Car lamp LED chip driving module and car lamp system
Through the design of embedding the heat dissipation substrate in the LED chip driving module of the headlights, the problem of high-power heat dissipation of the LED chip is solved, better heat dissipation effect is achieved, and the service life of the LED lights is extended.
Patent Information
- Application Number
- CN202422251521.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-13
AI Technical Summary
The high-power heat dissipation problem of LED chips in existing car lights leads to accelerated aging of LED chips, affecting the stability and service life of the car lights.
A headlight LED chip driver module is designed, and the heating substrate of LED heat dissipation pads and LED driver chips are embedded on the circuit board to achieve thermoelectric separation and improve the heat dissipation effect.
Effectively quickly dissipate heat generated by the headlight LED chip and LED driver chip, improving the stability and service life of the LED headlights.
Smart Images
Figure CN223004848U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of vehicle lamps, and in particular, to a driving module for an LED chip of a vehicle lamp and a vehicle lamp system. Background Art
[0002] With the continuous development of automotive technology, the functions and lighting effects of vehicle lamps have received increasing attention. In existing vehicle lamps, the power of the LED chips used as light sources is getting larger and larger, and the problem of high-power heat dissipation has always existed. Semiconductor components are usually very sensitive to heat. Prolonged heating or excessive heat will cause problems with their stability and service life. If the heat generated by the LED chips in the vehicle lamp cannot be dissipated in time, the LED chips will age rapidly, affecting the overall stability and service life of the vehicle lamp. Summary of the Utility Model
[0003] To solve the above technical problems, the embodiments of the present application provide a driving module for an LED chip of a vehicle lamp and a vehicle lamp system to quickly dissipate the heat generated by the LED chip of the vehicle lamp and the heat generated by the LED driving chip that drives the LED chip of the vehicle lamp to emit light, improve the heat dissipation effect, and improve the stability and service life of the LED vehicle lamp.
[0004] To achieve the above object, the embodiments of the present application provide the following technical solutions:
[0005] A driving module for an LED chip of a vehicle lamp includes a circuit board, an LED pad, and an LED driving chip;
[0006] The LED pad includes an LED positive pad, an LED negative pad, and an LED heat dissipation pad. The LED positive pad and the LED negative pad are embedded in the circuit board. The LED positive pad is used for electrically connecting the positive electrode of the LED chip of the vehicle lamp, the LED negative pad is used for electrically connecting the negative electrode of the LED chip of the vehicle lamp, and the LED heat dissipation pad is used for dissipating heat from the LED chip of the vehicle lamp;
[0007] The LED driving chip includes an LED driving circuit, pins, and a driving heat dissipation pad. The LED driving circuit is electrically connected to the circuit board through a plurality of the pins, and then electrically connected to the LED chip of the vehicle lamp through the LED positive pad and the LED negative pad, and is used for driving the LED chip of the vehicle lamp to emit light; the driving heat dissipation pad is used for dissipating heat from the LED driving circuit;
[0008] At least one of the LED heat dissipation pad and the LED driving chip is embedded in the circuit board through a heat dissipation substrate.
[0009] Optionally, the LED heat dissipation pad is embedded in the circuit board through a first heat dissipation substrate;
[0010] The first heat dissipation substrate is embedded in the circuit board, and the LED heat dissipation pad is embedded in the first heat dissipation substrate.
[0011] Optionally, the orthographic projection area of the first heat dissipation substrate on the plane where the circuit board is located is not less than the orthographic projection area of the LED heat dissipation pad on the plane where the circuit board is located.
[0012] Optionally, the LED driving chip is embedded in the circuit board through a second heat dissipation substrate;
[0013] The second heat dissipation substrate is embedded in the circuit board, and the LED driving chip is embedded in the second heat dissipation substrate.
[0014] Optionally, the driving heat dissipation pad is located on the side of the LED driving circuit close to the circuit board, and the driving heat dissipation pad is embedded in the second heat dissipation substrate.
[0015] Optionally, the orthographic projection area of the second heat dissipation substrate on the plane where the circuit board is located is not less than the orthographic projection area of the driving heat dissipation pad on the plane where the circuit board is located, and is not less than the orthographic projection area of the LED driving circuit on the plane where the circuit board is located.
[0016] Optionally, the heat dissipation substrate is a copper substrate.
[0017] Optionally, there are multiple groups of the LED pads, and there are multiple LED driving chips. One LED driving chip is correspondingly electrically connected to one group of the LED pads;
[0018] The LED heat dissipation pads in at least two groups of the LED pads share one heat dissipation substrate and are embedded in the circuit board.
[0019] Optionally, the circuit board is an FR4 PCB board.
[0020] A vehicle lamp system includes a vehicle lamp LED chip and a vehicle lamp LED chip driving module, and the vehicle lamp LED chip driving module is the vehicle lamp LED chip driving module described in any one of the above.
[0021] Compared with the prior art, the above technical solution has the following advantages:
[0022] The headlight LED chip driving module provided by the embodiment of the present application includes a circuit board, an LED pad, and an LED driving chip. Among them, the LED pad includes an LED positive pad, an LED negative pad, and an LED heat dissipation pad. The LED positive pad and the LED negative pad are embedded in the circuit board. The LED positive pad is used for electrically connecting the positive electrode of the headlight LED chip, the LED negative pad is used for electrically connecting the negative electrode of the headlight LED chip, and the LED heat dissipation pad is used for dissipating heat from the headlight LED chip. The LED driving chip includes an LED driving circuit, pins, and a driving heat dissipation pad. The LED driving circuit is electrically connected to the circuit board through multiple pins, and then is electrically connected to the headlight LED chip through the LED positive pad and the LED negative pad, and is used for driving the headlight LED chip to emit light. The driving heat dissipation pad is used for dissipating heat from the LED driving circuit. Thus, the separation of the LED conductive pads (i.e., the LED positive pad and the LED negative pad) and the LED heat dissipation pad, and the separation of the LED driving circuit and the driving heat dissipation pad are realized, that is, the thermoelectric separation is realized.
[0023] Although the LED heat dissipation pad can dissipate heat from the headlight LED chip and the driving heat dissipation pad can dissipate heat from the LED driving circuit, however, if the LED heat dissipation pad and the LED driving chip are directly embedded in the circuit board, due to the poor heat dissipation performance of the circuit board, and the large power of the headlight LED chip, more heat is generated, so the heat dissipation effect is still not very good, and the loads of the LED heat dissipation pad and the driving heat dissipation pad are large. Based on this, in the headlight LED chip driving module provided by the embodiment of the present application, at least one of the LED heat dissipation pad and the LED driving chip is embedded in the circuit board through a heat dissipation substrate, that is, the LED heat dissipation pad is embedded in the circuit board through a heat dissipation substrate, or the LED driving chip is embedded in the circuit board through a heat dissipation substrate, or, the LED heat dissipation pad is embedded in the circuit board through a heat dissipation substrate, and the LED driving chip is embedded in the circuit board through a heat dissipation substrate. In this way, the heat dissipation substrate can be further used for heat dissipation, which is beneficial to quickly dissipating the heat generated by the headlight LED chip and the heat generated by the LED driving chip for driving the headlight LED chip to emit light, improving the heat dissipation effect, and enhancing the stability and service life of the LED headlight. Description of the Drawings
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0025] Figure 1 It is a top view schematic diagram of a headlight LED chip driving module provided by an embodiment of the present application.
[0026] Reference numerals:
[0027] 10 - Circuit board; 20 - LED pad; 21 - LED positive pad; 22 - LED negative pad; 23 - LED heat dissipation pad; 30 - LED driver chip; 31 - LED drive circuit; 32 - Pin; 33 - Drive heat dissipation pad; 40 - Heat dissipation substrate; 41 - First heat dissipation substrate; 42 - Second heat dissipation substrate. Detailed implementation manners
[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0029] Many specific details are set forth in the following description in order to provide a thorough understanding of the present application, but the present application may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0030] As described in the background art section, the power of the LED chips used as light sources in existing vehicle lights is getting larger and larger, and the problem of high-power heat dissipation has always existed. Semiconductor components are usually very sensitive to heat. Prolonged heating or excessive heat will cause problems with their stability and service life. If the heat generated by the LED chips in the vehicle lights cannot be dissipated in time, the LED chips will age rapidly, affecting the overall stability and service life of the vehicle lights.
[0031] In view of this, the embodiments of the present application provide a driving module for a vehicle light LED chip, Figure 1 showing a top view schematic diagram of a driving module for a vehicle light LED chip provided by the embodiments of the present application, as Figure 1 shown, the driving module for the vehicle light LED chip includes a circuit board 10, an LED pad 20, and an LED driver chip 30.
[0032] Among them, the circuit board 10 can be an FR4 PCB board, that is, a printed circuit board (Printed Circuit Board, abbreviated as PCB) made of FR4 material. FR4 is a code for a flame-retardant material grade, representing a material specification in which the resin material must be able to self-extinguish under combustion conditions. It is not a specific material name but a material grade standard. The FR4 material is mainly composed of materials such as epoxy resin and fiberglass cloth, and is made into a plate-shaped pressed product through processes such as high temperature, high pressure, and hot pressing. This material has high mechanical properties and dielectric properties, good heat resistance and moisture resistance, and excellent electrical insulation properties. The PCB board is a circuit board that fixes electronic components (including active devices and passive devices) on an insulating material substrate through a specific process and realizes electrical connection between components through wires.
[0033] The LED pads 20 include an LED positive pad 21, an LED negative pad 22, and an LED heat dissipation pad 23. The LED positive pad 21 and the LED negative pad 22 are embedded in the circuit board 10. The LED positive pad 21 is used to electrically connect the positive electrode of the vehicle headlight LED chip, and the LED negative pad 22 is used to electrically connect the negative electrode of the vehicle headlight LED chip. The LED heat dissipation pad 23 is used to dissipate heat from the vehicle headlight LED chip, so as to separate the LED conductive pads (that is, the LED positive pad 21 and the LED negative pad 22) from the LED heat dissipation pad 23, realizing thermoelectric separation.
[0034] It should be noted that in this application, "embedded on the circuit board" means fixed and connected to the circuit board. For example, the LED positive pad 21 and the LED negative pad 22 are embedded in the circuit board 10, which means that the LED positive pad 21 and the LED negative pad 22 are fixed and connected to the circuit board. However, this application does not limit the method of embedding on the circuit board. For example, it can be by means of surface mounting on the circuit board, or by setting a groove on the circuit board and then filling it in the groove, or by embedding it in the internal layer or surface layer of the circuit board, etc. As long as it can be fixed and connected to the circuit board, it can be considered as a method of embedding on the circuit board.
[0035] It can be understood that since the LED positive pad 21 and the LED negative pad 22 are embedded in the circuit board 10, the LED positive pad 21 and the LED negative pad 22 are electrically connected to the circuit board 10.
[0036] The LED driving chip 30 includes an LED driving circuit 31, pins 32, and a driving heat dissipation pad 33. The LED driving circuit 31 is electrically connected to the circuit board 10 through a plurality of pins 32. As known above, the LED positive electrode pad 21 and the LED negative electrode pad 22 are embedded on the circuit board 10, so that the LED positive electrode pad 21 and the LED negative electrode pad 22 are electrically connected to the circuit board 10. Furthermore, the LED driving circuit 31 can be electrically connected to the vehicle headlight LED chip through the pins 32, the circuit board 10, and the LED positive electrode pad 21 and the LED negative electrode pad 22 to drive the vehicle headlight LED chip to emit light. And the driving heat dissipation pad 33 is used to dissipate heat from the LED driving circuit 31. In this way, the LED driving circuit 31 and the driving heat dissipation pad 33 are also separated to achieve thermoelectric separation.
[0037] It can be understood that in practical applications, the positive electrode of the LED chip serving as the light source in the vehicle headlight is electrically connected to the LED positive electrode pad 21, and the negative electrode is electrically connected to the LED negative electrode pad 22. Thus, the LED driving circuit 31 drives the LED chip to emit light through the pins 32, the circuit board 10, and the LED positive electrode pad 21 and the LED negative electrode pad 22. At the same time, the LED heat dissipation pad 23 dissipates heat from the vehicle headlight LED chip, and the driving heat dissipation pad 33 dissipates heat from the LED driving circuit 31 to achieve thermoelectric separation.
[0038] However, if the LED heat dissipation pad 23 and the LED driving chip 30 are directly embedded on the circuit board 10, since the heat dissipation performance of the circuit board 10 is poor, and the power of the vehicle headlight LED chip is large and the generated heat is more, therefore, the heat dissipation effect is still not very good, and the loads of the LED heat dissipation pad 23 and the driving heat dissipation pad 33 are large.
[0039] Based on this, as Figure 1 shown, in the vehicle headlight LED chip driving module provided by the embodiment of the present application, at least one of the LED heat dissipation pad 23 and the LED driving chip 30 is embedded on the circuit board 10 through a heat dissipation substrate 40.
[0040] Optionally, as Figure 1 shown, the LED heat dissipation pad 23 is embedded on the circuit board 10 through a first heat dissipation substrate 41, that is, a first heat dissipation substrate 41 is provided between the LED heat dissipation pad 23 and the circuit board 10. Specifically, the first heat dissipation substrate 41 is embedded on the circuit board 10, and the LED heat dissipation pad 23 is embedded on the first heat dissipation substrate 41, that is, the first heat dissipation substrate 41 is fixed and connected to the circuit board 10, and the LED heat dissipation pad 23 is fixed and connected to the first heat dissipation substrate 41. For example, the LED heat dissipation pad 23 can be embedded on the first heat dissipation substrate 41 through thermal adhesive. In this way, the heat on the LED heat dissipation pad 23 can be further dissipated through the first heat dissipation substrate 41 to improve the heat dissipation effect and reduce the load of the LED heat dissipation pad 23.
[0041] In practical applications, a groove for placing the LED heat dissipation pad 23 may be provided on the first heat dissipation substrate 41, and the LED heat dissipation pad 23 is embedded in the groove provided on the first heat dissipation substrate 41, or the LED heat dissipation pad 23 is directly attached to the surface of the first heat dissipation substrate 41. Similarly, the first heat dissipation substrate 41 can be placed in the groove of the circuit board 10 or directly attached to the surface of the circuit board 10.
[0042] At this time, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located may be not less than the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located, that is, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located may be greater than or equal to the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located. Thus, the relatively larger first heat dissipation substrate 41 can be used to more quickly dissipate the heat on the LED heat dissipation pad 23, further improving the heat dissipation effect and reducing the load of the LED heat dissipation pad 23.
[0043] Of course, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located may also be less than the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located. In this way, the first heat dissipation substrate 41 can also appropriately dissipate the heat on the LED heat dissipation pad 23, and similarly, the heat dissipation effect will be improved and the load of the LED heat dissipation pad 23 will be reduced.
[0044] Another alternative is, as Figure 1 shown, the LED driving chip 30 is embedded in the circuit board 10 through the second heat dissipation substrate 42, that is, a second heat dissipation substrate 42 is provided between the LED driving chip 30 and the circuit board 10; specifically, the second heat dissipation substrate 42 is embedded in the circuit board 10, and the LED driving chip 30 is embedded in the second heat dissipation substrate 42, that is, the second heat dissipation substrate 42 is fixed and connected to the circuit board 10, and the LED driving chip 30 is fixed and connected to the second heat dissipation substrate 42. For example, the LED driving chip 30 can be embedded in the second heat dissipation substrate 42 through thermal adhesive; thus, the heat on the LED driving circuit 31 in the LED driving chip 30 can also be quickly dissipated through the second heat dissipation substrate 42, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33 in the LED driving chip 30.
[0045] On this basis, optionally, the driving heat dissipation pad 33 can be located on the side of the LED driving circuit 31 close to the circuit board 10, and the driving heat dissipation pad 33 is embedded in the second heat dissipation substrate 42, that is, the driving heat dissipation pad 33 is fixed and electrically connected to the second heat dissipation substrate 42. In this way, the driving heat dissipation pad 33 is in contact with the second heat dissipation substrate 42 to use the second heat dissipation substrate 42 to quickly dissipate the heat on the driving heat dissipation pad 33, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33.
[0046] In practical applications, the second heat dissipation substrate 42 may be provided with a groove for placing the driving heat dissipation pad 33, and the driving heat dissipation pad 33 is embedded in the groove provided on the second heat dissipation substrate 42, or the driving heat dissipation pad 33 is directly attached to the surface of the second heat dissipation substrate 42. Similarly, the second heat dissipation substrate 42 can be placed in the groove of the circuit board 10, or directly attached to the surface of the circuit board 10.
[0047] Alternatively, the driving heat dissipation pad 33 may also be located on the side of the LED driving circuit 31 away from the circuit board 10. In this way, the LED driving circuit 31 is embedded in the second heat dissipation substrate 42, that is, the LED driving circuit 31 is fixed and connected to the second heat dissipation substrate 42. With this arrangement, the heat generated by the LED driving circuit 31 can be dissipated through the driving heat dissipation pad 33 and the second heat dissipation substrate 42 at the same time, which can also improve the heat dissipation effect and reduce the load on the driving heat dissipation pad 33.
[0048] Further optional, such as Figure 1 As shown, the orthographic projection area of the second heat dissipation substrate 42 on the plane where the circuit board 10 is located can be no less than the orthographic projection area of the driving heat dissipation pad 33 on the plane where the circuit board 10 is located, and no less than the orthographic projection area of the LED driving circuit 31 on the plane where the circuit board 10 is located, so that the second heat dissipation substrate 42 with a relatively large area can be used to dissipate the heat on the LED driving circuit 31 and the driving heat dissipation pad 33 more quickly, further improve the heat dissipation effect, and reduce the load on the driving heat dissipation pad 33.
[0049] Of course, the orthographic projection area of the second heat dissipation substrate 42 on the plane where the circuit board 10 is located can also be smaller than the orthographic projection area of the driving heat dissipation pad 33 on the plane where the circuit board 10 is located, or smaller than the orthographic projection area of the LED driving circuit 31 on the plane where the circuit board 10 is located. In this way, the second heat dissipation substrate 42 can also dissipate the heat generated by the LED driving circuit 31, improve the heat dissipation effect, and reduce the load of the driving heat dissipation pad 33.
[0050] Another option is, Figure 1As shown, the LED heat dissipation pad 23 is embedded on the circuit board 10 through the first heat dissipation substrate 41, that is, the first heat dissipation substrate 41 is arranged between the LED heat dissipation pad 23 and the circuit board 10; specifically, the first heat dissipation substrate 41 is embedded on the circuit board 10, and the LED heat dissipation pad 23 is embedded on the first heat dissipation substrate 41; moreover, the LED driving chip 30 is embedded on the circuit board 10 through the second heat dissipation substrate 42, that is, the second heat dissipation substrate 42 is arranged between the LED driving chip 30 and the circuit board 10; specifically, the second heat dissipation substrate 42 is embedded on the circuit board 10, and the LED driving chip 30 is embedded on the second heat dissipation substrate 42; thus, not only can the heat on the LED heat dissipation pad 23 be further dissipated through the first heat dissipation substrate 41, improving the heat dissipation effect and reducing the load of the LED heat dissipation pad 23, but also the heat on the LED driving circuit 31 in the LED driving chip 30 can be quickly dissipated through the second heat dissipation substrate 42, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33 in the LED driving chip 30.
[0051] Among them, for the case where the LED heat dissipation pad 23 is embedded on the circuit board 10 through the first heat dissipation substrate 41, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located can be set to be not less than the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located, that is, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located is greater than or equal to the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located, so that the heat on the LED heat dissipation pad 23 can be dissipated more quickly by using the relatively large-area first heat dissipation substrate 41, further improving the heat dissipation effect and reducing the load of the LED heat dissipation pad 23.
[0052] For the case where the LED driving chip 30 is embedded on the circuit board 10 through the second heat dissipation substrate 42, the driving heat dissipation pad 33 can be arranged on the side of the LED driving circuit 31 close to the circuit board 10, and the driving heat dissipation pad 33 is embedded on the second heat dissipation substrate 42. In this way, the driving heat dissipation pad 33 is in contact with the second heat dissipation substrate 42 to quickly dissipate the heat on the driving heat dissipation pad 33 by using the second heat dissipation substrate 42, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33; or the driving heat dissipation pad 33 can be arranged on the side of the LED driving circuit 31 away from the circuit board 10, and the LED driving circuit 31 is embedded on the second heat dissipation substrate 42. With this setting, the heat generated by the LED driving circuit 31 is dissipated through both the driving heat dissipation pad 33 and the second heat dissipation substrate 42, which can also improve the heat dissipation effect and reduce the load of the driving heat dissipation pad 33.
[0053] Moreover, for the case where the LED driving chip 30 is embedded in the circuit board 10 through the second heat dissipation substrate 42, it can be set that the orthographic projection area of the second heat dissipation substrate 42 on the plane where the circuit board 10 is located is not less than the orthographic projection area of the driving heat dissipation pad 33 on the plane where the circuit board 10 is located, and not less than the orthographic projection area of the LED driving circuit 31 on the plane where the circuit board 10 is located. Thus, the relatively large-area second heat dissipation substrate 42 can be used to more quickly dissipate the heat on the LED driving circuit 31 and the driving heat dissipation pad 33, further improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33.
[0054] In this application, the heat dissipation substrate 40 can be a copper substrate, that is, both the first heat dissipation substrate 41 and the second heat dissipation substrate 42 can be copper substrates. Since the copper substrate has a fast heat dissipation speed and good heat dissipation performance, the heat dissipation effect can be effectively improved.
[0055] It can be seen that in the headlight LED chip driving module provided by the embodiment of this application, at least one of the LED heat dissipation pad 23 and the LED driving chip 30 is embedded in the circuit board 10 through the heat dissipation substrate 40, that is, the LED heat dissipation pad 23 is embedded in the circuit board 10 through the heat dissipation substrate 40, or the LED driving chip 30 is embedded in the circuit board 10 through the heat dissipation substrate 40, or further, the LED heat dissipation pad 23 is embedded in the circuit board 10 through the heat dissipation substrate 40, and the LED driving chip 30 is embedded in the circuit board 10 through the heat dissipation substrate 40. In this way, the heat dissipation substrate 40 can be further used for heat dissipation, which is beneficial to quickly dissipate the heat generated by the headlight LED chip and the heat generated by the LED driving chip that drives the headlight LED chip to emit light, improving the heat dissipation effect and enhancing the stability and service life of the LED headlight.
[0056] In practical applications, as Figure 1 shown, there are usually multiple groups of LED pads 20, and there are usually multiple LED driving chips 30. One LED driving chip 30 is electrically connected to one group of LED pads 20.
[0057] When the LED heat dissipation pads 23 in each group of LED pads 20 are embedded on the circuit board 10 through the first heat dissipation substrate 41, optionally, each LED heat dissipation pad 23 in each group of LED pads 20 can correspond to a first heat dissipation substrate 41. In this way, the orthographic projection area of the first heat dissipation substrate 41 corresponding to each LED heat dissipation pad 23 on the plane where the circuit board 10 is located only needs to be larger than the orthographic projection area of the corresponding LED heat dissipation pad 23 on the plane where the circuit board 10 is located, which can save the cost of the first heat dissipation substrate 41; Another option is that the LED heat dissipation pads 23 in at least two groups of LED pads 20 can share a heat dissipation substrate 40 (that is, share a first heat dissipation substrate 41) and be embedded on the circuit board 10. In this way, the orthographic projection area of the first heat dissipation substrate 41 shared by the LED heat dissipation pads 23 in at least two groups of LED pads 20 on the plane where the circuit board 10 is located is relatively large, and the heat dissipation effect is better, but the cost is also relatively high.
[0058] When each LED driving chip 30 is embedded on the circuit board 10 through the second heat dissipation substrate 42, since each LED driving chip 30 needs to be electrically connected to the circuit board 10 through the pin 32, therefore, the second heat dissipation substrate 42 corresponding to each LED driving chip 30 is suitable for being independently arranged.
[0059] Similarly, since the LED positive pads 21 and the LED negative pads 22 in each group of LED pads 20 need to be electrically connected to the circuit board 10, therefore, the LED heat dissipation pads 23 and the LED driving chips 30 in the LED pads 20 are also suitable for independently arranging the heat dissipation substrates 40, that is, the first heat dissipation substrate 41 and the second heat dissipation substrate 42 are independently arranged from each other.
[0060] Correspondingly, the embodiment of the present application further provides a vehicle lamp system, which includes a vehicle lamp LED chip and a vehicle lamp LED chip driving module, and the vehicle lamp LED chip driving module is the vehicle lamp LED chip driving module provided in any of the above embodiments.
[0061] As known from the foregoing, the vehicle lamp LED chip driving module includes a circuit board 10, LED pads 20, and LED driving chips 30.
[0062] Among them, the LED pads 20 include an LED positive pad 21, an LED negative pad 22, and an LED heat dissipation pad 23. The LED positive pad 21 and the LED negative pad 22 are embedded on the circuit board 10. The LED positive pad 21 is used to electrically connect the positive electrode of the vehicle lamp LED chip, and the LED negative pad 22 is used to electrically connect the negative electrode of the vehicle lamp LED chip. The LED heat dissipation pad 23 is used to dissipate heat from the vehicle lamp LED chip, so as to separate the LED conductive pads (that is, the LED positive pad 21 and the LED negative pad 22) from the LED heat dissipation pad 23, realizing thermoelectric separation.
[0063] The LED driving chip 30 includes an LED driving circuit 31, pins 32 and a driving heat dissipation pad 33. The LED driving circuit 31 is electrically connected to the circuit board 10 through a plurality of pins 32. As known above, the LED positive electrode pad 21 and the LED negative electrode pad 22 are embedded in the circuit board 10, so that the LED positive electrode pad 21 and the LED negative electrode pad 22 are electrically connected to the circuit board 10. Furthermore, the LED driving circuit 31 can be electrically connected to the headlight LED chip through the pins 32, the circuit board 10, and the LED positive electrode pad 21 and the LED negative electrode pad 22 to drive the headlight LED chip to emit light. And the driving heat dissipation pad 33 is used to dissipate heat from the LED driving circuit 31. In this way, the LED driving circuit 31 and the driving heat dissipation pad 33 are also separated to achieve thermoelectric separation.
[0064] By setting at least one of the LED heat dissipation pad 23 and the LED driving chip 30 to be embedded in the circuit board 10 through the heat dissipation substrate 40, that is, the LED heat dissipation pad 23 is embedded in the circuit board 10 through the heat dissipation substrate 40, or the LED driving chip 30 is embedded in the circuit board 10 through the heat dissipation substrate 40, or further, the LED heat dissipation pad 23 is embedded in the circuit board 10 through the heat dissipation substrate 40 and the LED driving chip 30 is embedded in the circuit board 10 through the heat dissipation substrate 40. In this way, the heat dissipation substrate 40 can be further used for heat dissipation, which is beneficial to quickly dissipate the heat generated by the headlight LED chip and the heat generated by the LED driving chip that drives the headlight LED chip to emit light, improve the heat dissipation effect, and improve the stability and service life of the LED headlight.
[0065] Optionally, the LED heat dissipation pad 23 is embedded in the circuit board 10 through the first heat dissipation substrate 41. Specifically, the first heat dissipation substrate 41 is embedded in the circuit board 10, and the LED heat dissipation pad 23 is embedded in the first heat dissipation substrate 41, that is, the first heat dissipation substrate 41 is fixed and connected to the circuit board 10, and the LED heat dissipation pad 23 is fixed and connected to the first heat dissipation substrate 41. For example, the LED heat dissipation pad 23 can be embedded in the first heat dissipation substrate 41 through thermal adhesive. In this way, the heat on the LED heat dissipation pad 23 can be further dissipated through the first heat dissipation substrate 41, improve the heat dissipation effect, and reduce the load of the LED heat dissipation pad 23.
[0066] Another optional way is that the LED driving chip 30 is embedded on the circuit board 10 through the second heat dissipation substrate 42. Specifically, the second heat dissipation substrate 42 is embedded on the circuit board 10, and the LED driving chip 30 is embedded on the second heat dissipation substrate 42. That is, the second heat dissipation substrate 42 is fixed and connected to the circuit board 10, and the LED driving chip 30 is fixed and connected to the second heat dissipation substrate 42. For example, the LED driving chip 30 can be embedded on the second heat dissipation substrate 42 through thermal adhesive. In this way, the heat on the LED driving circuit 31 in the LED driving chip 30 can also be quickly dissipated through the second heat dissipation substrate 42, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33 in the LED driving chip 30.
[0067] Yet another optional way is that the LED heat dissipation pad 23 is embedded on the circuit board 10 through the first heat dissipation substrate 41. Specifically, the first heat dissipation substrate 41 is embedded on the circuit board 10, and the LED heat dissipation pad 23 is embedded on the first heat dissipation substrate 41. And the LED driving chip 30 is embedded on the circuit board 10 through the second heat dissipation substrate 42. Specifically, the second heat dissipation substrate 42 is embedded on the circuit board 10, and the LED driving chip 30 is embedded on the second heat dissipation substrate 42. In this way, not only can the heat on the LED heat dissipation pad 23 be further dissipated through the first heat dissipation substrate 41, improving the heat dissipation effect and reducing the load of the LED heat dissipation pad 23, but also the heat on the LED driving circuit 31 in the LED driving chip 30 can be quickly dissipated through the second heat dissipation substrate 42, improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33 in the LED driving chip 30.
[0068] Among them, for the case where the LED heat dissipation pad 23 is embedded on the circuit board 10 through the first heat dissipation substrate 41, it can be set that the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located is not less than the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located, that is, the orthographic projection area of the first heat dissipation substrate 41 on the plane where the circuit board is located is greater than or equal to the orthographic projection area of the LED heat dissipation pad 23 on the plane where the circuit board is located. Thus, the heat on the LED heat dissipation pad 23 can be dissipated more quickly by using the relatively larger first heat dissipation substrate 41, further improving the heat dissipation effect and reducing the load of the LED heat dissipation pad 23.
[0069] For the case where the LED driving chip 30 is embedded in the circuit board 10 through the second heat dissipation substrate 42, the driving heat dissipation pad 33 can be arranged on the side of the LED driving circuit 31 close to the circuit board 10, and the driving heat dissipation pad 33 is embedded in the second heat dissipation substrate 42. In this way, the driving heat dissipation pad 33 is in contact with the second heat dissipation substrate 42, so as to use the second heat dissipation substrate 42 to quickly dissipate the heat on the driving heat dissipation pad 33, improve the heat dissipation effect, and reduce the load of the driving heat dissipation pad 33. It is also possible to arrange the driving heat dissipation pad 33 on the side of the LED driving circuit 31 away from the circuit board 10, and the LED driving circuit 31 is embedded in the second heat dissipation substrate 42. With this arrangement, the heat generated by the LED driving circuit 31 is dissipated through both the driving heat dissipation pad 33 and the second heat dissipation substrate 42, which can also improve the heat dissipation effect and reduce the load of the driving heat dissipation pad 33.
[0070] Moreover, for the case where the LED driving chip 30 is embedded in the circuit board 10 through the second heat dissipation substrate 42, it can be set that the orthographic projection area of the second heat dissipation substrate 42 on the plane where the circuit board 10 is located is not less than the orthographic projection area of the driving heat dissipation pad 33 on the plane where the circuit board 10 is located, and not less than the orthographic projection area of the LED driving circuit 31 on the plane where the circuit board 10 is located. Thus, the relatively larger second heat dissipation substrate 42 can be used to more quickly dissipate the heat on the LED driving circuit 31 and the driving heat dissipation pad 33, further improving the heat dissipation effect and reducing the load of the driving heat dissipation pad 33.
[0071] In this application, the heat dissipation substrate 40 can be a copper substrate, that is, both the first heat dissipation substrate 41 and the second heat dissipation substrate 42 can be copper substrates. Since the copper substrate has a fast heat dissipation speed and good heat dissipation performance, the heat dissipation effect can be effectively improved.
[0072] In this specification, each part is described in a combined way of parallel and progressive. The key point of each part is to illustrate the differences from other parts. For the same or similar parts among each part, reference can be made to each other.
[0073] For the above description of the disclosed embodiments, the features recorded in each embodiment in this specification can be mutually replaced or combined, enabling those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A car light LED chip driver module, characterized in that: Including circuit board, LED pad and LED driver chip; The LED pads include an LED positive pad, an LED negative pad and an LED heat dissipation pad, the LED positive pad and the LED negative pad are embedded in the circuit board, the LED positive pad is used to electrically connect the positive electrode of the headlight LED chip, the LED negative pad is used to electrically connect the negative electrode of the headlight LED chip, and the LED heat dissipation pad is used to dissipate heat for the headlight LED chip; The LED driver chip comprises an LED driver circuit, pins and a driver heat dissipation pad. The LED driver circuit is electrically connected to the circuit board through a plurality of the pins, and further electrically connected to the headlight LED chip through the LED positive pad and the LED negative pad, so as to drive the headlight LED chip to emit light; the driver heat dissipation pad is used to dissipate heat from the LED driver circuit; At least one of the LED heat dissipation pad and the LED driving chip is embedded in the circuit board through a heat dissipation substrate.
2. The vehicle light LED chip driving module according to claim 1, characterized in that: The LED heat dissipation pad is embedded in the circuit board through a first heat dissipation substrate; The first heat dissipation substrate is embedded in the circuit board, and the LED heat dissipation pad is embedded in the first heat dissipation substrate.
3. The vehicle light LED chip driving module according to claim 2, characterized in that: The orthographic projection area of the first heat dissipation substrate on the plane where the circuit board is located is not less than the orthographic projection area of the LED heat dissipation pad on the plane where the circuit board is located.
4. The vehicle light LED chip driving module according to claim 1, characterized in that: The LED driver chip is embedded in the circuit board through a second heat dissipation substrate; The second heat dissipation substrate is embedded in the circuit board, and the LED driving chip is embedded in the second heat dissipation substrate.
5. The vehicle light LED chip driving module according to claim 4, characterized in that: The driving heat dissipation pad is located at a side of the LED driving circuit close to the circuit board, and the driving heat dissipation pad is embedded in the second heat dissipation substrate.
6. The vehicle light LED chip driving module according to claim 4 or 5, characterized in that: The orthographic projection area of the second heat dissipation substrate on the plane where the circuit board is located is not less than the orthographic projection area of the driving heat dissipation pad on the plane where the circuit board is located, and is not less than the orthographic projection area of the LED driving circuit on the plane where the circuit board is located.
7. The vehicle light LED chip driving module according to claim 1, characterized in that: The heat dissipation substrate is a copper substrate.
8. The vehicle light LED chip driving module according to claim 1, characterized in that: There are multiple groups of LED pads, there are multiple LED driver chips, and one LED driver chip is electrically connected to one group of LED pads; The LED heat dissipation pads in at least two groups of the LED pads share a heat dissipation substrate embedded in the circuit board.
9. The vehicle light LED chip driving module according to claim 1, characterized in that: The circuit board is a FR4 PCB board.
10. A vehicle lighting system, characterized in that: It comprises a car light LED chip and a car light LED chip driving module, wherein the car light LED chip driving module is the car light LED chip driving module according to any one of claims 1 to 9.