Refrigerating system and testing equipment

Abstract

The utility model relates to a refrigerating system and testing equipment, a high-temperature-stage refrigerating module of the refrigerating system comprises an intermediate heat exchanger, a throttling branch and a throttling part, a high-temperature-stage loop comprises a first flow path located between a condenser and a first expansion valve, and the throttling branch communicates between the condenser and the air suction end of a first compressor; the throttling part is arranged on the throttling branch and used for throttling and cooling the refrigerant flowing through the throttling branch and controlling on-off of the throttling branch. The first flow path and the throttling branch exchange heat through the intermediate heat exchanger, the refrigerant of the throttling branch flows upwards, and the intermediate heat exchanger is located on the downstream of the throttling part. According to the technical scheme, when the environment temperature is high, under the condition that energy consumption is not increased, the refrigerating effect of the whole refrigerating system can be improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor test equipment, particularly to a refrigeration system and a test equipment. Background Art

[0002] Refrigeration systems are divided into single-stage refrigeration and multi-stage refrigeration. Multi-stage refrigeration can provide a lower refrigeration temperature compared to single-stage refrigeration. Two-stage refrigeration systems are widely used in semiconductor test equipment. A two-stage refrigeration system includes a high-temperature stage circuit and a low-temperature stage circuit. The refrigerant in the high-temperature stage circuit cools the refrigerant in the low-temperature stage circuit and can provide a lower refrigeration temperature to the outside through a load evaporator on the low-temperature stage circuit.

[0003] After the refrigerant on the high-temperature stage circuit is discharged from the high-temperature stage compressor, it will be cooled at the condenser. If the ambient temperature is too high, especially for an air-cooled condenser, it is difficult for the refrigerant to reach the required condensation temperature when flowing through the condenser. The temperature and pressure of the refrigerant discharged from the condenser are relatively high. The subsequent throttling and cooling and pressure reduction effect of the high-temperature stage expansion valve is not obvious, and the refrigeration capacity of the refrigerant decreases, resulting in poor refrigeration effect of the entire refrigeration system. If the refrigeration effect is to be improved, it is necessary to increase the condensation capacity of the condenser, increasing energy consumption, which is not conducive to energy conservation. Summary of the Utility Model

[0004] Based on this, this application provides a refrigeration system and a test equipment, which helps to improve the refrigeration effect of the refrigeration system and reduce the refrigeration energy consumption.

[0005] In the first aspect, an embodiment of this application provides a refrigeration system, which includes:

[0006] A high-temperature stage refrigeration module, including a first compressor, a condenser, and a first expansion valve that are sequentially located in the high-temperature stage circuit;

[0007] A low-temperature stage refrigeration module, including a second compressor, a second expansion valve, and a load evaporator that are sequentially located in the low-temperature stage circuit;

[0008] An evaporative condenser, the high-temperature stage circuit between the first expansion valve and the suction end of the first compressor exchanges heat with the low-temperature stage circuit between the discharge end of the second compressor and the second expansion valve via the evaporative condenser;

[0009] Among them, the high-temperature stage refrigeration module further includes an intermediate heat exchanger, a throttle branch, and a throttling section. The high-temperature stage circuit includes a first flow path between the condenser and the first expansion valve. The throttle branch is connected between the condenser and the suction end of the first compressor. The throttling section is provided in the throttle branch for throttling and cooling the refrigerant flowing through the throttle branch and controlling the on-off of the throttle branch. The first flow path and the throttle branch exchange heat through the intermediate heat exchanger, and in the refrigerant flow direction of the throttle branch, the intermediate heat exchanger is located downstream of the throttling section.

[0010] In some embodiments, the high-temperature stage refrigeration module further includes a temperature sensor for detecting the temperature of the refrigerant flowing to the throttling section;

[0011] The detection result of the temperature sensor is used to instruct the throttling section to control the on-off of the throttle branch.

[0012] In some embodiments, the high-temperature stage refrigeration module further includes a liquid receiver provided in the first flow path and located between the condenser and the intermediate heat exchanger. The temperature sensor is provided on the outlet side of the liquid receiver;

[0013] The throttle branch is connected to the condenser through the liquid receiver.

[0014] In some embodiments, the high-temperature stage circuit further includes a second flow path between the first expansion valve and the suction end of the first compressor. The second flow path passes through the evaporation condenser, and a first control valve is provided upstream of the evaporation condenser;

[0015] The high-temperature stage refrigeration module further includes a bypass branch connected in parallel with the second flow path and passing through the load evaporator, and a second control valve is provided upstream of the load evaporator;

[0016] The first control valve and the second control valve are not opened simultaneously.

[0017] In some embodiments, the low-temperature stage circuit includes a third flow path between the evaporation condenser and the load evaporator, and a fourth flow path between the load evaporator and the suction end of the second compressor;

[0018] The low-temperature stage refrigeration module further includes a regenerator. The third flow path and the fourth flow path exchange heat through the regenerator. On the third flow path, the second expansion valve is located downstream of the regenerator.

[0019] In some embodiments, the condenser includes a high-temperature stage condensation pipeline and a low-temperature stage condensation pipeline that are independently arranged. The high-temperature stage loop passes through the high-temperature stage condensation pipeline, and the low-temperature stage loop passes through the low-temperature stage condensation pipeline. Moreover, the low-temperature stage condensation pipeline is located between the evaporative condenser and the exhaust end of the second compressor.

[0020] In some embodiments, the heat exchange area of the high-temperature stage condensation pipeline is larger than that of the low-temperature stage condensation pipeline.

[0021] In some embodiments, the condenser is an air-cooled condenser.

[0022] In some embodiments, the refrigeration system further includes a secondary refrigerant cooling module. The secondary refrigerant cooling module includes a secondary refrigerant flow path for connecting to a test terminal to jointly form a secondary refrigerant circulation loop. The secondary refrigerant flow path passes through the load evaporator.

[0023] In some embodiments, the secondary refrigerant cooling module further includes a heater. The heater is arranged on the secondary refrigerant flow path and is used to heat the secondary refrigerant flowing out of the load evaporator.

[0024] In a second aspect, the present application provides a test device, including a test terminal and the refrigeration system described in any of the above embodiments. The refrigeration system is used to regulate the temperature of the test terminal.

[0025] In the above refrigeration system and test device, when the ambient temperature is too high, the throttling part conducts the throttling branch. At this time, after the high-temperature and high-pressure gaseous refrigerant discharged by the first compressor is condensed and cooled in the condenser to become a medium-temperature and high-pressure liquid refrigerant, it is split into the first flow path and the throttling branch. When flowing through the throttling branch, the medium-temperature and high-pressure liquid refrigerant is throttled, cooled, and depressurized by the throttling part, and then exchanges heat with the medium-temperature and high-pressure liquid refrigerant flowing through the first flow path in the intermediate heat exchanger, so that the temperature and pressure of the refrigerant on the first flow path drop when passing through the intermediate heat exchanger, that is, the refrigerant is precooled before entering the first expansion valve, improving the throttling expansion effect of the first expansion valve, reducing the flash gas generated by the sudden pressure drop of the refrigerant during the throttling expansion process, and thus enabling the refrigerant to generate more cooling capacity when flowing through the evaporative condenser, improving the refrigeration effect of the entire refrigeration system without increasing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. Moreover, in all the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0027] Figure 1Schematic diagram of a refrigeration system according to an embodiment of the present application.

[0028] Figure 2 Schematic diagram of a refrigeration system according to another embodiment of the present application.

[0029] Figure 3 Schematic diagram of a refrigeration system according to still another embodiment of the present application.

[0030] Figure 4 Schematic structural diagram of a condenser according to an embodiment of the present application.

[0031] Figure 5 is Figure 4 side view of the condenser shown.

[0032] Reference numerals in the accompanying drawings in the specific embodiments are as follows:

[0033] 100, refrigeration system; 10, high-temperature stage refrigeration module; 10G, high-temperature stage circuit; G1, first flow path; G2, second flow path; 10J, throttle branch; 10P, bypass branch; K1, first control valve; K2, second control valve; 11, first compressor; 12, condenser; 12a, high-temperature stage condensing pipeline; 12b, low-temperature stage condensing pipeline; 13, first expansion valve; 14, intermediate heat exchanger; 15, throttle section; 16, temperature sensor; 17, liquid receiver; 20, low-temperature stage refrigeration module; 20D, low-temperature stage circuit; D1, third flow path; D2, fourth flow path; 21, second compressor; 22, second expansion valve; 23, load evaporator; 24, regenerator; 30, evaporative condenser; 40, secondary coolant cooling module; 40Z, secondary coolant flow path; 41, heater; 42, circulation pump; 43, liquid storage tank. Specific embodiments

[0034] To make the above objects, features, and advantages of the present application more obvious and understandable, the following describes the specific embodiments of the present application in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0035] In the description of the present application, it should be understood that if present, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0036] In addition, if present, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0037] In the present application, unless otherwise clearly specified and limited, if present, the terms "mounted", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, if present, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0039] It should be noted that if it appears, when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.

[0040] In view of the problems mentioned in the background art, the embodiment of the present application first provides a refrigeration system.

[0041] Referring to Figure 1 , the refrigeration system 100 provided by the embodiment of the present application includes a high-temperature stage refrigeration module 10, a low-temperature stage refrigeration module 20, and an evaporative condenser 30. The high-temperature stage refrigeration module 10 includes a first compressor 11, a condenser 12, and a first expansion valve 13 that are sequentially located in the high-temperature stage loop 10G. The low-temperature stage refrigeration module 20 includes a second compressor 21, a second expansion valve 22, and a load evaporator 23 that are sequentially located in the low-temperature stage loop 20D. The high-temperature stage loop 10G located between the first expansion valve 13 and the suction end of the first compressor 11 exchanges heat with the low-temperature stage loop 20D located between the discharge end of the second compressor 21 and the second expansion valve 22 via the evaporative condenser 30.

[0042] Specifically, the condenser 12 can be a water-cooled condenser, an air-cooled condenser, etc. The load evaporator 23 can be selected to exchange heat with an external structure. The evaporative condenser 30 is located in both the high-temperature stage loop 10G and the low-temperature stage loop 20D. The evaporative condenser 12 usually includes two heat exchange flow paths inside. One heat exchange flow path is connected between the first expansion valve 13 and the suction end of the first compressor 11 and is located on the high-temperature stage loop 10G; the other heat exchange flow path is connected between the discharge end of the second compressor 21 and the second expansion valve 22 and is located on the low-temperature stage loop 20D.

[0043] Among them, the high-temperature stage refrigeration module 10 further includes an intermediate heat exchanger 14, a throttle branch 10J, and a throttle part 15. The high-temperature stage loop 10G includes a first flow path G1 located between the condenser 12 and the first expansion valve 13. The throttle branch 10J communicates between the condenser 12 and the suction end of the first compressor 11. The throttle part 15 is provided in the throttle branch 10J for throttling and cooling the refrigerant flowing through the throttle branch 10J and controlling the on-off of the throttle branch 10J. The first flow path G1 and the throttle branch 10J exchange heat via the intermediate heat exchanger 14, and in the refrigerant flow direction of the throttle branch 10J, the intermediate heat exchanger 14 is located downstream of the throttle part 15.

[0044] Specifically, the intermediate heat exchanger 14 can be, but is not limited to, a plate heat exchanger, which is located in both the throttling branch 10J and the first flow path G1. The throttling section 15 can be a throttle valve, which not only has the function of throttling and cooling, but also can open and close the throttling branch 10J. Of course, the throttling section 15 can also be composed of a solenoid valve and a capillary tube. The capillary tube plays a role in throttling and cooling, and the solenoid valve is used to control the opening and closing of the throttling branch 10J.

[0045] For the convenience of description, the refrigerant generated by the high-temperature stage refrigeration module 10 is called the primary refrigerant, and the refrigerant generated by the low-temperature stage refrigeration module 20 is called the secondary refrigerant.

[0046] In actual application, the refrigeration system 100 can have multiple working modes. When the ambient temperature is normal, the refrigeration system 100 can be in the first working mode, and both the first compressor 11 and the second compressor 21 are started, and the throttling section 15 cuts off the throttling branch 10J. At this time, in the high-temperature stage loop 10G, after the high-temperature and high-pressure gaseous primary refrigerant is output from the exhaust end of the first compressor 11, it is first cooled by the condenser 12 to become a medium-temperature and high-pressure liquid primary refrigerant, and then expanded and cooled by the first expansion valve 13 to become a low-temperature and low-pressure liquid primary refrigerant. At the same time, the high-temperature and high-pressure gaseous secondary refrigerant discharged by the second compressor 21 exchanges heat with the low-temperature and low-pressure liquid primary refrigerant in the evaporation condenser 30. The primary refrigerant absorbs heat and evaporates into a low-temperature and low-pressure gaseous primary refrigerant, and the high-temperature and high-pressure gaseous secondary refrigerant is cooled to become a medium-temperature and high-pressure liquid secondary refrigerant, and then expanded and cooled by the second expansion valve 22 to become a low-temperature and low-pressure liquid secondary refrigerant, and absorbs heat from the outside in the load evaporator 23 to be refrigerated into a low-temperature and low-pressure gaseous secondary refrigerant. Finally, the low-temperature and low-pressure gaseous primary refrigerant returns to the first compressor 11, is compressed into a high-temperature and high-pressure gaseous primary refrigerant and then re-output, and so on. Finally, the low-temperature and low-pressure gaseous secondary refrigerant returns to the second compressor 21, is compressed into a high-temperature and high-pressure gaseous secondary refrigerant and then re-output, and so on.

[0047] When the ambient temperature is too high, the refrigeration system 100 can be in the second working mode, both the first compressor 11 and the second compressor 21 are started, and the throttling part 15 conducts the throttling branch 10J. At this time, the medium-temperature and high-pressure liquid primary refrigerant flowing out of the condenser 12 is split into the first flow path G1 and the throttling branch 10J. When flowing through the throttling branch 10J, the medium-temperature and high-pressure liquid primary refrigerant is throttled, cooled, and depressurized by the throttling part 15, and then exchanges heat with the medium-temperature and high-pressure liquid primary refrigerant flowing through the first flow path G1 in the intermediate heat exchanger 14, so that the temperature and pressure of the primary refrigerant on the first flow path G1 decrease when passing through the intermediate heat exchanger 14, that is, pre-cooling is performed on the primary refrigerant before it enters the first expansion valve 13, improving the throttling expansion effect of the first expansion valve 13, reducing the content of flash gas generated due to the sudden pressure drop during the throttling expansion process of the primary refrigerant, enabling the primary refrigerant to generate more cooling capacity when flowing through the evaporative condenser 30, and improving the refrigeration effect of the entire refrigeration system 100 without increasing energy consumption.

[0048] Moreover, after the primary refrigerant entering the throttling branch 10J is throttled by the throttling part 15, it can absorb heat and gasify at the intermediate heat exchanger 14, and the gasified primary refrigerant flows back to the first compressor 11, which can ensure the gas return volume of the first compressor 11.

[0049] Among them, regarding the judgment of whether the ambient temperature is too high, a temperature sensing structure can be set outside the refrigeration system 100 to sense the ambient temperature. If the ambient temperature is higher than the set temperature, it means it is too high, and then the throttling part 15 is controlled to switch to the state of conducting the throttling branch 10J. If the ambient temperature does not exceed the set temperature, it means it is normal, and then the throttling part 15 is controlled to switch to the state of cutting off the throttling branch 10J. Of course, the following method can also be adopted to control the state switching of the throttling part 15.

[0050] In some embodiments, referring to Figure 1 , the high-temperature stage refrigeration module 10 further includes a temperature sensor 16, and the temperature sensor 16 is used to detect the temperature of the refrigerant flowing to the throttling part 15. The detection result of the temperature sensor 16 is used to instruct the throttling part 15 to control the on-off of the throttling branch 10J.

[0051] Specifically, the temperature sensor 16 can be set on the outlet pipeline of the condenser 12 to detect the temperature of the refrigerant flowing to the throttling branch 10J. When the refrigerant temperature exceeds the set value, it means that the condensation of the condenser 12 is insufficient, and then the throttling part 15 is controlled to switch to the state of conducting the throttling branch 10J. When the refrigerant temperature does not exceed the set value, it means that the condensation of the condenser 12 is sufficient, and then the throttling part 15 is controlled to switch to the state of cutting off the throttling branch 10J.

[0052] At this time, by directly sensing the refrigerant temperature with the temperature sensor 16, the condensation degree of the refrigerant can be directly fed back, and the control is more accurate.

[0053] Specifically in the embodiments, referring to Figure 1 , the high-temperature stage refrigeration module 10 further includes a liquid reservoir 17. The liquid reservoir 17 is arranged in the first flow path G1 and is located between the condenser 12 and the intermediate heat exchanger 14. The temperature sensor 16 is arranged on the outlet side of the liquid reservoir 17. The throttle branch 10J communicates with the condenser 12 via the liquid reservoir 17.

[0054] The liquid reservoir 17 can be used to store the refrigerant and is used to adjust the refrigerant circulation flow of the high-temperature stage loop 10G. The use of the liquid reservoir 17 is a conventional means in the art. The liquid reservoir 17 is arranged on the first flow path G1 between the condenser 12 and the intermediate heat exchanger 14. The refrigerant of the throttle branch 10J comes from the liquid reservoir 17, and the temperature sensor 16 is arranged on the outlet side of the liquid reservoir 17. The temperature sensor 16 senses the refrigerant temperature on the outlet side of the liquid reservoir 17, and the on-off of the throttle part 15 can be controlled according to the refrigerant temperature.

[0055] In some embodiments, referring to Figure 2 , the high-temperature stage loop 10G further includes a second flow path G2 located between the first expansion valve 13 and the suction end of the first compressor 11. The second flow path G2 passes through the evaporative condenser 30, and a first control valve K1 is arranged upstream of the evaporative condenser 30. The high-temperature stage refrigeration module 10 further includes a bypass branch 10P. The bypass branch 10P is arranged in parallel with the second flow path G2 and passes through the load evaporator 23, and a second control valve K2 is arranged upstream of the load evaporator 23. The first control valve K1 and the second control valve K2 are not opened simultaneously.

[0056] When the refrigeration system 100 is in the first working mode, the first compressor 11 and the second compressor 21 are both started, the first control valve K1 is opened, and the second control valve K2 is closed. The high-temperature stage loop 10G and the low-temperature stage loop 20D are both conducted. At this time, the refrigeration system 100 can exchange heat with the outside through the load evaporator 23 on the low-temperature stage loop 20D, and the refrigeration effect of the refrigeration system 100 is stronger, which is suitable for the situation with a higher refrigeration demand (such as reducing to a lower test temperature).

[0057] In actual application, the refrigeration system 100 can also have a third working mode. In the third working mode, the first compressor 11 is started, the second compressor 21 is stopped, the first control valve K1 is closed, and the second control valve K2 is opened. At this time, the low-temperature stage refrigeration module 20 is not used, and the refrigerant in the load evaporator 23 is provided by the second compressor 21 via the bypass branch 10P. The refrigerant temperature in the load evaporator 23 is relatively high, and the refrigeration effect of the refrigeration system 100 is weaker than that in the first working mode, which can be suitable for the situation with a general refrigeration demand (such as reducing to a higher test temperature). Since the second compressor 21 is not started, the energy consumption can be reduced, and an energy-saving effect is achieved.

[0058] At this time, the refrigeration system 100 can switch between different working modes according to different refrigeration demands. When the refrigeration demand is low, the second compressor 21 is not enabled, and only the first compressor 11 is enabled to provide refrigerant for the load evaporator 23. The refrigeration system 100 consumes less energy and is more energy-efficient.

[0059] In some embodiments, referring to Figure 1 and Figure 2 , the low-temperature stage circuit 20D includes a third flow path D1 located between the evaporation condenser 30 and the load evaporator 23, and a fourth flow path D2 located between the load evaporator 23 and the suction end of the second compressor 21. The low-temperature stage refrigeration module 20 further includes a regenerator 24, and the third flow path D1 and the fourth flow path D2 exchange heat through the regenerator 24. On the third flow path D1, the second expansion valve 22 is located downstream of the regenerator 24.

[0060] In practical applications, the high-temperature and high-pressure gaseous secondary refrigerant discharged from the second compressor 21 is condensed at the evaporation condenser 30 to form a medium-temperature and high-pressure liquid secondary refrigerant. The medium-temperature and high-pressure liquid secondary refrigerant exchanges heat with the low-temperature and low-pressure gaseous secondary refrigerant discharged from the load evaporator 23 in the regenerator 24 and is pre-cooled. After throttling by the second expansion valve 22 and cooling down again, it is in a subcooled state. The subcooled secondary refrigerant can provide more refrigeration capacity in the load evaporator 23, improving the refrigeration efficiency of the refrigeration system. Moreover, the secondary refrigerant discharged from the evaporation condenser 30 can heat the secondary refrigerant flowing to the second compressor 21 in the regenerator 24 to make it superheated, increasing the gas-phase content of the refrigerant flowing back to the second compressor 21 and reducing the risk of liquid hammer in the second compressor 21.

[0061] In some embodiments, referring to Figure 4 and Figure 5 , and in combination with Figures 1 to 3 , the condenser 12 includes a separately provided high-temperature stage condensing pipeline 12a and a low-temperature stage condensing pipeline 12b. The high-temperature stage circuit 10G passes through the high-temperature stage condensing pipeline 12a, and the low-temperature stage circuit 20D passes through the low-temperature stage condensing pipeline 12b. Moreover, the low-temperature stage condensing pipeline 12b is located between the evaporation condenser 30 and the exhaust end of the second compressor 21.

[0062] In other words, the high-temperature stage circuit 10G and the low-temperature stage circuit 20D share the condenser 12. The secondary refrigerant discharged from the second compressor 21 first flows through the low-temperature stage condensing pipeline 12b in the condenser 12 and is condensed and cooled down, and then is cooled down again at the evaporation condenser 30. In this way, the heat load at the evaporation condenser 30 can be reduced, thereby reducing the exhaust volume of the first compressor 11 in the high-temperature stage circuit 10G and lowering the power requirement for the first compressor 11, which helps to reduce the cost of the refrigeration system 100.

[0063] Moreover, the high-temperature circuit 10G and the low-temperature circuit 20D share the condenser 12, reducing the number of condensers 12 used, which can further reduce the cost of the refrigeration system 100.

[0064] Further in the embodiment, the heat exchange area of the high-temperature condensation pipeline 12a is larger than that of the low-temperature condensation pipeline 12b. Specifically, the heat exchange area of the high-temperature condensation pipeline 12a can be increased by controlling the number of arrangement columns. The more the number of arrangement columns, the longer the pipeline length, the larger the heat exchange area, and the higher the heat exchange efficiency. Since the secondary refrigerant in the low-temperature circuit 20D can be condensed and cooled at the evaporative condenser 30, the low-temperature condensation pipeline 12b mainly plays an auxiliary role in cooling the secondary refrigerant. Designing the heat exchange area of the low-temperature condensation pipeline 12b to be smaller can not only avoid the overcooling of the secondary refrigerant but also reduce the configuration cost of the condenser 12.

[0065] Specifically in one embodiment, the condenser 12 is an air-cooled condenser. The air-cooled condenser uses the rotation of the fan to accelerate the air flow, thereby taking away the heat of the condensation pipeline and realizing the cooling of the refrigerant. The air-cooled condenser has a lower cost and is convenient to use.

[0066] In some embodiments, referring to Figure 3 , the refrigeration system 100 further includes a coolant cooling module 40. The coolant cooling module 40 includes a coolant flow path 40Z for accessing the test terminal to share the coolant circulation loop. The coolant flow path 40Z passes through the load evaporator 23.

[0067] The coolant flow path 40Z is used for circulating the coolant. The coolant can be a liquid or gaseous substance such as cooling water or fluorinated liquid that can refrigerate the test terminal. When the coolant circulates in the load evaporator 23, it can exchange heat with the primary refrigerant or secondary refrigerant flowing through the load evaporator 23 and be cooled. When the cooled coolant circulates in the test terminal, it adjusts the temperature of the test terminal.

[0068] At this time, the refrigeration system 100 directly circulates the coolant in the test terminal through the coolant cooling module 40, achieving more sufficient heat exchange with the test terminal and higher refrigeration utilization rate of the refrigeration system 100.

[0069] Further in the embodiment, referring to Figure 3 , the coolant cooling module 40 further includes a heater 41. The heater 41 is disposed on the coolant flow path 40Z and is used to heat the coolant flowing out of the load evaporator 23.

[0070] Specifically, the heater 41 is provided with a pipeline for circulating the coolant and a heating element for heating the pipeline. The heating element can be but is not limited to an electric heating element.

[0071] After the secondary refrigerant is cooled by the load evaporator 23 and heated by the heater 41, the hot and cold are in opposition, enabling the secondary refrigerant to reach the required temperature, which helps to precisely control the temperature of the test terminal.

[0072] In other embodiments, referring to Figure 3 , the secondary refrigerant cooling module 40 may further include a circulation pump 42, a liquid storage tank 43, etc. provided on the secondary refrigerant flow path 40Z. The circulation pump 42 can prompt the secondary refrigerant to circulate in the secondary refrigerant circulation loop. The liquid storage tank 43 can appropriately store the secondary refrigerant, adjust the circulation amount of the secondary refrigerant on the secondary refrigerant flow path 40Z, and thus adjust the heat exchange capacity of the secondary refrigerant cooling module 40 for the test terminal.

[0073] It can be understood that when the refrigeration system 100 does not include the secondary refrigerant cooling module 40, the load evaporator 23 can be directly used to cool the test terminal, and it can be flexibly set specifically according to the type of the test terminal.

[0074] In addition, the embodiment of the present application also provides a test device, including a test terminal and the refrigeration system 100 in the above embodiment, and the refrigeration system 100 is used to control the temperature of the test terminal.

[0075] The test device can be a sorting test device or a probe station device, and is used for testing semiconductor devices such as chips or wafers. The test terminal can be a test head, a test chamber, a preheating plate, a shuttle, a wafer carrier, etc. The test chamber is a cavity structure for providing a test space, and multiple chips or wafers can be placed in its test space. The load evaporator 23 of the refrigeration system 100 can be arranged in the test space to adjust the test temperature of the test space. The test head refers to a head structure that can press down and abut against the chip, and it directly contacts the chip to control the temperature of the chip. The secondary refrigerant flow path 40Z of the refrigeration system 100 is connected to the pipeline inside the test head to adjust the temperature of the test head. The preheating plate refers to a structure for carrying the chip and adjusting the temperature of the chip. The secondary refrigerant flow path 40Z of the refrigeration system 100 is connected to the pipeline of the preheating plate to adjust the temperature of the preheating plate. The shuttle refers to a structure for transporting the chip. The secondary refrigerant flow path 40Z of the refrigeration system 100 is connected to the pipeline inside the shuttle to adjust the temperature of the shuttle. The wafer carrier refers to a structure for carrying the wafer by adsorption. The secondary refrigerant flow path 40Z of the refrigeration system 100 is connected to the pipeline inside the wafer carrier to adjust the test temperature of the wafer.

[0076] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0077] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A refrigeration system (100), characterized in that: The refrigeration system (100) comprises: A high-temperature refrigeration module (10) comprises a first compressor (11), a condenser (12), and a first expansion valve (13) which are sequentially located in a high-temperature circuit (10G); A low-temperature refrigeration module (20) comprises a second compressor (21), a second expansion valve (22), and a load evaporator (23) which are sequentially located in a low-temperature circuit (20D); an evaporative condenser (30), wherein the high-temperature circuit (10G) located between the first expansion valve (13) and the suction end of the first compressor (11) exchanges heat with the low-temperature circuit (20D) located between the discharge end of the second compressor (21) and the second expansion valve (22) via the evaporative condenser (30); The high-temperature refrigeration module (10) further comprises an intermediate heat exchanger (14), a throttling branch (10J) and a throttling section (15); the high-temperature circuit (10G) comprises a first flow path (G1) located between the condenser (12) and the first expansion valve (13); the throttling branch (10J) is connected between the condenser (12) and the suction end of the first compressor (11); the throttling section (15) is arranged on the throttling branch (10J) for throttling and cooling the refrigerant flowing through the throttling branch (10J) and controlling the on-off of the throttling branch (10J); the first flow path (G1) and the throttling branch (10J) exchange heat via the intermediate heat exchanger (14); and in the refrigerant flow direction of the throttling branch (10J), the intermediate heat exchanger (14) is located downstream of the throttling section (15).

2. The refrigeration system (100) according to claim 1, characterized in that: The high-temperature refrigeration module (10) further comprises a temperature sensor (16), wherein the temperature sensor (16) is used to detect the temperature of the refrigerant flowing to the throttling portion (15); The detection result of the temperature sensor (16) is used to instruct the throttling unit (15) to control the on and off of the throttling branch (10J).

3. The refrigeration system (100) according to claim 2, characterized in that: The high-temperature refrigeration module (10) further comprises a liquid reservoir (17), the liquid reservoir (17) being arranged in the first flow path (G1) and located between the condenser (12) and the intermediate heat exchanger (14), and the temperature sensor (16) being arranged at an outlet side of the liquid reservoir (17); The throttling branch (10J) is connected to the condenser (12) via the liquid reservoir (17).

4. The refrigeration system (100) according to claim 1, characterized in that: The high-temperature stage circuit (10G) further comprises a second flow path (G2) located between the first expansion valve (13) and the suction end of the first compressor (11), wherein the second flow path (G2) passes through the evaporative condenser (30) and is provided with a first control valve (K1) located upstream of the evaporative condenser (30); The high-temperature refrigeration module (10) further comprises a bypass branch (10P), the bypass branch (10P) being arranged in parallel with the second flow path (G2) and passing through the load evaporator (23), and having a second control valve (K2) disposed thereon and located upstream of the load evaporator (23); The first control valve (K1) and the second control valve (K2) are not opened at the same time.

5. The refrigeration system (100) according to claim 1, characterized in that: The low temperature stage circuit (20D) comprises a third flow path (D1) located between the evaporative condenser (30) and the load evaporator (23), and a fourth flow path (D2) located between the load evaporator (23) and the suction end of the second compressor (21); The low-temperature refrigeration module (20) further includes a regenerator (24), and the third flow path (D1) and the fourth flow path (D2) exchange heat via the regenerator (24); on the third flow path (D1), the second expansion valve (22) is located downstream of the regenerator (24).

6. The refrigeration system (100) according to claim 1, characterized in that: The condenser (12) comprises a high-temperature condensation pipeline (12a) and a low-temperature condensation pipeline (12b) which are independently arranged, the high-temperature loop (10G) passes through the high-temperature condensation pipeline (12a), the low-temperature loop (20D) passes through the low-temperature condensation pipeline (12b), and the low-temperature condensation pipeline (12b) is located between the evaporative condenser (30) and the exhaust end of the second compressor (21).

7. The refrigeration system (100) according to claim 6, characterized in that: The heat exchange area of ​​the high-temperature condensation pipeline (12a) is greater than the heat exchange area of ​​the low-temperature condensation pipeline (12b).

8. The refrigeration system (100) according to claim 6, characterized in that: The condenser (12) is an air-cooled condenser.

9. The refrigeration system (100) according to claim 1, characterized in that: The refrigeration system (100) further comprises a refrigerant cooling module (40), wherein the refrigerant cooling module (40) comprises a refrigerant flow path (40Z) for connecting to a test terminal to form a refrigerant circulation loop, and the refrigerant flow path (40Z) passes through the load evaporator (23); The brine cooling module (40) further comprises a heater (41), wherein the heater (41) is arranged in the brine flow path (40Z) and is used to heat the brine flowing out of the load evaporator (23).

10. A testing device, characterized in that: It comprises a test terminal and a refrigeration system (100) according to any one of claims 1 to 9, wherein the refrigeration system (100) is used to regulate the temperature of the test terminal.

Images