Server liquid cooling system

Abstract

The utility model relates to the technical field of computer hardware cooling, in particular to a server liquid cooling system which comprises a liquid cooling plate, multiple paths of multi-layer parallel liquid flow channels are arranged in the liquid cooling plate, all the paths of liquid flow channels are communicated in a staggered mode, the liquid flow channels are connected with an integrated temperature control mechanism, and the integrated temperature control mechanism is connected with the liquid cooling plate. The integrated temperature control mechanism comprises a temperature sensor used for detecting the temperature in the liquid flow channel and an intelligent flow pump used for controlling the flowing speed of liquid. The purposes of promoting full play of the heat dissipation performance of the liquid-cooling cold plate and reducing the overall energy consumption are achieved.

Description

Technical Field

[0001] This application relates to the technical field of computer hardware cooling, and particularly to a server liquid cooling system. Background Art

[0002] With the wide application of technologies such as cloud computing, big data, and artificial intelligence, the computing density of data center servers has been continuously climbing, which has led to a sharp increase in the heat generated by internal components of the servers. Due to the limitations of the heat capacity ratio and heat transfer coefficient of air, traditional air-cooling technologies are difficult to effectively cope with the high heat flux density of modern servers. In contrast, liquid cooling technology can more effectively conduct heat from the heat source to the external cooling system by directly or indirectly contacting the heating elements with liquid, taking advantage of the high heat capacity and fluidity of the liquid, and has become the preferred solution for cooling high-power density servers.

[0003] Common liquid cooling components are liquid cold plates. The design of liquid cold plates faces limitations such as low thermal conductivity and sub-optimal flow channel layout, which restrict the full play of heat dissipation performance and increase energy consumption. Utility Model Content

[0004] In order to promote the full play of the heat dissipation performance of liquid cold plates and reduce overall energy consumption, this application provides a server liquid cooling system.

[0005] The server liquid cooling system provided by this application adopts the following technical solutions:

[0006] A server liquid cooling system includes a liquid cold plate. The liquid cold plate is provided with multiple parallel multi-layer liquid flow channels, and each liquid flow channel is alternately connected. The liquid flow channels are connected to an integrated temperature control mechanism, and the integrated temperature control mechanism includes a temperature sensor for detecting the temperature in the liquid flow channels and an intelligent flow pump for controlling the liquid flow rate.

[0007] Optionally, the liquid flow channels are configured as finned or cylindrical structures.

[0008] Optionally, turbulence elements are added in the liquid flow channels.

[0009] Optionally, the width of the liquid flow channels decreases from the center to both sides.

[0010] Optionally, the liquid flow channels are provided with diagonal inlets and outlets, that is, two opposite corners at one end of the liquid flow channel are inlets, and two opposite corners at the other end are outlets.

[0011] Optionally, the integrated temperature control mechanism further includes a controller, and the controller is electrically connected to both the temperature sensor and the intelligent flow pump.

[0012] Optionally, the temperature sensor is disposed at the water inlet, water outlet of the liquid cooling cold plate, and high heat density regions along the flow path.

[0013] In summary, the present application includes at least one of the following beneficial technical effects:

[0014] 1. Through the multi-layer parallel and staggered liquid flow paths, each flow path is connected to all other flow paths, thereby ensuring that the coolant can effectively disperse the fluid flow, and each flow path is connected to all other flow paths, thereby ensuring that the coolant can effectively disperse the fluid flow;

[0015] 2. By setting the diagonal inlet and outlet in the liquid flow path, the phenomenon of fluid short circuit is effectively avoided, that is, the coolant directly flows out without fully absorbing heat, thereby improving the overall heat exchange efficiency;

[0016] 3. By setting the temperature sensor, controller and intelligent flow pump, the output flow of the intelligent flow pump is dynamically adjusted. When the detected temperature is low, the output flow of the intelligent flow pump is also controlled to become smaller, realizing heat dissipation on demand and reducing energy consumption at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic cross-sectional view of the liquid cooling cold plate in the horizontal direction in the embodiment of the present application;

[0018] Figure 2 is a schematic cross-sectional view of the liquid cooling cold plate in the vertical direction in the embodiment of the present application;

[0019] Figure 3 is a schematic diagram of the composition of the integrated temperature control mechanism in the embodiment of the present application.

[0020] Description of the reference numerals: 1, liquid cooling cold plate; 2, liquid flow path; 3, temperature sensor; 4, intelligent flow pump; 5, water inlet; 6, water outlet. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The following further describes the present application in detail Figures 1-3 with reference to the accompanying drawings.

[0022] The embodiment of the present application discloses a server liquid cooling system. Referring to Figure 1 , a server liquid cooling system includes a liquid cooling cold plate 1. A liquid flow path 2 and an integrated temperature control mechanism are arranged inside the liquid cooling cold plate 1. The coolant flows in the liquid cooling cold plate along the liquid flow path 2, thereby taking away the heat transferred by the CPU and dissipating it, and through the integrated temperature control mechanism, the dynamic flow rate of the coolant in the liquid is controlled to achieve the purpose of promoting the full play of the heat dissipation performance of the liquid cooling cold plate 1 and reducing the overall energy consumption.

[0023] Referring to Figure 1, the liquid cold plate 1 is entirely made of materials with high thermal conductivity, such as copper or aluminum alloy, to reduce the thermal resistance. At the same time, the contact surface between the cold plate and the CPU is refined, such as using microgrooves, bump structures or coatings to increase the surface area. The internal structure of the liquid flow channel 2 is set as a finned or cylindrical structure, which can increase the contact area between the fluid and the cold plate surface, thereby improving the heat exchange efficiency. Turbulence-promoting elements, such as turbulators and vortex generators, are added to the liquid flow channel 2 to promote the fluid to generate turbulence and enhance heat mixing.

[0024] The liquid flow channel 2 is designed as a multi-path and multi-layer parallel micro-channel structure. Each liquid flow channel 2 can be set as a spiral or corrugated shape. At the same time, the liquid flow channels 2 can be staggered. The liquid flow channels 2 are arranged along the length direction of the liquid cold plate 1. Both ends of each layer of liquid flow channels 2 are respectively connected to the water inlet 5 and the water outlet 6. Communication cavities are arranged at a certain distance along the vertical and horizontal directions to achieve that each flow channel is connected to all other flow channels, so as to ensure that the coolant can effectively disperse the fluid flow and avoid local overheating caused by the rapid concentrated flow of the fluid in a single direction.

[0025] The liquid flow channel 2 can also be designed as a four-layer staggered structure (not shown in the attached figure). Each layer of channels is staggered at 45°, ensuring the uniform distribution of the coolant among the layers. Specifically, the four-layer micro-channels are all arranged inside the cold plate, perpendicular to the surface of the CPU or other main heat-generating components. Each layer can be imagined as a two-dimensional plane, which can be defined as the X-Y plane. The direction of the first layer of channels is set as the positive direction of the X axis, that is, the channels are parallel to a long side of the cold plate; the second layer of channels is rotated 45° so that its channel direction is aligned with the positive direction of the X+Y axis (i.e., the diagonal direction of the first and third quadrants); the third layer of channels is rotated 45° again to make it parallel to the negative direction of the X axis; finally, the fourth layer of channels is rotated 45° again to align with the positive direction of the Y axis on the X-Y plane. This increases the complexity of the fluid path, promotes the formation of a more uniform distribution of the fluid inside the cold plate, and the heat of each micro-region can be fully taken away, thereby reducing the probability of forming "hot spots".

[0026] The width of the liquid flow channel 2 decreases from the center to both sides. At the same time, the channel depth is appropriately reduced to promote fluid acceleration. At the same time, the liquid flow channel 2 is provided with diagonal inlets and outlets, that is, the two opposite corners at one end are the water inlets 5, and the two opposite corners at the other end are the water outlets 6. This design helps to form convection. When the coolant enters from the two corners at one end, due to the pressure difference at the diagonal water outlet 6, the liquid is naturally pushed to flow in the diagonal direction. This design effectively avoids the phenomenon of fluid short-circuit, that is, the coolant flows out directly without fully absorbing heat, thereby improving the overall heat exchange efficiency and promoting the formation of a more uniform and efficient circulating flow of the coolant inside the cold plate.

[0027] The integrated temperature control mechanism includes a temperature sensor 3, a controller and an intelligent flow pump 4, and the temperature sensor 3 and the intelligent flow pump 4 are electrically connected to the controller; the temperature sensor 3 is arranged at key positions of the liquid-cooled cold plate 1, such as the water inlet 5, the water outlet 6 and the high heat density area along the flow channel. The integrated temperature sensor 3 is selected with high precision and low power consumption, can withstand the fluid environment, and does not affect the flow of the coolant; the intelligent flow pump 4 is fixedly installed at the water inlet 5, and the flow rate of the coolant can be controlled by controlling the valve of the intelligent flow pump 4; the temperature sensor 3 detects the temperature of the area and outputs a temperature signal. The controller receives the temperature signal and dynamically adjusts the output flow of the intelligent flow pump 4. When the detected temperature is low, the output flow of the intelligent flow pump 4 is also controlled to be smaller, so as to achieve on-demand heat dissipation and reduce energy consumption.

[0028] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A server liquid cooling system, comprising a liquid cooling cold plate (1), characterized in that: The liquid-cooled cold plate (1) is provided with multiple multi-layer parallel liquid flow channels (2), each of which is interconnected in an interlaced manner. The liquid flow channels (2) are connected to an integrated temperature control mechanism, which includes a temperature sensor (3) for detecting the temperature in the liquid flow channel (2) and an intelligent flow pump (4) for controlling the flow rate of the liquid.

2. A server liquid cooling system according to claim 1, characterized in that: The liquid flow channel (2) is configured as a fin-type or cylindrical structure.

3. A server liquid cooling system according to claim 1, characterized in that: A flow disturbance element is added in the liquid flow channel (2).

4. A server liquid cooling system according to claim 1, characterized in that: The width of the liquid flow channel (2) decreases gradually from the center to both sides.

5. A server liquid cooling system according to claim 4, characterized in that: The liquid flow channel (2) is provided with diagonal inlets and outlets, that is, two opposite corners at one end of the liquid flow channel (2) are water inlets (5), and two opposite corners at the other end are water outlets (6).

6. A server liquid cooling system according to claim 1, characterized in that: The integrated temperature control mechanism also includes a controller, and the controller is electrically connected to the temperature sensor (3) and the intelligent flow pump (4).

7. A server liquid cooling system according to claim 1, characterized in that: The temperature sensor (3) is arranged at the water inlet (5), the water outlet (6) and the high heat density area along the flow channel of the liquid-cooled cold plate (1).

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