity; 317. Avoidance opening; 318. Bottom shell; 319. Bottom cover; 32. Heat conduction member; 321. Heat conduction sheet; 322. Heat conduction pipe; 33. Thermoelectric cooler; 34. Heat dissipation member; 35. Air supply fan; 36. Heat dissipation fan; 37. Limiting frame; 40. Baffle; 41. Slide block; 411. Positioning protrusion; 50. Cover plate; 51. Groove; 60. Folding rack; 61. Base; 62. Connecting rod; 63. Damping shaft; F1. First direction; F2. Second direction. Detailed implementation manners

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0032] Please refer to Figures 1 to 8 simultaneously, and a heat dissipation bracket provided by an embodiment of the present application will be described hereinafter.

[0033] Please refer to Figures 3 to 6 , the heat dissipation bracket includes a supporting plate 10, a cover plate 50 and a baffle 40. The cover plate 50 is arranged on the supporting plate 10. The baffle 40 is slidably engaged with the supporting plate 10 along a first direction F1. There is a groove 51 on one of the cover plate 50 and the baffle 40, and a positioning protrusion 411 is arranged on the other of the cover plate 50 and the baffle 40. The positioning protrusion 411 is engaged with the groove 51. The number of the positioning protrusions 411 and / or the grooves 51 is multiple, and the multiple positioning protrusions 411 and / or the multiple grooves 51 are arranged at intervals along the first direction F1.

[0034] For the convenience of understanding, let the width direction of the supporting plate 10 be the first direction F1, and the length direction of the supporting plate 10 be the second direction F2. The first direction F1 is perpendicular to the second direction F2. In the embodiment of the present application, the first direction F1 is the front-back direction, and the second direction F2 is the left-right direction, as Figure 1 .

[0035] Please refer to Figure 1 and Figure 2 , the supporting plate 10 is used to support an electronic device. Among them, the supporting plate 10 has a supporting surface 11 and a mounting surface 12 which are arranged opposite to each other. The supporting surface 11 is used to support the electronic device. The electronic device can be, but is not limited to, movable electronic products such as a laptop computer and a tablet computer.

[0036] Optionally, the supporting plate 10 can be, but is not limited to, an aluminum alloy plate.

[0037] In some embodiments, the number of the positioning protrusions 411 is multiple, and the number of the grooves 51 can be one or more. In other embodiments, the number of the grooves 51 is multiple, and the number of the positioning protrusions 411 can be one or more. It can be understood that by engaging the positioning protrusion 411 with different grooves 51, or, different positioning protrusions 411 with the groove 51, or, different positioning protrusions 411 with different grooves 51, the adjustment and positioning of multiple gears of the baffle 40 are realized, so that the baffle 40 can be adjusted in multiple gears.

[0038] It should be noted that the positioning protrusion 411 is an elastic structure. During the process of sliding the baffle 40, when the positioning protrusion 411 is misaligned with the groove 51, the positioning protrusion 411 generates elastic compression deformation. When the positioning protrusion 411 corresponds to the groove 51, the positioning protrusion 411 snaps into the corresponding groove 51, as Figure 6 and Figure 7 , so as to limit the baffle 40.

[0039] The beneficial effects of the heat dissipation bracket provided by the present application are as follows. Compared with the prior art, in the present application, one of the cover plate 50 and the baffle 40 has a groove 51, and the other of the cover plate 50 and the baffle 40 is provided with a positioning protrusion 411. By pushing and pulling the baffle 40 along the first direction F1, the length of the baffle 40 extending from the supporting plate 10 in the first direction F1 is adjusted. When the baffle 40 is adjusted to a preset position, the positioning protrusion 411 is snapped into the corresponding groove 51 to limit the baffle 40. By arranging a plurality of positioning protrusions 411 and / or a plurality of grooves 51 along the first direction F1, the adjustment and positioning of multiple gears of the baffle 40 are realized, so that the baffle 40 can be adjusted in multiple gears, the adjustment is convenient, the user operation is facilitated, and the user experience is improved.

[0040] In some embodiments of the present application, please refer to Figure 3 , the supporting plate 10 is provided with a movable groove 16 penetrating through the supporting surface 11 and the mounting surface 12. The cover plate 50 is arranged on the supporting surface 11 and covers the movable groove 16. The baffle 40 is in sliding contact with the mounting surface 12. A slider 41 is arranged on the baffle 40. The slider 41 penetrates through the movable groove 16 and is slidably arranged between the cover plate 50 and the supporting plate 10 along the first direction F1. The positioning protrusion 411 or the groove 51 is arranged on the slider 41. By reciprocating the slider 41 along the first direction F1, the baffle 40 is driven to reciprocate along the first direction F1.

[0041] Further, the supporting surface 11 has a limiting groove 15 penetrating through the supporting surface 11. The cover plate 50 is limited in the limiting groove 15. The movable groove 16 is communicated with the limiting groove 15. A part of the slider 41 is slidably arranged on the side surface where the limiting groove 15 is located. By limiting the cover plate 50 in the limiting groove 15, the structure is more compact, which is beneficial to reducing the space occupation.

[0042] Optionally, please refer to Figure 4 , two groups of grooves are arranged on the baffle 40 at intervals along the second direction F2. Each group of grooves includes a plurality of grooves 51. The number of sliders 41 is two. The two sliders 41 are arranged at intervals along the second direction F2. Positioning protrusions 411 are arranged on each slider 41. As Figure 5 , the positioning protrusions 411 on the two sliders 41 are respectively engaged with at least one groove 51 of the two groups of grooves. By arranging two sliders 41 to cooperate with the two groups of grooves respectively, it is beneficial to improve the stability of the baffle 40 moving along the first direction F1 and the stability of positioning the baffle 40.

[0043] In some embodiments of the present application, please refer to Figure 2 and Figure 3 , the heat dissipation bracket further includes a heat dissipation component 30. The heat dissipation component 30 is arranged on the supporting plate 10. The heat dissipation component 30 is used for dissipating heat from the electronic device placed on the supporting surface 11.

[0044] Specifically, please refer to Figure 8 , the heat dissipation component 30 includes a housing 31, a heat conduction member 32, a semiconductor refrigeration member 33, a heat dissipation member 34, an air supply fan 35 and a heat dissipation fan 36. The housing 31 is provided with relatively independent cold air channels and heat dissipation channels. At least part of the heat conduction member 32 and the air supply fan 35 are arranged in the cold air channels, and the heat dissipation fan 36 and the heat dissipation member 34 are arranged in the heat dissipation channels. The semiconductor refrigeration member 33 is connected to the heat conduction member 32 and the heat dissipation member 34.

[0045] Among them, the semiconductor refrigeration member 33 is a semiconductor refrigeration chip. The cold surface of the semiconductor refrigeration member 33 is in contact with the heat conduction member 32, and the hot surface of the semiconductor refrigeration member 33 is in contact with the heat dissipation member 34. The semiconductor refrigeration member 33 can be cooled when powered on. The heat conduction member 32 is used to transfer the cold quantity of the cold surface and use the absorbed cold quantity of the cold surface to cool the air in the cold air channel. The cold air fan is used to blow air on the heat conduction member 32. The heat dissipation member 34 is used to transfer the heat of the hot surface, and the heat dissipation fan 36 is used to blow air on the heat dissipation member 34 to discharge the heat on the semiconductor refrigeration member 33 from the heat dissipation channel.

[0046] When the heat dissipation component 30 works, the air supply fan 35 introduces the outside normal temperature air into the cold air channel. The normal temperature air forms cold air lower than the normal temperature after passing through the heat conduction member 32, and then flows to the cooling tank 24 to act on the electronic device to reduce the temperature of the electronic device during operation, so as to achieve the purpose of cooling and dissipating heat of the electronic device. The heat on the heat conduction member 32 is transferred to the heat dissipation member 34 through the semiconductor refrigeration member 33. The heat dissipation fan 36 introduces the outside normal temperature air into the heat dissipation channel. The normal temperature air forms hot air higher than the normal temperature after passing through the heat dissipation member 34 and then is discharged.

[0047] In the above technical solution, by relatively independently arranging the cold air channel and the heat dissipation channel, the cold air flow and the hot air flow in the housing 31 are separated, effectively preventing the cold air and the hot air in the housing 31 from flowing through each other. Therefore, it is beneficial to improve the heat dissipation and cooling effect on the electronic device;

[0048] Furthermore, in some embodiments of the present application, please refer to Figure 8, the housing 31 is provided with a first air inlet 311, a cold air outlet 312, a cold air chamber 313, a second air inlet 314, a hot air outlet 315 and a heat dissipation chamber 316. The first air inlet 311 and the cold air outlet 312 are respectively arranged on opposite sides of the housing 31. The first air inlet 311, the cold air chamber 313 and the cold air outlet 312 are sequentially communicated to form a cold air channel, and the cold air outlet 312 is communicated with the cooling groove 24. Specifically, the cold air outlet 312 is correspondingly communicated with the ventilation port 13, that is, the cold air outlet 312 is communicated with the cooling groove 24 through the ventilation port 13 and the notch. The second air inlet 314 and the hot air outlet 315 are respectively arranged at opposite ends of the housing 31. The second air inlet 314, the heat dissipation chamber 316 and the hot air outlet 315 are sequentially communicated to form a heat dissipation channel.

[0049] In the above technical solution, by arranging the first air inlet 311 and the cold air outlet 312 on opposite sides of the housing 31 respectively, a positive convection is formed between the first air inlet 311 and the cold air outlet 312, which can enable the air flow to quickly flow from the first air inlet 311 to the cold air outlet 312. By arranging the second air inlet 314 and the hot air outlet 315 at opposite ends of the housing 31 respectively, a positive convection is formed between the second air inlet 314 and the hot air outlet 315, which can enable the air flow to quickly flow from the second air inlet 314 to the hot air outlet 315. Moreover, the first air inlet 311 and the hot air outlet 315 are respectively located on different sides of the housing 31, effectively preventing the hot air in the heat chamber from being discharged from the hot air outlet 315 and then entering the cold air chamber 313 from the first air inlet 311.

[0050] Optionally, the cold conduction member 32 is arranged close to the cold air outlet 312, the heat dissipation fan 36 is arranged close to the second air inlet 314, the heat dissipation member 34 is arranged close to the hot air outlet 315, and the air supply fan 35 is located between the heat dissipation fan 36 and the heat dissipation member 34.

[0051] In the above technical solution, by arranging the cold conduction member 32 close to the cold air outlet 312, the cold air cooled by the cold conduction member 32 can be discharged from the cold air outlet 312 in time, reducing the flow time of the cold air in the cooling channel, effectively preventing the housing 31 from absorbing the cold in the cooling channel, effectively reducing the loss of cold in the cooling channel, and improving the heat dissipation effect. By arranging the heat dissipation fan 36 close to the second air inlet 314, the heat dissipation fan 36 can easily draw the ambient normal temperature air into the heat dissipation channel. By arranging the heat dissipation member 34 close to the hot air outlet 315, the heat of the heat dissipation member 34 can be discharged from the hot air outlet 315 in time, reducing the flow time of the hot air in the heat dissipation channel, and effectively preventing the heat in the heat dissipation channel from being transferred to the cooling channel.

[0052] Optionally, the material of the cold conduction member 32 can be, but is not limited to, copper. The material of the heat dissipation member 34 can be, but is not limited to, aluminum alloy. The heat dissipation member 34 includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals, which is beneficial to improving the heat dissipation efficiency of the heat dissipation member 34.

[0053] In some embodiments of the present application, please continue to refer to Figure 8 , the housing 31 is further provided with an avoidance opening 317 communicating with the heat dissipation cavity 316. The heat conduction member 32 includes a heat conduction sheet 321 and a heat conduction pipe 322 connecting the heat conduction sheet 321. The heat conduction sheet 321 is disposed at the avoidance opening 317 and is attached to the semiconductor refrigeration member 33. The heat conduction pipe 322 is disposed at the cold air outlet 312.

[0054] Optionally, the heat conduction pipe 322 is in a meandering shape, effectively increasing the heat conduction area of the heat conduction pipe 322, thereby effectively improving the refrigeration efficiency.

[0055] Specifically, the housing 31 includes a bottom case 318 and a bottom cover 319. The bottom cover 319 covers the bottom case 318 to form an accommodation space. A limit frame 37 is provided on the bottom cover 319. The limit frame 37 is located in the middle of the side of the bottom cover 319 facing the bottom case 318. The limit frame 37 divides the accommodation space into a cold air cavity 313 and a heat dissipation cavity 316. The first air inlet 311, the second air inlet 314 and the hot air outlet 315 are all opened on the bottom case 318, and the avoidance opening 317 and the cold air outlet 312 are opened on the bottom cover 319.

[0056] In some embodiments of the present application, please refer to Figure 1 and Figure 3 , the heat dissipation bracket further includes a cooling frame assembly 20. The cooling frame assembly 20 forms a cooling groove 24. The cold air channel communicates with the cooling groove 24. The heat dissipation assembly 30 is used to convey cold air into the cooling groove 24. The cooling frame assembly 20 is used to contact the circumferential edge of the heat dissipation surface or the heat dissipation air inlet of the electronic device. The cooling groove 24 is used to converge the cold air, and the cooling groove 24 covers the heat dissipation surface or the heat dissipation air inlet of the electronic device, so that most of the cold air can fully act on the electronic device to dissipate heat and cool down the electronic device better.

[0057] Specifically, the supporting plate 10 is provided with a ventilation opening 13 penetrating through the supporting surface 11 and the mounting surface 12. The heat dissipation assembly 30 is disposed on the mounting surface 12 and is correspondingly arranged with the ventilation opening 13. The cooling frame assembly 20 is disposed on the mounting surface 12, and the cooling groove 24 communicates with the ventilation opening 13. The cold air output by the heat dissipation assembly 30 flows through the ventilation opening 13 to the cooling groove 24 to dissipate heat and cool down the electronic device.

[0058] The cooling frame assembly 20 includes a main frame 21, a first side frame 22 and a second side frame 23. The first side frame 22 and the second side frame 23 are respectively disposed at both ends of the main frame 21 along the second direction F2 and enclose the cooling groove 24 with the main frame 21. The first side frame 22 and the second side frame 23 are both slidably disposed between the main frame 21 and the supporting surface 11 of the supporting plate 10 along the second direction F2, so that the length of the cooling frame assembly 20 and the cooling groove 24 in the second direction F2 is adjustable.

[0059] With the above technical solution, by pushing and pulling the first frame 22 and the second frame 23 along the second direction F2, the lengths of the first frame 22 and the second frame 23 extending from the main frame 21 in the second direction F2 are changed, so as to adjust the lengths of the cooling frame assembly 20 and the cooling groove 24 in the second direction F2. By adjusting the length of the cooling frame assembly 20 in the second direction F2, electronic devices of different sizes can be supported. By adjusting the length of the cooling groove 24 in the second direction F2, the acting range of the cold air on the electronic device can be adjusted, so that electronic devices of different sizes can be adapted. In addition, by adjusting the cooling range of the cooling groove 24 for the electronic device, it is convenient to be compatible with the different positions of the heat dissipation surface or the heat dissipation air inlet of the electronic devices of different sizes. It can be understood that, according to electronic devices of different sizes, by making the first frame 22 and the second frame 23 extend and contract along the second direction F2, the supporting range of the cooling frame assembly 20 for the electronic device and the cooling range of the cooling groove 24 for the electronic device can be adjusted.

[0060] Exemplarily, the electronic device is a laptop computer. By adjusting the lengths of the first frame 22 and the second frame 23 extending from the main frame 21 in the second direction F2 and adjusting the length of the baffle 40 extending from the supporting plate 10 in the first direction F1, laptop computers with different sizes can be adapted.

[0061] In some embodiments of the present application, please continue to refer to Figure 1 and Figure 3 , the heat dissipation bracket further includes a dust-proof net 14, the dust-proof net 14 covers the ventilation opening 13, and the dust-proof net 14 has a dust-proof and filtering effect.

[0062] In some embodiments of the present application, please refer to Figure 1 and Figure 2 , the heat dissipation bracket further includes a folding frame 60, the folding frame 60 is connected to the supporting plate 10, and is configured to adjust the height and the inclination angle of the supporting plate 10.

[0063] With the above technical solution, when the electronic device is placed on the supporting plate 10, the overall height and the inclination angle of the supporting plate 10 can be adjusted by the folding frame 60, so that the supporting plate 10 can support the electronic device at a preset height and inclination angle required by the user, which is convenient for the user to use. In addition, when not in use, by folding the folding frame 60, it is beneficial to save space occupancy and is convenient for storage and carrying.

[0064] In some embodiments of the present application, please refer to Figure 3, the folding frame 60 includes a base 61 and at least two connecting rods 62. The at least two connecting rods 62 are spaced apart along the second direction F2. One end of the connecting rod 62 is rotatably connected to the base 61, and the other end of the connecting rod 62 is rotatably connected to the supporting plate 10. By rotating the connecting rod 62 relative to the base 61, the connecting rod 62 can be unfolded or folded relative to the base 61, thereby adjusting the height of the supporting plate 10. By rotating the supporting plate 10 relative to the connecting rod 62, the inclination angle of the supporting plate 10 can be adjusted.

[0065] It should be noted that there is a preset damping between one end of the connecting rod 62 and the base 61, and between the other end of the connecting rod 62 and the supporting plate 10, so that the folding frame 60 can support the supporting plate 10 on which the electronic device is placed to remain at a position with a preset height and inclination angle. Optionally, both ends of the connecting rod 62 are hinged to the base 61 and the supporting plate 10 through damping shafts 63.

[0066] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation bracket, characterized in that, It includes a supporting plate, a cover plate and a baffle. The cover plate is arranged on the supporting plate. The baffle is slidably matched with the supporting plate in a first direction. One of the cover plate and the baffle has a groove, and the other of the cover plate and the baffle is provided with a positioning protrusion. The positioning protrusion is engaged with the groove. The number of the positioning protrusions and / or the grooves is multiple, and the multiple positioning protrusions and / or the multiple grooves are arranged at intervals in the first direction.

2. The heat dissipation bracket according to claim 1, characterized in that: The supporting plate has a supporting surface and an installation surface which are arranged oppositely. The supporting plate is provided with a movable groove penetrating through the supporting surface and the installation surface. The cover plate is arranged on the supporting surface. The baffle is in sliding contact with the installation surface. The baffle is provided with a slider. The slider penetrates through the movable groove and is slidably arranged between the cover plate and the supporting plate in the first direction. The positioning protrusion or the groove is arranged on the slider.

3. The heat dissipation bracket according to claim 2, characterized in that: The supporting surface has a limiting groove penetrating through the supporting surface. The cover plate is limited in the limiting groove. The movable groove is communicated with the limiting groove. A part of the slider is slidably arranged on the side surface where the limiting groove is located.

4. The heat dissipation bracket according to claim 2, characterized in that: The baffle is provided with two groups of grooves which are distributed at intervals in a second direction. Each group of grooves includes multiple grooves. The number of the sliders is two. The positioning protrusions are arranged on each slider. The positioning protrusions on the two sliders are respectively engaged with at least one groove of the two groups of grooves.

5. The heat dissipation bracket according to any one of claims 1-4, characterized in that: The heat dissipation bracket further includes a heat dissipation component, and the heat dissipation component is arranged on the supporting plate.

6. The heat dissipation bracket according to claim 5, characterized in that: The heat dissipation component includes a housing, a heat conduction member, a semiconductor refrigeration member, a heat dissipation member, an air supply fan and a heat dissipation fan. The housing is provided with a relatively independent cold air channel and a heat dissipation channel. At least a part of the heat conduction member and the air supply fan are both arranged in the cold air channel. The heat dissipation fan and the heat dissipation member are both arranged in the heat dissipation channel. The semiconductor refrigeration member is connected to the heat conduction member and the heat dissipation member.

7. The heat dissipation bracket according to claim 5, characterized in that: The heat dissipation bracket further includes a cooling frame assembly, and the cooling frame assembly forms a cooling groove. The heat dissipation component is used for conveying cold air into the cooling groove.

8. The heat dissipation bracket according to claim 2, characterized in that: The heat dissipation bracket further includes a heat dissipation component, and the heat dissipation component is arranged on the supporting plate; the heat dissipation bracket further includes a cooling frame assembly, and the cooling frame assembly forms a cooling groove. The heat dissipation component is used for conveying cold air into the cooling groove; the supporting plate is provided with a ventilation port penetrating through the supporting surface and the installation surface. The heat dissipation component is arranged on the installation surface and is correspondingly arranged with the ventilation port. The cooling frame assembly is arranged on the installation surface, and the cooling groove is communicated with the ventilation port.

9. The heat dissipation bracket according to claim 7, characterized in that: The cooling frame assembly includes a main frame, a first frame and a second frame. The first frame and the second frame are respectively arranged at two ends of the main frame in the second direction and enclose the cooling groove with the main frame. The first frame and the second frame are both slidably arranged between the main frame and the supporting plate in the second direction.

10. The heat dissipation bracket according to any one of claims 1-4, characterized in that: The heat dissipation bracket further includes a folding frame. The folding frame is connected to the supporting plate and is configured to adjust the height and the inclination angle of the supporting plate.

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