Display module and display device

Abstract

The utility model discloses a display module and a display device. The display module comprises a circuit board and a display panel, and the circuit board is provided with a plurality of through containing holes; the display panel is arranged on the lower side of the circuit board in a laminated mode, the orthographic projection of the containing hole on the display panel is located on the surface limited by the display panel, and the containing hole is used for allowing an adsorption device located on the upper side of the circuit board to penetrate through and adsorb the surface of the display panel. According to the display module, the containing hole is formed in the circuit board, on the basis that the circuit board is located above the display panel, the adsorption device can penetrate through the containing hole to be directly adsorbed and fixed to the display panel located below, and therefore the display panel and the circuit board can be moved synchronously, a bonding layer does not need to be additionally arranged between the display panel and the circuit board, and the production efficiency is improved. Therefore, the material cost of the bonding layer and the cost of process equipment for arranging the bonding layer can be reduced, the assembly process is simplified, and the assembly time is saved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display module and a display device. Background Art

[0002] In the electronic paper industry, the structural design of the entire product includes a display panel and a circuit board, which are connected by a flexible circuit board. During the assembly of the electronic paper machine, the assembly process between the display panel and the circuit board is relatively cumbersome, which is not conducive to reducing costs. Utility Model Content

[0003] The purpose of the present application is to at least solve the problem of high assembly cost in display devices. This purpose is achieved through the following technical solutions:

[0004] The first aspect of the present application provides a display module, comprising:

[0005] A circuit board, wherein the circuit board is provided with a plurality of penetrating receiving holes;

[0006] The display panel is laminated on the lower side of the circuit board, the orthographic projection of the accommodating hole on the display panel is located on the surface defined by the display panel, and the accommodating hole is used for allowing the adsorption device located on the upper side of the circuit board to pass through and adsorb the surface of the display panel.

[0007] The display module provided in the present application includes a circuit board and a display panel, and the circuit board is used to control the display panel to display. A plurality of through-holes are provided on the circuit board, and the holes are used to accommodate the adsorption device. The display panel is stacked on the lower side of the circuit board. Specifically, the display panel includes a light-emitting surface and a surface opposite to the light-emitting surface. In the stacked display panel and the circuit board, the circuit board is located on the side of the surface opposite to the light-emitting surface in the display panel, so that the circuit board does not block the light emission of the display panel. The positive projection of the accommodating hole in the circuit board on the display panel is located on the surface defined by the display panel, so that during the assembly process of the display module, the adsorption device can be placed on the side of the circuit board away from the display panel, and the adsorption device is passed through the accommodating hole and adsorbed on the side surface of the display panel away from the light-emitting surface, and the display panel is located on the lower side of the circuit board, so that under the action of gravity, the circuit board is carried on the display panel to avoid separation of the circuit board from the display panel. In the display module, a receiving hole is opened on the circuit board, and on the basis that the circuit board is located above the display panel, the adsorption device is passed through the receiving hole and directly adsorbed and fixed to the display panel located below, so that the display panel and the circuit board can move synchronously without adding an adhesive layer between the display panel and the circuit board, thereby reducing the material cost of the adhesive layer and the cost of the process equipment for setting the adhesive layer, simplifying the assembly process and saving assembly time.

[0008] In some embodiments of the present application, the number of the receiving holes is multiple, and the receiving holes are located at both ends of the circuit board along its own length direction, or the receiving holes are dispersedly arranged along the circumferential direction of the circuit board.

[0009] In some embodiments of the present application, the shape of the receiving hole matches the cross-sectional shape of the adsorption device; or the shape of the receiving hole is circular, regular polygon or strip-shaped.

[0010] In some embodiments of the present application, a clamping and limiting portion is provided on the lower surface of the circuit board. The clamping and limiting portion includes a first baffle and a second baffle. The first baffle is parallel to the circuit board, and the second baffle is located between the first baffle and the circuit board. A first receiving groove is formed among the first baffle, the second baffle and the circuit board, and a part of the display panel is received in the first receiving groove.

[0011] In some embodiments of the present application, the same end of the circuit board and the display panel is connected by a flexible circuit board, and the clamping and limiting portion is located at the end of the circuit board far from the flexible circuit board.

[0012] In some embodiments of the present application, the second baffle is a light-emitting device, and the first baffle is connected to the circuit board through the light-emitting device.

[0013] In some embodiments of the present application, the outer diameter dimension of the receiving hole is D, and 4mm ≤ D ≤ 10mm.

[0014] In some embodiments of the present application, a clamping groove is formed on the side wall of the receiving hole, and the dimension of the clamping groove along the direction perpendicular to the thickness direction of the circuit board gradually increases along the circumferential direction of the receiving hole.

[0015] The second aspect of the present application further provides a display device, including any one of the display modules provided in the first aspect of the present application.

[0016] In some embodiments of the present application, it further includes a housing. The housing includes a front housing and a rear housing which are oppositely arranged. The display module is received in the housing, and the display panel is located on the side of the circuit board facing the front housing. Description of the Drawings

[0017] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0018] Figure 1It is a schematic structural diagram of a display device in the related art;

[0019] Figure 2 It is a schematic diagram of the assembly process of a display module provided by an embodiment of the present application;

[0020] Figure 3 It is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of the assembly process of a display module and a front shell provided by an embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of the assembly process of a display module cooperating with an adsorption device provided by an embodiment of the present application;

[0023] Figure 6 It is a schematic structural diagram of a circuit board in a display module provided by an embodiment of the present application;

[0024] Figure 7 It is a schematic structural diagram of a circuit board in another display module provided by an embodiment of the present application;

[0025] Figure 8 It is a schematic structural diagram of a circuit board in another display module provided by an embodiment of the present application;

[0026] Figure 9 It is a schematic diagram of a display module cooperating with an adsorption device provided by an embodiment of the present application;

[0027] Figure 10 It is a schematic structural diagram of a circuit board in another display module provided by an embodiment of the present application;

[0028] Figure 11 It is a schematic structural diagram of a circuit board in another display module provided by an embodiment of the present application;

[0029] Figure 12 It is a schematic structural diagram of another display module provided by an embodiment of the present application;

[0030] Figure 13 It is Figure 12 an enlarged view of the Q area in;

[0031] Figure 14 It is Figure 12 an enlarged view of the P area in;

[0032] Figure 15 It is a schematic diagram of a partial structure of another display module provided by an embodiment of the present application;

[0033] Figure 16 It is a schematic diagram of the assembly process of a display module provided by an embodiment of the present application;

[0034] Figure 17 It is a schematic structural diagram of a display device provided by an embodiment of the present application.

[0035] The reference numerals are as follows:

[0036] 01, display panel; 02, circuit board; 03, adhesive layer; 1, display module; 11, display panel; 12, circuit board; 121, accommodation hole; 1210, clamping groove; 1214, special-shaped area; 1211, middle part; 1212, first part; 1213, second part; 122, clamping limit part; 1221, first baffle; 1222, second baffle; 1223, first accommodation groove; 13, flexible circuit board; 14, positioning hole; 15, light-emitting device; 2, adsorption device; L, first dimension; C1, long side; C2, short side; 3, display device; 31, housing; 311, front shell; 3111, hollow area; 312, rear shell; 32, gasket; 33, battery module; 331, battery; 332, battery cover. Detailed implementation manners

[0037] Hereinafter, the exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0038] It should be understood that the terms used herein are only for the purpose of describing specific exemplary embodiments and are not intended to be limiting. Unless otherwise clearly specified in the context, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "include", "comprise", "contain", and "have" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be executed in the specific order described or illustrated, unless the execution order is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0039] Although terms such as first, second, and third may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another region, layer, or section. Unless the context clearly indicates otherwise, terms such as "first" and "second" and other numerical terms do not imply an order or sequence when used herein. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0040] For ease of description, spatial relative relationship terms may be used herein to describe the relationship of one element or feature shown in the figure to another element or feature, such as "inner", "outer", "inner side", "outer side", "below", "beneath", "above", "over", etc. Such spatial relative relationship terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the figure. For example, if the device in the figure is flipped, an element described as "below" or "beneath" another element or feature will then be oriented as "above" or "over" the other element or feature. Thus, the exemplary term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein are to be interpreted accordingly.

[0041] The inventors have found through research that in the assembly process of a display device, taking an electronic paper as an example, the reason why the assembly process between the display panel 01 and the circuit board 02 is relatively cumbersome is that: as Figure 1 shown, in the assembly process of the display panel 01 and the circuit board 02, one end of the display panel 01 needs to be connected to one end of the circuit board 02 through a flexible circuit board, and a bonding layer 03 is used to bond and fix between the display panel 01 and the circuit board 02 to form an assembly, and then the assembly is assembled with the front shell in the electronic paper whole machine. Among them, the bonding layer 03 includes double-sided tape or glue. Therefore, in the assembly process, it is necessary to add the steps of attaching double-sided tape or dotting glue between the display panel 01 and the circuit board 02, and then the circuit board 02 is sucked from above by a manipulator to assemble the assembly into the front shell. This assembly process increases the material cost and the assembly process due to the addition of double-sided tape or glue, and at the same time increases the process equipment and process for automatically attaching double-sided tape, resulting in an increase in the manufacturing cost and an increase in the complexity of the entire assembly process.

[0042] As Figures 2 to 6As shown, according to the embodiment of the present application, a display module 1 is provided, which includes a circuit board 12 and a display panel 11, wherein the circuit board 12 is provided with a plurality of penetrating receiving holes 121; and the display panel 11 is laminated and arranged on the lower side of the circuit board 12. The orthographic projection of the receiving holes 121 on the display panel 11 is located on the surface defined by the display panel 11, and the receiving holes 121 are used for the adsorption device 2 located on the upper side of the circuit board 12 to pass through and adsorb the surface of the display panel 11.

[0043] The display module 1 provided in the present application includes a circuit board 12 and a display panel 11, and the circuit board 12 is used to control the display panel 11 to display. A plurality of penetrating receiving holes 121 are provided on the circuit board 12, and the receiving holes 121 are used to accommodate the adsorption device 2. The display panel 11 is stacked on the lower side of the circuit board 12. Specifically, the display panel 11 includes a light emitting surface and a surface opposite to the light emitting surface. In the stacked display panel 11 and the circuit board 12, the circuit board 12 is located on the side of the surface of the display panel 11 opposite to the light emitting surface, so that the circuit board 12 does not block the light emitting from the display panel 11. The orthographic projection of the receiving holes 121 in the circuit board 12 on the display panel 11 is located on the surface defined by the display panel 11. During the assembly process of the display module 1, refer to Figure 5 , the display panel 11 is located at the lower side of the circuit board 12, and the adsorption device 2 is located at the upper side of the circuit board 12, that is, the adsorption device 2 is located at the side of the circuit board 12 away from the display panel 11. When the adsorption device 2 needs to drive the display module to move, the adsorption device 2 is passed through the receiving hole 121 and adsorbed on the surface of the display panel 11 away from the light-emitting surface. Under the action of gravity, the circuit board 12 is carried on the display panel 11 to prevent the circuit board 12 from separating from the display panel 11, so that the adsorption device 2 can drive the display panel 11 and the circuit board 12 to move synchronously. In the display module 1, by opening the receiving hole 121 on the circuit board 12, the adsorption device 2 can be passed through the receiving hole 121 on the basis that the circuit board 12 is located above the display panel 11, and the display panel 11 and the circuit board 12 can be directly adsorbed and fixed to the display panel 11 located below, so that the display panel 11 and the circuit board 12 can be synchronously moved to the front shell 311 for assembly, without adding an adhesive layer between the display panel 11 and the circuit board 12, reducing the material cost of the adhesive layer and the cost of the process equipment for setting the adhesive layer, simplifying the assembly process, and saving assembly time.

[0044] like Figure 6 As shown, the receiving hole 121 can be reused as the positioning hole 14 of the circuit board 12, and the original positioning hole 14 is eliminated. Therefore, the preparation process of the receiving hole 121 will not increase the preparation process. The step of preparing the original positioning hole 14 can be directly changed to the step of preparing the receiving hole 121. The outer diameter of the receiving hole 121 is larger than the aperture of the original positioning hole 14 so as to accommodate the adsorption device 2. Or, as Figure 7As shown, accommodation holes 121 can also be newly added on the basis of retaining the original positioning holes 14. In a feasible implementation, as Figure 8 shown, the number of accommodation holes 121 is multiple, and the accommodation holes 121 are located at both ends of the circuit board 12 along its own length direction, or, as Figure 6 and Figure 7 shown, the accommodation holes 121 are dispersedly arranged along the circumferential direction of the circuit board 12.

[0045] In the above implementation, the number of accommodation holes 121 in the circuit board 12 is multiple, so that during the process of adsorbing the display panel 11 by the adsorption device 2, the display panel 11 can be evenly stressed, the probability of the display panel 11 tilting can be reduced, and it is helpful to improve the adsorption stability and the transfer yield. The number of accommodation holes 121 in the circuit board 12 is multiple, so that the circuit board 12 located above the display panel 11 can be limited in the direction parallel to the surface of the display panel 11, as Figure 9 shown, the probability of the accommodation holes 121 of the circuit board 12 rotating around the adsorption device 2 is reduced, which is helpful to improve the alignment accuracy between the circuit board 12 and the display panel 11, and is helpful to improve the yield of transfer and assembly, and further helpful to improve the yield of the display device 3.

[0046] In the above implementation, the accommodation holes 121 are located at both ends of the circuit board 12 along its own length direction, or the accommodation holes 121 are dispersedly arranged along the circumferential direction of the circuit board 12, so that the stress uniformity of the display panel 11 can be further improved, and the stability of the transfer process can be improved.

[0047] In a feasible implementation, the shape of the accommodation hole 121 matches the cross-sectional shape of the adsorption device 2; or the shape of the accommodation hole 121 is circular, regular polygon or strip-shaped.

[0048] In the above implementation, the shape of the accommodation hole 121 matches the cross-sectional shape of the adsorption device 2, so that the cooperation degree between the two can be improved. During the transfer process, alignment can be achieved by ensuring that the center of the accommodation hole 121 coincides with the center of the end of the adsorption device 2 close to the accommodation hole 121, which helps to reduce the difficulty of alignment.

[0049] Specifically, as Figure 10 and Figure 11 shown, the shape of the accommodation hole 121 can be circular, regular polygon or strip-shaped. Using a regular shape design can reduce the preparation difficulty, thereby reducing the preparation time and cost. Regular polygons include squares, regular pentagons, regular hexagons, etc. At the same time, using a circular accommodation hole 121 design can match the shape of the existing adsorption device 2, so that the cost of matching the shape of the accommodation hole 121 with the cross-sectional shape of the adsorption device 2 can be reduced.

[0050] Specifically, when the shape of the receiving hole 121 is non-circular, it is convenient to limit the adsorption device 2, improve the problem of the receiving hole 121 rotating around the adsorption device 2, and thus the alignment accuracy between the circuit board 12 and the display panel 11 can be improved.

[0051] Specifically, the shape of the receiving hole 121 can also be an irregular polygon.

[0052] Specifically, the projection of the receiving hole 121 in its own thickness direction includes a middle portion 1211 and a first portion 1212 and a second portion 1213 located on both sides of the middle portion 1211. The shape of the middle portion 1211 is rectangular, and the first portion 1212 and the second portion 1213 are semi-circular. The straight edges of the semi-circles coincide with the sides of the rectangle. Adopting the above shape can match the existing adsorption device 2, thereby reducing the cost of making the shape of the receiving hole 121 match the cross-sectional shape of the adsorption device 2.

[0053] In a feasible implementation manner, as Figure 12 and Figure 13 shown, a clamping and limiting portion 122 is provided on the lower surface of the circuit board 12. The clamping and limiting portion 122 includes a first baffle 1221 and a second baffle 1222. The first baffle 1221 is parallel to the circuit board 12, and the second baffle 1222 is located between the first baffle 1221 and the circuit board 12. A first receiving groove 1223 is formed among the first baffle 1221, the second baffle 1222 and the circuit board 12. A part of the display panel 11 is received in the first receiving groove 1223.

[0054] In the above implementation manner, a clamping and limiting portion 122 can be provided on the lower surface of the circuit board 12 (i.e., the surface close to the display panel 11). The clamping and limiting portion 122 can limit the circuit board 12 and the display panel 11 in the arrangement direction of the two, reduce the probability that the circuit board 12 moves along the extending direction of the adsorption device 2 (i.e., the direction of inserting into the receiving hole 121) through the receiving hole 121 during the transfer process, and thus help to improve the position accuracy between the circuit board 12 and the display panel 11, so as to further improve the yield of the display module 1.

[0055] In the above-described embodiment, the snap-limiting portion 122 specifically includes a first baffle 1221 and a second baffle 1222. The first baffle 1221 is parallel to the circuit board 12, and the second baffle 1222 is located between the first baffle 1221 and the circuit board 12. The second baffle 1222 is used to connect the first baffle 1221 and the circuit board 12. A first receiving groove 1223 is formed among the first baffle 1221, the second baffle 1222, and the circuit board 12. A part of the display panel 11 is received in the first receiving groove 1223. The displacement of the display panel 11 and the circuit board 12 along their arrangement direction is defined by the first baffle 1221 and the circuit board 12, and the displacement between the display panel 11 and the circuit board 12 along the direction parallel to the circuit board 12 is defined by the second baffle 1222. Thus, the limitation of the circuit board 12 and the display panel 11 along their arrangement direction and along the direction parallel to the circuit board 12 can be realized, which helps to improve the position accuracy of the two.

[0056] In a feasible embodiment, as Figure 12 shown, the same ends of the circuit board 12 and the display panel 11 are connected by a flexible circuit board 13, and the snap-limiting portion 122 is located at the end of the circuit board 12 away from the flexible circuit board 13.

[0057] In the above-described embodiment, the same ends of the circuit board 12 and the display panel 11 are connected by a flexible circuit board 13. The "same ends" refer to the opposite ends of the circuit board 12 and the display panel 11 along the arrangement direction of the circuit board 12 and the display panel 11 when they are stacked. The flexible circuit board 13 is used to realize the electrical connection between the circuit board 12 and the display panel 11, so as to realize the control of the display panel 11 by the circuit board 12. The flexible circuit board 13 has bending performance. One end of the flexible circuit board 13 is connected to the circuit board 12, and the other end is connected to the display panel 11. After the display panel 11 and the circuit board 12 are stacked, the flexible circuit board 13 is in a bent state, that is, in the display module 1, the flexible circuit board 13 is in a bent state.

[0058] In the above-described embodiment, the snap-limiting portion 122 is located at the end of the circuit board 12 away from the flexible circuit board 13, and the snap-limiting portion 122 has an opening facing the flexible circuit board 13. During the assembly process, one end of the flexible circuit board 13 can be connected to the circuit board 12, the other end can be connected to the display panel 11, and then the flexible circuit board 13 is bent to stack the circuit board 12 and the display panel 11. After the flexible circuit board 13 is bent, the end of the display panel 11 away from the flexible circuit board 13 can be moved along the direction parallel to the circuit board 12 and inserted into the snap-limiting portion 122 to achieve snap connection with the snap-limiting portion 122. Since the flexible circuit board 13 has a tension opposite to the bending direction after being bent, the snap connection effect between the snap-limiting portion 122 and the display panel 11 can be good and it is not easy to disengage.

[0059] Specifically, the first baffle 1221 can project outwards from the second baffle 1222 in the direction close to the flexible circuit board 13, so that the clamping and limiting part 122 has an opening facing the flexible circuit board 13, facilitating the clamping and limiting of the display panel 11 with the clamping and limiting part 122.

[0060] In a feasible implementation manner, the second baffle 1222 is a light-emitting device 15, and the first baffle 1221 is connected to the circuit board 12 through the light-emitting device 15.

[0061] In the above implementation manner, a light-emitting device 15 for indicating the state of the circuit board 12 is arranged at one end of the surface of the circuit board 12 close to the display panel 11 and away from the flexible circuit board 13. The light-emitting device 15 can be reused as the second baffle 1222, thus omitting the material cost of preparing the second baffle 1222 and the time cost of the preparation process, and simplifying the structure of the circuit board 12 at the same time.

[0062] In the above implementation manner, the first baffle 1221 at least includes a projecting part that projects outwards from the edge of the light-emitting device 15 in the direction close to the flexible circuit board 13, so as to cooperate with the circuit board 12 to clamp and limit the display panel 11.

[0063] In the above implementation manner, the dimension of the overlapping part of the first baffle 1221 and the display panel 11 in the arrangement direction of the clamping and limiting part 122 and the flexible circuit board 13 is the first dimension LL. The first dimension L can be in the range of 0.1 mm - 0.2 mm. If the first dimension L is too small, the yield of the clamping and limiting of the display panel 11 will be affected. If the first dimension L is too large, the pressure of the front shell 311 on the light-emitting device 15 will be too large, affecting the yield of the light-emitting device 15. That is, when the first dimension L is too large, the first baffle 1221 will contact the front shell 311 and be extruded by the front shell 311, so that the first baffle 1221 will extrude the light-emitting device 15 and affect the performance of the light-emitting device 15.

[0064] Specifically, the first dimension L can be 0.1 mm, 0.12 mm, 0.13 mm, 0.15 mm, 0.18 mm, 0.19 mm, 0.2 mm, etc. The present application does not make special limitations on this.

[0065] In a feasible implementation manner, the second baffle 1222 can also be prepared separately. The clamping and limiting portion 122 can be located at one end of the surface of the circuit board 12 close to the display panel 11 and away from the flexible circuit board 13, that is, near the light-emitting device 15. Placing the clamping and limiting portion 122 at one end of the surface of the circuit board 12 close to the display panel 11 and away from the flexible circuit board 13 can facilitate moving the end of the display panel 11 away from the flexible circuit board 13 in a direction parallel to the circuit board 12 and inserting it into the clamping and limiting portion 122 after the flexible circuit board 13 is bent. This assembly process is simple and has little impact on the display panel 11. Moreover, the clamping and limiting portion 122 and the flexible circuit board 13 are arranged oppositely and act together to fix the positions of the circuit board 12 and the display panel 11.

[0066] In a feasible implementation manner, as Figure 7 shown, the outer diameter dimension of the receiving hole 121 is D, and 4 mm ≤ D ≤ 10 mm.

[0067] Specifically, the outer diameter dimension of the receiving hole 121 can specifically be 4 mm, 4.3 mm, 4.6 mm, 5 mm, 6.1 mm, 7.4 mm, 8.6 mm, 10 mm, and so on.

[0068] In the above implementation manner, the outer diameter dimension of the receiving hole 121 is the diameter of the circumscribed circle of the receiving hole 121. The outer diameter dimension of the receiving hole 121 is in the range of 4 mm to 10 mm. On the one hand, it can prevent the contact area between the adsorption device 2 and the display panel 11 from being too small due to the too small outer diameter dimension of the receiving hole 121, thus affecting the adsorption yield. On the other hand, it can prevent the outer diameter dimension of the receiving hole 121 from being too large, which may cause the circuit board 12 to be too large or affect the arrangement of other functional devices in the circuit board 12.

[0069] In a feasible implementation manner, as Figure 14 shown, a clamping groove 1210 is formed on the side wall of the receiving hole 121, and the dimension of the clamping groove 1210 in the direction perpendicular to the thickness direction of the circuit board 12 gradually increases along the circumferential direction of the receiving hole 121.

[0070] In the above embodiments, by providing the clamping groove 1210 on the side wall of the receiving hole 121, it is convenient to realize the clamping and fixing with the adsorption device 2, thereby further limiting the position of the circuit board 12 in the thickness direction of itself, reducing the probability of the circuit board 12 moving in the extending direction of the adsorption device 2, and thus helping to improve the alignment accuracy between the circuit board 12 and the display panel 11. Specifically, the dimension of the clamping groove 1210 in the direction perpendicular to the thickness of the circuit board 12 gradually increases along the circumferential direction of the receiving hole 121. A clamping portion that can expand and contract in the radial direction of the outer diameter of the receiving hole 121 can be provided on the adsorption device 2 to be clamped and fixed with the receiving groove. The clamping portion abuts against the position where the dimension of the clamping groove 1210 in the direction perpendicular to the thickness of the circuit board 12 is smaller, and extends out during the process of rotating to the position where the dimension in the direction perpendicular to the thickness of the circuit board 12 is larger to be clamped with the clamping groove 1210. Or, as Figure 15 shown, a clamping portion that can extend in the radial direction of the outer diameter of the receiving hole 121 is provided on the adsorption device 2. The receiving hole 121 is set to be irregular, including an irregular area 1214 for receiving the clamping portion. The clamping groove 1210 extends from the irregular area 1214 to the circumferential direction. After the clamping portion enters the receiving portion 121 from the irregular area 1214, it can move along the circumferential direction in the clamping groove 1210 starting from the irregular area 1214 to be fixed with the clamping groove, so as to realize the clamping with the clamping groove 1210 in the non-irregular area 1214.

[0071] In a feasible embodiment, as Figure 16 shown, the circuit board 12 and the display panel 11 respectively have a long side C1 and a short side C2, and the widths of the circuit board 12 and the display panel 11 are the same, where the width is the dimension of the short side C2. Setting the widths of the circuit board 12 and the display panel 11 to be the same can reduce the alignment difficulty between the circuit board 12 and the display panel 11, improve the alignment yield between the display panel 11 and the circuit board 12, and thus simplify the assembly difficulty.

[0072] Specifically, when the flexible circuit board 13 is bent to realize the stacking arrangement of the circuit board 12 and the display panel 11, it is necessary to ensure that the display panel 11 and the circuit board 12 are aligned in the center, that is, the orthographic projection of the display panel 11 on the circuit board 12 is located at the center of the circuit board 12, rather than on the side or there is an angle between the long sides C1 of the two. When the display panel 11 and the circuit board 12 are not aligned in the center, the accuracy of the subsequent process will be poor. When the width of the display panel 11 is smaller than the width of the circuit board 12, it will cause the display panel 11 to have a certain rotation space on the circuit board 12 during the bending and alignment process. When the width of the circuit board 12 and the display panel 11 are the same, when the flexible circuit board 13 is bent to realize the stacking arrangement of the circuit board 12 and the display panel 11, it can be positioned by relying on the edge of the long side C1, and it is not easy to rotate and generate an angle between the long sides C1, so that the display panel 11 and the long sides C1 of the circuit board 12 are flush after bending, and the probability of the angle between the long sides C1 of the display panel 11 and the circuit board 12 is reduced, so that the assembly accuracy is higher in the subsequent process.

[0073] The present application also provides a display device 3, such as Figure 17 As shown, it includes any one display module 1 provided in the above embodiments.

[0074] In the above display device 3, by opening the receiving hole 121 on the circuit board 12, the circuit board 12 can be located above the display panel 11, and the adsorption device 2 can be passed through the receiving hole 121 to be directly adsorbed and fixed to the display panel 11 located below, so that the display panel 11 and the circuit board 12 can move synchronously, without adding an adhesive layer between the display panel 11 and the circuit board 12, thereby reducing the material cost of the adhesive layer and the cost of the process equipment for setting the adhesive layer, simplifying the assembly process and saving assembly time. This helps to simplify the assembly process of the display device 3 and reduce the assembly cost, that is, it helps to reduce the manufacturing cost of the display device 3.

[0075] In a possible implementation, Figure 17 As shown, it also includes a housing 31 , which includes a front housing 311 and a rear housing 312 that are arranged opposite to each other. The display module 1 is accommodated in the housing 31 , and the display panel 11 is located on the side of the circuit board 12 facing the front housing 311 .

[0076] In the above embodiment, the display device 3 includes a housing 31, the housing 31 includes a front housing 311 and a rear housing 312, the display module 1 is located in the housing 31, and the housing 31 is used to protect the display module 1 and improve the aesthetics of the display device 3. The front housing 311 is located on the side of the rear housing 312 close to the user, the display panel 11 is located on the side of the circuit board 12 facing the front housing 311, and the front housing 311 has a hollow area 3111, and the display panel 11 can display through the hollow area 3111.

[0077] In the above-described embodiment, the display device 3 further includes a gasket 32, which is located between the front case 311 and the display panel 11 and contacts the edge area other than the hollow area 3111, for protecting the display panel 11.

[0078] In the above-described embodiment, the display device 3 may further include a battery module 33 located on the side of the circuit board 12 away from the display panel 11. The battery module 33 includes a battery 331 and a battery cover 332. The battery cover 332 is located on the side of the battery 331 away from the circuit board 12, and the battery module 33 is connected to the circuit board 12.

[0079] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that: include: A circuit board, wherein the circuit board is provided with a plurality of penetrating receiving holes; The display panel is laminated on the lower side of the circuit board, the orthographic projection of the accommodating hole on the display panel is located on the surface defined by the display panel, and the accommodating hole is used for allowing the adsorption device located on the upper side of the circuit board to pass through and adsorb the surface of the display panel.

2. The display module according to claim 1, characterized in that: There are multiple accommodating holes, and the accommodating holes are located at two ends of the circuit board along its own length direction, or the accommodating holes are dispersedly arranged along the circumference of the circuit board.

3. The display module according to claim 1, characterized in that: The shape of the receiving hole matches the cross-sectional shape of the adsorption device; or, the shape of the receiving hole is circular, regular polygonal or long strip.

4. The display module according to claim 1, characterized in that: A clamping and limiting portion is provided on the lower surface of the circuit board, and the clamping and limiting portion includes a first baffle and a second baffle, the first baffle is parallel to the circuit board, the second baffle is located between the first baffle and the circuit board, and a first accommodating groove is formed between the first baffle, the second baffle and the circuit board, and a portion of the display panel is accommodated in the first accommodating groove.

5. The display module according to claim 4, characterized in that: The same end of the circuit board and the display panel is connected via a flexible circuit board, and the clamping limit portion is located at an end of the circuit board away from the flexible circuit board.

6. The display module according to claim 4, characterized in that: The second baffle is a light emitting device and the first baffle is connected to the circuit board through the light emitting device.

7. The display module according to claim 1, characterized in that: The outer diameter of the receiving hole is D, 4mm≤D≤10mm.

8. The display module according to claim 1, characterized in that: A clamping groove is formed on the side wall of the receiving hole, and the dimension of the clamping groove in a direction perpendicular to the thickness of the circuit board gradually increases along the circumference of the receiving hole.

9. A display device, characterized in that: Comprising a display module as described in any one of claims 1-8.

10. The display device according to claim 9, characterized in that: It also includes a shell, which includes a front shell and a rear shell that are arranged opposite to each other. The display module is accommodated in the shell, and the display panel is located on a side of the circuit board facing the front shell.

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