Full-automatic wafer morphology and thickness measuring and sorting system

Abstract

The utility model discloses a full-automatic wafer morphology thickness measuring and sorting system, which comprises a machine body, a feeding module and a detection module, the feeding module and the detection module are mounted on the machine body, a detection cavity is arranged in the machine body, the feeding module comprises a storage component, a feeding component, an edge searching component and a dust removal component, and the detection module is arranged in the detection cavity. The material storage assembly is installed on the right side wall of the machine body, the feeding assembly and the edge searching assembly are arranged in the detection cavity, the dust removal assembly is installed on the top of the machine body, and the material storage assembly comprises a compatible carrier plate, a position sensor, an indicator lamp and a confirmation button. According to the utility model, through the induction anti-collision design of the storage assembly, the mapping detection of the feeding assembly, the accurate positioning of the edge searching assembly and the anti-interference detection of the platform assembly, the high-efficiency and high-precision automatic detection of wafers is realized, the system supports modular extension, is compatible with various feeding and discharging modes and detection requirements, and significantly improves the detection accuracy and stability; the method is suitable for semiconductor manufacturing.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection equipment, in particular to a full-automatic wafer morphology and thickness measurement and sorting system. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 wafer or multiple wafers at the same time. As the semiconductor feature size becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, with the reduction of the feature size, the influence of the number of particles in the air on the quality and reliability of the wafer after processing increases during wafer processing. With the improvement of cleanliness, new data characteristics have also emerged in the number of particles. After the wafer is processed, it is necessary to detect the morphology and thickness of the wafer.

[0003] However, the existing wafer detection equipment has the following problems in the process of use: the existing detection equipment mainly detects the wafer thickness through the confocal method shooting scheme or the interference method scheme, but the existing equipment has its limitations and poor compatibility. For wafer products of various materials, the equipment needs to be continuously replaced to achieve the detection, which greatly increases the cost and the detection convenience is also poor; at the same time, due to different equipment algorithm architectures, the measurement accuracy is greatly reduced, the stability is also poor, and the detection efficiency is low. Therefore, corresponding technical solutions need to be designed to solve the existing technical problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a full-automatic wafer morphology and thickness measurement and sorting system, which solves the technical problem that the existing detection equipment mainly detects the wafer thickness through the confocal method shooting scheme or the interference method scheme, but the existing equipment has its limitations and poor compatibility. For wafer products of various materials, the equipment needs to be continuously replaced to achieve the detection, which greatly increases the cost and the detection convenience is also poor; at the same time, due to different equipment algorithm architectures, the measurement accuracy is greatly reduced, the stability is also poor, and the detection efficiency is low. This solution realizes the high-efficiency and high-precision automatic detection of wafers through the induction anti-collision design of the storage component, the mapping detection of the loading component, the precise positioning of the edge-finding component, and the anti-interference detection of the platform component. The system supports modular expansion, is compatible with various loading and unloading modes and detection requirements, significantly improves the detection accuracy and stability, and is applicable to the semiconductor manufacturing field.

[0005] To achieve the above object, the present utility model provides the following technical solutions: a fully automatic wafer morphology and thickness measurement and sorting system, including a body and a feeding module and a detection module installed on the body. A detection cavity is provided inside the body. The feeding module includes a material storage component, a feeding component, an edge-finding component, and a dust removal component. The material storage component is installed on the right side wall of the body. The feeding component and the edge-finding component are placed inside the detection cavity. The dust removal component is installed on the top of the body. The material storage component includes a compatible carrier plate, a position sensor, an indicator light, and a confirmation button. The position sensor is installed above the compatible carrier plate and the detection end faces the compatible carrier plate. The indicator light is installed above the position sensor. The confirmation button is installed at the corner of the compatible carrier plate. The feeding component includes a robot body and a tooth fork installed on the top of the robot body. A mapping measuring instrument is also equipped on the top of the robot body. The edge-finding component includes an XYR motion platform, a code reading OCR, a vision module, and a stage. The code reading OCR is arranged above the XYR motion platform. The vision module is located on one side of the code reading OCR. The stage is located above the vision module. The detection module includes a detection component and a platform component, and both are arranged inside the detection cavity.

[0006] As a preferred embodiment of the present utility model, the body includes a chassis and several groups of rollers installed at the bottom of the chassis. A control console is installed on one side of the chassis. The control console is connected to the feeding module and the detection module through circuits.

[0007] As a preferred embodiment of the present utility model, the dust removal component adopts a fan filter unit and is assembled above the chassis.

[0008] As a preferred embodiment of the present utility model, the detection component adopts a spectral confocal displacement sensor.

[0009] As a preferred embodiment of the present utility model, the platform component includes an XY linear platform and a carrier mounted on the XY linear platform.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] Through the intelligent induction and anti-collision design of the material storage component, the efficient wafer detection of the feeding component, the sub-micron-level precise positioning of the edge-finding component, and the active anti-interference detection technology of the platform component, the present utility model realizes the intelligence and automation of the whole process of mapping detection. Through the innovative electromechanical and software integration design, it perfectly balances cost, performance, and scalability. The detection efficiency is increased by more than 50% compared with traditional equipment, providing a set of high-cost-performance intelligent detection solutions for semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1This is the overall structure diagram of the present utility model;

[0013] Figure 2 This is the distribution schematic diagram of the feeding module described in the present utility model;

[0014] Figure 3 This is the distribution schematic diagram of the detection module described in the present utility model;

[0015] Figure 4 This is the structure diagram of the storage component described in the present utility model;

[0016] Figure 5 This is the structure diagram of the feeding component described in the present utility model;

[0017] Figure 6 This is the structure diagram of the edge-finding component described in the present utility model;

[0018] Figure 7 This is the structure diagram of the detection component described in the present utility model;

[0019] Figure 8 This is the structure diagram of the platform component described in the present utility model.

[0020] In the figure: 1, machine body; 2, detection chamber; 3, storage component; 4, feeding component; 5, edge-finding component; 6, dust removal component; 7, compatible carrier board; 8, position sensor; 9, indicator light; 10, confirmation button; 11, robot body; 12, tooth fork; 13, mapping measuring instrument; 14, XYR moving platform; 15, code reading OCR; 16, vision module; 17, carrier; 18, detection component; 19, platform component; 20, chassis; 21, roller; 22, console; 23, XY linear platform; 24, carrier vehicle. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figure 1-8, the present utility model provides a technical solution: a fully automatic wafer shape and thickness measurement and sorting system, including a fully automatic wafer shape and thickness measurement and sorting system, which includes a machine body 1 and a feeding module and a detection module installed on the machine body 1. A detection cavity 2 is provided inside the machine body 1. The feeding module includes a material storage component 3, a feeding component 4, an edge finding component 5 and a dust removal component 6. The material storage component 3 is installed on the right side wall of the machine body 1. The feeding component 4 and the edge finding component 5 are placed inside the detection cavity 2. The dust removal component 6 is installed on the top of the machine body 1. The material storage component 3 includes a compatible carrier 7, a position sensor 8, an indicator light 9 and a confirmation button 10. The position sensor 8 is installed above the compatible carrier 7 and the detection end faces the compatible carrier 7. The indicator light 9 is installed above the position sensor 8. The confirmation button 10 is installed at the corner of the compatible carrier 7. According to different types and sizes of wafer products, a high-precision position sensor 8 is equipped in the material storage component 3. This position sensor 8 can real-time monitor the placement position of the wafer in the storage area. Once it is found that the wafer is placed abnormally, it will immediately feedback to the console 22, effectively avoiding risks such as collision and dropping in subsequent operations, and ensuring the safety of the wafer storage and transfer process. The main operation process: manually place the product cartridge on the compatible carrier 7. The designed size specification of the compatible carrier 7 is larger than the sizes of each wafer product and can be used to place wafers of different specifications, having universality. Press the confirmation button 10. At the same time, the position sensing device will determine whether the cartridge product is placed in place and give it to the console 22. After confirming that it is in place, check whether the product is placed properly. If there is no abnormality, the next step can be carried out. The feeding component 4 includes a robot body 11 and a tooth fork 12 installed on the top of the robot body 11. A mapping measuring instrument 13 (Mapping measuring instrument) is also equipped on the top of the robot body 11. The robot body 11 combined with the tooth fork 12 serves as a sorting execution mechanism. The robot body 11 accurately grabs the wafer after detection. The tooth fork 12 is an electric tooth fork and can adjust the clamping position at the front end of the tooth fork 12 according to the specification of the wafer and clamp wafers of different sizes, achieving the purpose of compatibility. The part in contact with the wafer is made of a special flexible material, specifically carbon fiber material, which can not only ensure the stable clamping of the wafer during the grabbing process, but also avoid damaging the surface of the wafer, enabling it to quickly and efficiently transport the wafer from the detection position to the corresponding sorting area to realize the sorting operation. The edge finding component 5 includes an XYR moving platform 14, a code reading OCR 15, a vision module 16 and a stage 17. The code reading OCR 15 is arranged above the XYR moving platform 14. The vision module 16 is located on one side of the code reading OCR 15. The stage 17 is located above the vision module 16. A multi-axis linkage mechanism is used in combination with the vision module 16. The multi-axis linkage mechanism can achieve high-precision spatial motion control and can flexibly adjust the position and angle of the vision module 16 to ensure the omnidirectional observation and positioning of the wafer. The code reading OCR 15 can quickly and accurately read the identification code on the surface of the wafer and transmit relevant information to the analysis module.Provide a key basis for subsequent sorting strategies and data traceability. The detection module includes a detection component 18 and a platform component 19, both of which are arranged in the detection chamber 2.,

[0023] Note: The robot body 11 uses a TA series TA4030 type wafer robot.

[0024] Further improved, as Figure 1 shown, the body 1 includes a chassis 20 and a number of groups of rollers 21 installed at the bottom of the chassis 20. A console 22 is installed on one side of the chassis 20, and the console 22 is connected to the on-line feeding module and the detection module through a circuit.

[0025] Further improved, as Figure 1 shown, the dust removal component 6 uses a fan filter unit and is assembled above the chassis 20. An efficient fan filter unit is introduced to build a Class 100 clean environment. The efficient fan provides strong air circulation power to quickly extract and send the air in the detection and sorting areas into the filtration system. The filtration system uses multiple layers of high-efficiency filters, which can effectively filter the tiny particles in the air, ensuring that the air quality in the working area meets the Class 100 clean standard. This clean environmental condition greatly reduces the risk of external dust particles contaminating the wafer surface, ensures the reliability of the detection and sorting process, and avoids detection misjudgment caused by dust interference and potential impact on the wafer quality.

[0026] Further improved, as Figure 7 shown, the detection component 18 uses a spectral confocal displacement sensor to measure the topography and thickness of the wafer.

[0027] Specifically, the platform component 19 includes an XY linear platform 23 and a carrier 24 mounted on the XY linear platform 23. The position of the carrier 24 is adjusted by the XY linear platform 23, and the flatness and positioning accuracy of the carrier 24 can firmly and accurately fix the wafer, reducing the detection error caused by the deviation of the wafer placement.

[0028] During use: Manually place the product cartridge on the compatible carrier 7, press the confirmation button 10. Meanwhile, the position sensing device will determine whether the cartridge product is placed in place and send the information to the console 22. After confirming that it is in place, check whether the product is properly placed. If there are no abnormalities, the next step can be carried out to avoid the risk of collision debris caused by feeding. At the same time, the feeding assembly 4 moves to the waiting detection position. The feeding assembly 4 is equipped with a mapping detection function, which can detect the quantity and abnormalities of the products in the storage assembly 3. After the detection is completed, the feeding assembly takes out the product, moves it, and places it in the edge-finding assembly 5. The edge-finding assembly 5 can reposition the product and can be equipped with code reading and RFID functions, cooperating with data storage. After the positioning is completed, the feeding assembly 4 takes the product off the edge-finding assembly, moves it, and places the product in the carrier 24 above the platform assembly 19. The form of the carrier 24 can be made in different styles and be compatible according to requirements. The detection assembly 18 uses a confocal opposed beam scheme or interferometry to detect the product. Synchronously cooperate with the detection assembly 18 for detection. After the detection is completed, the feeding assembly 4 takes out the product, puts it back into the storage assembly 3, and completes the detection.

[0029] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention.

[0030] In addition, the terms "first", "second", "third", "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", "fourth" may explicitly or implicitly include at least one of such features.

[0031] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "set", "connected", "fixed", "swivelly connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0032] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. Fully automatic wafer topography thickness measurement and sorting system, characterized by: The invention comprises a fully automatic wafer morphology thickness measurement and sorting system, comprising a machine body (1) and a loading module and a detection module installed on the machine body (1); the machine body (1) is provided with a detection chamber (2); the loading module comprises a storage component (3), a loading component (4), an edge finding component (5) and a dust removal component (6); the storage component (3) is installed on the right side wall of the machine body (1); the loading component (4) and the edge finding component (5) are built in the detection chamber (2); the dust removal component (6) is installed on the top of the machine body (1); the storage component (3) comprises a compatible carrier board (7), a position sensor (8), an indicator light (9) and a confirmation button (10); the position sensor (8) is installed above the compatible carrier board (7) with the detection end facing the compatible carrier board (7); the indicator light (9) is installed at the position The sensor (8) is mounted above the sensor (8), the confirmation button (10) is installed at the corner of the compatible carrier (7), the loading component (4) includes a robot body (11) and a tooth fork (12) installed on the top of the robot body (11), and the top of the robot body (11) is also equipped with a mapping measuring instrument (13), the edge finding component (5) includes an XYR motion platform (14), an OCR code reader (15), a visual module (16) and a carrier (17), the OCR code reader (15) is arranged above the XYR motion platform (14), the visual module (16) is located on one side of the OCR code reader (15), and the carrier (17) is located above the visual module (16), and the detection module includes a detection component (18) and a platform component (19), and both are arranged in the detection chamber (2).

2. The fully automatic wafer topography thickness measurement and sorting system according to claim 1, characterized in that: The machine body (1) comprises a chassis (20) and a plurality of groups of rollers (21) installed at the bottom of the chassis (20); a control console (22) is installed on one side of the chassis (20); and the control console (22) is connected via a line feeding module and a detection module.

3. The fully automatic wafer topography thickness measurement and sorting system according to claim 2, characterized in that: The dust removal component (6) adopts a fan filter unit and is installed above the chassis (20).

4. The fully automatic wafer topography thickness measurement and sorting system according to claim 1, characterized in that: The detection component (18) adopts a spectral confocal displacement sensor.

5. The fully automatic wafer topography thickness measurement and sorting system according to claim 1, characterized in that: The platform component (19) comprises an XY linear platform (23) and a carrier (24) mounted on the XY linear platform (23).

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