Semiconductor equipment cavity maintenance cover plate device

Abstract

The utility model discloses a semiconductor equipment cavity maintenance cover plate device which comprises a cover plate assembly which comprises at least two foldable cover plates and limiting pieces connected to the edges of the cover plates; the supporting assembly comprises a supporting disc and a central supporting unit arranged at the bottom of the supporting disc; when the cover plate assembly is horizontally opened, the supporting assembly is supported at the center position of the bottom of the cover plate assembly. According to the semiconductor equipment cavity maintenance cover plate device, the foldable cover plate assembly and the supporting assembly are designed, when the cavity of a semiconductor is maintained, the supporting assembly is placed in the middle of the cavity, the cover plate assembly is horizontally unfolded and fixed to the edge of the cavity through the limiting piece, and the wear-resistant belt is arranged at the bottom of the cover plate. Convenient operation sight and supporting positions are provided for maintenance of the cavity, protection on the edge of the cavity is guaranteed, and the risk that the heating disc is damaged due to falling of components can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment maintenance auxiliary tools, in particular to a cavity maintenance cover plate device for semiconductor equipment. Background Art

[0002] In the prior art, when a large cavity CVD device is opened for maintenance, due to the large size, high height of the cavity, and small space between the upper and lower cavities, it is impossible to provide a maintenance platform and vision for maintenance personnel. At the same time, there is a risk that heavy objects in the upper cavity will fall and damage the heating plate during maintenance, making the maintenance work of the staff extremely difficult. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a cavity maintenance cover plate device for semiconductor equipment to solve the technical problem of inconvenient cavity maintenance of existing semiconductor equipment.

[0004] To achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An embodiment of the utility model provides a cavity maintenance cover plate device for semiconductor equipment, which includes:

[0006] A cover plate assembly, the cover plate assembly includes at least two foldable cover plates and a limiting member connected to the edge of the cover plate;

[0007] A support assembly, the support assembly includes a support plate and a central support unit arranged at the bottom of the support plate;

[0008] Wherein, when the cover plate assembly is horizontally opened, the support assembly supports at the bottom center position of the cover plate assembly.

[0009] Wherein, adjacent cover plates are connected by hinge members, and the hinge members connected between different cover plates are sequentially crossed and respectively connected to the top surface and the bottom surface of the cover plates.

[0010] Wherein, along the folding direction of the cover plate, a handle is further provided on the cover plate at the outermost edge.

[0011] Wherein, when at least two cover plates are unfolded, a support panel is formed, there are a plurality of limiting members, the plurality of limiting members are respectively arranged at the edge of the support panel, and at least one limiting member is arranged in each orthogonal direction of the support panel.

[0012] Wherein, the limiting member is an L-shaped plate member.

[0013] Wherein, the support assembly further includes a plurality of edge support units, the plurality of edge support units are connected to the bottom of the support plate and are distributed around the central support unit.

[0014] Among them, the central support unit includes: a square tube, a positioning pin connected to the bottom end of the square tube, and a connecting member that fixedly connects the square tube and the positioning pin.

[0015] Among them, the edge support unit includes: a support square tube, a support foot connected to the bottom end of the support square tube, and a screw that fixedly connects the support foot to the support square tube.

[0016] Among them, the support disk is a disk, the top end of the central support unit is connected to the center of the bottom of the disk, and the edge support units are uniformly arranged at the bottom of the disk.

[0017] Among them, a wear-resistant band is further provided at the bottom of the cover plate assembly, and the wear-resistant band is annularly arranged at a position close to the edge at the bottom of the cover plate assembly.

[0018] For the semiconductor device cavity maintenance cover plate device of the present utility model, a foldable cover plate assembly and a support assembly are designed. When maintaining the cavity of the semiconductor, the support assembly is placed in the middle of the cavity, the cover plate assembly is horizontally unfolded, fixed to the edge of the cavity through a limiting member, and a wear-resistant band is provided at the bottom of the cover plate, which not only provides a convenient operation sight and a support position for cavity maintenance, ensures the protection of the cavity edge, but also can reduce the risk of component falling and damaging the heating plate.

[0019] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the following preferred embodiments are specifically described in detail as follows. Description of the Drawings

[0020] Figure 1 and Figure 2 are schematic diagrams of the overall structure of the semiconductor device cavity maintenance cover plate device of the embodiment of the present utility model from different perspectives.

[0021] Figure 3 is an exploded view of the semiconductor device cavity maintenance cover plate device of the embodiment of the present utility model.

[0022] Figure 4 is a schematic diagram of a partial structure of the cover plate assembly of the semiconductor device cavity maintenance cover plate device of the embodiment of the present utility model.

[0023] Figure 5 is an exploded view of a part of the cover plate assembly of the semiconductor device cavity maintenance cover plate device of the embodiment of the present utility model.

[0024] Figure 6This is a partial structural schematic diagram of the support assembly of the semiconductor equipment cavity maintenance cover plate device according to an embodiment of the present invention.

[0025] Figure 7 This is an exploded view of the support assembly part of the semiconductor equipment cavity maintenance cover plate device according to an embodiment of the present invention.

[0026] Description of reference numerals:

[0027] Semiconductor equipment cavity maintenance cover plate device 100, cover plate assembly 1, support assembly 2, wear-resistant belt 3, cover plate 11, cover plate 12, cover plate 13, cover plate 14, handle 131, handle 141, hinge member 15, hinge member 10, limiting member 16, limiting member 17, limiting member 18, limiting member 19, support disk 21, central support unit 22, edge support unit 23, square tube 221, positioning pin 222, connecting member 223, positioning column 2221, support square tube 231, support foot 232, screw 233. Detailed implementation manners

[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "resin", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0031] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0032] In the present utility model, unless otherwise clearly specified and defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0033] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0034] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0035] When repairing the cavity of a large cavity CVD semiconductor device, in the prior art, a clean cloth is generally used to cover the edge of the cavity opening to prevent the cavity from being soiled. Since the cavity is large and high, after the cavity is opened, the maintenance personnel can only stand on one side of the equipment to repair the cavity. The problems with this method are: the line of sight of the maintenance personnel is limited, the operation is laborious, it is not convenient for maintenance, and there is a risk that the equipment components may fall and damage the heating plate during maintenance. Therefore, based on the above requirements, this embodiment provides a semiconductor device cavity maintenance cover device 100.

[0036] Please refer to Figures 1 to 7 , the semiconductor device cavity maintenance cover plate device 100 of this embodiment includes:

[0037] A cover plate assembly 1, the cover plate assembly 1 includes at least two foldable cover plates 11 and 12, and a limiting member 18 connected to the edge of the cover plate 11;

[0038] A support assembly 2, the support assembly 2 includes a support disk 21 and a central support unit 22 arranged at the bottom of the support disk 21;

[0039] Wherein, when the cover plate assembly 1 is opened horizontally, the support assembly 2 supports at the bottom center position of the cover plate assembly 1, and the limiting members 16, 17, 18 and 19 are limited to the edge of the equipment cavity to form an operation support platform for maintenance personnel to lie flat.

[0040] The semiconductor device cavity maintenance cover plate device 100 of this embodiment is an auxiliary tool for opening the cavity of a semiconductor device for maintenance. During maintenance, the cover plate assembly 1 is unfolded and placed on the top opening of the equipment cavity, supported in the middle by the support assembly 2, and the edge of the cover plate assembly 1 is fixed to the edge of the top opening of the equipment cavity by the limiting member 18. Maintenance personnel can lie flat on the cover plate assembly 1, with better visibility, more labor-saving and convenient operation. At the same time, the parts that may fall are caught by the cover plate assembly 1 and will not damage the mechanisms such as the heating plate below.

[0041] The number of the cover plates 11 is determined according to the size of the opening of the cavity, and two or more foldable connections can be set. In this embodiment, the cover plates 11, 12, 13 and 14 made of high-strength lightweight materials such as four aluminum plates are taken as an example for structural description. As Figure 4 shown, the middle is hinged at the edges of the cover plates 11 and 12, the cover plate 14 is hinged on the other outer side of the cover plate 11, and the cover plate 13 is hinged on the other outer side of the cover plate 12. The adjacent splicing edges between the cover plates 13, 12, 11 and 14 are all connected by hinge members, so that the cover plate assembly 1 can be folded and stored and unfolded to form a support plane.

[0042] Specifically, the adjacent cover plates 11 and 12 are connected by a hinge member 15, and the hinge members 15 and 10 between the adjacent cover plates are sequentially crossed and connected to the top surface and the bottom surface of the cover plate assembly 1 respectively. As Figure 4 and Figure 5As shown, they are respectively the schematic structural views of the top surface perspective and the bottom surface perspective of the cover plate assembly 1. Among them, the cover plate 11 and the cover plate 12 are connected by a hinge member 15, and the hinge member 15 is arranged on the top surface of the cover plate assembly 1. The cover plate 11 and the cover plate 14 are connected by a hinge member 10, and the hinge member 10 is arranged on the bottom surface of the cover plate assembly 1. Similarly, the hinge member connecting the cover plate 12 and the cover plate 13 is also arranged on the bottom surface of the cover plate assembly 1, and so on. The hinge members arranged on the hinge edges of adjacent cover plates are arranged in a cross manner in the order of top surface - bottom surface - top surface - bottom surface. The purpose of this design is to facilitate the folding of multiple cover plates, prevent the hinge members from affecting the folding, so that the thickness of the finally folded cover plate assembly 1 is as small as possible, which is convenient for carrying.

[0043] In this embodiment, both the hinge member 15 and the hinge member 10 are hinge pieces. In other embodiments, other existing hinge components can be used. The cover plates 11, 12, 13, and 14 are rectangular plates with substantially the same width. The folding process of the cover plate assembly 1 is as follows: Taking Figure 4 the perspective shown as an example, first, the cover plate 11 and the cover plate 12 are rotated upward and stacked together, and then the cover plates 13 and 14 are rotated downward respectively, so that the cover plate 13 fits on the cover plate 12, and the cover plate 14 fits on the cover plate 11. Finally, the four cover plates are folded to approximately the size of a single cover plate, which is convenient for carrying and storing.

[0044] Among them, along the folding direction of the cover plate 11 (12, 13, 14), a handle 131 (141) is further provided on the outermost cover plate 13 (14). The provision of the handle 131 (141) facilitates the hand-held movement after the cover plate assembly 1 is folded and is also convenient for unfolding.

[0045] Furthermore, at least two of the cover plates 11 and 12 form a support panel when unfolded. There are multiple limiting members 18, and the multiple limiting members are respectively arranged on the edges of the support panel, and at least one limiting member is arranged in each of the orthogonal directions of the support panel. That is, at least one limiting member is arranged in each of the east, west, south, and north directions of the cover plate assembly 1. After the cover plate assembly 1 is unfolded and laid flat, the cover plate assembly 1 can be stably and reliably connected to the edge of the top opening of the cavity through the limiting members located at the edges in the four orthogonal directions, preventing the cover plate assembly 1 from moving and slipping. In this embodiment, taking four limiting members as an example for illustration, the limiting member 18 is arranged on the short side edge of the cover plate 12, the limiting member 17 is arranged on the outer edge of the cover plate 13, the limiting member 19 is arranged on the outer edge of the cover plate 14, and the limiting member 16 is arranged on the short side edge of the cover plate 12.

[0046] Among them, the limiting member 16 (17, 18, 19) is an L-shaped plate member. This L-shaped plate member can be movably or fixedly connected to the edge of the cover plate assembly 1. When the cover plate assembly 1 is unfolded and placed on the top opening edge of the equipment cavity, the L-shaped plate member is buckled to the cavity opening edge, so that the cover plate assembly 1 will not slide.

[0047] Please refer to again Figure 6 and Figure 7 , the support assembly 2 further includes a plurality of edge support units 23, and a plurality of the edge support units 23 are connected to the bottom of the support disk 21 and are distributed around the central support unit 22.

[0048] The central support unit 22 includes: a square tube 221, a positioning pin 222 connected to the bottom end of the square tube 221, and a connecting member 223 that fixedly connects the square tube 221 and the positioning pin 222. The connecting member 223 is a screw or the like. A positioning post 2221 is provided at the bottom end of the positioning pin 222, and this positioning post 2221 can be inserted into the positioning hole at the bottom of the equipment cavity. The square tube 221 can also adopt a support structural member such as a round tube or a rod-shaped member.

[0049] Among them, the edge support unit 23 includes: a support square tube 231, a support foot 232 connected to the bottom end of the support square tube 231, and a screw 233 that fixedly connects the support foot 232 to the support square tube. A support plate portion is provided at the bottom of the support foot 232, which can improve the support stability and the stress area.

[0050] Specifically, the support disk 21 is a disk, the top end of the central support unit 22 is connected to the bottom center of the disk, and the edge support units 23 are uniformly arranged at the bottom of the disk.

[0051] Please refer to again Figure 2 , a wear-resistant belt 3 is further provided at the bottom of the cover plate assembly 1. The wear-resistant belt 3 is arranged around the bottom of the cover plate assembly 1 near the edge. The annular wear-resistant belt 3 is approximately similar in shape to the cavity opening of the semiconductor device, so that the edge of the cover plate assembly 1 and the cavity opening edge are spaced and abutted by the wear-resistant belt 3, thereby preventing the cover plate assembly 1 from moving or being pressed to damage the sealing ring of the cavity opening.

[0052] For the semiconductor device cavity maintenance cover plate device 100 of this embodiment, it designs a foldable cover plate assembly 1 and a support assembly 2. When maintaining the cavity of the semiconductor, the support assembly 2 is placed in the middle of the cavity, the cover plate assembly 1 is horizontally unfolded, fixed to the cavity edge by the limiting member, and a wear-resistant belt 3 is provided at the bottom of the cover plate assembly 1, which not only provides a convenient operation line of sight and a support position for cavity maintenance, but also ensures the protection of the cavity edge, and can also reduce the risk of component falling and damaging the heating plate.

[0053] The above only further illustrates the technical content of the present utility model with embodiments to facilitate easier understanding by readers, but it does not mean that the implementation modes of the present utility model are limited thereto. Any technical extension or re-creation made according to the present utility model is protected by the present utility model. The protection scope of the present utility model shall be subject to the claims.

Claims

1. A semiconductor equipment cavity maintenance cover device, characterized in that: include: A cover plate assembly, the cover plate assembly comprising at least two foldable cover plates and a stopper connected to the edges of the cover plates; A support assembly, the support assembly comprising a support plate and a central support unit disposed at the bottom of the support plate; Wherein, when the cover assembly is opened horizontally, the support assembly is supported at the bottom center position of the cover assembly, and the limiting member is limited at the edge of the equipment cavity.

2. The semiconductor equipment chamber maintenance cover device according to claim 1, characterized in that: Adjacent cover plates are connected by hinges, and the hinges between adjacent cover plates are sequentially and cross-arranged on the top surface and the bottom surface of the cover plate assembly respectively.

3. The semiconductor equipment chamber maintenance cover device according to claim 2, characterized in that: A handle is also provided on the cover plate at the outermost edge along the folding direction of the cover plate.

4. The semiconductor equipment chamber maintenance cover device according to claim 1, characterized in that: When at least two of the cover plates are unfolded, a support panel is formed. A plurality of the limit members are provided. The plurality of limit members are respectively arranged at the edges of the support panel, and at least one of the limit members is provided in an orthogonal direction of the support panel.

5. The semiconductor equipment chamber maintenance cover device according to claim 4, characterized in that: The limiting member is an L-shaped plate.

6. The semiconductor equipment chamber maintenance cover device according to claim 1, characterized in that: The support assembly further comprises a plurality of edge support units, wherein the plurality of edge support units are connected to the bottom of the support plate and are distributed around the central support unit.

7. The semiconductor equipment chamber maintenance cover device according to claim 6, characterized in that: The central support unit includes: a square tube, a positioning pin connected to the bottom end of the square tube, and a connecting piece for fixedly connecting the square tube and the positioning pin.

8. The semiconductor equipment chamber maintenance cover device according to claim 7, characterized in that: The edge support unit includes: a supporting square tube, a supporting foot connected to the bottom end of the supporting square tube, and a screw that fixes the supporting foot to the supporting square tube.

9. The semiconductor equipment chamber maintenance cover device according to claim 8, characterized in that: The support disk is a circular disk, the top end of the central support unit is connected to the bottom center of the circular disk, and the edge support units are evenly arranged at the bottom of the circular disk.

10. The semiconductor equipment chamber maintenance cover device according to any one of claims 1 to 9, characterized in that: The bottom of the cover plate assembly is also provided with a wear-resistant belt, which is arranged in a ring shape at a position close to the edge of the bottom of the cover plate assembly.

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